Low coupling double copper-iron co-fired inductor

Abstract

A kind of low coupling double copper iron co-fired inductance of splicing, including inductance body, through electrode and pin electrode, through electrode penetrates inductance body, and the edge of through electrode is flush with the edge of inductance body;Inductance body and through electrode are provided with two, pin electrode is provided with four, two inductance bodies are stacked and integrated in vertical direction, and the edge of two through electrodes is flush, two inductance bodies are integrated to form double splicing inductance, the projection of two through electrodes in horizontal plane is perpendicular to each other, pin electrode is arranged in the corner of double splicing inductance, and pin electrode is in contact with through electrode, the size of two inductances integrated together is close to single inductance, and two electrodes adopt cross to ensure characteristic area saving, two inductances are very low coupling, the working condition of one inductance is basically not affected by the working condition of another inductance, and the inductance is symmetrical up and down, double splicing inductance not only saves material, but also saves 30% area of mounting.

Description

Technical Field

[0001] This utility model relates to the field of inductors, and in particular to a low-coupling dual-copper-iron co-fired inductor. Background Technology

[0002] Copper-iron co-fired inductors are manufactured by integrally pressing metal powder magnetic material with copper electrodes, followed by sintering under a nitrogen atmosphere at a temperature range of 650-750℃. Copper-iron co-fired inductors are characterized by high material permeability, high saturation magnetization, and the ability to operate for extended periods at temperatures around 150℃. Because of these characteristics, they are widely used in power modules for chips in AI servers.

[0003] Currently, the number of inductors used in a single AI chip is increasing, which means that the mounting area around the chip is being occupied more and more. This necessitates reducing the mounting area while meeting the inductor requirements of the chip. An integrated design is an effective way to solve this problem, but integrating two or more inductors together introduces a coupling issue. If the coupling between two inductors is too strong, their operating conditions when working simultaneously or alternately will differ from those of independent inductors, resulting in different inductance values. Utility Model Content

[0004] The technical problem to be solved by this utility model is to overcome the defect in the existing technology that the two inductors are too strongly coupled, and their working conditions when they work simultaneously or alternately will be different from those of independent inductors, resulting in differences in inductance values. This utility model provides a low-coupling dual-copper-iron co-fired inductor.

[0005] The technical solution adopted by this utility model to solve its technical problem is a low-coupling dual-core copper-iron co-fired inductor, including an inductor body, a through-hole electrode, and lead electrodes. The through-hole electrode penetrates through the inductor body, and the edge of the through-hole electrode is flush with the edge of the inductor body. There are two inductor bodies and two through-hole electrodes, and four lead electrodes. Two inductor bodies are stacked and integrated in the vertical direction, and the edges of the two through-hole electrodes are flush. The two inductor bodies are integrated to form a dual-core inductor. The projections of the two through-hole electrodes on the horizontal plane are perpendicular to each other. The lead electrodes are located at the corners of the dual-core inductor and are in contact with the through-hole electrodes.

[0006] Furthermore, the inductor body is an octagonal prism with four long sides and four short sides, and the width of the through-hole electrode is the same as the length of the short side of the inductor body.

[0007] Furthermore, the short sides are symmetrical and parallel to each other, and the long sides are symmetrical and parallel to each other.

[0008] Furthermore, the through-hole electrode penetrates the inductor body along the vertical direction of the short side and is flush with the short side of the inductor body.

[0009] Furthermore, the length of the pin electrode is equal to the length of the short side, and the height of the pin electrode is equal to the height of the dual-insulator.

[0010] Furthermore, the pin electrodes are mounted on the dual-core inductor by electroplating.

[0011] Furthermore, the inductor body includes an edge layer, a through-core layer, and a merging layer. The through-core electrode is located in the through-core layer. When two inductor bodies are stacked and integrated, the two inductor bodies share a merging layer.

[0012] Furthermore, the edge layer, through-core layer, and merging layer have the same height.

[0013] This utility model has the following beneficial technical effects:

[0014] The size of the two inductors integrated together is close to that of a single inductor. The two electrodes are arranged in a cross shape to ensure performance and save space. The coupling between the two inductors is very low; the operation of one inductor has virtually no impact on the operation of the other. Furthermore, the inductors are symmetrical. This dual-inductor design not only saves on materials but also reduces the mounting area by 30%. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the edge layer structure of the inductor body in an embodiment of a low-coupling dual-copper-iron co-fired inductor of this utility model;

[0016] Figure 2 This is a schematic diagram of the edge layer and through-hole electrode structure of an embodiment of a low-coupling dual-copper-iron co-fired inductor of this utility model;

[0017] Figure 3 This is a schematic diagram of the main structure of the inductor in an embodiment of a low-coupling dual-copper-iron co-fired inductor of this utility model;

[0018] Figure 4 This is a schematic diagram of the main structure of the inductor in an embodiment of a low-coupling dual-copper-iron co-fired inductor of this utility model;

[0019] Figure 5 This is a schematic diagram of the stacked structure of two main inductor bodies in an embodiment of a low-coupling dual-copper-iron co-fired inductor according to this utility model;

[0020] Figure 6 This is a schematic diagram of the dual-cell inductor structure of an embodiment of a low-coupling dual-cell copper-iron co-fired inductor of this utility model;

[0021] Figure 7 This is a schematic diagram of the pin electrode structure of a dual-coupling copper-iron co-fired inductor according to an embodiment of the present invention.

[0022] Explanation of reference numerals in the attached figures:

[0023] 1. Inductor body; 11. Long side; 12. Short side; 13. Edge layer; 14. Through-core layer; 15. Merging layer; 2. Through-core electrode; 3. Lead electrode; 4. Dual-layer inductor. Detailed Implementation

[0024] The present invention will be further described in detail below with reference to the accompanying drawings and embodiments.

[0025] Reference Figure 4 , 5 6. This embodiment includes two inductor bodies 1, two through electrodes 2 and lead electrodes 3. The through electrodes 2 are located inside the inductor body 1 and pass through the inductor body 1 to form an independent inductor. The two independent inductors are stacked vertically and integrated to form a dual-inductor 4. The lead electrodes 3 are located at the four corners of the dual-inductor 4.

[0026] Specifically, the inductor body 1 is an octagonal prism with four long sides 11 and four short sides 12. The four short sides 12 are all the same length, and the four long sides 11 are all the same length. They are arranged sequentially in the order of long side 11, short side 12, long side 11, short side 12. The short sides 12 are symmetrical and parallel to each other, as are the long sides 11. The through-electrode 2 penetrates the inductor body 1 along the vertical direction of the short side 12. The width of the through-electrode 2 is the same as the length of the short side 12 of the inductor body 1, and the length of the through-electrode 2 is the same as the straight-line distance between the two short sides 12, so that the edge of the through-electrode 2 is exactly flush with the short side 12 of the inductor body 1. Furthermore, when two independent inductors are stacked, the two through-electrodes 2 are located on different horizontal planes, but their projections on the horizontal plane are staggered at 90°, ensuring that the through-electrode 2 is exposed on all four short sides 12 of the formed double-layer inductor 4.

[0027] In fact, the inductor body 1 is divided into three layers, specifically including an edge layer 13, a through layer 14, and a merging layer 15. The through electrode 2 is located in the through layer 14. The edge layer 13 and the merging layer 15 are octagonal prisms, and the through layer 14 is also an octagonal prism, which needs to be subtracted from the shape of the through electrode 2, that is, it is approximately two symmetrical trapezoids. Moreover, the heights of the edge layer 13, the through layer 14, and the merging layer 15 are all the same. When two independent inductors are stacked and integrated, the two inductor bodies 1 share a merging layer 15, resulting in a total of five layers in the integrated large inductor, namely the edge layer 13, the through layer 14, the merging layer 15, the through layer 14, and the edge layer 13, and these five layers are also a whole.

[0028] The large inductor formed by stacking two independent inductors cannot yet be called a dual-inductor 4. It only becomes a complete dual-inductor 4 after the lead inductor is installed. The integrated large inductor is also an octagonal column. The lead electrodes 3 are electroplated onto the surface of the short sides 12 of the dual-inductor 4 to form a complete dual-inductor 4. The lead electrodes 3 are actually a very thin layer, with a very small thickness that is usually negligible. The electroplating onto the surface of the short sides 12 is similar to covering the short sides 12. The length of the electroplated lead electrodes 3 is equal to the length of the short sides 12, and the height of the lead electrodes 3 is equal to the height of the dual-inductor 4. At the same time, a small part of the lead electrodes 3 also covers the top and bottom surfaces of the inductor, and the lead electrodes 3 are in contact with the through-hole electrode 2.

[0029] The specific manufacturing process of the dual-cell inductor 4 is as follows:

[0030] 1. Preparation of finished powder: Use iron-silicon-aluminum and iron-nickel atomized powders coated with silica or alumina as raw materials; mix the raw materials with 0.5-3wt% silicone resin and 8-15wt% acetone or anhydrous ethanol to form wet clay blocks, granulate through a 40-60 mesh sieve, and dry for later use.

[0031] 2. Press the material from step 1 into the mold with a pressure of less than 1 MPa to flatten the upper surface, such as... Figure 1 ;

[0032] 3. Place the first through-electrode 2, as follows: Figure 2 As shown;

[0033] 4. Fill the mold again with powder and press the upper surface flat with a pressure of less than 1 MPa. Figure 3 ;

[0034] 5. Place the second through-electrode 2, as follows: Figure 4 As shown;

[0035] 6. Fill the mold again with powder and press the upper surface flat with a pressure of less than 1 MPa. Figure 5 ;

[0036] 7. Heat the mold cavity. Before pressing, preheat the mold cavity at 110-130℃ for 60 seconds, press at 160-180℃ under 600-1800MPa pressure for 70-90 seconds, and then demold.

[0037] 8. Place the formed blank into an atmosphere furnace and sinter it at 660-720℃ for 1-2 hours under nitrogen protection. Remove it after cooling.

[0038] 9. Use a laser to etch the end area, i.e., the short side 12, on the surface to destroy the insulating layer on the powder surface in this area. Then, electroplate a layer of tin on the end area and electroplate the lead electrode 3 onto it.

[0039] In this embodiment, the long side 11 of the dual-instrument 4 is 4.95mm, the short side 12 is 2mm, and the thickness (height) is 2.8mm. The through-hole electrode 2 measures 2×0.35×9mm. The lead electrode 3 covers a length (width) of 2mm and a height of 2.8mm. A small portion of the lead-out length on each side of the top and bottom surfaces of the dual-instrument 4 is 1.6mm. Both inductors have an inductance of 120nH, and the total PCB mounting area is 60mm². 2 .

[0040] Compared to inductors of the same size, this one measures 9×4×2.8mm, with internal electrode dimensions of 2×0.35×9mm, 1.6mm lead-out on each side of the bottom surface, an inductance value of 120nH, and a single unit occupying 36mm² of the PCB mounting area. 2 The two side-by-side chips, including the gap in between, occupy 85mm² of the circuit board mounting area. 2 In comparison, the dual-cell inductor 4 not only uses less material, but also reduces the mounting area by 30%.

[0041] The above are all preferred embodiments of this utility model, and are not intended to limit the scope of protection of this utility model. Identical components are represented by the same reference numerals. It should be noted that the terms "front," "rear," "left," "right," "up," and "down" used in the following description refer to directions in the accompanying drawings, while the terms "inner" and "outer" refer to directions toward or away from the geometric center of a specific component. Therefore, all equivalent changes made to the structure, shape, and principle of this utility model should be included within the scope of protection of this utility model.

Claims

1. A low-coupling dual-copper-iron co-fired inductor, characterized in that, The inductor includes an inductor body (1), a through electrode (2), and a lead electrode (3). The through electrode (2) passes through the inductor body (1), and the edge of the through electrode (2) is flush with the edge of the inductor body (1). There are two inductor bodies (1) and two through electrodes (2), and four lead electrodes (3). Two inductor bodies (1) are stacked and integrated in the vertical direction, and the edges of the two through electrodes (2) are flush. The two inductor bodies (1) are integrated to form a double inductor (4). The projections of the two through electrodes (2) on the horizontal plane are perpendicular to each other. The lead electrodes (3) are installed at the corners of the double inductor (4), and the lead electrodes (3) are in contact with the through electrodes (2).

2. The low-coupling dual-copper-iron co-fired inductor according to claim 1, characterized in that, The inductor body (1) is an octagonal prism with four long sides (11) and four short sides (12). The width of the through electrode (2) is the same as the length of the short side (12) of the inductor body (1).

3. The low-coupling dual-copper-iron co-fired inductor according to claim 2, characterized in that, The short sides (12) are symmetrical and parallel to each other, and the long sides (11) are symmetrical and parallel to each other.

4. The low-coupling dual-copper-iron co-fired inductor according to claim 2, characterized in that, The through-hole electrode (2) penetrates the inductor body (1) in the direction perpendicular to the short side (12) and is flush with the short side (12) of the inductor body (1).

5. A low-coupling dual-copper-iron co-fired inductor according to claim 2, characterized in that, The length of the pin electrode (3) is equal to the length of the short side (12), and the height of the pin electrode (3) is equal to the height of the dual-insulator (4).

6. The low-coupling dual-copper-iron co-fired inductor according to claim 1, characterized in that, The pin electrode (3) is mounted on the dual-core inductor (4) by electroplating.

7. The low-coupling dual-copper-iron co-fired inductor according to claim 1, characterized in that, The inductor body (1) includes an edge layer (13), a through-core layer (14) and a merging layer (15). The through-core electrode (2) is located in the through-core layer (14). When two inductor bodies (1) are stacked and integrated, the two inductor bodies (1) share a merging layer (15).

8. A low-coupling dual-copper-iron co-fired inductor according to claim 7, characterized in that, The edge layer (13), the core layer (14), and the merging layer (15) have the same height.

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