Display module and electronic device

Abstract

The application provides a display module and an electronic device. The display module comprises a display panel and a flexible circuit board. The display panel comprises a first part and a first binding area which are arranged in layers. The first binding area and the flexible circuit board are arranged on a side of a support layer away from the first binding area. The flexible circuit board comprises a second part, a third part and a second binding area which are connected in sequence. The second part is connected to the support layer. The second binding area is connected to the first binding area. The second binding area is located on a side of the first binding area away from the support layer. The third part is located between the second part and the second binding area. A first gap is formed between the third part and the support layer. The first gap extends along a first direction. First sealing parts are arranged at both ends of the first gap along the first direction. Thus, the first sealing parts can seal the first gap. The first sealing parts and the first gap form a sealed cavity. The waterproof and corrosion-resistant performance of the second binding area of the flexible circuit board is improved.

Description

Technical Field

[0001] This application relates to the field of electronic technology, and more particularly to a display module and an electronic device. Background Technology

[0002] As the environments in which mobile phones and other electronic devices are used become increasingly complex, the requirements for waterproofing are becoming more stringent. Waterproofing and corrosion resistance will affect consumer experience and product quality.

[0003] The electronic device includes a display module and a flexible circuit board disposed on the side opposite to the light-emitting surface of the display module. The flexible circuit board can be bonded to the display module; however, the waterproof and corrosion-resistant performance is poor near the second bonding area between the flexible circuit board and the display module. Utility Model Content

[0004] This application provides a display module and an electronic device that solves the problem of poor waterproof and corrosion-resistant performance near the second bonding area between the flexible circuit board and the display module.

[0005] To achieve the above objectives, the embodiments of this application adopt the following technical solutions:

[0006] A first aspect of this application provides a display module, comprising: a display panel, a support layer, and a flexible circuit board. The support layer is disposed on the side of the display panel opposite to the light-emitting surface. The display panel includes: a first portion and a first bonding area, with the support layer located between the first portion and the first bonding area. Both the first bonding area and the flexible circuit board are disposed on the side opposite to the support layer and the first portion. The flexible circuit board includes: a second portion, a third portion, and a second bonding area connected sequentially. The second portion is connected to the support layer, and the second bonding area is connected to the first bonding area, located on the side of the first bonding area away from the support layer. The third portion is located between the second portion and the second bonding area. A first gap exists between the third portion and the support layer, extending along a first direction. First sealing portions are provided at both ends of the first gap along the first direction, and each first sealing portion is connected to the support layer. Thus, by providing the first sealing portions, the first gap can be sealed, and the first sealing portions and the first gap form a sealed cavity, improving the waterproof and corrosion-resistant performance of the second bonding area of ​​the flexible circuit board.

[0007] In one alternative implementation, the first bonding area and the second portion are arranged along a second direction, and the first bonding area is connected to the support layer. Thus, the flexible circuit board and the first bonding area of ​​the display panel are laid flat, facilitating the installation of a sealing portion.

[0008] In one optional implementation, the second part includes: a first sub-part, a second sub-part, and a third sub-part connected to each other. The second sub-part and the first bonding area are arranged along a second direction, and the first sub-part, the first bonding area, and the third sub-part are arranged along a first direction. The first sub-part and the first bonding area have a second gap, and the third sub-part and the first bonding area have a third gap. Both the second gap and the third gap are connected to the first gap. The display module further includes: a shielding layer located on the side of the display module away from the light-emitting surface. The shielding layer, the support layer, the first sub-part, the first bonding area, and the first sealing part form a first cavity. The first adhesive layer, the fatigue layer, the third sub-part, the first bonding area, and the first sealing part form a second cavity. The support layer, the third part, the first bonding area, and the second sub-part form a third cavity, and the third cavity is connected to the first cavity and the second cavity. Therefore, the shielding layer in the display module can be reused, and the gap between the flexible circuit board and the first bonding area of ​​the display panel can be sealed together by the first sealing part and the shielding layer, so as to prevent moisture in the external environment from invading and causing corrosion and failure of the second bonding area.

[0009] In one alternative implementation, the shielding layer includes electromagnetic shielding tape. Therefore, the shielding layer can also achieve electromagnetic shielding.

[0010] In one alternative implementation, the support layer, the third portion, the first bonding area, the second portion, and the first sealing portion form a fourth cavity. Thus, the first sealing portion seals the gap between the flexible circuit board and the first bonding area of ​​the display panel, preventing moisture intrusion from the external environment from causing corrosion and failure of the second bonding area.

[0011] In one optional implementation, the display module further includes a first adhesive layer and a second adhesive layer. The first bonding area is connected to the support layer via the first adhesive layer, the second portion is connected to the support layer via the second adhesive layer, the first sealing portion is connected to the first bonding area via the first adhesive layer, and the first sealing portion is connected to the second portion via the second adhesive layer. This connection between the first sealing portion and the adhesive layers provides higher connection stability and better sealing.

[0012] In one alternative implementation, the first adhesive layer includes foam adhesive; the second adhesive layer includes backing adhesive. Thus, the adhesive layers can achieve both bonding and sealing functions.

[0013] In one optional implementation, the first bonding area and the second portion are stacked, with the first bonding area located on the side of the second portion away from the support layer. The third portion is arc-shaped, and the third portion and a portion of the first sealing portion form a fifth cavity. The third portion, the support layer, and another portion of the first sealing portion form a sixth cavity. Thus, the flexible circuit board is stacked with the first bonding area of ​​the display panel, and the first sealing portion can also be used to seal the second bonding area of ​​this type of flexible circuit board.

[0014] In one alternative implementation, the first sealing part is formed by dispensing adhesive. This simplifies the forming process of the first sealing part and reduces production costs.

[0015] In one alternative implementation, the material of the first sealing part includes a UV-curable adhesive. Therefore, the first sealing part is easy to cure and has superior sealing performance.

[0016] In one optional implementation, the display module further includes: a cover film and a third adhesive layer overlapping the cover film, wherein both the cover film and the third adhesive layer are located on the side of the second bonding area closer to the first bonding area; the third adhesive layer is located between the second bonding area and the first bonding area, and the cover film is located in the third portion, with the cover film and the third adhesive layer overlapping. Thus, waterproof sealing can be achieved without the need for a first sealing portion, occupying less space and facilitating miniaturization of the device.

[0017] In one alternative implementation, a portion of the third adhesive layer is located between the second bonding area and the first bonding area, and another portion of the third adhesive layer is located within the third area. Therefore, by increasing the width of the first bonding area and the third adhesive layer, the cover film and the third adhesive layer can overlap, thereby improving waterproof and corrosion-resistant performance.

[0018] In one alternative implementation, a portion of the cover film is located in the third part, and another portion of the cover film is located between the second bonding area and the first bonding area. Therefore, the third adhesive layer can be applied to the flexible circuit board before being connected to the first bonding area, resulting in a simpler process and superior waterproof and corrosion-resistant performance.

[0019] In one alternative implementation, the portion of the third adhesive layer that overlaps with the cover film is layered with the cover film. This improves waterproof and corrosion-resistant performance.

[0020] In one alternative implementation, the material of the third adhesive layer includes anisotropic conductive adhesive.

[0021] In one optional implementation, a second sealing portion is provided at the connection point between the third part and the first binding area. The second sealing portion includes a fourth sub-part and a fifth sub-part connected to each other. The surface of the third part facing the support layer and the surface of the first binding area facing the second part are both connected to the fourth sub-part. The fifth sub-part is located on the side of the first binding area away from the second binding area. Therefore, the second sealing portion has a larger coverage area and better waterproof performance.

[0022] In one alternative implementation, the first binding region includes: a first portion of the stacked configuration, a connecting layer, and a backing membrane.

[0023] A second aspect of this application provides a display module, comprising: a display screen, a support layer, a flexible circuit board, a cover film, and a third adhesive layer; the support layer is disposed on the side of the display panel away from the light-emitting surface; the display panel includes: a first portion and a first bonding area stacked together, the support layer being located between the first portion and the first bonding area, the first bonding area and the circuit board being arranged along a second direction, the first bonding area and the circuit board being disposed on the side of the support layer away from the first bonding area; the flexible circuit board includes: a second portion, a third portion, and a second bonding area connected in sequence, the second portion being connected to the support layer, the second bonding area being connected to the first bonding area, the second bonding area being located on the side of the first bonding area away from the support layer; a first gap is formed between the third portion and the support layer; the third adhesive layer is located between the second bonding area and the first bonding area, the cover film is located on the side of the third portion near the light-emitting surface of the support layer, and the third adhesive layer overlaps with the cover film.

[0024] In one alternative implementation, a portion of the third adhesive layer is located between the second bonding region and the first bonding region, and another portion of the third adhesive layer is located in the third region.

[0025] In one alternative implementation, a portion of the cover film is located in the third portion, and another portion of the cover film is located between the second binding area and the first binding area.

[0026] In one alternative implementation, the portion of the third adhesive layer that overlaps with the cover film is stacked with the cover film.

[0027] In one alternative implementation, the material of the third adhesive layer includes anisotropic conductive adhesive.

[0028] A third aspect of this application provides a display module, comprising: a display screen, a support layer, and a flexible circuit board; the support layer is disposed on the side of the display panel away from the light-emitting surface; the display panel includes: a first portion and a first bonding area stacked together, the support layer being located between the first portion and the first bonding area; the first bonding area and the circuit board are arranged along a second direction, the first bonding area and the circuit board being disposed on the side of the support layer away from the first bonding area; the flexible circuit board includes: a second portion, a third portion, and a second bonding area connected sequentially, the second portion being connected to the support layer, and the second bonding area being connected to the support layer. The third part is connected to the first binding area, and the second binding area is located on the side of the first binding area away from the support layer; there is a first gap between the third part and the support layer; a second sealing part is provided at the connection position between the third part and the first binding area, and the second sealing part includes: a fourth sub-part and a fifth sub-part connected to each other, the surface of the third part facing the support layer and the surface of the first binding area facing the second part are both connected to the fourth sub-part, and the fifth sub-part is located on the side of the first binding area away from the second binding area.

[0029] A fourth aspect of this application provides an electronic device comprising: a housing and a display module as described above, wherein the housing is connected to the display module. Therefore, the electronic device employing the aforementioned display module exhibits improved waterproof and corrosion-resistant performance.

[0030] This application provides a display module and an electronic device. The electronic device includes the display module, which includes a display panel. A flexible circuit board is located on the side of the display panel opposite to the light-emitting surface. A second bonding area of ​​the flexible circuit board is bonded to a first bonding area of ​​the display panel. To improve the waterproof performance of the second bonding area and the flexible circuit board near the second bonding area, in some embodiments, a first sealing portion can be provided at both ends of the gap formed between the flexible circuit board and the first bonding area. The first sealing portion and the gap form a sealing cavity to seal the second bonding area of ​​the flexible circuit board and prevent moisture and impurities from entering. The flexible circuit board can be stacked or arranged side-by-side with the first bonding area of ​​the display panel. The gap can be of a regular shape or an irregular shape.

[0031] In other embodiments, the cover film and adhesive layer on the side of the flexible circuit board facing the display module can be adjusted to fully cover the exposed surface of the flexible circuit board facing the display module, reducing the impact of moisture and other factors on the flexible circuit board.

[0032] In other embodiments, the dispensing area of ​​the second bonding area of ​​the flexible circuit board can be adjusted so that the adhesive rises from near the second bonding area to the side of the first bonding area away from the second bonding area, resulting in a better sealing effect and reducing the impact of moisture and other factors on the second bonding area of ​​the flexible circuit board.

[0033] The above solutions are all single waterproof structures. In other embodiments, one or more of the above waterproof structures can be combined to achieve multiple waterproofing. Attached Figure Description

[0034] Figure 1 This is a schematic diagram of the structure of an electronic device provided in an embodiment of this application;

[0035] Figure 2 This is a schematic diagram of the structure of a candybar mobile phone provided in an embodiment of this application;

[0036] Figure 3 This is a schematic diagram of the structure of a flexible screen mobile phone provided in an embodiment of this application;

[0037] Figure 4 This is a schematic diagram of a cross-sectional structure of a display module;

[0038] Figure 5 A schematic diagram of a structure in which a flexible circuit board is disposed on the surface of a display module;

[0039] Figure 6 for Figure 5 The image shows a cross-sectional view of the AA section of the display module;

[0040] Figure 7 This is a schematic diagram of a display module with a flexible circuit board disposed on its surface, provided in an embodiment of this application.

[0041] Figure 8 for Figure 7 The BB cross-sectional view of the display module is shown in the middle;

[0042] Figure 9 This is a schematic diagram of another display module with a flexible circuit board on its surface provided in an embodiment of this application;

[0043] Figure 10 This is a schematic diagram of another display module with a flexible circuit board on its surface provided in an embodiment of this application;

[0044] Figure 11 This is a schematic diagram of another display module with a flexible circuit board on its surface provided in an embodiment of this application;

[0045] Figure 12 for Figure 11 The image shows a CC cross-sectional view of the display module.

[0046] Figure 13 A schematic diagram of the connection structure between the first bonding area of ​​a display panel and a flexible circuit board provided in an embodiment of this application;

[0047] Figure 14This is a schematic diagram of pressing the first binding area of ​​the display panel with a pressure head, as provided in an embodiment of this application.

[0048] Figure 15 A schematic diagram of the connection structure between the first bonding area of ​​a display panel and a flexible circuit board provided in an embodiment of this application;

[0049] Figure 16 Schematic diagram of the third adhesive layer attachment structure for flexible circuit boards

[0050] Figure 17 for Figure 15 The diagram shown is a schematic of the module assembly.

[0051] Figure 18 A schematic diagram of the connection structure between the first bonding area of ​​a display panel and a flexible circuit board;

[0052] Figure 19 A schematic diagram of the connection structure between the first bonding area of ​​a display panel and a flexible circuit board provided in an embodiment of this application;

[0053] Figure 20 This is a schematic diagram of another display module with a flexible circuit board on its surface provided in an embodiment of this application;

[0054] Figure 21 This is a schematic diagram of another display module with a flexible circuit board on its surface provided in an embodiment of this application. Detailed Implementation

[0055] To make the objectives, technical solutions, and advantages of this application clearer, the application will now be described in further detail with reference to the accompanying drawings.

[0056] In the following description, the terms "first," "second," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first," "second," etc., may explicitly or implicitly include one or more of that feature. In the description of this application, unless otherwise stated, "a plurality of" means two or more.

[0057] Furthermore, in this application, directional terms such as "upper" and "lower" are defined relative to the orientation of the components shown in the accompanying drawings. It should be understood that these directional terms are relative concepts, used for relative description and clarification, and can change accordingly depending on the orientation of the components in the accompanying drawings.

[0058] This application provides an electronic device. This electronic device can be a tablet computer, mobile phone, e-reader, remote control, personal computer (PC), laptop computer, personal digital assistant (PDA), in-vehicle device, smart TV, wearable device, television set, or other products with a display interface, as well as smart display wearable products such as smartwatches and smart bracelets. This application does not impose any special limitations on the form of the above-mentioned electronic device. For ease of explanation, the following embodiments all use a mobile phone as an example for illustration.

[0059] Figure 1 This is a schematic diagram of the structure of an electronic device provided in an embodiment of this application. Figure 1 As shown, the electronic device 1 includes a display module 10, a mid-frame 11, and a battery cover (or housing) 12. The mid-frame 11 is located between the display module 10 and the housing 12.

[0060] Display module 10 is used to display images.

[0061] The display module 10, the middle frame 11, and the housing 12 can be disposed on different layers in the thickness direction of the electronic device, and these layers can be parallel to each other.

[0062] Display module 10 can be used as follows Figure 1 The flexible printed circuit (FPC) shown passes through the middle frame 11 and is electrically connected to the PCB disposed on the middle frame 11. This allows the PCB to transmit display data to the display module 10 to control the display module 10 to display images.

[0063] The middle frame 11 is located between the display module 10 and the housing 12. The surface of the middle frame 11 away from the display module 10 is used to mount internal components such as batteries, printed circuit boards (PCBs), cameras, and antennas. After the housing 12 is closed with the middle frame 11, the aforementioned internal components are located between the housing 12 and the middle frame 11.

[0064] The housing 12 is connected to the middle frame 11 to form a cavity for accommodating the aforementioned electronic components such as the PCB, camera, and battery. This prevents external moisture and dust from entering the cavity and affecting the performance of the electronic components.

[0065] This application does not limit the structure of the mobile phone in its embodiments. In some embodiments of this application, such as... Figure 2 As shown, Figure 2This is a schematic diagram of the structure of a candybar mobile phone provided in an embodiment of this application. The mobile phone can be a candybar mobile phone and includes a display screen 10a. The display screen 10a of the candybar mobile phone cannot be bent.

[0066] Alternatively, the phone could also be a foldable phone. In some embodiments, such as Figure 3 As shown, Figure 3 This is a schematic diagram of the structure of a flexible screen mobile phone provided in an embodiment of this application. The mobile phone can also be a foldable screen mobile phone. The foldable screen mobile phone includes: a flexible display screen 10b, which includes a first non-bending area 10b1, a second non-bending area 10b2, and a bending area 10b3 located between the first non-bending area 10b1 and the second non-bending area 10b2.

[0067] Figure 4 This is a schematic cross-sectional view of a display module. Figure 4 As shown, the display module 10 includes: a cover plate 103, a polarizer 102 (POL), a display panel 100, and a support layer 104 stacked together, with the support layer 104 disposed on the side opposite to the light-emitting surface of the display panel 100.

[0068] The polarizer 102 is disposed on the light-emitting surface side of the display panel 100, and the cover plate 103 is disposed on the side of the polarizer 102 facing away from the display panel 100. The display panel 100 is disposed between the polarizer 102 and the support layer 104. The polarizer 102 is used to convert unpolarized light into polarized light, or to change the polarization direction of polarized light.

[0069] The display panel 100 is a layer used to implement display functions, which can convert electrical signals into visual information. In some embodiments, the display panel 100 is a screen display control panel (PNL). The support layer 104 is disposed below the display panel 100 and can play a role in buffering and protection.

[0070] In some embodiments, the support layer 104 includes a back film (BF). Exemplarily, the material of the support layer 104 may include at least one of thermoplastic polyurethanes (TPU), polypropylene, polyethylene terephthalate (PET), or polyimide (PI).

[0071] In other embodiments, the support layer 104 includes a protective layer 1041 and a support member 1042 (Bracket). The protective layer 1041 may be a back film (BF). For example, the material of the protective layer 1041 may be polyethylene terephthalate (PET).

[0072] In some embodiments, the display module 10 further includes an adhesive layer 101 disposed between the cover plate 103 and the polarizer 102 for bonding the cover plate 103 and the polarizer 102. For example, the adhesive layer 101 may be made of optical adhesive or the like.

[0073] Understandable. Figure 4 The stacked structure of the display module 10 shown is merely exemplary. The stacked structure of the display module 10 varies for different types of electronic devices, and will not be described in detail here.

[0074] Figure 5 This is a schematic diagram of a structure in which a flexible circuit board is disposed on the surface of a display module. Figure 5 As shown, the back of the display module is provided with a flexible circuit board 20.

[0075] Figure 6 for Figure 5 The image shows a cross-sectional view of module AA. Combined with... Figure 5 and Figure 6 As shown, the display module includes a display panel 100, a support layer 104, and a flexible circuit board 20. The support layer 104 is disposed on the side of the display panel 100 that is away from the light-emitting surface.

[0076] The display panel 100 includes a first portion 1001 and a first binding area 1003, and a connecting portion 1002 connecting the first portion 1001 and the first binding area 1003, with the support layer 104 located between the first portion 1001 and the first binding area 1003.

[0077] Both the first bonding area 1003 and the flexible circuit board 20 are located on the side opposite to the support layer and opposite to the first bonding area 1003. The first bonding area 1003 is, for example, the bonding area of ​​the display panel 100. The first bonding area 1003 includes a plurality of bonding pads, and the flexible circuit board 20 is connected to one bonding pad.

[0078] The flexible circuit board 20 includes a second portion 201, a third portion 202, and a second bonding area 203 connected in sequence. The second portion 201 is connected to the support layer 104, and the second bonding area 203 is connected to the first bonding area 1003. The third portion 202 is located between the second portion 201 and the second bonding area 203. The second bonding area 203 is, for example, the bonding area of ​​the flexible circuit board 20.

[0079] In some embodiments, the second bonding area 203 of the flexible circuit board 20 is connected to a bonding pad of the first bonding area 1003.

[0080] The third portion 202 and the support layer 104 have a first gap d1, which extends along a first direction. For example, as shown... Figure 5 As shown, the first direction is, for example, the X direction, and the first gap d1 extends along the X direction. The first direction can be the length or width direction of the display module, and for example, it is parallel to the side connecting the first portion 1001 and the first binding area 1003.

[0081] In some embodiments, reference is then made to Figure 6 The display module also includes a first adhesive layer 301 and a second adhesive layer 302. The first bonding area 1003 is connected to the support layer 104 through the first adhesive layer 301, and the second part 201 is connected to the support layer 104 through the second adhesive layer 302.

[0082] This application embodiment limits the structure of the first adhesive layer 301 and the second adhesive layer 302. For example, the first adhesive layer 301 includes foam adhesive; the second adhesive layer 302 includes backing adhesive.

[0083] The flexible circuit board 20 can be a functional device of the flexible circuit board 20 layer of the display panel 100, and the flexible circuit board 20 is connected to the display panel 100.

[0084] The flexible circuit board 20 can be connected to the driving circuit or power supply circuit in the display panel 100 through the first bonding area 1003 to drive the display module to display images or to supply power to the display module.

[0085] In some embodiments, the first bonding area 1003 is provided with a driving chip 40 on the side opposite to the support layer 104, and the driving chip 40 can be sealed around by dispensing adhesive.

[0086] However, the flexible circuit board 20 does not have a waterproof structure on the side facing the light-emitting surface. External moisture and impurities can easily corrode the flexible circuit board 20 after entering the electronic device, causing the flexible circuit board 20 to fail.

[0087] Therefore, this application provides an improved display module. In some embodiments, adhesive can be applied to both ends of the first gap d1: end E1 and end E2, to seal the gap between the flexible circuit board 20 and the first bonding area 1003 and prevent moisture from entering.

[0088] In other embodiments, the cover film and the third adhesive layer may overlap to seal the second bonding area 203 and the third portion 202 of the flexible circuit board 20 facing the light-emitting surface, thereby reducing the impact of moisture and other factors on the second bonding area 203 of the flexible circuit board 20.

[0089] In other embodiments, adhesive can be applied to cover the area where the second bonding area 203 and the first bonding area 1003 of the flexible circuit board 20 are connected, and extend to the surface of the first bonding area 1003 near the light-emitting side, thereby reducing the impact of moisture and other factors on the flexible circuit board 20.

[0090] In other embodiments, the above-mentioned waterproof structures can be combined to achieve double or multiple waterproofing.

[0091] Figure 7 This is a schematic diagram of a display module with a flexible circuit board on its surface, provided in an embodiment of this application. Figure 8 for Figure 7 The image shows a BB cross-sectional view of the module. For example, as shown... Figure 7 , Figure 8 As shown, in some embodiments, the first binding area 1003 and the second portion 201 are arranged along a second direction, and the first binding area 1003 is connected to the support layer 104. For example, the second direction is, for example, the Y direction.

[0092] In some embodiments of this application, the third portion 202 is located between the first binding area 1003 and the second portion 201. The support layer 104, the third portion 202, the first binding area 1003, and the second portion 201 form a cavity with openings at both ends. The display module also includes two first sealing portions: sealing portion 501 and sealing portion 502. Sealing portion 501 is disposed at the end E1 of the first gap d1, and sealing portion 502 is disposed at the end E2 of the first gap d1. Sealing portion 501 and sealing portion 502 can seal the openings at both ends of the third cavity along the first direction.

[0093] In some embodiments of this application, the first binding area 1003 and the second part 201 may both be rectangles, for example.

[0094] In some embodiments of this application, sealing part 501 and sealing part 502 can be directly connected to the first binding area 1003 and the second part 201, and the support layer 104, the third part 202, the first binding area 1003, the second part 201, sealing part 501 and sealing part 502 together form a fourth cavity.

[0095] In other embodiments, the first sealing part can be connected to the first binding area 1003 through the first adhesive layer 301, and the first sealing part can be connected to the second part 201 through the second adhesive layer 302. The first adhesive layer 301, the second adhesive layer 302, the support layer 104, the sealing part 501 and the sealing part 502 together form the fourth cavity.

[0096] This application does not limit the molding process of the first sealing part. In some embodiments, the first sealing part is molded by dispensing adhesive.

[0097] This application does not limit the material of the first sealing part. For example, the material of the first sealing part includes: UV-curable adhesive.

[0098] In the above embodiments, the first binding area 1003 is a regular shape, while in other embodiments, the second part 201 can be an irregular shape.

[0099] Example, Figure 9 This is a schematic diagram of another display module with a flexible circuit board on its surface, provided in an embodiment of this application. Figure 9 As shown, the second part 201 includes: a first sub-part 2011, a second sub-part 2012, and a third sub-part 2013 connected to each other. The second sub-part 2012 and the first binding area 1003 are arranged along a second direction. The first sub-part 2011, the first binding area 1003, and the third sub-part 2013 are arranged along the first direction X. The second sub-part 2012 and the first binding area 1002 have the aforementioned first gap d1. In the above embodiment, the first gap d1 is between the third part 202 and the support layer 104. The first gap d1 is formed, for example, by the third part 202 and the support layer 104 arranged along the z direction, and the second sub-part 2012 and the first binding area 1002 arranged along the y direction.

[0100] Furthermore, the first sub-part 2011 has a second gap d2 with the first binding area 1003, and the third sub-part 2013 has a third gap d3 with the first binding area 1003. Both the second gap d2 and the third gap d3 are connected to the first gap d1.

[0101] Figure 10This is a schematic diagram of another display module with a flexible circuit board on its surface, provided in an embodiment of this application. Figure 10 As shown, the display module also includes a shielding layer 300, which is located on the side of the display module away from the light-emitting surface, and the first sealing part consists of two parts: sealing part 501 and sealing part 502.

[0102] Combination Figure 10 and Figure 4 The sealing part 501 is connected to the shielding layer 300, the support layer 104, the first sub-part 2011 and the first binding area 1003, and the shielding layer 300, the support layer 104, the first sub-part 2011, the first binding area 1003 and the sealing part 501 form a first cavity.

[0103] Combination Figure 10 and Figure 4 The sealing part 502 is connected to the shielding layer 300, the support layer 104, the third sub-part 2013 and the first binding area 1003, and the shielding layer 300, the support layer 104, the third sub-part 2013, the first binding area 1003 and the sealing part 502 form a second cavity.

[0104] Furthermore, the support layer 104, the third part 202, the first binding area 1003, and the second sub-part 2012 enclose a third cavity, which is connected to the first cavity and the second cavity to form an irregular cavity. The projection of the irregular cavity along the XY plane can be concave.

[0105] This application does not limit the material of the shielding layer 300. For example, the shielding layer 300 includes electromagnetic interference tape (EMI tape), which can be used to achieve electromagnetic shielding. In this embodiment, the shielding layer can be formed into cavities with the second gap and the third gap, respectively.

[0106] The display module provided in this embodiment can reuse the shielding layer in the display module. The first sealing part and the shielding layer together seal the gap between the flexible circuit board and the first bonding area of ​​the display panel, thereby preventing corrosion and failure caused by moisture intrusion from the external environment.

[0107] In the above embodiments, the first binding area 1003 and the second portion 201 are located on the same plane, for example, both located on the XY plane, and the first binding area 1003 and the second portion 201 are arranged along the second direction Y. In other embodiments, the first binding area 1003 and the second portion 201 may be stacked along the Z direction. The Z direction, for example, is the thickness direction of the display module. Figure 11This is a schematic diagram of another display module with a flexible circuit board on its surface provided in an embodiment of this application. Figure 11 As shown, the projections of the first binding area 1003 and the second part 201 onto the XY plane at least partially overlap.

[0108] Figure 12 for Figure 11 The image shows a CC cross-sectional view of the display module. (See image.) Figure 12 As shown, the first binding area 1003 is, for example, located on the side of the second part 201 away from the support layer 104, and the second binding area 203 is located on the side of the first binding area 1003 away from the second part 201.

[0109] The second part 201 is connected to the support layer 104 via the first adhesive layer 301, and the first bonding area 1003 is connected to the second part 201 via the second adhesive layer 302. The second bonding area 203 can be connected to the first bonding area 1003 via the adhesive layer 3020. The adhesive layer 3020 can be an adhesive backing.

[0110] The third part 202 is arc-shaped, and a part of the sealing part 501 is connected to one end of the third part 202. The third part 202 and the first sealing part form a fifth cavity. A part of the sealing part 501 is connected to the third part 202 and the support layer 104. The third part 202, the support layer 104 and the first sealing part form a sixth cavity.

[0111] The fifth cavity is connected at one end to the sealing part 501 and at the other end to the sealing part 502. Similarly, the sixth cavity is connected at one end to the sealing part 501 and at the other end to the sealing part 502. This design ensures that both the fifth and sixth cavities are sealed, reducing the impact of external moisture, grease, and other contaminants on the circuit board.

[0112] The above embodiments seal the gap between the flexible circuit board and the first bonding area of ​​the display panel by applying adhesive to both sides. In other embodiments, the film and adhesive layers on the surfaces of the display module and the flexible circuit board can be adjusted to reduce the impact of external impurities on the flexible circuit board.

[0113] Example, Figure 13 This is a schematic diagram illustrating the connection structure between the first bonding area of ​​a display panel and a flexible circuit board, provided in an embodiment of this application. Figure 13 As shown, the display module also includes: a cover layer (CVL) 2021 and a third adhesive layer 303. The cover layer 2021 and the third adhesive layer 303 are both located on the side of the second bonding area 203 close to the first bonding area 1003. The third adhesive layer 303 is located between the second bonding area 203 and the first bonding area 1003. The cover layer 2021 is located in the third portion 202.

[0114] The material of the third adhesive layer 303 is not limited in this application embodiment. In some embodiments, the third adhesive layer 303 includes anisotropic conductive film (ACF).

[0115] In some embodiments, the cover film 2021 and the third adhesive layer 303 are spaced apart, making it easy for external impurities to enter between the cover film 2021 and the third adhesive layer 303, thus affecting the flexible circuit board.

[0116] The display module provided in this application has the cover film 2021 and the third adhesive layer 303 overlapping to avoid gaps between the cover film 2021 and the third adhesive layer 303, thereby reducing the impact of external impurities on the flexible circuit board.

[0117] For example, such as Figure 13 As shown, the third adhesive layer 303 overlaps with the cover film 2021. A portion of the third adhesive layer 303 is located between the second bonding area 203 and the first bonding area 1003, and another portion of the third adhesive layer 303 is located in the third portion 202.

[0118] This application does not limit the overlapping method of the cover film 2021 and the third adhesive layer 303. In some embodiments, the first bonding area 1003 of the display panel can be extended towards the second portion 201, that is, the first bonding area 1003 and the third adhesive layer 303 of the display panel can be widened, so that the cover film 2021 of the flexible circuit board overlaps the first bonding area 1003 of the display panel, and the cover film 2021 and the third adhesive layer 303 form protection for the flexible circuit board, improving its waterproof and corrosion-resistant performance.

[0119] In this embodiment, the thickness of the overlap between the cover film 2021 and the third adhesive layer 303 is greater than the thickness of the third adhesive layer 303, which can easily cause the flexible circuit board to lift when pressed by the pressure head. This embodiment widens the first bonding area 1003 of the display panel. When connecting the cover film 2021 and the third adhesive layer 303 by pressing with the pressure head, sufficient width can be reserved to avoid pressing the overlap between the cover film 2021 and the third adhesive layer 303, thus improving the connection stability of the flexible circuit board. Figure 14 This is a schematic diagram illustrating the pressing of a first bonding area of ​​the display panel by a pressure head, as provided in an embodiment of this application. The pressure head can be, for example, Figure 14 The black square shown.

[0120] In other embodiments, Figure 15 This is a schematic diagram illustrating the connection structure between the first bonding area of ​​a display panel and a flexible circuit board, as provided in an embodiment of this application. Figure 15As shown, a portion of the cover film 2021 is located in the third portion 202, and another portion of the cover film 2021 is located between the second binding area 203 and the first binding area 1003.

[0121] For example, the portion of the third adhesive layer 303 that overlaps with the cover film 2021 is stacked with the cover film 2021 along the z-direction, and the portion of the third adhesive layer 303 that overlaps is located on the side of the cover film 2021 that is away from the third portion 202.

[0122] This application does not limit the manufacturing process of the display module. In some embodiments, the third adhesive layer 303 can be attached to the flexible circuit board with the cover film 2021, such that the third adhesive layer 303 overlaps with the cover film 2021, to obtain the following: Figure 16 The flexible circuit board shown has a third adhesive layer 303. Among them, Figure 16 This is a schematic diagram of the third adhesive layer attachment structure for a flexible circuit board. Next, it can be done as follows: Figure 17 As shown, Figure 16 The third adhesive layer 303 on the flexible circuit board shown is bonded to the first bonding area 1003 of the display panel, resulting in the following: Figure 15 The product shown connects the display panel and the flexible circuit board. Among them, Figure 17 for Figure 15 The diagram shown illustrates the assembly of the display module.

[0123] This application embodiment does not limit the structure of the first binding area 1003. In some embodiments, such as Figure 13 , Figure 15 As shown, the first bonding area 1003 includes: a first portion 1031, a connecting layer 1032, and a back film 1033 stacked together. In some embodiments, a protective film 1034 is further provided on the side of the back film 1033 away from the connecting layer 1032.

[0124] In some embodiments, the bonding layer 1032 is made of optically clear adhesive (OCA). The backing film 1033 is made of polyethylene terephthalate (PET) or polyimide (PI). The protective film 1034 can be a release film.

[0125] In some embodiments of this application, a second sealing portion 503 is provided at the connection position between the third portion 202 of the flexible circuit board and the first bonding area 1003. The material and molding method of the second sealing portion can be referred to the description of the first sealing portion above, and will not be repeated here.

[0126] In some embodiments, Figure 18This is a schematic diagram of the connection structure between the first bonding area of ​​a display panel and a flexible circuit board. Figure 18 As shown, the adhesive 504 of the connecting layer 1032 is prone to seeping out from the side of the first bonding area 1003, and the seeping adhesive 504 affects the sealing performance of the second sealing part 503.

[0127] The process of the second sealing part 503 can be adjusted in the embodiments of this application. For example, the protective film 1034 can be removed first, and then adhesive can be applied at the connection position between the third part 202 of the flexible circuit board and the first bonding area 1003, so that the second sealing part 503 can seal the side of the first bonding area 1003 and the surface away from the second bonding area 203, thereby reducing the influence of the adhesive 504 on the sealing performance of the second sealing part 503.

[0128] Example, Figure 19 This is a schematic diagram illustrating the connection structure between the first bonding area of ​​a display panel and a flexible circuit board, as provided in an embodiment of this application. Figure 19 As shown, the second sealing portion 503 includes a fourth sub-part 5031 and a fifth sub-part 5032 connected to each other. The fourth sub-part 5031 is located near the connection point between the third part 202 and the first bonding area 1003. The surface of the third part 202 facing the light-emitting side of the display panel and the surface of the first bonding area 1002 facing the second part 201 are both connected to the fourth sub-part 5031. The fifth sub-part is located on the side of the first bonding area 1003 facing away from the second bonding area 203. This second sealing portion has a larger coverage area and better waterproof performance.

[0129] The above embodiments disclose a variety of waterproof structures. In other embodiments, one or more of the above waterproof structures can be combined to achieve multiple waterproofing.

[0130] Example, Figure 20 This is a schematic diagram of another display module with a flexible circuit board on its surface, provided in an embodiment of this application. Figure 20 As shown, the display module includes: a display panel 100, a support layer 104, a flexible circuit board 20, and a first sealing part. The support layer 104 is disposed on the side of the display panel 100 away from the light-emitting surface.

[0131] In some embodiments of this application, the display panel 100 includes: a first portion 1001 and a first binding area 1003 stacked together, and a connecting portion 1002 connecting the first portion 1001 and the first binding area 1003, wherein the support layer 104 is located between the first portion 1001 and the first binding area 1003.

[0132] In some embodiments of this application, the first bonding area 1003 and the flexible circuit board 20 are both disposed on the side opposite to the support layer and opposite to the first bonding area 1003.

[0133] In some embodiments of this application, the flexible circuit board 20 includes: a second part 201, a third part 202, and a second bonding area 203 connected in sequence. The second part 201 is connected to the support layer 104, the second bonding area 203 is connected to the first bonding area 1003, the third part 202 is located between the second part 201 and the second bonding area 203, and a first gap d1 is formed between the third part 202 and the support layer 104.

[0134] In some embodiments of this application, the first sealing part includes: sealing part 501 and sealing part 502.

[0135] In some embodiments of this application, the support layer 104, the third portion 202, the first binding area 1003, and the second portion 201 form a cavity with openings at both ends. The sealing portion 501 is connected to one end of the support layer 104, the third portion 202, the first binding area 1003, and the second portion 201, and the sealing portion 502 is connected to the other end of the support layer 104, the third portion 202, the first binding area 1003, and the second portion 201. The support layer 104, the third portion 202, the first binding area 1003, the second portion 201, the sealing portion 501, and the sealing portion 502 together form a fourth cavity, thereby improving the waterproof and corrosion-resistant performance of the flexible circuit board.

[0136] In some embodiments of this application, the second portion 202 is provided with a cover film 2021 on the side near the support layer 104, the second bonding area 203 is close to the third adhesive layer 303 of the support layer 104, the third adhesive layer 303 is located between the second bonding area 203 and the first bonding area 1003, the cover film 2021 is located in the third portion 202, and the cover film 2021 and the third adhesive layer 303 overlap to avoid gaps between the cover film 2021 and the third adhesive layer 303, thereby reducing the impact of external impurities on the flexible circuit board.

[0137] By incorporating two sealing structures, the waterproof and corrosion-resistant properties of this display module can be improved.

[0138] In other embodiments, Figure 21 This is a schematic diagram of another display module with a flexible circuit board on its surface, provided in an embodiment of this application. Figure 21 As shown, the sealing structure of the display module includes: a sealing part 501, a sealing part 502, a cover film 2021, a third adhesive layer 303, and a second sealing part 503.

[0139] The sealing portion 501, sealing portion 502, cover film 2021, and third adhesive layer 303 can be referred to the description of the above embodiments, and will not be repeated here. A portion of the second sealing portion 503 is close to the connection position between the third portion 202 and the first bonding area 1003. The surface of the third portion 202 facing the light-emitting side of the display panel and the surface of the first bonding area 1002 facing the second portion 201 are both connected to this portion. Another portion of the second sealing portion 503 is located on the side of the first bonding area 1003 away from the second bonding area 203, for example, between the first bonding area 1003 and the support layer 104.

[0140] By setting up three sealing structures, the waterproof and corrosion-resistant performance of this display module can be further improved.

[0141] This application provides a display module and an electronic device. The electronic device includes the display module, which includes a display panel. A flexible circuit board is located on the side of the display panel opposite to the light-emitting surface. A second bonding area of ​​the flexible circuit board is bonded to a first bonding area of ​​the display panel. To improve the waterproof performance of the second bonding area and the flexible circuit board near the second bonding area, in some embodiments, a first sealing portion can be provided at both ends of the gap formed between the flexible circuit board and the first bonding area. The first sealing portion and the gap form a sealing cavity to seal the second bonding area of ​​the flexible circuit board and prevent moisture and impurities from entering. The flexible circuit board can be stacked or arranged side-by-side with the first bonding area of ​​the display panel. The gap can be of a regular shape or an irregular shape.

[0142] In other embodiments, the cover film and adhesive layer on the side of the flexible circuit board facing the display module can be adjusted to fully cover the exposed surface of the flexible circuit board facing the display module, thereby reducing the impact of moisture and other factors on the flexible circuit board.

[0143] In other embodiments, the dispensing area of ​​the second bonding area of ​​the flexible circuit board can be adjusted so that the adhesive rises from near the second bonding area to the side of the first bonding area away from the second bonding area, resulting in a better sealing effect and reducing the impact of moisture and other factors on the second bonding area of ​​the flexible circuit board.

[0144] The above solutions are all single waterproof structures. In other embodiments, one or more of the above waterproof structures can be combined to achieve multiple waterproofing.

[0145] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any changes or substitutions within the technical scope disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A display module, characterized in that, include: The display panel, the support layer, and the flexible circuit board are provided, wherein the support layer is disposed on the side of the display panel opposite to the light-emitting surface; The display panel includes: a first portion and a first bonding area, and the support layer is located between the first portion and the first bonding area; The first bonding area and the flexible circuit board are disposed on the side of the support layer opposite to the first part; The flexible circuit board includes: a second part, a third part, and a second bonding area connected in sequence. The second part is connected to the support layer, and the second bonding area is connected to the first bonding area. The second bonding area is located on the side of the first bonding area away from the support layer. The third part is located between the second part and the second bonding area. A first gap exists between the third part and the support layer. The first gap extends along a first direction. First sealing portions are provided at both ends of the first gap along the first direction. The first sealing portions are connected to the support layer.

2. The display module according to claim 1, characterized in that, The first binding area and the second part are arranged along the second direction, and the first binding area is connected to the support layer.

3. The display module according to claim 2, characterized in that, The second part includes: a first sub-part, a second sub-part, and a third sub-part connected to each other. The second sub-part and the first binding area are arranged along a second direction. The first sub-part, the first binding area, and the third sub-part are arranged along a first direction. The first sub-part and the first binding area have a second gap. The third sub-part and the first binding area have a third gap. The second gap and the third gap are both connected to the first gap. The display module also includes: a shielding layer located on the side of the display module away from the light-emitting surface. The shielding layer, the support layer, the first sub-part, the first binding area, and the first sealing part form a first cavity. The shielding layer, the support layer, the third sub-part, the first binding area, and the first sealing part form a second cavity. The support layer, the third part, the first binding area, and the second sub-part form a third cavity. The third cavity is connected to the first cavity and the second cavity.

4. The display module according to claim 3, characterized in that, The shielding layer includes: electromagnetic shielding tape.

5. The display module according to claim 2, characterized in that, The support layer, the third part, the first binding area, the second part, and the first sealing part form a fourth cavity.

6. The display module according to claim 5, characterized in that, The display module further includes: a first adhesive layer and a second adhesive layer, wherein the first bonding area is connected to the support layer through the first adhesive layer, the second part is connected to the support layer through the second adhesive layer, the first sealing part is connected to the first bonding area through the first adhesive layer, and the first sealing part is connected to the second part through the second adhesive layer.

7. The display module according to claim 6, characterized in that, The first adhesive layer includes: foam adhesive; the second adhesive layer includes: backing adhesive.

8. The display module according to claim 1, characterized in that, The first binding area and the second part are stacked, the first binding area is located on the side of the second part away from the support layer, the third part is arc-shaped, the third part and a part of the first sealing part surround a fifth cavity, and the third part, the support layer and another part of the first sealing part surround a sixth cavity.

9. The display module according to any one of claims 1-8, characterized in that, The first sealing part is formed by dispensing adhesive.

10. The display module according to any one of claims 1-9, characterized in that, The material of the first sealing part includes: UV-curable adhesive.

11. The display module according to any one of claims 2-7, characterized in that, The display module further includes: a cover film, and a third adhesive layer overlapping the cover film, wherein the cover film and the third adhesive layer are both located on the side of the second bonding area close to the first bonding area; the third adhesive layer is located between the second bonding area and the first bonding area, and the cover film is located in the third part.

12. The display module according to claim 11, characterized in that, A portion of the third adhesive layer is located between the second bonding area and the first bonding area, and another portion of the third adhesive layer is located in the third portion.

13. The display module according to claim 11, characterized in that, A portion of the covering film is located in the third part, and another portion of the covering film is located between the second binding area and the first binding area.

14. The display module according to any one of claims 11-13, characterized in that, The portion of the third adhesive layer that overlaps with the cover film is stacked with the cover film.

15. The display module according to any one of claims 11-14, characterized in that, The material of the third adhesive layer includes anisotropic conductive adhesive.

16. The display module according to any one of claims 2-7, characterized in that, A second sealing part is provided at the connection position between the third part and the first binding area. The second sealing part includes a fourth sub-part and a fifth sub-part connected to each other. The surface of the third part facing the support layer and the surface of the first binding area facing the second part are both connected to the fourth sub-part. The fifth sub-part is located on the side of the first binding area away from the second binding area.

17. The display module according to any one of claims 1-16, characterized in that, The first binding area includes: a first portion, a connecting layer, and a backing film that are stacked together.

18. A display module, characterized in that, include: Display screen, support layer, flexible circuit board, cover film, and third adhesive layer; The support layer is disposed on the side of the display panel opposite to the light-emitting surface; The display panel includes: a first portion and a first bonding area stacked together, a support layer located between the first portion and the first bonding area, the first bonding area and the circuit board arranged along a second direction, and the first bonding area and the circuit board disposed on the side of the support layer opposite to the first bonding area; The flexible circuit board includes: a second part, a third part, and a second bonding area connected in sequence; the second part is connected to the support layer; the second bonding area is connected to the first bonding area; the second bonding area is located on the side of the first bonding area away from the support layer; a first gap exists between the third part and the support layer; a third adhesive layer is located between the second bonding area and the first bonding area; a cover film is located on the side of the third part near the light-emitting surface of the support layer; and the third adhesive layer overlaps with the cover film.

19. The display module according to claim 18, characterized in that, A portion of the third adhesive layer is located between the second bonding area and the first bonding area, and another portion of the third adhesive layer is located in the third portion.

20. The display module according to claim 18, characterized in that, A portion of the covering film is located in the third part, and another portion of the covering film is located between the second binding area and the first binding area.

21. The display module according to any one of claims 18-20, characterized in that, The portion of the third adhesive layer that overlaps with the cover film is stacked with the cover film.

22. The display module according to any one of claims 18-21, characterized in that, The material of the third adhesive layer includes anisotropic conductive adhesive.

23. A display module, characterized in that, include: Display screen, support layer, and flexible circuit board; The support layer is disposed on the side of the display panel opposite to the light-emitting surface; The display panel includes: a first portion and a first bonding area stacked together, and a support layer located between the first portion and the first bonding area; the first bonding area and the circuit board are arranged along a second direction, and the first bonding area and the circuit board are disposed on the side of the support layer opposite to the first bonding area; The flexible circuit board includes: a second part, a third part, and a second bonding area connected in sequence. The second part is connected to the support layer, and the second bonding area is connected to the first bonding area. The second bonding area is located on the side of the first bonding area away from the support layer. A first gap exists between the third part and the support layer. A second sealing part is provided at the connection position between the third part and the first bonding area. The second sealing part includes: a fourth sub-part and a fifth sub-part connected to each other. The surface of the third part facing the support layer and the surface of the first bonding area facing the second part are both connected to the fourth sub-part. The fifth sub-part is located on the side of the first bonding area away from the second bonding area.

24. An electronic device, characterized in that, include: The housing and the display module as described in any one of claims 1-23, wherein the housing is connected to the display module.

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