A cold conducting cavity

Abstract

The application provides a cold guide cavity, comprising: a sealed cavity, a cold guide pipe arranged on the outer wall of the sealed cavity, and a contact connection structure between the cold guide pipe and the outer wall for fixing the cold guide pipe on the outer wall; a filling connection structure is further arranged between the cold guide pipe and the outer wall of the sealed cavity to fill the gap between the cold guide pipe and the outer wall, and the cold guide pipe and the outer wall form surface contact. The cold guide pipe is fixed on the outer wall of the sealed cavity through the contact connection structure, and the cold guide pipe is preliminarily fixed. Then, low-temperature solder is filled in the gap between the cold guide pipe and the outer wall, and a welding layer is formed between the cold guide pipe and the outer wall through heating to fill the gap between the cold guide pipe and the outer wall, so that the cold guide pipe and the outer wall of the sealed cavity form surface contact, the contact area is increased, the cold guide effect is enhanced, and the welding difficulty and welding cost between the cold guide pipe and the sealed cavity are reduced.

Description

Technical Field

[0001] This utility model relates to the field of superconducting cooling technology, and in particular to a cooling cavity. Background Technology

[0002] Current cryogenic superconducting technologies typically require a continuous and stable ultra-low temperature environment. Devices creating this environment usually employ cryogenic cooling chambers to provide a sealed, insulated, and accelerated cooling environment for the main cooling circuit. To reduce heat radiation from room temperature into the cryogenic cooling chamber and thus decrease its cooling efficiency, existing cryogenic cooling chambers typically consist of cooling pipes wound around one wall. A cooling medium is circulated through these pipes to remove heat radiated from the outside, thereby minimizing heat radiation from room temperature into the chamber.

[0003] In existing technologies, the cooling pipes are fixed to the cooling cavity by spot welding. However, this welding method results in line contact between the cooling pipes and the wall surface, leading to low cooling efficiency. To overcome these drawbacks, a common method is to fully weld the cooling pipes to the wall surface. While this method eliminates the problem of low cooling efficiency, it requires advanced welding techniques and is quite difficult to execute.

[0004] Therefore, how to balance improving the cooling effect and reducing the welding difficulty has become an urgent technical problem to be solved. Utility Model Content

[0005] This utility model provides a cooling cavity that solves the technical problem in the prior art of how to simultaneously improve the cooling effect and reduce the welding difficulty.

[0006] To overcome the above-mentioned technical problems, according to an embodiment of the present invention, a cooling cavity is provided, comprising: a sealed cavity, a cooling pipe disposed on the outer wall of the sealed cavity, wherein the cooling pipe and the outer wall have a contact connection structure to fix the cooling pipe to the outer wall; a filling connection structure is further provided between the cooling pipe and the outer wall of the sealed cavity to fill the gap between the cooling pipe and the outer wall, so that the cooling pipe and the outer wall form a surface contact.

[0007] In one embodiment, the contact connection structure includes a plurality of welding points formed by spot welding.

[0008] In one embodiment, the contact connection structure includes a mechanical clamping structure.

[0009] In one embodiment, the mechanical clamping structure includes: a plurality of metal clamps, which press the cooling tube against the outer wall of the sealed cavity.

[0010] In one embodiment, the mechanical clamping structure includes a slot formed on the outer wall of the sealed cavity, and the cooling tube is interference-fitted with the slot.

[0011] In one embodiment, the filling connection structure includes a solder layer formed of indium-based solder or tin-based solder filling the gap between the cooling tube and the outer wall.

[0012] In one embodiment, the cooling tube is spirally wound in multiple turns around the outer wall of the sealed cavity.

[0013] In one embodiment, the cooling tubes are distributed in an arc shape on the outer wall of the sealed cavity.

[0014] In one embodiment, the sealed cavity includes an outer Dewar and an inner Dewar, wherein the cooling pipe is disposed on the outer wall of the outer Dewar, the inner Dewar contains a cooling medium, the superconducting magnet is disposed in the cooling medium, and a vacuum environment exists between the outer Dewar and the inner Dewar.

[0015] The technical solutions provided by the embodiments of this utility model may include the following beneficial effects: The cooling cavity provided in this application includes a sealed cavity and a cooling pipe disposed on the outer wall of the sealed cavity. The cooling pipe has a contact connection structure with the outer wall to fix it to the outer wall. A filling connection structure is also provided between the cooling pipe and the outer wall of the sealed cavity to fill the gap between them, forming a surface contact. After the cooling pipe is initially fixed to the outer wall of the sealed cavity using the contact connection structure, a low-temperature solder is filled into the gap between the cooling pipe and the outer wall. Upon heating, a weld layer is formed between the cooling pipe and the outer wall of the sealed cavity to fill the gap, creating a surface contact between them. This increases the contact area, enhances the cooling effect, and simultaneously reduces the welding difficulty and cost between the cooling pipe and the sealed cavity.

[0016] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and do not limit the present invention. Attached Figure Description

[0017] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with the present invention and, together with the description, serve to explain the principles of the present invention.

[0018] Figure 1 This is a schematic diagram of the structure of a cooling cavity according to an exemplary embodiment.

[0019] Figure 2This is a schematic diagram illustrating a cooling cavity during welding, according to an exemplary embodiment.

[0020] In the diagram, 10 is a sealed cavity; 20 is a cooling pipe; 31 is a contact connection structure; 32 is a filling connection structure; and 40 is a heating platform. Detailed Implementation

[0021] In the accompanying drawings of this utility model, the same or similar reference numerals correspond to the same or similar components. In the description of this utility model, it should be understood that if terms such as "upper," "lower," "left," "right," "inner," and "outer" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, they are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, the terms used to describe positional relationships in the drawings are only for illustrative purposes and should not be construed as limiting this patent. For those skilled in the art, the specific meaning of the above terms can be understood according to the specific circumstances.

[0022] In the description of this utility model, unless otherwise explicitly specified and limited, the term "connection" or similar designation indicating the connection relationship between components should be interpreted broadly. For example, it can refer to a fixed connection, a detachable connection, or an integral part; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0023] like Figure 1 and 2 As shown, this utility model provides a cooling cavity, including: a sealed cavity 10, a cooling pipe 20 disposed on the outer wall 11 of the sealed cavity 10, the cooling pipe 20 having a contact connection structure 31 with the outer wall 11 to fix the cooling pipe 20 on the outer wall 11; a filling connection structure 32 is also provided between the cooling pipe 20 and the outer wall 11 of the sealed cavity 10 to fill the gap between the cooling pipe 20 and the outer wall 11, so that the cooling pipe 20 and the outer wall 11 form a surface contact.

[0024] In this embodiment, the cooling tube 20 is first fixed to the outer wall 11 of the sealed cavity 10 by the contact connection structure 31. After initial fixation, low-temperature solder is filled into the gap between the cooling tube 20 and the outer wall 11. After heating, a weld layer is formed between the cooling tube 20 and the outer wall 11 of the sealed cavity 10 to fill the gap between the cooling tube 20 and the outer wall 11, so that the cooling tube 10 and the outer wall 11 of the sealed cavity 10 form a surface contact, increasing the contact area and enhancing the cooling effect, while reducing the welding difficulty and welding cost between the cooling tube 20 and the sealed cavity 10.

[0025] For example, low-temperature solders may use indium-based solders, such as pure indium solders, indium alloy solders, including In52Sn48 with a melting point of 117°C, In60Sn40 with a melting point of 113°C, or In80Ag20 with a melting point of 107°C. Low-temperature solders may also use tin-based solders.

[0026] In one embodiment, the contact connection structure 31 may include a welding structure and / or a mechanical clamping structure. The welding structure may be formed by spot welding between the cooling tube 20 and the outer wall 11 using welding methods such as argon arc welding or laser welding, for initial fixation.

[0027] The mechanical clamping structure can be fixed using metal clamps, pressure plates, or other clamping structures. For example, multiple metal clamps can be used to press the cooling pipe tightly against the outer wall of the sealing cavity 10. Alternatively, pressure plates can be used in conjunction with bolts to fix the pipeline to the outer wall. The bolts can be fixed directly to the outer wall 11, or the bolts can be fixed by welding protruding fixing lugs onto the outer wall 11 to prevent the bolts from affecting the sealing performance of the sealing cavity 10.

[0028] In one embodiment, a slot can also be provided on the outer wall 11. For example, a slot for engaging the cooling tube 20 can be opened or stamped on the outer wall 11. The cooling tube 20 and the slot are initially fixed by an interference fit.

[0029] In one embodiment, after the cold conducting tube 20 and the sealed cavity 10 are fixed by the welding structure and / or mechanical clamping structure, a filling connection structure 32 is formed between the cold conducting tube 20 and the outer wall 11 of the sealed cavity 10. For example, the cold conducting tube 20 and the sealed cavity 10 may be preheated by a heating table 40 first; after reaching a preset temperature, low-temperature solder is placed into the gap between the cold conducting tube 20 and the outer wall 11 of the sealed cavity 10, and then the low-temperature solder is melted by a hot air gun, so that the solder infiltrates into the gap between the cold conducting tube 20 and the outer wall 11 of the sealed cavity 10. Meanwhile, the preheated sealed cavity 10 slows down the solidification time of the melted solder, which enables more uniform infiltration, increases the welding area, reduces air bubbles in the welding layer, and enhances the cold conducting effect. In another embodiment, the low-temperature solder may also be placed before preheating, and then preheating is performed, which is not limited in the present application.

[0030] In one embodiment, the cold conducting tube 20 may be spirally wound around the outer wall 11 of the sealed cavity 10 with multiple turns; it may also be distributed in an arch shape on the outer wall 11 of the sealed cavity 10. In this embodiment, the distribution form of the cold conducting tube 20 on the outer wall 11 of the sealed cavity 10 is not limited, and other distribution forms that increase the contact area between the cold conducting tube 20 and the outer wall 11 of the sealed cavity 10, such as S-shaped distribution and zigzag "hui" shape distribution, are all within the protection scope of this embodiment.

[0031] In one embodiment, the sealed cavity 10 may include an outer dewar and an inner dewar, wherein the outer wall of the outer dewar is provided with the cold conducting tube, the inner dewar is filled with a cooling medium, the superconducting magnet is arranged in the cooling medium, and a vacuum environment is formed between the outer dewar and the inner dewar. The cold conducting tube 20 is arranged on the outer wall of the outer dewar, the cold conducting tube 20 is first primarily fixed by a contact connection structure 31, and low-temperature solder is filled in the gap between the cold conducting tube 20 and the outer wall of the outer dewar to form a filling connection structure 32, for secondary fixation and gap filling. Surface contact between the cold conducting tube 20 and the outer wall of the outer dewar can be formed without full welding between the cold conducting tube 20 and the outer wall of the outer dewar, which increases the cold conducting area. The welding layer formed by the low-temperature solder realizes efficient cold conduction from the cold conducting tube 20 to the sealed cavity 10, effectively inhibits the heat radiation exchange between the outside and the sealed cavity 10, and enhances the cold conducting effect of the sealed cavity 10.

[0032] The two ends of the cold conducting tube 20 are respectively a low-temperature cooling medium inlet and a high-temperature cooling medium outlet, a refrigerator is arranged between the low-temperature cooling medium inlet and the high-temperature cooling medium outlet, and the position of the low-temperature cooling medium inlet is lower than that of the high-temperature cooling medium outlet.

[0033] The high-temperature cooling medium at the outlet of the high-temperature cooling medium is cooled and becomes a low-temperature cooling medium at the condenser of the refrigerator. This low-temperature cooling medium sinks into the low-temperature cooling medium inlet and flows into the cooling pipe 20. The low-temperature cooling medium flows in the cooling pipe 20 and exchanges heat with the outer wall 11 of the sealed cavity 10 and its external environment, absorbing heat from the outer wall 11 and its external environment, thus maintaining a lower temperature for the outer wall 11 of the sealed cavity 10. The low-temperature cooling medium absorbs heat and becomes a high-temperature cooling medium, flowing back into the condenser of the refrigerator from the outlet of the high-temperature cooling medium. The cooling medium circulates in the cooling pipe 20, continuously carrying away heat radiated from the outside to the outer wall 11 of the sealed cavity 10, thereby greatly reducing external heat radiation to the sealed cavity 10 and enhancing the cooling effect of the sealed cavity 10.

[0034] In one embodiment, the cooling medium may be liquid nitrogen or nitrogen gas; or liquid helium or helium gas may be used.

[0035] Other embodiments of the present invention will readily occur to those skilled in the art upon consideration of the specification and practice of the disclosure herein. This application is intended to cover any variations, uses, or adaptations of the present invention that follow the general principles of the present invention and include common knowledge or customary techniques in the art not disclosed herein. The specification and examples are to be considered exemplary only, and the true scope and spirit of the present invention are indicated by the following claims.

[0036] It should be understood that this invention is not limited to the precise structure described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of this invention is limited only by the appended claims.

Claims

1. A cooling cavity, characterized in that, include: Sealed cavity, A cooling tube is disposed on the outer wall of the sealed cavity. The cooling tube has a contact connection structure with the outer wall to fix the cooling tube to the outer wall. A filling connection structure is also provided between the cooling tube and the outer wall of the sealed cavity to fill the gap between the cooling tube and the outer wall, so that the cooling tube and the outer wall form a surface contact.

2. The cooling cavity as described in claim 1, characterized in that, The contact connection structure includes multiple welding points formed by spot welding.

3. The cooling cavity as described in claim 1 or 2, characterized in that, The contact connection structure includes a mechanical clamping structure.

4. The cooling cavity as described in claim 3, characterized in that, The mechanical clamping structure includes: Multiple metal clamps press the cooling tube tightly against the outer wall of the sealed cavity.

5. The cooling cavity as described in claim 3, characterized in that, The mechanical clamping structure includes: A slot is formed on the outer wall of the sealed cavity, and the cooling tube is interference-fitted with the slot.

6. The cooling cavity as described in claim 1, characterized in that, The filling connection structure includes a solder layer formed by indium-based solder or tin-based solder filling the gap between the cooling tube and the outer wall.

7. The cooling cavity as described in claim 1, characterized in that, The cooling tube is spirally wound in multiple turns around the outer wall of the sealed cavity.

8. The cooling cavity as described in claim 1, characterized in that, The cooling pipes are distributed in an arc shape on the outer wall of the sealed cavity.

9. The cooling cavity as described in claim 1, characterized in that, The sealed cavity includes: An outer Dewar and an inner Dewar, wherein the cooling tube is disposed on the outer wall of the outer Dewar, the inner Dewar is filled with a cooling medium, the superconducting magnet is disposed in the cooling medium, and the space between the outer Dewar and the inner Dewar is a vacuum environment.

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