An antenna cover assembly based on an lds process

Abstract

The utility model relates to sensing detection technical field especially relates to a kind of antenna cover assembly based on LDS process, including antenna cover, high-frequency antenna and bottom shell, the antenna cover and the bottom shell are connected as an entirety and are relatively fixed, pre-printing base is provided on the antenna cover, the high-frequency antenna is formed on the pre-printing base by LDS process, the pre-printing base and the high-frequency antenna are located in the cavity enclosed by the antenna cover and the bottom shell.

Description

Technical Field

[0001] This utility model relates to the field of sensing and detection technology, and in particular to an antenna radome assembly based on LDS technology. Background Technology

[0002] Currently, the industry has an increasing demand for autonomous driving technology and space exploration technology, which places higher demands on the detection capability, resolution capability, spatial size and cost of sensor detection units. The unit size of sensor detection units, the space required for placement and avoidance, and the cost of components all urgently need to be improved.

[0003] For millimeter-wave sensing units, traditional methods employ either a combination of onboard microstrip antennas and radomes, or a combination of waveguide antennas and radomes. Both combinations require numerous components and occupy significant installation space, necessitating the separate manufacturing and assembly of the antenna, circuit board, and radome. Accumulated deviations during installation can easily lead to variations in antenna performance, resulting in significant performance inconsistencies, prolonged product development cycles, and hindering miniaturization and cost control. The combination of waveguide antennas and radomes demands even higher mechanical precision and surface metallization accuracy, placing higher demands on manufacturing processes and increasing manufacturing costs. Utility Model Content

[0004] This utility model provides an antenna radome assembly based on LDS process, which includes an antenna radome, a high-frequency antenna and a bottom shell. The antenna radome and the bottom shell are connected as a whole and relatively fixed. A pre-printed base is provided on the antenna radome. The high-frequency antenna is formed on the pre-printed base by LDS process. The pre-printed base and the high-frequency antenna are located in the cavity enclosed by the antenna radome and the bottom shell.

[0005] Furthermore, the high-frequency antenna includes an array unit and a feed point unit, both of which are formed on the lower surface of the pre-printed substrate. The feed point unit is electrically connected to a feed terminal located below it. The feed terminal is used to form the feed network of the high-frequency antenna. The feed terminal is also electrically connected to a high-frequency circuit board located in the cavity formed by the radome and the bottom shell.

[0006] Furthermore, a fixing seat is provided on the radome, and the fixing seat is disposed in the cavity formed by the radome and the bottom shell, and the fixing seat is used to fix the feed terminal.

[0007] Furthermore, the feed terminal includes a main body, a feed point contact, a side protrusion, and a second crimping part. The feed point contact is located at the upper end of the main body and abuts against and is interference-fitted with the feed point unit. The feed terminal is used to form an electrical connection with the high-frequency antenna. The side protrusion is located on the side of the main body and abuts against the inner wall of the mounting base. The feed terminal is fixed in the mounting base by the interference fit between the side protrusion and the mounting base. The second crimping part is located at the lower end of the main body and is used to form an electrical connection with the high-frequency circuit board.

[0008] Furthermore, the mounting base includes a top limiting block and a limiting chamfer. The upper end of the mounting base is integrally connected to the antenna cover. The top limiting block is located at the top of the mounting base and is formed by protruding inward from the inner wall of the mounting base. The top limiting block abuts against the feed terminal in the circumferential direction, thereby limiting the feed terminal circumferentially within the mounting base. The limiting chamfer is located at the lower section of the inner wall of the mounting base and is used to form a chamfer at the lower end of the inner wall of the mounting base to facilitate the axial insertion of the feed terminal into the mounting base.

[0009] Furthermore, the high-frequency circuit board is disposed in the cavity formed by the antenna cover and the bottom shell. The high-frequency circuit board is electrically connected to the feed terminal. The main body of the high-frequency circuit board integrates a radio frequency management unit (MMIC) and a high-frequency signal transmission line. The radio frequency management unit (MMIC) and the high-frequency signal transmission line are electrically connected. The feed terminal is electrically connected to the radio frequency management unit (MMIC) through the high-frequency signal transmission line.

[0010] Furthermore, it also includes an external connector integrated on the bottom housing. A portion of the external connector is located within the cavity formed by the radome and the bottom housing, and another portion is located outside the cavity formed by the radome and the bottom housing, below the bottom housing. The external connector includes external connection terminals for electrical connection with external devices, and the external connection terminals are electrically connected to the high-frequency circuit board.

[0011] Furthermore, the high-frequency circuit board is provided with a through-hole unit, which is electrically connected to the high-frequency circuit board. The through-hole unit includes a first through-hole and a second through-hole formed on the high-frequency circuit board. The first through-hole is integrated with the high-frequency signal transmission line and forms an electrical connection with the high-frequency signal transmission line. The power supply terminal can be pressed into the first through-hole by a crimping process to form an electrical connection with the high-frequency signal transmission line. The external connection terminal can be pressed into the second through-hole by a crimping process to form an electrical connection with the high-frequency circuit board.

[0012] Furthermore, it also includes a positioning part, a lower support block, and an upper support block. The positioning part and the lower support block are disposed on the bottom shell and are integrally connected to the bottom plate of the bottom shell. The upper support block is disposed below the radome and is integrally connected to the top plate of the radome. The positioning part, the lower support block, and the upper support block are respectively disposed in the cavity formed by the radome and the bottom shell. The positioning part is used to position the high-frequency circuit board relative to the bottom shell. The lower support block and the upper support block abut against the high-frequency circuit board from above and below, respectively, to fix the high-frequency circuit board in the cavity formed by the radome and the bottom shell.

[0013] Furthermore, it also includes a flange and a sidewall. The flange is formed by folding down the edge of the top plate and extending downward, and the sidewall is formed by folding up the edge of the bottom plate and extending upward. The sidewall is located inside the flange, and the inside of the flange abuts against and seals the outside of the sidewall.

[0014] The radome assembly based on LDS technology provided by this utility model avoids the use of onboard microstrip antennas or waveguide antennas in the sensing and detection unit by manufacturing an radome with an integrated high-frequency antenna based on LDS technology. It also firmly fixes the relative relationship between the high-frequency antenna and the radome, eliminates the traditional antenna and radome assembly steps, reduces the accumulation of installation deviations, makes the antenna performance consistency fluctuation small, shortens the product development cycle, and reduces product costs. Attached Figure Description

[0015] Figure 1 A cross-sectional view of the radome assembly based on LDS technology provided by this utility model.

[0016] Figure 2 This is an exploded view of the radome assembly based on LDS technology in this utility model.

[0017] Figure 3 This is another exploded view of the radome assembly based on LDS technology in this utility model.

[0018] Figure 4 This is a schematic diagram of the radome in this utility model.

[0019] Figure 5 This is a schematic diagram of the bottom shell in this utility model.

[0020] Figure 6 This is a schematic diagram of the high-frequency circuit board in this utility model.

[0021] Figure 7 This is a schematic diagram of the high-frequency antenna, high-frequency circuit board, and feed terminal in this utility model.

[0022] Figure 8 This is a partially enlarged schematic diagram of the external connector and high-frequency circuit board in this utility model.

[0023] Figure 9 This is a partially enlarged schematic diagram of the mounting base and power supply terminal in this utility model.

[0024] Figure 10 This is a partial schematic diagram of the flange and sidewall portion in this utility model.

[0025] In the figure: 11. Bottom shell; 111. Base plate; 112. External connector; 113. External connection terminal; 1131. First crimping part; 114. Positioning part; 115. Lower support block; 116. Side wall part; 12. Radome; 121. Array unit; 122. Feed point unit; 123. Top plate; 124. Pre-printed base; 125. Mounting base; 1251. Top limiting block; 1252. Limiting chamfer; 126. Flanged edge; 127. Upper support block; 13. High-frequency circuit board; 131. Main board body; 132. Through-hole unit; 133. First through-hole; 134. High-frequency signal transmission line; 135. Radio frequency management unit (MMIC); 137. Second through-hole; 14. Power supply terminal; 141. Main body; 142. Power supply contact part; 143. Second crimping part; 144. Side protrusion part. Detailed Implementation

[0026] To further illustrate the technical means and effects adopted by this utility model in order to achieve the intended purpose of the invention, the present utility model will be described in detail below with reference to the accompanying drawings and preferred embodiments.

[0027] It should be noted that the terms "first," "second," "third," "fourth," etc., in the specification and claims of this utility model are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence.

[0028] LDS (Laser-Direct-structuring) is a technology that uses specialized composite plastics and organometallic compounds as substrates to form circuits on the substrates through steps such as laser activation and chemical plating.

[0029] Please see Figures 1 to 6The radome assembly based on LDS technology provided by this utility model can be applied to sensing and detection units, especially to millimeter-wave sensing units in millimeter-wave imaging radar. The radome assembly based on LDS technology in this utility model includes an radome 12, a high-frequency antenna, and a base shell 11. The radome 12 and the base shell 11 are connected as a whole and relatively fixed. A pre-printed base plate 124 is provided on the radome 12. The high-frequency antenna is formed on the pre-printed base plate 124 by LDS technology. The pre-printed base plate 124 and the high-frequency antenna are located in the cavity enclosed by the radome 12 and the base shell 11. Specifically, the radome 12 in this invention is produced by injection molding using plastic with good wave transmittance that meets the requirements of the LDS process. A pre-printed substrate 124 is located inside the top plate 123 of the radome 12, on the side of the radome 12 facing the bottom shell 11. The pre-printed substrate 124 serves as the base for the LDS process. The pre-printed substrate 124 contains at least a special composite plastic and an organometallic composite. The pre-printed substrate 124 can be laser-activated and chemically plated during the LDS process to form a circuit, thus assembling a high-frequency antenna. In one embodiment of this invention, the high-frequency antenna includes an array unit 121 and a feed unit 122. Both the array unit 121 and the feed unit 122 are formed on the lower surface of the pre-printed substrate 124. The feed unit 122 is electrically connected to a feed terminal 14 located below it. The feed terminal 14 is used to form the feed network of the high-frequency antenna. For cost considerations, adjusting the relative distance or positional relationship between the feed point unit 122 and the feed terminal 14 can be achieved by adjusting the size of the pre-printed base plate 124 without changing the specifications of the feed terminal 14. The radome assembly based on LDS technology provided by this invention avoids the use of onboard microstrip antennas or waveguide antennas in the sensing and detection unit by manufacturing the radome 12 with an integrated high-frequency antenna using LDS technology. It also firmly fixes the relative relationship between the high-frequency antenna and the radome 12, eliminating the traditional assembly steps of the antenna and radome 12, reducing the accumulation of installation deviations, minimizing fluctuations in antenna performance consistency, shortening the product development cycle, and reducing product costs.

[0030] Please refer to the following: Figure 7 and Figure 8Furthermore, the LDS-based radome assembly of this invention also includes a high-frequency circuit board 13 and an external connector 112. The high-frequency circuit board 13 is disposed within the cavity formed by the radome 12 and the bottom shell 11. The high-frequency circuit board 13 is electrically connected to the feed terminal 14. The main board 131 of the high-frequency circuit board 13 integrates a radio frequency management unit MMIC135 (Monolithic Microwave Integrated Circuit). Circuit (microwave integrated chip) and high-frequency signal transmission line 134, radio frequency management unit MMIC 135 and high-frequency signal transmission line 134 are electrically connected, and feed terminal 14 is electrically connected to radio frequency management unit MMIC 135 through high-frequency signal transmission line 134; external connector 112 is integrated on bottom shell 11, part of external connector 112 is located in the cavity formed by radome 12 and bottom shell 11, and another part is located outside the cavity formed by radome 12 and bottom shell 11, below bottom shell 11. External connector 112 includes external connection terminal 113 for electrical connection with external devices. External connection terminal 113 is also electrically connected to high-frequency circuit board 13. External connector 112, external connection terminal 113 and bottom plate portion 111 of bottom shell 11 are integrated into one piece by overmolding process. Please refer to the following. Figure 6 , Figure 7 and Figure 8 Specifically, in one embodiment of this utility model, a through-hole unit 132 is provided on the high-frequency circuit board 13. The through-hole unit 132 is electrically connected to the high-frequency circuit board 13. The through-hole unit 132 includes a first through-hole 133 and a second through-hole 137 formed on the high-frequency circuit board 13. A plurality of first through-holes 133 are arranged at intervals in the middle of the high-frequency circuit board 13 to correspond one-to-one with the power supply terminals 14 above them. The first through-holes 133 are integrated with the high-frequency signal transmission line 134 and are electrically connected to the high-frequency signal transmission line 134. The power supply terminals 14 can be pressed into the first through-holes 133 by a crimping process to form an electrical connection with the high-frequency signal transmission line 134. A plurality of second through-holes 137 are arranged at intervals on the side of the high-frequency circuit board 13 near the external connector 112 to correspond one-to-one with the external connection terminals 113 below them. The first crimping part 1131 located on the top of the external connection terminal 113 can be pressed into the second through-hole 137 by a crimping process to form an electrical connection with the high-frequency circuit board 13. The feed point unit 122, the feed terminal 14, the through hole unit 132, the high-frequency signal transmission line 134, and the radio frequency management unit MMIC 135 constitute a complete antenna radio frequency system.

[0031] Please refer to the following: Figure 9 Furthermore, the radome 12 in this invention also includes a fixing base 125, which is disposed within the cavity formed by the radome 12 and the bottom shell 11, below the radome 12. The fixing base 125 is used to fix the feed terminal 14. Please refer to the following for details. Figure 4 , Figure 6 and Figure 9 Specifically, in one embodiment of this utility model, the feed terminal 14 includes a main body 141, a feed point contact 142, a side protrusion 144, and a second crimping part 143. The feed point contact 142 is located at the upper end of the main body 141. The feed point contact 142 abuts against and is interference-fitted with the feed point unit 122 of the high-frequency antenna, so that the feed terminal 14 is relatively fixed with the high-frequency antenna and forms a stable electrical connection. The side protrusion 144 is located on the side of the main body 141. The side protrusion 144 abuts against the inner wall of the fixing seat 125. The feed terminal 14 is fixed in the fixing seat 125 by the interference fit between the side protrusion 144 and the fixing seat 125. The second crimping part 143 is located at the lower end of the main body 141. The second crimping part 143 can be pressed into the first through hole 133 by crimping process to form an electrical connection with the high-frequency circuit board 13. The mounting base 125 is located on the side of the array unit 121 where the feed point unit 122 is provided. The mounting base 125 includes a top limiting block 1251 and a limiting chamfer 1252. The mounting base 125 is a single-sided open cylindrical structure with the opening facing downward. The upper end of the mounting base 125 is connected to the top plate body 123 as a whole. The top limiting block 1251 is located at the top of the mounting base 125. The top limiting block 1251 is formed by protruding inward from the inner wall of the mounting base 125. The top limiting block 1251 abuts against the main body 141 of the feed terminal 14 in the circumferential direction, thereby limiting the feed terminal 14 in the circumferential direction within the mounting base 125. The limiting chamfer 1252 is located at the lower end of the inner wall of the mounting base 125. The limiting chamfer 1252 is used to form a chamfer at the lower end of the inner wall of the mounting base 125 to facilitate the axial extension of the feed terminal 14 into the mounting base 125. In particular, the feed terminal in this utility model is made of copper alloy, while the antenna cover 12 and the bottom shell 11 are made of plastic material with a hardness much lower than that of copper alloy. Therefore, when the feed terminal 14 is installed into the fixing seat 125, the fixing seat 125 will produce a certain degree of elastic deformation, ensuring that interference fit is formed everywhere, so that the assembly effect is stable.

[0032] Please refer to this carefully. Figure 1 , Figure 2 and Figure 3Furthermore, the LDS-based radome assembly of this invention also includes a positioning part 114, a lower support block 115, and an upper support block 127. The positioning part 114 and the lower support block 115 are disposed on the bottom shell 11 and are integrally connected to the bottom plate 111 of the bottom shell 11. The upper support block 127 is disposed below the top plate 123 and is integrally connected to the top plate 123. The positioning part 114, the lower support block 115, and the upper support block 127 are respectively disposed within the cavity formed by the radome 12 and the bottom shell 11. 114 can extend into the positioning hole 136 on the motherboard body 131 to position the motherboard body 131 relative to the bottom shell 11. The lower support block 115 and the upper support block 127 abut against the motherboard body 131 from above and below, respectively, to fix the high-frequency circuit board 13 in the cavity formed by the antenna cover 12 and the bottom shell 11. That is, the motherboard body 131 is sandwiched between the lower support block 115 and the upper support block 127, and its height in the cavity formed by the lower support block 115 and the upper support block 127 is restricted by the lower support block 115 and the upper support block 127. Specifically, in one embodiment of this utility model, the positioning part 114 is a columnar structure protruding from the four corners of the bottom shell 11. The lower end of the positioning part 114 is integrated with the bottom plate part 111. A total of four positioning parts 114 are located at the four corners of the bottom plate part 111, corresponding to the positioning holes 136 located at the four corners of the main body 131 to form shaft hole fits. The lower support block 115 is a plate-shaped structure protruding from the bottom plate part 111. The lower support block 115 is disposed around the positioning part 114. Two lower support blocks 115 can be joined together to form an approximately quarter cylinder and surround it. A positioning part 114, i.e., the base plate part 111, has a total of eight lower support blocks 115 at its four corners. The lower end of the lower support block 115 is integrated with the base plate part 111, and the upper end of the lower support block 115 abuts against the lower surface of the main body 131. The upper support block 127 is a rectangular block structure protruding below the top plate 123. The upper end of the upper support block 127 is integrated with the top plate 123. Several upper support blocks 127 are located on the inner edge of the radome 12, and the lower end of the upper support block 127 abuts against the upper surface of the main body 131. In this utility model, the high-frequency circuit board 13 is limited and fixed in the cavity formed by the radome 12 and the base shell 11 by the positioning part 114, the lower support blocks 115, and the upper support blocks 127, so that the high-frequency circuit board 13 and the high-frequency antenna on the radome 12 form a stable spatial relationship.

[0033] Please refer to the following: Figure 10Furthermore, the LDS-based radome assembly of this invention also includes a flange 126 on the radome 12 and a sidewall 116 on the bottom shell 11. The flange 126 is formed by folding down and extending downward from the edge of the top plate 123, and the sidewall 116 is formed by folding up and extending upward from the edge of the bottom plate 111. The sidewall 116 is located inside the flange 126, and the inner side of the flange 126 abuts against and seals the outer side of the sidewall 116. In particular, in one embodiment of this invention, the flange 126 extends slightly outward from top to bottom, so when the sidewall 116 is gradually moved upward from the inner side of the flange 126 for assembly, the friction gradually increases, resulting in a good relative positioning effect. In this invention, the radome 12 and the bottom shell 11 are connected as one unit by laser welding. The welding point of the laser welding is located at the upper end of the side wall 116 and the inner side of the flange 126. During welding, a part of the upper end of the side wall 116 melts and fuses with the lower surface of the radome 12, so that the radome 12 and the bottom shell 11 enclose and form a sealed cavity.

[0034] In summary, the radome assembly based on LDS technology provided by this utility model avoids the use of onboard microstrip antennas or waveguide antennas in the sensing and detection unit by manufacturing an radome with an integrated high-frequency antenna based on LDS technology. It also firmly fixes the relative relationship between the high-frequency antenna and the radome, eliminates the traditional antenna and radome assembly steps, reduces the accumulation of installation deviations, minimizes the fluctuation of antenna performance consistency, shortens the product development cycle, and reduces product costs.

[0035] The above are merely specific embodiments of this utility model, but the protection scope of this utility model is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this utility model should be included within the protection scope of this utility model. Therefore, the protection scope of this utility model should be determined by the scope of the claims.

Claims

1. An antenna radome assembly based on LDS technology, characterized in that: The device includes an radome (12), a high-frequency antenna, and a base shell (11). The radome (12) and the base shell (11) are connected as a whole and relatively fixed. A pre-printed substrate (124) is provided on the radome (12). The high-frequency antenna is formed on the pre-printed substrate (124) by LDS process. The pre-printed substrate (124) and the high-frequency antenna are located in the cavity formed by the radome (12) and the base shell (11).

2. The radome assembly based on LDS technology as described in claim 1, characterized in that: The high-frequency antenna includes an array unit (121) and a feed point unit (122). The array unit (121) and the feed point unit (122) are both formed on the lower surface of the pre-printed substrate (124). The feed point unit (122) is electrically connected to a feed terminal (14) located below it. The feed terminal (14) is used to form the feed network of the high-frequency antenna. The feed terminal (14) is also electrically connected to a high-frequency circuit board (13) located in the cavity formed by the radome (12) and the bottom shell (11).

3. The radome assembly based on LDS technology as described in claim 2, characterized in that: A mounting base (125) is provided on the radome (12). The mounting base (125) is located in the cavity formed by the radome (12) and the bottom shell (11). The mounting base (125) is used to fix the feed terminal (14).

4. The radome assembly based on LDS technology as described in claim 3, characterized in that: Therefore, the feed terminal (14) includes a main body (141), a feed point contact (142), a side protrusion (144), and a second crimping part (143). The feed point contact (142) is located at the upper end of the main body (141). The feed point contact (142) abuts against the feed point unit (122) and is interference-fitted. The feed terminal (14) is used to form an electrical connection with the high-frequency antenna. The side protrusion (144) is located on the side of the main body (141). The side protrusion (144) abuts against the inner wall of the fixing seat (125). The feed terminal (14) is fixed in the fixing seat (125) by the interference fit between the side protrusion (144) and the fixing seat (125). The second crimping part (143) is located at the lower end of the main body (141). The second crimping part (143) is used to form an electrical connection with the high-frequency circuit board (13).

5. The radome assembly based on LDS technology as described in claim 3, characterized in that: The mounting base (125) includes a top limiting block (1251) and a limiting chamfer (1252). The upper end of the mounting base (125) is integrally connected to the antenna cover (12). The top limiting block (1251) is located at the top of the mounting base (125). The top limiting block (1251) is formed by protruding inward from the inner wall of the mounting base (125). The top limiting block (1251) abuts against the feed terminal (14) in the circumferential direction, thereby limiting the feed terminal (14) in the mounting base (125) in the circumferential direction. The limiting chamfer (1252) is located at the lower section of the inner wall of the mounting base (125). The limiting chamfer (1252) is used to form a chamfer at the lower end of the inner wall of the mounting base (125) to facilitate the axial insertion of the feed terminal (14) into the mounting base (125).

6. The radome assembly based on LDS technology as described in claim 2, characterized in that: The high-frequency circuit board (13) is disposed in the cavity formed by the radome (12) and the bottom shell (11). The high-frequency circuit board (13) is electrically connected to the feed terminal (14). The main body (131) of the high-frequency circuit board (13) integrates a radio frequency management unit (MMIC) (135) and a high-frequency signal transmission line (134). The radio frequency management unit (MMIC) (135) and the high-frequency signal transmission line (134) are electrically connected. The feed terminal (14) is electrically connected to the radio frequency management unit (MMIC) (135) through the high-frequency signal transmission line (134).

7. The radome assembly based on LDS technology as described in claim 6, characterized in that: It also includes an external connector (112) integrated on the bottom shell (11). A portion of the external connector (112) is located within the cavity formed by the radome (12) and the bottom shell (11), and another portion is located outside the cavity formed by the radome (12) and the bottom shell (11) and below the bottom shell (11). The external connector (112) includes an external connection terminal (113) for electrical connection with an external device. The external connection terminal (113) is electrically connected to the high-frequency circuit board (13).

8. The radome assembly based on LDS technology as described in claim 7, characterized in that: The high-frequency circuit board (13) is provided with a through-hole unit (132), which is electrically connected to the high-frequency circuit board (13). The through-hole unit (132) includes a first through-hole (133) and a second through-hole (137) opened on the high-frequency circuit board (13). The first through-hole (133) is integrated with the high-frequency signal transmission line (134) and forms an electrical connection with the high-frequency signal transmission line (134). The power supply terminal (14) can be pressed into the first through-hole (133) by a crimping process to form an electrical connection with the high-frequency signal transmission line (134). The external connection terminal (113) can be pressed into the second through-hole (137) by a crimping process to form an electrical connection with the high-frequency circuit board (13).

9. The radome assembly based on LDS technology as described in claim 2, characterized in that: It also includes a positioning part (114), a lower support block (115), and an upper support block (127). The positioning part (114) and the lower support block (115) are disposed on the bottom shell (11) and are connected to the bottom plate (111) of the bottom shell (11) as a whole. The upper support block (127) is disposed below the radome (12) and is connected to the top plate (123) of the radome (12) as a whole. The positioning part (114) and the lower support block (115) The upper support block (127) and the lower support block (115) are respectively disposed in the cavity formed by the radome (12) and the bottom shell (11). The positioning part (114) is used to position the high frequency circuit board (13) relative to the bottom shell (11). The lower support block (115) and the upper support block (127) abut against the high frequency circuit board (13) from above and below, respectively, so as to fix the high frequency circuit board (13) in the cavity formed by the radome (12) and the bottom shell (11).

10. The radome assembly based on LDS technology as described in claim 2, characterized in that: It also includes a flange (126) and a side wall (116), the flange (126) being formed by folding down the edge of the top plate (123) and extending downward, and the side wall (116) being formed by folding up the edge of the bottom plate (111) and extending upward. The side wall (116) is located inside the flange (126), and the inside of the flange (126) abuts against and seals the outside of the side wall (116).

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