A hollow capacitor facilitating heat dissipation
Patent Information
- Application Number
- CN202522129913.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-10-09
- Publication Date
- 2026-09-15
- Estimated Expiration
- 2035-10-09
AI Technical Summary
[0003]现有技术中的电容器通常采用实心包裹,电容器在长时间连续运行过程中,会因内部电流损耗、介电材料极化等产生持续热量,由于实心封装结构缺乏有效的热量流通通道,热量难以快速传导至外部环境,极易在内部积聚,可能导致电容器自身温度升高,引发介电性能衰减、容量漂移等问题,还会加速内部元件老化,严重时甚至会因热失控影响整体电路的稳定运行,缩短电容器的使用寿命
本实用新型通过当电容产生热量,热量通过电容的内壁传递至与之固定连接的中心轴杆,六角块与中心轴杆内壁开设的六角槽进行配合,防止空心导热管发生转动,保证空心导热管与中心轴杆的稳固连接,提升热量传导效率,进入空心导热管的热量被传递到散热翅片,散热翅片以多片分布式结构在空心导热管内壁均匀设置,当空气流通时可快速将热量通过空气对流传递至外部环境,同时空心导热管的中空结构也为空气流通提供了通道,加速内部热量排出,避免电容核心区域热量堆积,从而降低了电容内部因高温导致的元件老化,提高了电容的使用寿命。
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Figure CN224759266U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of capacitor technology, and in particular to a hollow capacitor that facilitates heat dissipation. Background Technology
[0002] Capacitors are one of the core energy storage components in electronic circuits. Their core function is to temporarily store and release electrical energy, similar to a small energy reservoir in a circuit. Capacitors can smooth the current output of a charger, preventing voltage fluctuations from damaging the battery. They can assist motors in storing energy instantly, making startup smoother. Even when wireless headphones receive signals, certain capacitors can help filter and transmit high-frequency signals, ensuring clear sound quality. The core value of capacitors is "lossless temporary storage of electrical energy" and their response speed is extremely fast, completing charging and discharging in microseconds. Therefore, they have become key components for ensuring circuit stability and realizing specific functions (such as timing, filtering, and coupling).
[0003] In the present technology, capacitors are usually solid-encased. During long-term continuous operation, capacitors will generate continuous heat due to internal current loss and dielectric material polarization. Since the solid encapsulation structure lacks an effective heat flow channel, heat is difficult to conduct to the external environment quickly and is easy to accumulate inside. This may cause the capacitor's own temperature to rise, leading to problems such as dielectric performance degradation and capacitance drift. It will also accelerate the aging of internal components. In severe cases, thermal runaway may even affect the stable operation of the overall circuit and shorten the life of the capacitor. Utility Model Content
[0004] To solve the above-mentioned technical problems, this utility model provides a hollow capacitor that facilitates heat dissipation.
[0005] This utility model is achieved by the following technical solution: a hollow capacitor that facilitates heat dissipation, including a capacitor, a central shaft fixedly connected to the inner wall of the capacitor, a hexagonal groove opened inside the central shaft, a hexagonal block fixedly connected to the outer wall of the hexagonal groove, a hollow heat-conducting pipe fixedly connected to the inner wall of the hexagonal block, and heat dissipation fins fixedly connected to the inner wall of the hollow heat-conducting pipe.
[0006] Through the above technical solution, the heat entering the hollow heat pipe is transferred to the heat dissipation fins. The heat dissipation fins are evenly arranged in a multi-fin distributed structure on the inner wall of the hollow heat pipe. When air circulates, the heat can be quickly transferred to the external environment through air convection. At the same time, the hollow structure of the hollow heat pipe also provides a channel for air circulation, accelerating the dissipation of internal heat and preventing heat accumulation in the core area of the capacitor. This reduces the aging of components inside the capacitor caused by high temperature and improves the service life of the capacitor.
[0007] As a further improvement to the above solution, an epoxy resin is fixedly connected to the outer wall of the capacitor, and a shell is fixedly connected to the epoxy resin outer wall.
[0008] As a further improvement to the above solution, a thermally conductive and insulating coating is fixedly connected to the outer wall of the outer shell, and an antistatic coating is fixedly connected to the outer wall of the thermally conductive and insulating coating.
[0009] Through the above technical solution, epoxy resin, as an insulating layer, can block the electrical connection between the capacitor and the shell, avoiding the risk of leakage. While maintaining insulation, the thermally conductive insulating coating enhances heat conduction through internal thermally conductive fillers, quickly transferring the heat of the shell to the outermost antistatic coating. The antistatic coating is in direct contact with the external environment, preventing electrostatic breakdown of the capacitor's interior. At the same time, the antistatic coating has a smooth surface and is resistant to environmental corrosion, protecting the thermally conductive insulating coating from wear and ensuring long-term stable heat dissipation and insulation performance.
[0010] As a further improvement to the above solution, the outer end of the capacitor is fixedly connected with pins, and there are two pins, which are symmetrically arranged with the capacitor as the center.
[0011] As a further improvement to the above solution, a protective rod is fixedly connected to the outer wall of the pin, and a support plate is fixedly connected to the outer wall of the protective rod.
[0012] As a further improvement to the above solution, two protective rods are provided, which are symmetrically arranged around the capacitor. Four support plates are provided, which are symmetrically arranged around the capacitor.
[0013] As a further improvement to the above solution, a pin expansion piece is fixedly connected to the outer wall of the support plate, and the pin expansion piece is fixedly connected to the outer end of the pin.
[0014] As a further improvement to the above solution, a first support plate is fixedly connected to the outer wall of the pin, and the first support plate is fixedly connected to the outer wall of the pin expansion piece.
[0015] Through the above technical solutions, the pin is the core component for the electrical connection between the capacitor and the external circuit board. The protective rod prevents the pin from bending or breaking due to external force or vibration, indirectly improving the pin's resistance to external force. The pin expansion piece can significantly increase the contact area between the pin and the circuit board pad when the pin is soldered to the circuit board, allowing the solder to more fully cover the pin and the pad, reducing contact resistance, and thus increasing the overall stability.
[0016] Compared with the prior art, the beneficial effects of this utility model are as follows: This invention utilizes a method where, when a capacitor generates heat, the heat is transferred through the inner wall of the capacitor to a centrally connected shaft. A hexagonal block engages with a hexagonal groove on the inner wall of the central shaft to prevent the hollow heat pipe from rotating, ensuring a stable connection between the hollow heat pipe and the central shaft and improving heat conduction efficiency. The heat entering the hollow heat pipe is transferred to the heat dissipation fins, which are evenly distributed in multiple layers on the inner wall of the hollow heat pipe. When air circulates, heat can be quickly transferred to the external environment through air convection. Simultaneously, the hollow structure of the heat pipe provides a channel for airflow, accelerating the dissipation of internal heat and preventing heat accumulation in the core area of the capacitor. This reduces component aging caused by high temperatures inside the capacitor and extends its service life.
[0017] This invention fixes pins at both ends of a capacitor. Pins are the core components that enable electrical connection between the capacitor and the external circuit board. Protective rods are fixed to the outer walls of the pins to prevent them from bending or breaking due to external force or vibration, thus indirectly improving the pins' resistance to external forces. At the same time, the pins are fixed to pin expansion pieces. The pin expansion pieces can significantly increase the contact area between the pins and the circuit board pads when the pins are soldered to the circuit board, allowing the solder to more fully cover the pins and pads, reducing contact resistance. In addition, the first support plate fixed to the outer wall of the pins is connected to the outer wall of the pin expansion pieces, which can reinforce the connection between the pin expansion pieces and the pins from the side, thereby increasing the overall stability. Attached Figure Description
[0018] Figure 1 This is a schematic diagram of the overall structure of this utility model; Figure 2 This is a schematic diagram of the cross-sectional structure of the outer shell of this utility model; Figure 3 This is a schematic diagram of the capacitor structure of this utility model; Figure 4 This is a schematic diagram of the hollow heat pipe structure of this utility model; Figure 5 This is a schematic diagram of the antistatic coating structure of this utility model; Figure 6 This is a schematic diagram of the pin structure of this utility model; Figure 7 This is a schematic diagram of the pin expansion piece structure of this utility model.
[0019] Explanation of key symbols: 1. Capacitor; 2. Central shaft; 3. Hexagonal slot; 4. Hexagonal block; 5. Hollow heat pipe; 6. Heat dissipation fins; 7. Epoxy resin; 8. Outer shell; 9. Thermally conductive and insulating coating; 10. Antistatic coating; 11. Pin; 12. Protective rod; 13. Support plate; 14. Pin expansion piece; 15. First support plate. Detailed Implementation
[0020] The present invention will be further described below with reference to the accompanying drawings and specific embodiments. It should be noted that, without conflict, the various embodiments or technical features described below can be arbitrarily combined to form new embodiments.
[0021] Example: Please combine Figure 1-7 This embodiment provides a hollow capacitor for easy heat dissipation, comprising a capacitor 1, a central shaft 2 fixedly connected to the inner wall of the capacitor 1, a hexagonal groove 3 opened inside the central shaft 2, a hexagonal block 4 fixedly connected to the outer wall of the hexagonal groove 3, a hollow heat-conducting pipe 5 fixedly connected to the inner wall of the hexagonal block 4, and heat dissipation fins 6 fixedly connected to the inner wall of the hollow heat-conducting pipe 5.
[0022] An epoxy resin 7 is fixedly connected to the outer wall of capacitor 1, and an outer shell 8 is fixedly connected to the outer wall of epoxy resin 7.
[0023] The outer wall of the outer casing 8 is fixedly connected to a thermally conductive and insulating coating 9, and the outer wall of the thermally conductive and insulating coating 9 is fixedly connected to an antistatic coating 10.
[0024] The capacitor 1 is fixedly connected to a pin 11. There are two pins 11, which are symmetrically arranged with the capacitor 1 as the center.
[0025] A protective rod 12 is fixedly connected to the outer wall of the pin 11, and a support plate 13 is fixedly connected to the outer wall of the protective rod 12.
[0026] There are two protective rods 12, which are symmetrically arranged with the capacitor 1 as the center. There are four support plates 13, which are symmetrically arranged with the capacitor 1 as the center.
[0027] A pin expansion piece 14 is fixedly connected to the outer wall of the support plate 13, and the pin expansion piece 14 is fixedly connected to the outer end of the pin 11.
[0028] A first support plate 15 is fixedly connected to the outer wall of the pin 11, and the first support plate 15 is fixedly connected to the outer wall of the pin expansion piece 14.
[0029] The implementation principle of a hollow, heat-dissipating capacitor in this embodiment is as follows: When capacitor 1 is in operation, it generates heat. This heat is transferred through the inner wall of capacitor 1 to the central shaft 2, which is fixedly connected to it. The central shaft 2 further conducts the heat to the hollow heat-conducting pipe 5, which is fixed inside by a hexagonal block 4. The hexagonal block 4 cooperates with the hexagonal groove 3 opened in the inner wall of the central shaft 2 to prevent the hollow heat-conducting pipe 5 from rotating, ensuring a stable connection between the hollow heat-conducting pipe 5 and the central shaft 2, and improving the heat conduction efficiency. The heat entering the hollow heat-conducting pipe 5 is transferred to the heat dissipation fins 6. The heat dissipation fins 6 are arranged in a multi-fin distributed structure in the hollow heat-conducting pipe. The inner wall of tube 5 is uniformly arranged, allowing for rapid heat transfer to the external environment via air convection when air circulates. Simultaneously, the hollow structure of the hollow heat-conducting tube 5 provides a channel for airflow, accelerating internal heat dissipation and preventing heat buildup in the core area of capacitor 1. This reduces component aging caused by high temperatures inside capacitor 1 and extends its lifespan. Epoxy resin 7 is fixed to the outer wall of capacitor 1, serving as an insulating layer to block the electrical connection between capacitor 1 and the outer casing 8, preventing leakage risks. Epoxy resin 7 also possesses thermal conductivity, transferring heat from the outer wall of capacitor 1 to the outer casing 8. The outer casing 8, as an outer protective structure, does not... The epoxy resin 7 provides physical protection for capacitor 1 and further diffuses the heat transferred by the epoxy resin 7 to the thermally conductive insulating coating 9 on the surface. While maintaining insulation, the thermally conductive insulating coating 9 enhances heat conduction through internal thermally conductive fillers, rapidly transferring heat from the outer casing 8 to the outermost antistatic coating 10. The antistatic coating 10, in direct contact with the external environment, prevents electrostatic discharge from damaging the inside of capacitor 1. Simultaneously, the smooth surface of the antistatic coating 10 is resistant to environmental corrosion, protecting the thermally conductive insulating coating 9 from wear and ensuring long-term stable heat dissipation and insulation performance. Pins 11 are fixed at both ends of capacitor 1, providing electrical connection between capacitor 1 and the external circuit board. The core component includes a protective rod 12 fixed to the outer wall of the pin 11. The protective rod 12 prevents the pin 11 from bending or breaking due to external force or vibration, indirectly improving the pin 11's resistance to external forces. At the same time, the pin 11 is fixed to the pin expansion piece 14. The pin expansion piece 14 can significantly increase the contact area between the pin 11 and the circuit board pad when the pin 11 is soldered to the circuit board, allowing the solder to more fully cover the pin 11 and the pad, reducing contact resistance. Meanwhile, the first support plate 15 fixed to the outer wall of the pin 11 is connected to the outer wall of the pin expansion piece 14, which can reinforce the connection between the pin expansion piece 14 and the pin 11 from the side, thereby increasing the overall stability.
[0030] The above embodiments are merely preferred embodiments of this utility model and should not be construed as limiting the scope of protection of this utility model. Any non-substantial changes and substitutions made by those skilled in the art based on this utility model shall fall within the scope of protection claimed by this utility model.
Claims
1. A capacitor having a hollow structure for facilitating heat dissipation, characterized in that, The device includes a capacitor (1), a central shaft (2) is fixedly connected to the inner wall of the capacitor (1), a hexagonal groove (3) is opened inside the central shaft (2), a hexagonal block (4) is fixedly connected to the outer wall of the hexagonal groove (3), a hollow heat-conducting pipe (5) is fixedly connected to the inner wall of the hexagonal block (4), and a heat dissipation fin (6) is fixedly connected to the inner wall of the hollow heat-conducting pipe (5).
2. The hollow capacitor for easy heat dissipation as described in claim 1, characterized in that: An epoxy resin (7) is fixedly connected to the outer wall of the capacitor (1), and an outer shell (8) is fixedly connected to the outer wall of the epoxy resin (7).
3. A hollow capacitor for easy heat dissipation as described in claim 2, characterized in that: The outer wall of the outer shell (8) is fixedly connected to a thermally conductive insulating coating (9), and the outer wall of the thermally conductive insulating coating (9) is fixedly connected to an antistatic coating (10).
4. A hollow capacitor for easy heat dissipation as described in claim 1, characterized in that: The capacitor (1) is fixedly connected to a pin (11) at its outer end. There are two pins (11), and the two pins (11) are symmetrically arranged with the capacitor (1) as the center.
5. A hollow capacitor for easy heat dissipation as described in claim 4, characterized in that: A protective rod (12) is fixedly connected to the outer wall of the pin (11), and a support plate (13) is fixedly connected to the outer wall of the protective rod (12).
6. A hollow capacitor for easy heat dissipation as described in claim 5, characterized in that: There are two protective rods (12), which are symmetrically arranged with the capacitor (1) as the center. There are four support plates (13), which are symmetrically arranged with the capacitor (1) as the center.
7. A hollow capacitor for easy heat dissipation as described in claim 6, characterized in that: The outer wall of the support plate (13) is fixedly connected to a pin expansion piece (14), which is fixedly connected to the outer end of the pin (11).
8. A hollow capacitor for easy heat dissipation as described in claim 7, characterized in that: The outer wall of the pin (11) is fixedly connected to a first support plate (15), which is fixedly connected to the outer wall of the pin expansion piece (14).