Display device

Abstract

The application relates to a display device. The display device comprises a display panel, a flexible circuit board and a buffer layer. The display panel comprises a display part, a binding part arranged on the back of the display part, and a bending part connecting the display part and the binding part. The flexible circuit board is arranged on the back of the display part and is connected to the binding part. The buffer layer is arranged between the binding part and the display part. The edge of the buffer layer exceeds the edge of the binding part away from the one end of the bending part. In the display device, the buffer layer is arranged between the binding part and the display part, and the edge of the buffer layer exceeds the edge of the binding part, so that the part of the buffer layer exceeding the binding part can support the flexible circuit board, and the impact resistance of the display device is improved.

Description

Technical Field

[0001] This application relates to the field of display technology, and more particularly to a display device. Background Technology

[0002] Consumers have increasingly higher demands for the quality of display devices, which need to meet various reliability testing requirements. During point-pressure durability testing on the front of the display screen, some areas exhibit display failure after being subjected to pressure. Utility Model Content

[0003] This application provides a display device that improves the impact resistance of the display device and addresses the technical problem of display failure in certain areas after being subjected to pressure.

[0004] To achieve the above objectives, this application provides a display device, comprising:

[0005] The display panel includes a display part, a mounting part disposed on the back of the display part, and a bent part connecting the display part and the mounting part;

[0006] A flexible circuit board is located on the back of the display unit, and the flexible circuit board is bonded to the bonding part.

[0007] A buffer layer is disposed between the binding part and the display part;

[0008] The edge of the buffer layer extends beyond the edge of the binding portion at the end away from the bend.

[0009] Optionally, the buffer layer includes a buffer structure, the buffer structure including a first buffer portion and a second buffer portion, the second buffer portion being located on the side of the first buffer portion away from the bending portion, the second buffer portion corresponding to the edge of the binding portion away from the bending portion, and the elastic modulus of the second buffer portion being less than the elastic modulus of the first buffer portion.

[0010] Optionally, the display device further includes a driver chip, which is bonded to the bonding portion, and the first buffer portion is correspondingly disposed with respect to the driver chip.

[0011] Optionally, the first buffer section and the second buffer section are spaced apart.

[0012] Optionally, the material of the first buffer part is a wave-absorbing material, and the material of the second buffer part is foam.

[0013] Optionally, the buffer structure further includes a support portion disposed around the periphery of the first buffer portion, the orthographic projection of the support portion onto the binding portion being located within the binding portion, and the elastic modulus of the support portion being greater than the elastic modulus of the first buffer portion.

[0014] Optionally, the first buffer section, the second buffer section, and the support section are all spaced apart.

[0015] Optionally, the buffer layer further includes a first adhesive layer and a second adhesive layer, wherein the first adhesive layer is disposed on the side of the buffer structure near the display portion, and the second adhesive layer is disposed on the side of the buffer structure near the bonding portion;

[0016] The first adhesive layer is continuously disposed such that both the first buffer portion and the second buffer portion are connected to the display portion through the first adhesive layer.

[0017] Optionally, the orthographic projection of the second buffer portion on the display portion is offset from the orthographic projection of the second adhesive layer on the display portion.

[0018] Optionally, the thickness of the second buffer portion is greater than the thickness of the first buffer portion.

[0019] In the display device of this application embodiment, by providing a buffer layer between the bonding portion and the display portion, and the edge of the buffer layer extends beyond the edge of the bonding portion, the portion of the buffer layer extending beyond the bonding portion can support the flexible circuit board, thereby improving the impact resistance of the display device.

[0020] Other features and advantages of this application will be described in detail in the following detailed description section. Attached Figure Description

[0021] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0022] To gain a more complete understanding of this application and its beneficial effects, the following description will be provided in conjunction with the accompanying drawings, wherein the same reference numerals in the following description denote the same parts.

[0023] Figure 1 This is a top view of a display device provided in an exemplary embodiment of this disclosure;

[0024] Figure 2 yes Figure 1 A bottom-view structural diagram of the display device in the diagram;

[0025] Figure 3 yes Figure 2 A magnified structural diagram at point B in the diagram;

[0026] Figure 4yes Figure 3 Schematic diagram of the cross-sectional structure at point CC;

[0027] Figure 5 This is a schematic diagram illustrating the principle of how the buffer layer improves impact resistance in the embodiments of this application;

[0028] Figure 6 yes Figure 4 A magnified schematic diagram of the buffer layer in the middle;

[0029] Figure 7 yes Figure 5 A top view of the buffer layer structure.

[0030] Explanation of reference numerals in the attached figures:

[0031] 10-Display panel; 11-Display section; 12-Bending section; 13-Binding section;

[0032] 20 - Flexible circuit board; 21 - Connecting part; 22 - Main body; 221 - Components;

[0033] 30 - Buffer layer; 31 - Buffer structure; 311 - First buffer part; 312 - Second buffer part; 313 - Support part; 32 - First adhesive layer; 33 - Second adhesive layer;

[0034] 41 - Driver chip;

[0035] 42-Backplate; 421-First-stage backplate; 422-Second-stage backplate; 43-Polarizing film; 44-Adhesive layer; 45-Cover plate; 46-Protective layer; 47-Supporting layer;

[0036] A - Failure area;

[0037] h1 - The thickness of the first buffer section 311;

[0038] h2 - The thickness of the second buffer section 312. Detailed Implementation

[0039] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the protection scope of this application.

[0040] Figure 1 This is a top view of a display device provided in an exemplary embodiment of this disclosure. Figure 2 yes Figure 1 A bottom-view structural diagram of the display device. Figure 1 Corresponding to the display surface of the display device, Figure 2 This corresponds to the back of the display device. During a point-pressure durability test on the front of the display screen, some areas experienced display failure after being subjected to pressure. Figure 1 and Figure 2 The diagram shows several possible locations of the failure region A.

[0041] like Figures 1 to 5 As shown, this application provides a display device, including a display panel 10, a flexible circuit board 20, and a buffer layer 30. The display panel 10 includes a display part 11, a bonding part 13 disposed on the back of the display part 11, and a bent part 12 connecting the display part 11 and the bonding part 13. The flexible circuit board 20 is located on the back of the display part 11 and is bonded to the bonding part 13. The buffer layer 30 is disposed between the bonding part 13 and the display part 11. The edge of the buffer layer 30 extends beyond the edge of the bonding part 13 away from the bent part 12.

[0042] In some embodiments, the display panel 10 is a flexible panel, such as an OLED panel, a Mini-LED panel, or a Micro-LED panel.

[0043] like Figure 4 As shown, the display panel 10 includes a display section 11, a bending section 12, and a binding section 13 connected in sequence. The display section 11 is used to display an image, the bending section 12 bends towards the back of the display section 11, and the binding section 13 is located on the back of the display section 11. The back of the display section 11 refers to its non-display surface, and the back of the display section 11 is positioned opposite to the display surface of the display panel 10. Figure 4 In this design, the back side of the display unit 11 is its upper surface, and the display surface of the display unit 11 is its lower surface. By bending the binding part 13 to the back side of the display unit 11, the width of the bezel can be reduced, achieving a narrow bezel effect.

[0044] The display unit 11 includes a display area and a non-display area disposed around the display area. The display area may have multiple sub-pixels, which may include red, green, and blue sub-pixels, thereby achieving color display. The display area is provided with a pixel driving circuit for driving the sub-pixels to display. The non-display area may be provided with a gate driving circuit, etc., which can provide driving signals to the sub-pixels.

[0045] like Figure 2 and Figure 4 As shown, the flexible circuit board 20 is located on the back of the display unit 11. Components 221 and the like are provided on the flexible circuit board 20. The flexible circuit board 20 is used to connect with external structures and transmit external power signals and drive signals to the display panel 10.

[0046] like Figure 4As shown, the flexible circuit board 20 is bonded to the bonding portion 13. The flexible circuit board 20 can be bonded to the bonding portion 13 using anisotropic conductive adhesive or the like, but is not limited to this.

[0047] In some embodiments, such as Figure 4 As shown, the flexible circuit board 20 includes a connecting portion 21 and a main body portion 22. The connecting portion 21 is used for bonding with the bonding portion 13, and the main body portion 22 is located on the side of the connecting portion 21 away from the bending portion 12. Specifically, the connecting portion 21 and the bonding portion 13 overlap in the thickness direction of the display device. The surface of the connecting portion 21 near the bonding portion 13 is provided with a plurality of connecting terminals (not shown in the figure), and the surface of the bonding portion 13 near the connecting portion 21 is provided with a plurality of bonding terminals (not shown in the figure). Anisotropic conductive adhesive is provided between the connecting terminals and the bonding terminals, and the connecting terminals and the bonding terminals are electrically connected through the anisotropic conductive adhesive.

[0048] The bending part 12 is provided with multiple lines (not shown in the figure), which connect the display part 11 and the binding part 13, thereby realizing signal transmission between the binding part 13 and the display part 11.

[0049] like Figure 4 As shown, a buffer layer 30 is disposed between the bonding portion 13 and the display portion 11. The buffer layer 30 is made of a material with buffering capacity, such as at least one of foam, rubber, silicone, and plastic. The buffer layer 30 can buffer the display device when it is subjected to external impact, improve the impact resistance of the display portion 11, and reduce the risk of display failure after the display portion 11 is subjected to external pressure.

[0050] like Figure 4 As shown, the end of the bonding portion 13 near the bending portion 12 is connected to the bending portion 12, and the other end of the bonding portion 13 is the end away from the bending portion 12. The edge of the buffer layer 30 extends beyond the edge of the end of the bonding portion 13 away from the bending portion 12. This means that a portion of the buffer layer 30 overlaps with the bonding portion 13 in the thickness direction of the display panel 10, while another portion of the buffer layer 30 does not overlap with the bonding portion 13 in the thickness direction of the display panel 10. In other words, a portion of the buffer layer 30 overlaps with the bonding portion 13, and another portion overlaps with the main body portion 22. With the above arrangement, the portion of the buffer layer 30 that overlaps with the bonding portion 13 can support the bonding portion 13, and the portion that does not overlap with the bonding portion 13 can support the main body portion 22 of the flexible circuit board 20, thereby improving the impact resistance of the display device.

[0051] In some embodiments, such as Figure 4 As shown, the main body 22 can be bonded to the support layer 47 via the adhesive layer 44, thereby fixing the flexible circuit board 20.

[0052] In some embodiments, such as Figure 4As shown, the display device also includes a back plate 42, which may include a back plate 421 and a back plate 422. The back plate 421 is disposed on the back of the display unit 11 and is used to support and protect the display unit 11. The back plate 422 is disposed on the side of the binding part 13 near the display unit 11 and is used to support and protect the binding part 13.

[0053] In some embodiments, such as Figure 4 As shown, the display device also includes a support layer 47 disposed on the side of a back plate 421 away from the display unit 11. The support layer 47 has a certain rigidity and can provide back support and protection for the display unit 11, making the display unit 11 less susceptible to impact damage. The material of the support layer 47 can be metals such as stainless steel, aluminum, iron, and copper.

[0054] In some embodiments, such as Figure 4 As shown, the display device also includes a cover plate 45 disposed on one side of the display surface of the display unit 11. The cover plate 45 can be made of flexible materials such as ultra-foldable glass (UFG), ultra-thin glass (UTG), or polyimide, thereby giving the display device good bending performance and enabling folding.

[0055] In some embodiments, such as Figure 4 As shown, the display device also includes a polarizer 43 disposed on one side of the display surface of the display unit 11. The polarizer 43 can reduce the reflection of ambient light by the display panel 10 and improve the glare problem of the display device. The polarizer 43 can be disposed between the display unit 11 and the cover plate 45, or it can be disposed on the side of the cover plate 45 away from the display unit 11.

[0056] In some embodiments, the display device further includes an adhesive layer (not shown) for bonding adjacent film layers, such as the bonding between the cover plate 45 and the polarizer 43. The adhesive layer may be optically clear adhesive (OCA), etc.

[0057] In some embodiments, the display device further includes a protective layer 46 that covers the surface of the bonding portion 13 and the flexible circuit board 20, protecting the components 221 of the flexible circuit board 20 and the bonding portion 13. The protective layer 46 may be an electrostatic shielding film or the like, but is not limited thereto.

[0058] Optionally, such as Figure 4 , Figure 6 and Figure 7As shown, the buffer layer 30 includes a buffer structure 31, which includes a first buffer portion 311 and a second buffer portion 312. The second buffer portion 312 is located on the side of the first buffer portion 311 away from the bending portion 12. The second buffer portion 312 corresponds to the edge of the binding portion 13 away from the bending portion 12. The elastic modulus of the second buffer portion 312 is less than that of the first buffer portion 311.

[0059] like Figure 4 As shown, the second buffer portion 312 corresponds to the edge of the binding portion 13 away from the bending portion 12. That is, the end of the second buffer portion 312 near the first buffer portion 311 overlaps with the binding portion 13, and the end of the second buffer portion 312 away from the first buffer portion 311 overlaps with the main body portion 22 of the flexible circuit board 20. With the above arrangement, the second buffer portion 312 can support the main body portion 22 and the connecting portion 21 of the flexible circuit board 20, thereby improving the impact resistance of the flexible circuit board 20.

[0060] It should be noted that the second buffer portion 312 may only support a portion of the main body portion 22 and a portion of the connecting portion 21, and the second buffer portion 312 may support at least the area at the boundary line between the main body portion 22 and the connecting portion 21. The boundary line between the connecting portion 21 and the main body portion 22 may be flush with the edge of the binding portion 13.

[0061] like Figure 5 As shown, with the second buffer 312 provided, it can support the junction area between the main body 22 and the connecting part 21, preventing the flexible circuit board 20 from breaking under stress. When subjected to external impact (in the direction of the arrow in the figure), the flexible circuit board 20 deforms under stress, but is buffered by the second buffer 312, reducing the degree of deformation. When the second buffer 312 is not provided, the deformation of the flexible circuit board 20 is greater, potentially causing it to contact the underlying film layer, leading to breakage of the internal circuitry. This breakage affects signal transmission and causes display failure.

[0062] like Figure 4 The first buffer part 311 is located on the side of the second buffer part 312 near the bending part 12. The first buffer part 311 can support the binding part 13 to improve the impact resistance of the binding part 13.

[0063] In some embodiments, the elastic modulus of the second buffer portion 312 is less than that of the first buffer portion 311. The elastic modulus is the ratio of stress to strain. A larger elastic modulus means the material is less prone to deformation under stress; a smaller elastic modulus means the material is more prone to deformation under stress. By setting the elastic modulus of the second buffer portion 312 to be less than that of the first buffer portion 311, the second buffer portion 312 is more likely to deform when subjected to the same magnitude of force on the front of the display device, making it less likely to transmit external force to the flexible circuit board 20. This reduces the degree of deformation of the flexible circuit board 20 under stress and lowers the risk of deformation and breakage.

[0064] Optionally, such as Figure 3 and Figure 4 As shown, the display device also includes a driver chip 41, which is bonded to the bonding part 13, and the first buffer part 311 is correspondingly provided with the driver chip 41.

[0065] The first buffer portion 311 is disposed correspondingly to the driver chip 41. That is to say, the orthographic projection of the driver chip 41 on the bonding portion 13 is located within the orthographic projection of the first buffer portion 311 on the bonding portion 13. The first buffer portion 311 can buffer and protect the driver chip 41, preventing the driver chip 41 from being damaged by external impact.

[0066] In some embodiments, the area of ​​the first buffer portion 311 can be larger than the area of ​​the driver chip 41, thereby providing buffer protection not only for the driver chip 41 but also for the peripheral drives of the driver chip 41. The area of ​​the first buffer portion 311 refers to its area on a plane perpendicular to the thickness direction of the display device. The area of ​​the driver chip 41 refers to its area on a plane perpendicular to the thickness direction of the display device.

[0067] Optionally, such as Figure 4 , Figure 6 and Figure 7 As shown, the first buffer portion 311 and the second buffer portion 312 are spaced apart. That is to say, there is a gap between the first buffer portion 311 and the second buffer portion 312. Through the above arrangement, deformation space can be left between the first buffer portion 311 and the second buffer portion 312 to prevent the first buffer portion 311 and the second buffer portion 312 from being squeezed against each other after being impacted.

[0068] Optionally, the material of the first buffer portion 311 is a wave-absorbing material, and the material of the second buffer portion 312 is foam. In some embodiments, the material of the first buffer portion 311 is a wave-absorbing material, which can absorb the radio frequency signal on one side of the driver chip 41, prevent the driver chip 41 from being interfered with by the radio frequency signal, and improve the working reliability of the driver chip 41.

[0069] It should be noted that the material of the first buffer section 311 is a wave-absorbing material, which also has a certain buffering capacity, capable of buffering the impact of external forces on the driving chip 41. For example, the wave-absorbing material can be a stack of multiple materials, in which some film layers have wave-absorbing capacity and some film layers have buffering capacity, but it is not limited to this.

[0070] Optionally, such as Figure 6 and Figure 7 As shown, the buffer structure 31 also includes a support portion 313, which is disposed around the periphery of the first buffer portion 311. The orthographic projection of the support portion 313 onto the binding portion 13 is located inside the binding portion 13, and the elastic modulus of the support portion 313 is greater than that of the first buffer portion 311.

[0071] In some embodiments, the support portion 313 is disposed around the periphery of the first buffer portion 311. For example, the support portion 313 can be frame-shaped, that is, the support portion 313 can surround the first buffer portion 311, thereby supporting the peripheral area of ​​the first buffer portion 311. The support portion 313 can also be segmented, thereby saving material for the support portion 313 and reducing manufacturing costs.

[0072] It should be noted that the orthographic projection of the support part 313 on the binding part 13 is offset from the orthographic projection of the driver chip 41 on the binding part 13, thereby preventing the external force from acting directly on the driver chip 41 when the support part 313 is under load.

[0073] In some embodiments, the elastic modulus of the support portion 313 is greater than that of the first buffer portion 311. Because the elastic modulus of the support portion 313 is greater, it is less prone to deformation than the first buffer portion 311 when subjected to external impact, thereby bearing the force and preventing external force from acting on the driver chip 41 and causing damage to the driver chip 41.

[0074] In some embodiments, the material of the support portion 313 may be one of polyimide (PI), polycarbonate (PC), polynorbornene (PNB), and polyethylene terephthalate (PET).

[0075] Optionally, such as Figure 6 and Figure 7 As shown, the first buffer part 311, the second buffer part 312, and the support part 313 are all spaced apart. That is to say, there are gaps between the first buffer part 311, the second buffer part 312, and the support part 313. Through the above arrangement, deformation space can be left between the first buffer part 311 and the support part 313, and deformation space can be left between the second buffer part 312 and the support part 313, so as to prevent the first buffer part 311, the second buffer part 312, and the support part 313 from being squeezed against each other after being impacted.

[0076] Optionally, such as Figure 6 and Figure 7 As shown, the buffer layer 30 also includes a first adhesive layer 32 and a second adhesive layer 33. The first adhesive layer 32 is disposed on the side of the buffer structure 31 near the display part 11, and the second adhesive layer 33 is disposed on the side of the buffer structure 31 near the bonding part 13. The first adhesive layer 32 is continuously disposed so that the first buffer part 311 and the second buffer part 312 are both connected to the display part 11 through the first adhesive layer 32.

[0077] In some embodiments, the first adhesive layer 32 is an adhesive material, such as pressure-sensitive adhesive (PSA).

[0078] In some embodiments, the second adhesive layer 33 is an adhesive material, such as pressure-sensitive adhesive. The first adhesive layer 32 and the second adhesive layer 33 can be made of the same material, thereby simplifying the manufacturing process of the buffer layer 30.

[0079] The first adhesive layer 32 is continuously disposed so that both the first buffer part 311 and the second buffer part 312 are bonded to other structures through the first adhesive layer 32. This arrangement simplifies the manufacturing process of the buffer layer 30, reduces the types of materials used, and makes quality control easier. Furthermore, the bonding of the buffer layer 30 can be achieved in a single process, reducing the complexity of the process.

[0080] In some embodiments, the buffer structure 31 includes a first buffer portion 311, a second buffer portion 312, and a support portion 313. The first adhesive layer 32 is continuously disposed such that the first buffer portion 311, the second buffer portion 312, and the support portion 313 are all connected to the display portion 11 through the first adhesive layer 32.

[0081] Optionally, such as Figure 6 and Figure 7 As shown, the orthographic projection of the second buffer portion 312 on the display portion 11 is offset from the orthographic projection of the second adhesive layer 33 on the display portion 11. This means that the second adhesive layer 33 may not be provided on the side of the second buffer portion 312 away from the first adhesive layer 32. By the above arrangement, the thickness h2 of the second buffer portion 312 can be increased, thereby improving the buffering effect of the second buffer portion 312.

[0082] In some embodiments, the second adhesive layer 33 covers the first buffer portion 311.

[0083] In other embodiments, such as Figure 6As shown, when the buffer structure 31 includes a first buffer portion 311 and a support portion 313, the second adhesive layer 33 can continuously cover the first buffer portion 311 and the support portion 313, thereby connecting both the first buffer portion 311 and the support portion 313 to the bonding portion 13 through the second adhesive layer 33. This configuration simplifies the manufacturing process of the buffer layer 30, reduces the types of materials, and makes quality control easier. Furthermore, the bonding of the buffer layer 30 can be achieved in a single process, reducing the complexity of the process.

[0084] Optionally, such as Figure 6 As shown, the thickness h2 of the second buffer portion 312 is greater than the thickness h1 of the first buffer portion 311. Since the second adhesive layer 33 may not be provided on the upper surface of the second buffer portion 312, the thickness h2 of the second buffer portion 312 can be increased, thereby further improving the buffering effect of the second buffer portion 312.

[0085] In some embodiments, such as Figure 6 As shown, the upper surface of the second buffer portion 312 can be flush with the upper surface of the second adhesive layer 33. During the production of the buffer layer 30, to prevent the first adhesive layer 32 and the second adhesive layer 33 from adhering to other materials, a release film is typically provided on the surface of both the first adhesive layer 32 and the second adhesive layer 33. When assembling the buffer layer 30, the release film is removed, allowing the first adhesive layer 32 and the second adhesive layer 33 to adhere to other surfaces. By making the upper surface of the second buffer portion 312 flush with the upper surface of the second adhesive layer 33, the second buffer portion 312 can be prevented from pushing up the release film, thus avoiding difficulty in adhering the release film to the second adhesive layer 33.

[0086] In this embodiment, the display device can be any product or component with display function, such as a mobile phone, tablet computer, television, monitor, laptop computer, digital photo frame, or navigator.

[0087] In the description of this application, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more features. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0088] In the above embodiments, the descriptions of each embodiment have different focuses. For parts not described in detail in a certain embodiment, please refer to the relevant descriptions in other embodiments.

[0089] The embodiments, implementation methods, and related technical features of this application can be combined and substituted for each other without conflict.

[0090] The above are merely preferred embodiments of this application and are not intended to limit this application in any way. Any simple modifications, equivalent changes, and alterations made to the above embodiments based on the technical essence of this application without departing from the scope of the technical solution of this application shall still fall within the scope of the technical solution of this application.

Claims

1. A display device, characterized in that, include: The display panel includes a display part, a mounting part disposed on the back of the display part, and a bent part connecting the display part and the mounting part; A flexible circuit board is located on the back of the display unit, and the flexible circuit board is bonded to the bonding part. A buffer layer is disposed between the binding part and the display part; The edge of the buffer layer extends beyond the edge of the binding portion at the end away from the bend.

2. The display device according to claim 1, characterized in that, The buffer layer includes a buffer structure, which includes a first buffer portion and a second buffer portion. The second buffer portion is located on the side of the first buffer portion away from the bending portion. The second buffer portion corresponds to the edge of the binding portion away from the bending portion. The elastic modulus of the second buffer portion is less than that of the first buffer portion.

3. The display device according to claim 2, characterized in that, The display device further includes a driver chip, which is bonded to the bonding part, and the first buffer part is correspondingly provided with the driver chip.

4. The display device according to claim 2, characterized in that, The first buffer section and the second buffer section are spaced apart.

5. The display device according to claim 2, characterized in that, The first buffer part is made of wave-absorbing material, and the second buffer part is made of foam.

6. The display device according to claim 2, characterized in that, The buffer structure further includes a support portion, which is disposed around the periphery of the first buffer portion. The orthographic projection of the support portion onto the binding portion is located within the binding portion, and the elastic modulus of the support portion is greater than that of the first buffer portion.

7. The display device according to claim 6, characterized in that, The first buffer section, the second buffer section, and the support section are all spaced apart.

8. The display device according to any one of claims 2 to 7, characterized in that, The buffer layer further includes a first adhesive layer and a second adhesive layer, wherein the first adhesive layer is disposed on the side of the buffer structure near the display portion, and the second adhesive layer is disposed on the side of the buffer structure near the bonding portion; The first adhesive layer is continuously disposed such that both the first buffer portion and the second buffer portion are connected to the display portion through the first adhesive layer.

9. The display device according to claim 8, characterized in that, The orthographic projection of the second buffer portion on the display portion is offset from the orthographic projection of the second adhesive layer on the display portion.

10. The display device according to claim 2, characterized in that, The thickness of the second buffer part is greater than the thickness of the first buffer part.

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