Mounting bracket for mcu

Abstract

The utility model provides a kind of installation support for MCU, it is related to fixed technical field.The installation support, comprising: base, mounting plate, baffle, positioning plate, lock and fan.Base is provided with heat dissipation groove inside, and the top of base is provided with the air outlet that is communicated with heat dissipation groove.Mounting plate is installed in the top of base, and ventilation opening that exposes the air outlet is provided on mounting plate.Both sides of mounting plate are provided with baffle. Positioning plate is installed between two baffles, and mounting hole is provided on positioning plate.The bottom of mounting plate is connected with the one end of lock.Fan is installed on base, and the air outlet of fan is arranged in heat dissipation groove.The installation support of the utility model is based on guaranteeing firm and reliable, and it is beautiful, lightweight, and the installation support has independent cooling system, auxiliary MCU heat dissipation, so that the installation position of MCU has more diverse selection, and the limited space in aircraft electronic cabin is indirectly saved.

Description

Technical Field

[0001] This utility model relates to the field of mounting technology, and in particular to a mounting bracket for MCU. Background Technology

[0002] MCU chips, also known as microcontrollers, can be simply viewed as low-power miniature computers. They can perform all the basic functions of a computer, packing all the components of a computer onto a single tiny chip, including the CPU, memory, interfaces, read-only memory, and storage memory. In essence, they are chip-level computers. During flight, the MCU on the aircraft needs to be secured to ensure that it remains stable on the aircraft and to prevent the MCU from being affected by complex environments such as airflow and high or low temperatures. Utility Model Content

[0003] To solve the above-mentioned technical problems, this utility model provides a mounting bracket for MCUs. The mounting bracket is not only sturdy and reliable, but also aesthetically pleasing and lightweight. At the same time, the mounting bracket has an independent cooling system to assist in the heat dissipation of the MCU, which makes the installation position of the MCU more versatile and indirectly saves the limited space in the aircraft's electronics bay.

[0004] The technical solution adopted in this utility model is: A mounting bracket for an MCU includes: The base has a heat dissipation groove inside and an air outlet communicating with the heat dissipation groove on the top of the base. A mounting plate is installed on top of the base, and the mounting plate is provided with a ventilation opening that exposes the air outlet; Baffles are installed on both opposite sides of the mounting plate; A positioning plate is installed between the two baffles, and the positioning plate is provided with mounting holes; A locking device, one end of which is connected to the mounting plate and is positioned opposite to the positioning plate; A fan is mounted on the base, and the fan's air outlet is located inside the heat dissipation slot; The mounting plate, baffle, positioning plate and locking device form a fixed area for fixing the MCU.

[0005] Optionally, the base includes: A base body, wherein the heat dissipation groove is provided on the top of the base body; A heat sink is installed at the opening of the heat sink groove. The opposite ends of the heat sink are connected to the top of the base. The remaining two ends of the heat sink form a ventilation gap with the opening of the heat sink groove. The air outlet is located on the heat sink.

[0006] Optionally, the mounting plate and the baffle are integrally formed, and the baffle is located at one end of the mounting plate after installation.

[0007] Optionally, the baffle is provided with multiple process holes.

[0008] Optionally, the positioning plate is provided with a clearance groove, and the mounting holes on the positioning plate are used to fix the socket that cooperates with the MCU. The mounting holes are located on opposite sides of the clearance groove.

[0009] Optionally, the locking device includes: Mounting rod, which is mounted on the bottom of the mounting plate and has one end extending outside the mounting plate; An adjusting rod, one end of which is hinged to the end of the mounting rod located outside the mounting plate, and at least one limiting slit is provided on the rod wall of the adjusting rod; The positioning element is installed on the adjusting rod; An adjusting member is mounted on the adjusting rod and located at the end of the positioning member away from the adjusting rod, and the adjusting member abuts against the side wall of the MCU.

[0010] Optionally, the outer cover of the fan is provided with a fan cover.

[0011] Optionally, both the mounting plate and the baffle have rounded corners.

[0012] Compared with the prior art, the beneficial effects of this utility model are: This mounting bracket ensures robustness and reliability while also being aesthetically pleasing and lightweight. In addition, the mounting bracket has an independent cooling system to assist in the heat dissipation of the MCU, which allows for more diverse options for the installation location of the MCU and indirectly saves the limited space in the aircraft's electronics bay. Attached Figure Description

[0013] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0014] Figure 1 This is a schematic diagram of the overall structure of the mounting bracket for the MCU.

[0015] Figure 2 This is a schematic diagram of the base structure of a mounting bracket for an MCU.

[0016] Figure 3This is a cross-sectional schematic diagram of the base structure of the mounting bracket for MCU.

[0017] Figure 4 This is a schematic diagram of the locking mechanism for the mounting bracket of an MCU.

[0018] Figure 5 A schematic diagram of a structure in which an MCU is mounted on a mounting bracket.

[0019] Figure label: 11. Base; 12. Heat dissipation groove; 13. Air outlet; 14. Base body; 15. Heat dissipation plate; 16. Ventilation gap; Mounting plate; 21. Ventilation opening; Baffle; 31. Process hole; Positioning plate; 41. Mounting hole; 42. Leaving groove; Locking device; 51. Mounting rod; 52. Adjusting rod; 53. Limiting notch; 54. Positioning component; 55. Adjusting component; Fan; 61. Fan cover Fixed area; MCU; socket. Detailed Implementation

[0020] In the following description, only certain exemplary embodiments are briefly described. As those skilled in the art will recognize, the described embodiments can be modified in various ways without departing from the spirit or scope of this invention. Therefore, the drawings and description are considered exemplary in nature and not restrictive.

[0021] In the description of this utility model, it should be understood that the terms "upper", "lower", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product of this utility model is in use, or the orientation or positional relationship commonly understood by those skilled in the art. They are only used to facilitate the description of this utility model and simplify the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0022] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection, an electrical connection, or a communication connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0023] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0024] The following disclosure provides many different embodiments or examples for implementing various structures of this invention. To simplify the disclosure, specific examples of components and arrangements are described below. These are merely examples and are not intended to limit the scope of the invention. Furthermore, reference numerals and / or letters may be repeated in different examples; such repetition is for simplification and clarity and does not in itself indicate a relationship between the various embodiments and / or arrangements discussed. In addition, examples of various specific processes and materials are provided, but those skilled in the art will recognize the application of other processes and / or the use of other materials.

[0025] The embodiments of this utility model will now be described in detail with reference to the accompanying drawings.

[0026] like Figure 1 , Figure 2 , Figure 3 and Figure 5As shown, this utility model embodiment provides a mounting bracket for an MCU, including: a base 1, a mounting plate 2, a baffle 3, a positioning plate 4, a locking device 5, and a fan 6. The base 1 has a heat dissipation groove 11 inside, and an air outlet 12 communicating with the heat dissipation groove 11 is provided on the top of the base 1. The mounting plate 2 is mounted on the top of the base 1, and has a ventilation opening 21 exposing the air outlet 12. Baffles 3 are mounted on opposite sides of the mounting plate 2. The positioning plate 4 is mounted between the two baffles 3, and has mounting holes 41. One end of the locking device 5 is connected to the bottom of the mounting plate 2 and is positioned opposite to the positioning plate 4. The fan 6 is mounted on the base 1, and the air outlet 12 of the fan 6 is located within the heat dissipation groove 11. A fixing area 7 for fixing an MCU 8 is formed between the mounting plate 2, the baffle 3, the positioning plate 4, and the locking device 5.

[0027] In use, first fix the socket 9 onto the positioning plate 4, then connect the plug on the MCU 8 to the socket 9 mounted on the positioning plate 4. Then adjust the angle of the locking piece to fix the MCU 8 within the fixing area 7.

[0028] More specifically, two locking devices 5 are provided at the front of the mounting plate 2 (i.e., on the side opposite to the positioning plate 4), which, together with the baffles 3 on both sides of the mounting plate 2 and the positioning plate 4 installed between the baffles 3, secure the device from all angles. To remove the MCU 8, loosen the locking devices 5 and disconnect the plug on the MCU 8 from the socket 9 installed on the positioning plate 4, and the MCU 8 can be removed.

[0029] A fan 6 is mounted on the base 1, and a heat sink 11 is provided inside the base 1. An air outlet 12 communicating with the heat sink 11 is provided on the top of the base 1. The air provided by the fan 6 dissipates heat from the MCU 8. This design allows for a more diverse installation environment for the MCU 8, no longer limited to installation environments with independent cooling systems.

[0030] In one embodiment, such as Figure 1 , Figure 2 and Figure 3 As shown, the base 1 includes a base body 13 and a heat sink 14. A heat sink groove 11 is provided on the top of the base body 13. The heat sink 14 is installed at the opening of the heat sink groove 11, with opposite ends of the heat sink 14 connected to the top of the base 1, and the remaining two ends of the heat sink 14 forming a ventilation gap 15 with the opening of the heat sink groove 11. An air outlet 12 is provided on the heat sink 14.

[0031] To ensure the MCU 8 can be used in various installation environments, a heat dissipation slot 11 is provided on the top of the base 13, and a heat dissipation plate 14 is provided at the opening of the heat dissipation slot 11. To improve ventilation, an air outlet 12 is provided on the heat dissipation plate 14, and a ventilation gap 15 is provided between the heat dissipation plate 14 and the heat dissipation slot 11.

[0032] In one embodiment, such as Figure 1 As shown, to improve the structural stability of mounting plate 2 and baffle 3, mounting plate 2 and baffle 3 are integrally molded. For ease of installation of the MCU 8, baffle 3 is located at one end of mounting plate 2 after installation.

[0033] In one embodiment, each baffle 3 is provided with three 35mm process holes 31, which have the function of reducing weight and beautifying the appearance of the baffle 3.

[0034] In one embodiment, such as Figure 1 , Figure 2 , Figure 3 and Figure 5 As shown, the positioning plate 4 is provided with a clearance groove 42, and the mounting hole 41 on the positioning plate 4 is used to fix the socket 9 that cooperates with the MCU 8. The mounting hole 41 is located on opposite sides of the clearance groove 42.

[0035] A clearance groove 42 is provided on the positioning plate 4. The clearance groove 42 is used for positioning and auxiliary fixing of the socket 9 to prevent the socket 9 from wobbling left and right during use.

[0036] In one embodiment, such as Figure 1 and Figure 4 As shown, the locking device 5 includes: a mounting rod 51, an adjusting rod 52, a positioning member 54, and an adjusting member 55. The mounting rod 51 is mounted on the bottom of the mounting plate 2, with one end extending outside the mounting plate 2. One end of the adjusting rod 52 is hinged to the end of the mounting rod 51 located outside the mounting plate 2, and at least one limiting notch 53 is provided on the rod wall of the adjusting rod 52. The positioning member 54 is mounted on the adjusting rod 52. The adjusting member 55 is mounted on the adjusting rod 52 and is located at the end of the positioning member 54 away from the adjusting rod 52. When fixing the MCU 8, the adjusting member 55 abuts against the side wall of the MCU 8.

[0037] When fixing the MCU 8, adjust the angle between the adjusting rod 52 and the mounting rod 51 so that the positioning part 54 and the adjusting part 55 mounted on the adjusting rod 52 contact the side wall of the MCU 8 to achieve fixation. When it is necessary to disassemble the MCU 8, rotate the adjusting rod 52 so that the positioning part 54 and the adjusting part 55 are away from the MCU 8, and then the plug of the MCU 8 can be separated from the socket 9.

[0038] In one embodiment, such as Figure 1 and Figure 2 As shown, the outer side of the fan 6 is provided with a fan cover 61. The fan cover 61, which matches the length and width of the fan 6, is provided on the outer side of the fan 6, which effectively avoids injury to personnel due to improper operation, and does not affect the air intake of the fan 6 while taking into account aesthetics.

[0039] In one embodiment, such as Figure 1 As shown, the corners of both the mounting plate 2 and the baffle 3 are rounded to avoid sharp edges and improve safety and aesthetics.

[0040] Finally, it should be noted that the above description is merely a preferred embodiment of this utility model and is not intended to limit the utility model. Although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. An installation bracket for an MCU, characterized by, include: The base has a heat dissipation groove inside and an air outlet communicating with the heat dissipation groove on the top of the base. A mounting plate is installed on top of the base, and the mounting plate is provided with a ventilation opening that exposes the air outlet; Baffles are installed on both opposite sides of the mounting plate; A positioning plate is installed between the two baffles, and the positioning plate is provided with mounting holes; A locking device, one end of which is connected to the mounting plate and is positioned opposite to the positioning plate; A fan is mounted on the base, and the fan's air outlet is located inside the heat dissipation slot; The mounting plate, baffle, positioning plate and locking device form a fixed area for fixing the MCU.

2. The mounting bracket for MCUs according to claim 1, characterized by The base includes: A base body, wherein the heat dissipation groove is provided on the top of the base body; A heat sink is installed at the opening of the heat sink groove. The opposite ends of the heat sink are connected to the top of the base. The remaining two ends of the heat sink form a ventilation gap with the opening of the heat sink groove. The air outlet is located on the heat sink.

3. The mounting bracket for MCUs of claim 1, wherein, The mounting plate and the baffle are integrally formed, and the baffle is located at one end of the mounting plate after installation.

4. The mounting bracket for MCU according to claim 1 or 3, wherein The baffle is provided with multiple process holes.

5. The mounting bracket for MCUs according to claim 1, characterized in that, The positioning plate is provided with a clearance groove, and the mounting holes on the positioning plate are used to fix the socket that cooperates with the MCU. The mounting holes are located on opposite sides of the clearance groove.

6. The mounting bracket for MCUs according to claim 1, characterized in that, The locking device includes: Mounting rod, which is mounted on the bottom of the mounting plate and has one end extending outside the mounting plate; An adjusting rod, one end of which is hinged to the end of the mounting rod located outside the mounting plate, and at least one limiting slit is provided on the rod wall of the adjusting rod; The positioning element is installed on the adjusting rod; An adjusting member is mounted on the adjusting rod and located at the end of the positioning member away from the adjusting rod, and the adjusting member abuts against the side wall of the MCU.

7. The mounting bracket for MCUs according to claim 1, characterized in that, The fan is provided with a fan cover on its outer side.

8. The mounting bracket for an MCU according to claim 1, characterized in that, Both the mounting plate and the baffle have rounded corners.

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