Copper-aluminum composite conductive bar structure

Abstract

The utility model relates to the technical field of composite material, concretely relates to a copper -aluminium composite conductive row structure, including aluminium matrix layer, as the main body structure of conductive row, the copper composite layer is closely attached through metallurgical bonding process on aluminium matrix layer upper surface, the main heat dissipation hole is set up in aluminium matrix layer middle part, the auxiliary heat dissipation hole is set up to the both sides symmetry of main heat dissipation hole, and the heat dissipation cavity is set up between main heat dissipation hole and auxiliary heat dissipation hole, and the heat dissipation assembly is arranged in main heat dissipation hole and auxiliary heat dissipation hole, solved the problem that the traditional pure copper conductive row is under the high load, long time operation scene, and the problem of insufficient heat dissipation capacity.

Description

Technical Field

[0001] This utility model relates to the field of composite material technology, specifically to a copper-aluminum composite conductive busbar structure. Background Technology

[0002] In the field of power transmission and electrical connection, busbars are core components that ensure a stable power supply and the normal operation of electrical equipment. Traditional busbars are mostly made of pure copper. Copper has excellent electrical and thermal conductivity as well as good processing performance. However, copper resources are relatively scarce and expensive, which greatly increases the cost of power facility construction and electrical product manufacturing.

[0003] With increasing emphasis on cost control and efficient resource utilization across industries, finding alternatives to copper has become a key research direction. Aluminum is abundant and inexpensive, but its conductivity and mechanical strength are far inferior to copper, limiting its widespread application in demanding electrical applications. Furthermore, during the operation of electrical equipment, the busbar generates heat due to the flow of current. If this heat cannot be dissipated promptly, the busbar temperature will rise, affecting its conductivity, accelerating material aging, and potentially even causing electrical faults, posing a serious threat to the safe operation of equipment. While traditional pure copper busbars have some thermal conductivity, heat dissipation remains a significant issue under high loads and long operating times. Utility Model Content

[0004] This utility model addresses the technical problems existing in the prior art by providing a copper-aluminum composite conductive busbar structure.

[0005] The technical solution of this utility model to solve the above-mentioned technical problems is as follows: A copper-aluminum composite conductive bus structure includes an aluminum substrate layer as the main structure of the conductive bus. A copper composite layer is tightly bonded to the upper surface of the aluminum substrate layer through a metallurgical bonding process. A main heat dissipation hole is opened in the middle of the aluminum substrate layer, and secondary heat dissipation holes are symmetrically opened on both sides of the main heat dissipation hole. A heat dissipation cavity is opened between the main heat dissipation hole and the secondary heat dissipation holes. Heat dissipation components are installed in the main heat dissipation hole and the secondary heat dissipation holes.

[0006] The beneficial effects of this utility model are as follows: The copper-aluminum composite conductive busbar uses an aluminum substrate layer as the main structure, and a copper composite layer is tightly bonded to its upper surface through a metallurgical bonding process. This combination not only utilizes the advantages of aluminum being lightweight and low-cost, but also takes advantage of copper's excellent conductivity, reducing cost and weight while ensuring conductivity. The aluminum substrate layer has a main heat dissipation hole in the middle and secondary heat dissipation holes symmetrically arranged on both sides. There is a heat dissipation cavity between the two, and the aluminum substrate layer has a built-in heat dissipation component, which greatly improves its heat dissipation capacity and ensures its stability during use.

[0007] Furthermore, the aluminum substrate layer has a near-rectangular cross-section and a thickness ranging from 50mm to 60mm, while the copper composite layer has a thickness ranging from 0.5mm to 5mm. This optimizes material usage and reduces production costs while ensuring the structural strength and conductivity of the conductive busbar.

[0008] Furthermore, the outer surface of the copper composite layer is covered with a surface protective layer with a thickness of 0.001 mm to 0.01 mm; this prevents the copper composite layer from being oxidized and corroded, extends the service life of the busbar, and controls the thickness of the protective layer within a reasonable range, ensuring the protective effect without excessively increasing costs or affecting conductivity.

[0009] Furthermore, the surface protective layer is one of a tin plating layer, a silver plating layer, a conductive oxide layer, or a conductive polymer coating; in the working environment, a variety of surface protective layer options are provided, which can be flexibly selected according to different usage environments and cost requirements to meet diverse market demands.

[0010] Furthermore, the upper surface of the copper composite layer is provided with a groove texture structure to increase the contact area and reduce the contact resistance. When the conductive busbar is connected to other components, the groove texture structure increases the contact area between the copper composite layer and other components. When current passes through the connection part, due to the increased contact area, the contact resistance will decrease accordingly according to the relationship between resistance and contact area, thereby improving conductivity, reducing energy loss, and enhancing the stability of the connection.

[0011] Furthermore, the heat dissipation assembly includes a first drain pipe that passes through the main heat dissipation hole and a second drain pipe that passes through the secondary heat dissipation hole. The second drain pipe is connected to the first drain pipe through a one-way liquid guide pipe. Each end of the first drain pipe is equipped with a delivery pipe, and a one-way valve is installed on the delivery pipe. This forms a complete heat dissipation circulation system. Through the drain pipe and the one-way liquid guide pipe, the heat dissipation medium can be effectively guided to flow, achieving efficient heat dissipation.

[0012] Furthermore, insulating crossbars are symmetrically installed inside the first drainage pipe near the side wall, and flow-dispersing cones are linearly arranged on the insulating crossbars. The flow-dispersing cones can change the flow state of the heat dissipation medium, making the heat dissipation medium more evenly distributed in the first drainage pipe and enhancing the heat dissipation effect.

[0013] Furthermore, both the No. 1 and No. 2 drainage tubes are made of ceramic material. During the operation of the heat dissipation component, the ceramic drainage tubes will not react chemically with the heat dissipation medium and have good insulation properties, which can prevent safety problems such as short circuits caused by the heat dissipation medium being charged. At the same time, the ceramic material is resistant to high temperature and can adapt to the high temperature environment generated by the operation of the busbar.

[0014] Furthermore, a conductive part is fixedly installed on the upper end face of the copper composite layer. A limiting groove is formed on the side of the conductive part, and a terminal block is snapped into the limiting groove. An insulating pressure plate is rotatably installed on the upper end of the conductive part via a rotating shaft, and the lower end face of the insulating pressure plate slides into the conductive part. This structural design makes wiring convenient and secure. The limiting groove and snap-fit ​​method ensure the stable connection of the terminal block. The insulating pressure plate further fixes the terminal block and plays an insulating protection role, improving the safety and reliability of the conductive busbar wiring.

[0015] Furthermore, the copper-aluminum composite conductive busbar has a conductivity of not less than 80%, a tensile strength of not less than 150 MPa, and an elongation of not less than 10%. During normal operation, its conductivity of not less than 80% ensures efficient current conduction and reduces energy loss. Its tensile strength of not less than 150 MPa allows the busbar to withstand a certain amount of tension during installation and use without breaking. Its elongation of not less than 10% gives the busbar a certain degree of plastic deformation capability, enabling it to adapt to certain installation deformations and thermal expansion and contraction. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the overall three-dimensional structure of the present invention; Figure 2 This utility model Figure 1 A three-dimensional structural diagram after removing the heat dissipation components; Figure 3 This is a three-dimensional structural diagram of the heat dissipation component in this utility model; Figure 4 In this utility model Figure 3 A magnified structural diagram at point A; Figure 5 This is a schematic diagram of the three-dimensional connection structure between the conductive part, the limiting groove, the wiring terminal, the rotating shaft and the insulating pressure plate in this utility model.

[0017] The attached diagram lists the components represented by each number as follows: 1. Aluminum substrate layer; 2. Copper composite layer; 3. Main heat dissipation holes; 4. Secondary heat dissipation holes; 5. Heat dissipation components; 51. Drainage tube No. 1; 52. Drainage tube No. 2; 53. One-way liquid guide tube; 54. Transfer tube; 55. One-way valve; 56. Insulating crossbar; 57. Diffuser cone; 6. Conductive part; 7. Limiting groove; 8. Wiring terminal; 9. Rotating shaft; 10. Insulating pressure plate; 11. Heat dissipation cavity. Detailed Implementation

[0018] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0019] In the description of this application, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the stated features. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0020] In the description of this application, it should also be noted that, unless otherwise expressly specified and limited, the terms "set up," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this technology based on the specific circumstances.

[0021] In the description of this application, spatial relation terms such as "below," "under," "below," "below," "above," "over," etc., are used herein to describe the relationship between one element or feature shown in the figures and other elements or features. It should be understood that, in addition to the orientation shown in the figures, spatial relation terms also include different orientations of the device in use and operation. For example, if the device in the figures is flipped, an element or feature described as "below" or "under" or "below" of other elements or features would be oriented "over" of other elements or features. Therefore, the exemplary terms "below" and "under" can include both upper and lower orientations. Furthermore, the device may also include other orientations (e.g., rotated 90 degrees or other orientations), and the spatial descriptive terms used herein are interpreted accordingly.

[0022] In the description of this application, the term "for example" is used to mean "used as an example, illustration, or description." Any embodiment described as "for example" in this application is not necessarily to be construed as being more preferred or advantageous than other embodiments. The following description is provided to enable any person skilled in the art to implement and use the present invention. Details are set forth in the following description for purposes of explanation. It should be understood that those skilled in the art will recognize that the present invention can be implemented without using these specific details. In other instances, well-known structures and processes will not be described in detail to avoid obscuring the description of the present invention with unnecessary detail. Therefore, the present invention is not intended to be limited to the embodiments shown, but is consistent with the broadest scope of the principles and features disclosed in this application.

[0023] Example 1 See Figure 1 and Figure 2 A copper-aluminum composite conductive bus structure includes an aluminum substrate layer 1 as the main structure of the conductive bus. A copper composite layer 2 is tightly bonded to the upper surface of the aluminum substrate layer 1 through a metallurgical bonding process. A main heat dissipation hole 3 is opened in the middle of the aluminum substrate layer 1, and secondary heat dissipation holes 4 are symmetrically opened on both sides of the main heat dissipation hole 3. A heat dissipation cavity 11 is opened between the main heat dissipation hole 3 and the secondary heat dissipation holes 4. Heat dissipation components 5 are arranged in the main heat dissipation hole 3 and the secondary heat dissipation holes 4.

[0024] In this embodiment, the copper-aluminum composite conductive busbar uses an aluminum substrate layer 1 as the main structure, and a copper composite layer 2 is tightly bonded to its upper surface through a metallurgical bonding process. This combination takes advantage of the light weight and low cost of aluminum, and also utilizes the excellent conductivity of copper. It reduces cost and weight while ensuring conductivity. A main heat dissipation hole 3 is opened in the middle of the aluminum substrate layer 1, and secondary heat dissipation holes 4 are symmetrically arranged on both sides. There is a heat dissipation cavity 11 between the two, and the aluminum substrate layer 1 has a built-in heat dissipation component 5, which greatly improves its heat dissipation capacity and ensures its stability during use.

[0025] Example 2 See Figure 2 The aluminum substrate layer 1 has a nearly rectangular cross-section and a thickness ranging from 50 mm to 60 mm, while the copper composite layer 2 has a thickness ranging from 0.5 mm to 5 mm.

[0026] In this embodiment, during the operation of the busbar, the aluminum substrate layer 1 serves as the main body to carry the current and provides structural support. Its thickness is in the range of 50mm to 60mm, which can ensure sufficient mechanical strength to cope with various external forces during installation and use. The copper composite layer 2 is responsible for efficient current conduction. Its thickness of 0.5mm to 5mm meets the conductivity requirements while reasonably controlling costs and avoiding excessive use of copper materials. On the basis of ensuring the structural strength and conductivity of the busbar, the amount of material used is optimized and the production cost is reduced.

[0027] Example 3 Continue reading Figure 2 The outer surface of the copper composite layer 2 is covered with a surface protective layer with a thickness of 0.001 mm to 0.01 mm.

[0028] In this embodiment, when the busbar is in the working environment, the surface protective layer is in direct contact with the outside world. The protective layer with a thickness of 0.001mm to 0.01mm can effectively block air, moisture and other corrosive substances from contacting the copper composite layer, preventing the copper composite layer from being oxidized and corroded, and extending the service life of the busbar. At the same time, the thickness of the protective layer is controlled within a reasonable range, which ensures the protective effect without excessively increasing the cost and affecting the conductivity.

[0029] Example 4 Please continue reading. Figure 2 The surface protective layer is one of the following: tin plating, silver plating, conductive oxide layer, or conductive polymer coating.

[0030] In this embodiment, in the working environment, the tin layer can form a dense protective film on the copper surface, preventing the copper from reacting chemically with external substances. Silver has excellent conductivity and chemical stability. The silver plating layer can not only prevent copper oxidation, but also improve conductivity to a certain extent. It is suitable for occasions with extremely high conductivity requirements and relatively good environment. A conductive oxide film is formed on the copper surface through a specific oxidation treatment, which can play a protective role and maintain good conductivity. The conductive polymer coating has good flexibility and corrosion resistance, and can adapt to different environmental conditions, providing reliable protection for the copper composite layer. It provides a variety of surface protection layer options, which can be flexibly selected according to different usage environments and cost requirements to meet diverse market demands.

[0031] Example 5 See Figure 1 and Figure 2 The upper surface of the copper composite layer 2 is provided with a groove texture structure to increase the contact area and reduce the contact resistance.

[0032] In this embodiment, when the busbar is connected to other components, the groove texture structure increases the contact area between the copper composite layer 2 and other components. When current passes through the connection, due to the increased contact area, the contact resistance will decrease accordingly based on the relationship between resistance and contact area, thereby improving conductivity, reducing energy loss, and enhancing connection stability.

[0033] Example 6 See Figure 3The heat dissipation component 5 includes a first drain pipe 51 that penetrates the main heat dissipation hole 3 and a second drain pipe 52 that penetrates the secondary heat dissipation hole 4. The second drain pipe 52 is connected to the first drain pipe 51 through a one-way liquid guide pipe 53. A delivery pipe 54 is installed at both ends of the first drain pipe 51, and a one-way valve 55 is installed on the delivery pipe 54.

[0034] In this embodiment, the heat dissipation medium enters the first drain pipe 51 through the delivery pipe 54 and the one-way valve 55. The one-way valve 55 ensures that the heat dissipation medium can only flow in the set direction. Part of the heat dissipation medium in the first drain pipe 51 flows directly through the main heat dissipation hole 3 for heat dissipation, and the other part flows into the second drain pipe 52 through the one-way liquid guide pipe 53, and then flows through the auxiliary heat dissipation hole 4 for heat dissipation. Finally, the heat dissipation medium flows out from the delivery pipe 54 at the other end, forming a complete heat dissipation circulation system, which can effectively guide the flow of the heat dissipation medium and achieve efficient heat dissipation.

[0035] Example 7 See Figure 3 and Figure 4 An insulating crossbar 56 is symmetrically installed inside the first drainage tube 51 near the side wall, and a diffuser cone 57 is linearly arranged on the insulating crossbar 56.

[0036] In this embodiment, the diffuser cone 57 can change the flow state of the heat dissipation medium, making the heat dissipation medium more evenly distributed in the first drain pipe 51, thereby enhancing the heat dissipation effect.

[0037] Example 8 See Figure 3 and Figure 4 Both the No. 1 drainage tube 51 and the No. 2 drainage tube 52 are made of ceramic material.

[0038] In this embodiment, during the operation of the heat dissipation component 5, the first drain pipe 51 and the second drain pipe 52 made of ceramic material will not react chemically with the heat dissipation medium and have good insulation properties, which can prevent safety problems such as short circuits caused by the heat dissipation medium being charged. At the same time, the ceramic material is resistant to high temperature and can adapt to the high temperature environment generated by the operation of the conductive busbar.

[0039] Example 9 See Figure 1 and Figure 5 A conductive part 6 is fixedly installed on the upper end face of the copper composite layer 2. A limiting groove 7 is opened on the side of the conductive part 6. A terminal 8 is snapped into the limiting groove 7. An insulating pressure plate 10 is rotatably installed on the upper end of the conductive part 6 through a rotating shaft 9. The lower end face of the insulating pressure plate 10 and the conductive part 6 are in sliding fit.

[0040] In this embodiment, during wiring, the terminal 8 is inserted into the limiting groove 7 on the side of the conductive part 6 to achieve initial positioning and connection. Then, the insulating pressure plate 10 is rotated so that it rotates around the rotating shaft 9 and presses on the terminal 8. The lower end face of the insulating pressure plate 10 and the conductive part 6 slide together to further fix the terminal 8. This structural design makes wiring convenient and firm. The snap-fit ​​method ensures the stable connection of the terminal 8. The insulating pressure plate 10 further fixes the terminal 8 and plays an insulating protection role, improving the safety and reliability of the conductive busbar wiring.

[0041] Example 10 See Figure 1 The conductivity of the copper-aluminum composite conductive busbar is not less than 80%, its tensile strength is not less than 150MPa, and its elongation is not less than 10%.

[0042] In this embodiment, during normal operation of the busbar, its conductivity is not less than 80%, which ensures efficient current conduction and reduces energy loss. Its tensile strength is not less than 150MPa, which allows the busbar to withstand a certain amount of tension without breaking during installation and use. Its elongation is not less than 10%, which gives the busbar a certain plastic deformation capacity and allows it to adapt to certain installation deformations and thermal expansion and contraction.

[0043] While embodiments or examples of this disclosure have been described with reference to the accompanying drawings, it should be understood that the above embodiments are merely exemplary embodiments or examples, and the scope of this utility model is not limited by these embodiments or examples, but only by the granted claims and their equivalents. Various elements in the embodiments or examples may be omitted or replaced by their equivalents. Furthermore, the steps may be performed in a different order than that described in this disclosure. Further, various elements in the embodiments or examples may be combined in various ways. Importantly, as the technology evolves, many elements described herein can be replaced by equivalents that appear after this disclosure.

Claims

1. A copper-aluminum composite conductive busbar structure, characterized in that, include: An aluminum substrate layer (1) serves as the main structure of the conductive busbar; The copper composite layer (2) is tightly bonded to the upper surface of the aluminum substrate layer (1) through a metallurgical bonding process; Main heat dissipation hole (3): The main heat dissipation hole (3) is provided in the middle of the aluminum substrate layer (1); A secondary heat dissipation hole (4) is provided on both sides of the main heat dissipation hole (3), and a heat dissipation cavity (11) is provided between the main heat dissipation hole (3) and the secondary heat dissipation hole (4). The heat dissipation assembly (5) is provided inside the main heat dissipation hole (3) and the secondary heat dissipation hole (4).

2. The copper-aluminum composite conductive busbar structure according to claim 1, characterized in that, The aluminum substrate layer (1) has a nearly rectangular cross-section and a thickness ranging from 50 mm to 60 mm, while the copper composite layer (2) has a thickness ranging from 0.5 mm to 5 mm.

3. The copper-aluminum composite conductive busbar structure according to claim 1, characterized in that, The outer surface of the copper composite layer (2) is covered with a surface protective layer with a thickness of 0.001 mm to 0.01 mm.

4. The copper-aluminum composite conductive busbar structure according to claim 3, characterized in that, The surface protective layer is one of a tin plating layer, a silver plating layer, a conductive oxide layer, or a conductive polymer coating.

5. The copper-aluminum composite conductive busbar structure according to claim 3, characterized in that, The upper surface of the copper composite layer (2) is provided with a groove texture structure to increase the contact area and reduce the contact resistance.

6. The copper-aluminum composite conductive busbar structure according to claim 1, characterized in that, The heat dissipation assembly (5) includes a first drain pipe (51) that passes through the main heat dissipation hole (3) and a second drain pipe (52) that passes through the secondary heat dissipation hole (4). The second drain pipe (52) is connected to the first drain pipe (51) through a one-way liquid guide pipe (53). The first drain pipe (51) has a delivery pipe (54) installed at both ends, and a one-way valve (55) is installed on the delivery pipe (54).

7. The copper-aluminum composite conductive busbar structure according to claim 6, characterized in that, An insulating crossbar (56) is symmetrically installed inside the first drainage tube (51) near the side wall, and a diffuser cone (57) is arranged linearly on the insulating crossbar (56).

8. The copper-aluminum composite conductive busbar structure according to claim 6, characterized in that, Both the No. 1 drainage tube (51) and the No. 2 drainage tube (52) are made of ceramic material.

9. The copper-aluminum composite conductive busbar structure according to claim 1, characterized in that, A conductive part (6) is fixedly installed on the upper end face of the copper composite layer (2). A limiting groove (7) is opened on the side of the conductive part (6). A terminal block (8) is snapped into the limiting groove (7). An insulating pressure plate (10) is rotatably installed on the upper end of the conductive part (6) through a rotating shaft (9). The lower end face of the insulating pressure plate (10) and the conductive part (6) are in sliding fit.

10. A copper-aluminum composite conductive busbar structure according to claim 1, characterized in that, The copper-aluminum composite conductive busbar has a conductivity of not less than 80%, a tensile strength of not less than 150 MPa, and an elongation of not less than 10%.

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