RFID tag

Abstract

Provided is an RFID tag, including: an RFID electronic component; an inner shell, the RFID electronic component being sealed in the inner shell, a lower surface of the inner shell having a limiting hole; and an outer shell, the outer shell completely wrapping the inner shell and being a seamless structure integrally formed, the outer shell having a limiting post protruding from an upper surface of a bottom, the limiting post corresponding to the limiting hole.

Description

Technical Field

[0001] This application relates to the field of wireless communication, and more specifically, to an RFID tag. Background Technology

[0002] RFID tags, as advanced intelligent management data carriers, are widely used in various industries. In the oil and gas industry, RFID tags are particularly important for drill pipe management, providing accurate data for tracking key information such as the number of times drill pipes have been used and their maintenance history. However, the harsh environment inside oil wells has a significant impact on the survival of these tags. Drilling operations typically involve depths of 6,000 to 10,000 meters, temperatures reaching 180°C to 220°C, and pressures up to 22 kpsi (equivalent to 150 MPa), accompanied by intense vibration, friction, and corrosive media. RFID tags installed on drill pipes must remain effectively readable under these conditions, posing a significant challenge to the tag's materials and packaging structure.

[0003] Therefore, conventional structures and processes cannot meet the requirements for use in high temperature and high liquid (vapor) pressure environments. Utility Model Content

[0004] This application was made to solve the above-mentioned problems, and its purpose is to provide a high-strength and high-reliability RFID electronic tag that can work for a long time in harsh environments without damage.

[0005] To address the aforementioned issues, this application provides an RFID tag comprising: an RFID electronic component; an inner shell in which the RFID electronic component is sealed, and a limiting hole on the lower surface of the inner shell; and an outer shell that completely encloses the inner shell and is a seamless, integrally formed structure, the outer shell having a limiting post protruding from the upper surface of the bottom, the limiting post corresponding to the limiting hole.

[0006] Preferably, the thickness of the bottom of the housing is in the range of 0.8 mm to 1.5 mm.

[0007] Preferably, the inner shell includes a tightly fitted upper shell and a lower shell.

[0008] Preferably, a weld line is formed on the lower surface of the inner shell.

[0009] Preferably, the outer shell is made of alloy plastic material.

[0010] Preferably, the RFID electronic component includes: a substrate; a chip; and a metal strip antenna attached to the surface of the substrate and connected to both ends of the chip.

[0011] Preferably, the RFID electronic component includes: a loop antenna comprising a chip and a loop antenna conductor connected to both ends of the chip and configured as a loop together with the chip; and a main antenna comprising a block and a metal pattern coated on the surface of the block, the loop antenna being disposed above and coupled to the main antenna, the loop antenna and the main antenna being separated by an insulator.

[0012] Preferably, the top side of the housing has a stop that can cooperate with a stop component on the device on which the RFID tag is installed to fix the installation direction of the RFID tag.

[0013] Preferably, the polarization direction of the installed RFID tag is consistent with the direction of the metal extension of the device on which the RFID tag is installed.

[0014] Another aspect of this application provides an RFID tag, including: an RFID electronic component, the lower surface of which has a limiting hole, the RFID electronic component including: a substrate; a chip; and a metal sheet antenna, the metal sheet antenna being attached to the surface of the substrate and connected to both ends of the chip, the surface of the chip being covered by an adhesive; and a housing, the housing completely enclosing the RFID electronic component and being a seamless, integrally formed structure, the housing having a limiting post protruding from the upper surface of the bottom, the limiting post corresponding to the limiting hole. Attached Figure Description

[0015] To gain a more detailed understanding of the above features of this case, embodiments are provided for further description. However, it should be noted that the accompanying drawings are exemplary and should not be considered as limiting its scope, and allow for other equivalent embodiments.

[0016] Figure 1 This is a cross-sectional view of an RFID tag according to an embodiment of this application.

[0017] Figure 2 This is a diagram of the full-encapsulation injection molding structure according to an embodiment of this application.

[0018] Figures 3a-3c This is a diagram of the inner shell structure of one embodiment of this application.

[0019] Figure 4a This is a perspective view of an RFID electronic component according to an embodiment of this application. Figure 4b This is an unfolded view of the antenna of an RFID electronic component according to one embodiment of this application.

[0020] Figure 5 This is a perspective view of another RFID electronic component according to an embodiment of this application.

[0021] Figures 6a-6bThis is a comparison chart showing the frequency sweep test results of a conventional RFID tag and the RFID tag in this embodiment after undergoing high temperature and high pressure testing.

[0022] Figure 7 This is a cross-sectional view of an RFID tag according to another embodiment of this application.

[0023] Figures 8a-8b An exploded view of the RFID electronic components of an RFID tag according to another embodiment of this application.

[0024] Figure 9 This is a schematic diagram showing the installation direction of the RFID tag according to an embodiment of this application.

[0025] Figure 10 This is a cross-sectional view of an RFID tag with a stop device according to an embodiment of this application. Detailed Implementation

[0026] The present application will now be described in detail with reference to the accompanying drawings and specific embodiments. This application provides detailed embodiments and specific operating procedures, but the scope of protection of this application is not limited to the embodiments described below.

[0027] For ease of description, spatial relative terms such as "below," "under," "down," "above," "up," etc., may be used to describe the relationship of one element or characteristic relative to another element or characteristic as shown in the figure. It should be understood that spatial relative terms are intended to include different orientations of the device used or operated in addition to those shown in the figure.

[0028] This application is described in detail with reference to the schematic diagrams. When describing the embodiments of this application, for ease of explanation, the cross-sectional views of the device structure are partially enlarged and not in proportion to the general scale. Moreover, the schematic diagrams are only examples and should not limit the scope of protection of this application.

[0029] Unless otherwise defined, the technical or scientific terms used in the claims and description shall have the ordinary meaning understood by one of ordinary skill in the art to which this application pertains. The terms "comprising" or "including" and similar expressions used in this application and in the claims mean that the elements or objects preceding "comprising" or "including" encompass the elements or objects listed following "comprising" or "including" and their equivalents, and do not exclude other elements or objects.

[0030] <An RFID tag of one embodiment>

[0031] Figure 1This is a cross-sectional view of an RFID tag 10 according to an embodiment of this application. The RFID tag 10 includes a housing 100, an inner housing 200, and an RFID electronic component 300. The RFID electronic component 300 is sealed within the inner housing 200. The lower surface of the inner housing 200 has a limiting hole 202. The housing 100 completely encloses the inner housing 200 to form a seamless, integrally molded structure.

[0032] The outer casing 100 has a limiting post 112 protruding from the upper surface of the bottom 110, and the limiting post 112 of the outer casing 100 corresponds to the limiting hole 202 of the inner casing 200. When the RFID tag 10 is subjected to strong vibration in actual application, the limiting post 112 can limit the vibration and displacement of the inner casing 200, prevent the inner casing 200 from separating from the outer casing 100 due to vibration, reduce the vibration impact directly acting on the RFID electronic component 300, thereby enhancing the reliability of the RFID tag 10.

[0033] The outer shell 100 is formed from a high-temperature resistant, high-strength alloy plastic material through an integral injection molding process. The outer shell 100 uses a high-temperature resistant, high-strength alloy plastic with a melting point above 300℃. The alloy plastic can be a polymer of polyetheretherketone (PEEK) and polytetrafluoroethylene (PTFE) or a polymer of polyetheretherketone and nylon (PA), and glass reinforcement fibers or carbon fibers are added to improve the alloy strength.

[0034] The outer shell 100 is injection molded in one piece using a full-encapsulation injection molding process, so there are no openings or seams, rather than a spliced ​​structure, which gives the outer shell 100 a high degree of sealing.

[0035] Typically, hermetic encapsulation structures employ ultrasonic welding, potting, or adding sealing rings at the junction of the encapsulation shell. These methods achieve a maximum waterproof rating of IP68. Ultrasonic welding generally results in weld widths less than 0.5mm and very weak weld strength, unable to withstand high pressure. Potting is a method for moisture and water protection at normal temperature and pressure, but the bonding force between the adhesive and the shell generally does not exceed a shear strength of 50MPa, making it unsuitable for products used under high temperature and pressure. Sealing ring structures use flexible sealing rings to fill spaces that rigid materials cannot, requiring a strong structure to compress the sealing ring, such as metal screws or metal fittings. Its sealing effect is highly dependent on the material of the sealing ring and the degree of compression, making it unsuitable for small-sized RFID products.

[0036] If a two-stage injection molding process is used, a primary injection-molded shell is first formed as a support component. This primary shell is then placed in a mold and a secondary injection molding process is performed to form a secondary injection-molded shell. The resulting package structure appears to have the electronic components completely encased in the secondary injection-molded shell, which is made of the same material. However, in reality, the support component formed in the primary injection molding and the secondary injection-molded shell are not fused together; there are micron-sized gaps between them. This allows liquids or moisture to infiltrate through these gaps under high temperature and pressure. Similarly, two-color injection molding is similar to two-stage injection molding. The secondary injection typically uses a material with a lower temperature than the primary injection. In this type of injection molding, gaps still exist between the two materials in the resulting package structure, making it impossible to guarantee a tight seal under high pressure.

[0037] The one-time injection molding process of this application uses ejector pin support, and during the injection process, the ejector pin is controlled by a controller to retract at an appropriate time, so that the position originally occupied by the ejector pin can still be filled by the flowing molten plastic material without leaving any seams.

[0038] Figure 2 This is a schematic diagram of the full-enclosure injection molding process for an embodiment. After assembly, the inner shell 200 is placed inside the mold 400 used to form the outer shell 100. The mold 400 has a glue inlet 402 at its top. High-temperature molten plastic flows into the mold 400 through the glue inlet 402 to fill the space between the inner shell 200 and the mold 400.

[0039] The lower surface of the inner shell 200 has a limiting hole 202, into which an ejector pin 404, which extends into the mold 400, extends to support the inner shell 200. Preferably, the lower surface of the inner shell 200 may have multiple limiting holes 202 for more secure support by multiple ejector pins 404. The ejector pins 404 are inserted into the limiting holes 202, so that the inner shell 200 is centered within the mold 400. This can advantageously ensure uniform thickness of the injection-molded outer shell 100 and improve the sealing performance of the outer shell 100.

[0040] Ejector pin 404, made of a thermally conductive metal (e.g., steel), is coupled to temperature sensor 406. As molten plastic flows into mold 400, the temperature inside mold 400 gradually increases. When the molten plastic reaches the position of ejector pin 404, the temperature of ejector pin 404 rises rapidly.

[0041] Temperature sensor 406 senses that the temperature of ejector pin 404 has reached the predetermined temperature threshold range t0. Ejector pin controller 408 controls ejector pin 404 to quickly exit mold 400, so that molten plastic continues to flow and fills the remaining space at the bottom of limiting hole 202 and mold 400, thereby forming limiting post 112 and bottom 110 of the outer shell.

[0042] During injection molding, if the ejector pin 404 exits the mold 400 before its temperature reaches the temperature threshold range t0, or if the ejector pin 404 exits too quickly, the amount of high-temperature molten plastic flowing into the bottom of the mold 400 may be insufficient or may not have fully reached the bottom. After the ejector pin 404 exits, the inner shell 200 may descend due to gravity, resulting in an excessively thin bottom 110 of the outer shell 100, or the inner shell 200 may directly descend to the bottom of the mold 400, leading to incomplete encapsulation of the inner shell 200 by the outer shell 100. If the bottom 110 of the outer shell is too thin, the plastic around the limiting post 112 will be fragile and prone to cracking, leading to liquid leakage under high temperature and pressure.

[0043] When the ejector pin 404 is within the temperature threshold range t0, the ejector pin 404 exits the mold 400, and the bottom of the mold 400 has sufficient plastic support for the inner shell 200. The thickness of the bottom 110 of the resulting outer shell 100 is preferably in the range of 0.8 mm to 1.5 mm. After testing, this thickness is strong enough to resist liquid intrusion under high temperature and high pressure (200°C, 150 MPa).

[0044] If the ejector pin 404 exits the mold 400 only after its temperature exceeds the temperature threshold range t0, or if the ejector pin 404 exits after an excessively long injection time, the plastic has already reached the area around the ejector pin for some time and begun to solidify. In this state, the plastic has poor flowability and cannot completely fill the interior of the limiting hole 202 of the inner shell 200, or the plastic inside the limiting hole 202 may separate from the plastic in other areas. This can also lead to liquid leakage under high temperature and pressure.

[0045] Of course, the temperature threshold range t0 is determined by the high-temperature molten plastic material used in injection molding. Polyphenylene sulfide with a melting point of 330°C, polymers of polyetheretherketone (PEEK) and polytetrafluoroethylene (PTFE) with melting points above 300°C (e.g., 380 / 450°C), or polymers of PEEK and nylon (PA) can be used. During injection molding, the mold 400 is set at approximately 200°C, and the temperature threshold range t0 is a temperature range slightly lower than the processing temperature of the high-temperature molten plastic, determined after multiple tests based on the material properties (e.g., flowability, crystallinity, material strength, temperature resistance, weather resistance).

[0046] To protect the RFID electronic component 300 from direct thermal shock, the RFID electronic component 300 is sealed inside the inner shell 200. Figure 3a This is a perspective view of the inner shell 200 as seen from below. Figure 3b This is an exploded view of the inner shell 200, and Figure 3c This is a perspective view of the bottom of the upper shell of the inner shell 200.

[0047] In order to withstand the high temperature of the molten plastic during the injection molding process, the inner shell 200 can be formed of high-temperature resistant and high-strength plastic materials (e.g., polyetheretherketone, polyphenylene sulfide (PPS), polytetrafluoroethylene (PTFE), etc.).

[0048] The inner shell 200 includes an upper shell 210 and a lower shell 220. The lower surface of the upper shell 210 includes multiple limiting posts 212 and recessed sidewalls 214, and the upper surface of the lower shell 220 includes multiple limiting holes 222 and protruding sidewalls 224. The limiting posts 212 of the upper shell 210 correspond to the limiting holes 222 of the lower shell 220 in terms of position, shape, and size, and the recessed sidewalls 214 of the upper shell 210 correspond to the protruding sidewalls 224 of the lower shell 220 in terms of shape and size. This allows the limiting posts 212 of the upper shell 210 to be inserted into the limiting holes 222 of the lower shell 220 when the upper shell 210 and the lower shell 220 are pressed together, and the recessed sidewalls 214 of the upper shell 210 to surround the protruding sidewalls 224 of the lower shell 220 from the outside, preventing high-temperature molten plastic from entering the cavity 230 of the inner shell 200 and directly causing high-temperature impact on the RFID electronic component 300. A groove 226 is formed on the side wall of the inner surface of the inner shell 200. When the RFID electronic component 300 is placed inside the inner shell 200, the chip can be accommodated in the groove 226, thereby avoiding direct impact from the inner shell 200 on the chip during vibration and improving the vibration resistance of the RFID tag 10.

[0049] In addition, the inner shell 200 itself has a certain heat insulation effect, which prevents the heat of the high-temperature molten plastic from being immediately transferred to the RFID electronic component 300, thus reducing the high-temperature impact on the RFID electronic component 300.

[0050] Although referenced here Figures 3a-3c Having described this corresponding structure, those skilled in the art will understand that the mating structure of the upper shell 210 and the lower shell 220 can also be formed in reverse, that is, the upper shell 210 forms a limiting hole and / or protruding sidewalls and the lower shell 220 forms a limiting post and / or recessed sidewalls, as long as the upper shell 210 and the lower shell 220 can fit together tightly. In addition to pressing together by limiting and tight fitting, the upper shell 210 and the lower shell 220 can also be fixed together by ultrasonic waves or high-temperature adhesives, as long as it is ensured that the high-temperature molten plastic does not enter the interior of the inner shell 200 during the injection molding process of the outer shell 100.

[0051] Furthermore, a weld line 228 may be formed on the lower surface of the inner shell 200. At high temperatures, the weld line 228 melts and fuses with the high-temperature molten plastic used to form the outer shell 100, thereby enhancing the connection between the inner shell 200 and the outer shell 100.

[0052] Figure 4aThis is a perspective view of an RFID electronic component 300 according to an embodiment of this application. Figure 4b This is an unfolded view of the antenna of an RFID electronic component 300 according to an embodiment of this application.

[0053] The RFID electronic component 300 includes an RFID chip 310, an antenna 320, and a substrate 330. The substrate 330 is formed of a high-temperature resistant dielectric material (such as ceramic, high-temperature resistant PCB board, glass, or polyetheretherketone (PEEK)).

[0054] Antenna 320 is formed of a continuous metal sheet with good conductivity and high temperature resistance, and is attached to substrate 330 by bending and wrapping around the four surfaces of substrate 330. Antenna 320 includes a radiating surface 322, chip connection surfaces 324a and 324b, a ground plane 326, and an impedance matching surface 328. The radiating surface 322 and the ground plane 326 are electrically connected through the impedance matching surface 328, the chip connection surface 324a is electrically connected to the radiating surface 322, and the chip connection surface 324b is electrically connected to the ground plane 326. The radiating surface 322 can be formed into shapes such as oblique triangle, circle, square, and rhombus. RFID chip 310 is soldered between chip connection surfaces 324a and 324b.

[0055] Preferably, the antenna 320 can be formed of materials such as copper or stainless steel, giving it good temperature resistance and ductility, thus making it less susceptible to damage during the high-temperature injection molding process of the housing 100. Furthermore, the antenna 320 formed of such materials has a certain degree of elasticity, which can act as a buffer during vibration to protect the solder joints of the RFID chip 310. Additionally, preferably, the antenna 320 can be gold-plated or tin-plated to ensure good soldering between the antenna 320 and the RFID chip 310.

[0056] Figure 5 This is a perspective view of another RFID electronic component 300' according to an embodiment of this application. The RFID electronic component 300' includes a loop antenna 510 and a main antenna 520. The loop antenna 510 includes a chip 512 and a loop antenna conductor 514. The loop antenna conductor 514 is connected to both ends of the chip 512 and is constructed as a loop together with the chip 512.

[0057] The main antenna 520 includes a block 522 and a metal pattern 524 coated on the surface of the block 522. The block 522 may be formed of a high-temperature resistant dielectric material (such as ceramic), and the metal pattern 524 may be formed of silver. The metal pattern 524 is formed to substantially coat the block 522, and the upper surface of the block 522 is formed in an open-circuit state with a gap of width SL.

[0058] A loop antenna 510 is positioned above and coupled to the main antenna 520. The loop antenna 510 and the main antenna 520 are separated by an insulator 530. When the RFID tag vibrates, the coupling inductance can compensate for the difference in electric field strength caused by the vibration, thereby enhancing the reliability of the RFID tag in a vibration environment.

[0059] In this RFID electronic component 300', the open-type main antenna 520 can provide an extended impedance bandwidth. Various impedance tuning bandwidths can be flexibly adjusted by regulating the antenna conductor lengths FL on both sides of the chip 512. Furthermore, the loop antenna 510 and the main antenna 520 are physically spaced apart, rather than the chip being directly connected to the main antenna 520, making the tag performance less sensitive to differences in the tag manufacturing process and improving the tag reading distance.

[0060] Under high temperature and pressure, the outer shell formed by conventional sealing methods (e.g., potting, ultrasonic treatment) is not sufficiently sealed, allowing liquid to enter the RFID tag through tiny gaps. High pressure may even crack the RFID chip, causing the RFID tag's radio frequency performance to fail. If there is air inside the RFID tag, high pressure may indent the outer shell. The solder pads at the bottom of conventional RFID tags cave inward under pressure, physically damaging the chip. In contrast, the high-strength, high-sealing RFID tag 10 of this embodiment, even after being placed in a high-temperature, high-pressure, and strong-vibration environment for a period of time, still prevents liquid ingress, preserves its internal RFID electronic components, and can be identified by a reader.

[0061] Furthermore, liquids have a high dielectric constant, and liquid adhering to the antenna surface will cause a frequency shift to lower frequencies. Therefore, the sealing performance of RFID tags can be determined by performing a frequency sweep test. Figure 6a and Figure 6bThe results of frequency sweep tests on conventional RFID tags and RFID tag 10 of this embodiment after undergoing high-temperature and high-pressure testing are compared. After 5 hours in a high-temperature and high-pressure environment, the frequency of a conventional RFID tag decreased from 925MHz to 885MHz, and its peak reading distance decreased from 3.8m to 2.8m. In particular, the reading distance in the US band (902 MHz~928 MHz) decreased from 3.8m to about 1m, resulting in a significant reduction in reading stability and reliability. The RFID tag 10 of this embodiment was placed in the high-temperature and high-pressure test standard specified in GB / T 20174-2019 (temperature 200℃, liquid pressure 150Mpa, liquid medium is aviation hydraulic oil) for 2-5 hours as one cycle. After three cycles, the RFID tag 10 of this embodiment showed no liquid leakage, no frequency shift, and no change in reading distance. Furthermore, according to the IEC 60068 standard, under the action of sinusoidal random vibration at a temperature of 180°C and a frequency of 5~500Hz, after each of the X-axis, Y-axis and Z-axis has been continuously vibrating for 3 hours, the RFID tag 10 in this embodiment still maintains no surface damage, no radio frequency signal attenuation and no frequency shift, thus meeting the requirements for the tag's vibration resistance.

[0062] <Another embodiment of the RFID tag>

[0063] Figure 7 This is a cross-sectional view of an RFID tag 800 according to another embodiment of this application. Figure 8a This is a diagram showing the unfolded RFID electronic component 820 antenna of the RFID tag 800. Figure 8b This is a 3D view of the RFID electronic component 820 substrate.

[0064] The RFID tag 800 includes a housing 810 and an RFID electronic component 820. The housing 810 completely encloses the RFID electronic component 820 and is a seamless, one-piece structure. The structure, material, and injection molding method of the housing 810 are similar to those of the housing 100 of the aforementioned RFID tag 10.

[0065] The RFID electronic component 820 comprises a substrate 822, a chip 824 and an antenna 826. The structure of the RFID electronic component 820 is similar to that of the aforementioned RFID electronic component 300, with the differences that: the substrate 822 is made of a hard substrate material that does not deform at high temperatures (such as ceramic), the chip 824 and the antenna 826 are welded by a high melting point solder, the surface of the chip 824 is covered by a high temperature resistant colloid 828, and the lower surface of the RFID electronic component 820 is provided with a limiting hole 830. The structure and function of the limiting hole 830 of the RFID electronic component 820 are the same as those of the limiting hole 202 of the inner casing 200 of the aforementioned RFID tag 10. Preferably, the high temperature resistant colloid 828 is made of a material capable of withstanding a temperature above 380°C (for example, casting glue, epoxy glue, etc.). The high temperature resistant colloid 828 is coated on the surfaces of the chip and welding spots to achieve a heat insulation effect, reducing the thermal impact of high-temperature molten plastic on the chip and the impact of injection molding pressure on the chip.

[0066] <Installation of RFID Tag>

[0067] The polarization direction of an RFID tag is usually linear polarization. When an RFID tag is mounted on an elongated metal surface, if the polarization direction of the RFID tag is consistent with the length direction of the metal, the resonance and reflection of the electromagnetic field in the length direction will increase the backscattering cross section (RCS) of the tag, and improve the reading sensitivity and recognition distance. If the polarization direction of the RFID tag is perpendicular to the length direction of the metal, that is, consistent with the width direction, and the metal width dimension is less than one wavelength (about 325 mm) in the UHF frequency band, the resonance and reflection of the electromagnetic field in the width direction cannot enhance the backscattering cross section (RCS) of the tag, but may weaken it instead. Therefore, in order to ensure the reading distance of the RFID tag, it is necessary to make the polarization direction of the installed RFID tag consistent with the extending direction of the metal length of the installed device 1000 (for example, a drill rod), as Figure 9 shown.

[0068] As mentioned above, an external thread is formed on the outer side surface of the RFID tag, which cooperates with an internal thread on the installed device 1000 to mount the RFID tag on the device 1000. However, threaded installation cannot control the final fixing direction.

[0069] For this purpose, an RFID tag with a stopper is provided, as Figure 10As shown, a stop 1104 is formed on the top of the external thread 1102 on the outer side of the RFID tag 1100. The stop 1104 can mate with the internal thread and stop assembly on the installed device (e.g., drill pipe). When the RFID tag 1100 is initially screwed into the installation position, the stop 1104 is in a compressed state. As the RFID tag 1100 continues to be screwed in until the appropriate direction and depth are reached, the stop 1104 is precisely aligned with and mates with the stop assembly on the device. At this point, the RFID tag 1100 is in the optimal installation position and optimal operating state.

[0070] This concludes the description of RFID tags and their installation. By incorporating a seamless, one-piece shell that completely encloses the inner casing or RFID electronic components, RFID tags achieve high strength, high sealing, and high reliability. This ensures that even after prolonged exposure to high temperature, high pressure, and strong vibration environments, no liquid enters the RFID tag, the tag's structure remains intact, and its reading performance remains unchanged.

[0071] It should be understood that the above description is illustrative and not restrictive. The above embodiments (and / or aspects thereof) can be combined with each other. Furthermore, modifications can be made to adapt particular situations or materials to the teachings of the various embodiments of this application without departing from the scope of this invention. The dimensions and types of materials described herein are used to define parameters of the various embodiments of this application, but the embodiments are not restrictive but exemplary. Many other embodiments will become apparent to those skilled in the art upon reading the above description. Therefore, the scope of the various embodiments of this application should be determined by reference to the appended claims and the full scope of their equivalents.

Claims

1. An RFID tag, characterized in that, The RFID tag includes: RFID electronic components; An inner shell, in which the RFID electronic component is sealed, and the lower surface of the inner shell has a limiting hole; and The outer shell completely encloses the inner shell and is a seamless, integrally formed structure. The outer shell has a limiting post protruding from the upper surface of the bottom, and the limiting post corresponds to the limiting hole.

2. The RFID tag as claimed in claim 1, wherein the thickness of the bottom of the outer casing is in the range of 0.8 mm to 1.5 mm.

3. The RFID tag as claimed in claim 1, wherein the inner shell comprises: The upper and lower shells fit together tightly.

4. The RFID tag of claim 1, wherein the lower surface of the inner shell is formed with a weld line.

5. The RFID tag of claim 1, wherein the housing is formed of an alloy plastic material.

6. The RFID tag of claim 1, wherein the RFID electronic component comprises: substrate; chip; as well as A metal sheet antenna is attached to the surface of the substrate and connected to both ends of the chip.

7. The RFID tag of claim 1, wherein the RFID electronic component comprises: A loop antenna, comprising a chip and a loop antenna conductor, wherein the loop antenna conductor is connected to both ends of the chip and is constructed as a loop together with the chip; as well as The main antenna comprises a block and a metal pattern coated on the surface of the block. The loop antenna is disposed above and coupled to the main antenna, and the loop antenna and the main antenna are separated by an insulator.

8. The RFID tag of claim 1, wherein the top side of the housing has a stop that can cooperate with a stop component on the device on which the RFID tag is mounted to fix the mounting orientation of the RFID tag.

9. The RFID tag of claim 8, wherein the polarization direction of the installed RFID tag is consistent with the metal length extension direction of the RFID tag mounting device.

10. An RFID tag, characterized in that, The RFID tag includes: An RFID electronic component, wherein the lower surface of the RFID electronic component has a limiting hole, the RFID electronic component comprising: substrate; Chips; and A metal sheet antenna, the metal sheet antenna being attached to the surface of the substrate and connected to both ends of the chip, the surface of the chip being covered by an adhesive; and The housing completely encloses the RFID electronic components and is a seamless, one-piece structure. The housing has a limiting post protruding from the upper surface of the bottom, and the limiting post corresponds to the limiting hole.

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