A patch wiring terminal

Abstract

The utility model discloses a kind of patch wiring terminals including terminal body, it is integrally punched and coiled into shape by single sheet metal material, two side edges are curled along longitudinal direction and mutually embedded to form cylindrical side wall;Terminal body top is equipped with buckling part, and upper edge on side wall is realized mechanical locking by buckle structure, constitutes closed or semi-closed cylindrical cavity;Top surface is provided with threaded hole that is passed to cavity interior;Bottom is equipped with pad and downwardly extending plug-in board pin, constitutes double welding interface;The patch wiring terminal has the advantages of compact structure, high compressive strength, reliable welding, corrosion resistance and adapt to automation production etc..

Description

Technical Field

[0001] This utility model relates to the field of terminal block technology, specifically a surface mount terminal block. Background Technology

[0002] While commonly used cylindrical metal terminals can meet basic electrical connection requirements, they have significant shortcomings in key areas such as structural reliability, welding stability, and environmental adaptability. First, most cylindrical terminals are manufactured using segmented processing and assembly methods, such as welding the screw base to the main body and riveting the pins to the main body. This creates physical gaps at the joints, increasing contact resistance and resulting in insufficient compressive strength (<150MPa), making them prone to loosening under vibration. Second, using thick plate stamping processes to manufacture terminals leads to a large amount of copper used, resulting in high costs. Third, existing terminals often have only a single welding structure on the bottom, such as only having through-hole pins or surface mount pads. When only through-hole pins are used, insufficient contact between the pins and the through-hole wall can easily occur if the PCB through-hole diameter is off or the solder amount is insufficient. When only surface mount pads are used, the pad area is usually small, leading to concentrated welding stress. This can cause solder cracking or even detachment under thermal cycling conditions, and pre-positioning is not possible, making the terminal prone to misalignment during welding. Utility Model Content

[0003] To address the aforementioned challenges, this invention proposes a one-piece, low-cost, and highly reliable surface mount terminal block. The terminal block comprises a terminal body formed by integrally stamping and rolling a single sheet of metal. Its two side edges are longitudinally rolled and interlocked to form a cylindrical sidewall. The top of the terminal body has an inwardly or outwardly folded-out fastening portion, which is mechanically locked to the upper edge of the sidewall via a snap-fit ​​structure, thus forming a closed or semi-closed cylindrical cavity. The top surface of the terminal body has a threaded hole extending into the cylindrical cavity. The bottom of the terminal body has mounting pads and downwardly extending insert pins, which together with the mounting pads form a dual soldering interface.

[0004] Preferably, the first snap-fit ​​connection structure includes a first snap-fit ​​arm disposed on the edge of one side wall of the terminal body, and a first snap-fit ​​groove disposed on the edge of the opposite side wall. The first snap-fit ​​arm is embedded in the first snap-fit ​​groove to achieve mechanical locking of the side wall in a curled-up state. The second snap-fit ​​connection structure includes a second snap-fit ​​arm disposed around the edge of the top surface of the terminal body, and a second snap-fit ​​groove disposed on the outer side of the top of the side wall. The second snap-fit ​​arm and the second snap-fit ​​groove engage with each other to achieve circumferential mechanical locking between the top wall and the side wall.

[0005] Preferably, the ends of the plug pins are provided with guide chamfers with rounded transitions.

[0006] Preferably, the number of pins on the insert plate is two or more, symmetrically distributed on both sides of the central axis at the bottom of the cylindrical structure.

[0007] Preferably, the surface of the mounting pads has rough textures or pits.

[0008] Preferably, the depth of the rough texture or pit is 0.02-0.03 mm.

[0009] Preferably, the outer surface of the sidewall of the terminal body is provided with anti-slip texture.

[0010] Preferably, the surface of the metal sheet is provided with an electroplated layer with a thickness of 0.01-0.05 mm.

[0011] Preferably, the electroplated layer is one or more composite layers selected from tin plating, nickel plating, or silver plating.

[0012] Preferably, the bottom of the threaded hole is provided with an annular protrusion, and the inner wall of the threaded hole is provided with an anti-rust coating.

[0013] The beneficial effects are as follows: This application uses a single sheet metal to be integrally stamped and rolled, combined with a double snap-locking structure, which reduces the amount of copper used while increasing the compressive strength of the terminal body to over 200MPa, balancing low cost and high structural stability; the dual welding interface formed by the through-hole pins and the surface mount pads is suitable for both through-hole welding and surface mount, enhancing the reliability of the connection with the PCB board and effectively avoiding cold solder joints and solder cracking; the gap between the through-hole pins and the surface mount pads can effectively compensate for thermal stress during the welding process and prevent welding deformation; the rough texture or pits on the surface of the surface mount pads and the through-hole design significantly enhance the solder adhesion, reducing the solder cracking rate by 90% under hot and cold cycling conditions; the inner wall of the threaded hole is provided with an anti-rust coating, and the bottom is provided with a raised structure, which improves the clamping force and anti-rust ability of the wiring and avoids loosening caused by vibration; the outer surface of the side wall of the terminal body is provided with an anti-slip texture, which facilitates automated gripping and manual operation; the end of the through-hole pins is provided with a guide chamfer, which improves the accuracy of docking with the PCB board and the assembly efficiency. In addition, a sealing ring groove is provided at the top of the threaded hole. After the silicone sealing ring is installed, it can effectively prevent dust and moisture from entering, and reduce the internal oxidation rate of the terminal by 80%, further improving the environmental adaptability and service life of the product. Attached Figure Description

[0014] The accompanying drawings, which are included to provide a further understanding of this application and form part of this application, illustrate exemplary embodiments and are used to explain this application, but do not constitute an undue limitation of this application. In the drawings: Figure 1 This is a schematic diagram of the unfolded front structure of the surface mount terminal block of this application; Figure 2 This is a schematic diagram of the unfolded structure of the surface mount terminal block of this application; Figure 3 This is a first-view perspective three-dimensional structural diagram of the surface mount terminal block of this application; Figure 4 This is a two-dimensional structural diagram of the surface mount terminal block of this application from a second perspective; In the picture: 1. Terminal body; 11. Fastening part; 12. Side wall; 121. First snap-fit ​​connection structure; 1211. First snap-fit ​​arm; 1212. First snap-fit ​​groove; 13. Top wall; 131. Second snap-fit ​​connection structure; 1311. Second snap-fit ​​arm; 1312. Second snap-fit ​​groove; 132. Threaded hole; 14. Plug-in pins; 15. Mounting solder pads. Detailed Implementation

[0015] The following drawings will disclose several embodiments of this utility model. For clarity, many practical details will be described in the following description. However, it should be understood that these practical details should not be used to limit this utility model. That is, in some embodiments of this utility model, these practical details are not essential. In addition, for the sake of simplicity, some conventional structures and components will be shown in the drawings in a simple schematic manner.

[0016] It should be noted that all directional indicators in this utility model embodiment, such as up, down, left, right, front, back, etc., are only used to explain the relative positional relationship and movement of the components in a specific posture as shown in the attached figure. If the specific posture changes, the directional indicator will also change accordingly.

[0017] Furthermore, in this utility model, the use of terms such as "first" and "second" is for descriptive purposes only and does not specifically refer to any order or sequence, nor is it intended to limit the utility model. They are merely used to distinguish components or operations described with the same technical terms and should not be construed as indicating or implying their relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the technical solutions of various embodiments can be combined with each other, but only if they are feasible for those skilled in the art. If a combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this utility model.

[0018] Example Please see Figure 1 and Figure 2 , Figure 1This is a schematic diagram of the unfolded structure of the surface mount terminal block of this application. Figure 2 This is a three-dimensional structural diagram of the surface mount terminal block of this application. This embodiment provides a surface mount terminal block including a terminal body 1. The terminal body 1 is made of a single metal sheet (such as brass or copper alloy). The thickness of the metal sheet is 0.3-0.8 mm, a thickness range that ensures strength while saving cost. The surface of the metal sheet is provided with an electroplating layer of 0.01-0.05 mm thickness. The electroplating layer is one or more composite layers selected from tin plating, nickel plating, or silver plating, used to improve the corrosion resistance and conductivity stability of the terminal body 1. For example, a nickel-tin composite electroplating layer can be used, first plating a 0.02 mm thick nickel layer to improve the adhesion and corrosion resistance of the metal sheet, and then plating a 0.01 mm thick tin layer to reduce contact resistance and improve conductivity stability.

[0019] See also Figure 1 The terminal body 1 includes a side wall 12 and a top wall 13. The side wall 12 and the top wall 13 are connected by a fastening part 11. The two sides of the side wall 12 are rolled longitudinally and interlocked with each other through a first snap-fit ​​connection structure 121 to form a cylindrical structure. The fastening part 11 is folded 90° so that the top wall 13 covers one end of the cylindrical structure and is mechanically locked through a second snap-fit ​​connection structure 131, thereby forming a closed or semi-closed cylindrical cavity. The top wall 13 has a threaded hole 132 that extends into the interior of the cylindrical cavity. The bottom of the cylindrical structure is provided with a mounting pad 15 and a downwardly extending insert pin 14. The insert pin 14 and the mounting pad 15 together form a double soldering interface.

[0020] Please see Figure 3 and Figure 4 , Figure 3 This is a first-view perspective three-dimensional structural diagram of the surface mount terminal block of this application. Figure 4This is a two-dimensional structural diagram of the patch terminal block of this application from a second perspective. The first snap-fit ​​connection structure 121 includes a first snap-fit ​​arm 1211 disposed on the edge of one side wall 12 of the terminal body 1, and a first snap-fit ​​groove 1212 disposed on the edge of the opposite side wall 12. The first snap-fit ​​arm 1211 is embedded in the first snap-fit ​​groove 1212, realizing mechanical locking of the two side walls 12 in the curled-closed state, preventing the side walls 12 from loosening, and improving the overall stability and compressive strength of the cylindrical structure. The second snap-fit ​​connection structure 131 includes a second snap-fit ​​arm 1311 disposed around the edge of the top surface of the terminal body 1, and a second snap-fit ​​groove 1312 disposed on the outer side of the top of the side wall 12. The second snap-fit ​​arm 1311 and the second snap-fit ​​groove 1312 engage with each other, realizing circumferential mechanical locking between the top wall 13 and the side wall 12, further enhancing the sealing and deformation resistance of the cylindrical cavity. This design not only ensures that the compressive strength of the terminal body 1 reaches more than 200MPa, but also reduces the amount of copper material used to reduce production costs. To facilitate gripping in automated production and twisting during manual installation, a diamond-shaped anti-slip texture can be integrally stamped on the outer surface of the side wall 12 of the terminal body 1 to increase friction.

[0021] See also Figure 2 The top surface of the terminal body 1 has a threaded hole 132 extending into the cylindrical cavity for screwing in fasteners to crimp external wires. The bottom of the threaded hole 132 has an annular protrusion to provide additional clamping force when the screw is tightened and to prevent the screw from going too deep, thus avoiding damage to the terminal's interior. The threaded hole 132 is available in sizes M2-M4, and its inner wall is coated with a chromium nitride anti-rust coating to prevent loosening of the wiring due to thread corrosion. An annular sealing ring groove is located at the top opening of the threaded hole 132, and a silicone sealing ring made of heat-resistant silicone rubber is fitted inside the groove. When the screw is tightened, the sealing ring compresses and fills the gap between the screw and the threaded hole 132, preventing dust and moisture from entering the hollow cavity and avoiding oxidation or short circuits inside the terminal body 1.

[0022] See also Figure 2 , Figure 3 and Figure 4The bottom of the terminal body 1 is provided with mounting pads 15 arranged around the bottom edge of the cylindrical cavity and through-hole pins 14 extending downwards. The through-hole pins 14 and the mounting pads 15 together form a dual soldering interface for achieving a composite connection with the printed circuit board for through-hole soldering and surface mounting. There are two or more through-hole pins 14, preferably two, symmetrically distributed on both sides of the central axis at the bottom of the cylindrical structure. The thickness of the through-hole pins 14 is the same as that of the metal sheet, and the ends of the through-hole pins 14 are provided with rounded guide chamfers to guide the through-hole pins 14 to accurately align with the PCB board through-holes while avoiding scratching the inner wall of the PCB board through-holes. The surface of the mounting pads 15 is provided with rough textures or pits, with a texture or pit depth of 0.02-0.03mm, to accommodate solder paste during surface mounting, increase the solder wetting area and improve solder adhesion, and prevent solder cracking or even peeling under thermal cycling conditions. A gap of 0.1-0.3mm, preferably 0.2mm, is provided between the insert pin 14 and the mounting pad 15 to compensate for the thermal stress generated during the soldering process.

[0023] In use, first, through holes matching the pins 14 of the connector are made on the PCB board, and solder paste is printed at the corresponding positions of the mounting pads 15. The pins 14 of the terminal body 1 are inserted into the through holes of the PCB board, and the mounting pads 15 are attached to the solder paste area of ​​the PCB board. The mounting pads 15 are soldered using a reflow soldering process, and the pins 14 are soldered using a wave soldering process. During the soldering process, the gap between the pins 14 and the mounting pads 15 can absorb the thermal expansion and prevent the terminal or PCB board from deforming. After stripping the insulation layer of the external wire, it is inserted into the cylindrical cavity of the terminal body 1. The screw is screwed into the threaded hole 132, and the bottom of the screw presses against the conductor. At the same time, the annular protrusion at the bottom of the threaded hole 132 presses against the insulation layer of the wire. After the screw is tightened, the silicone sealing ring is tightly attached to the outer wall of the screw, sealing the gap of the threaded hole 132, thus completing the fixing and sealing of the wire.

[0024] In summary, this application utilizes a single sheet metal integral stamping and rolling process combined with double-clamp locking to reduce copper usage while achieving a compressive strength of over 200MPa, balancing low cost and high structural stability. Both through-hole and surface mount soldering interfaces are adaptable to different PCB assembly requirements. The gap between the through-hole pins and surface mount pads compensates for welding thermal stress, and the through holes and rough texture of the surface mount pads enhance solder adhesion, reducing solder cracking rate by 90% under thermal cycling. Silicone sealing rings effectively prevent dust and moisture intrusion, reducing internal terminal oxidation rate by 80%. The raised bottom of the threaded hole increases the clamping force of the wiring, preventing loosening due to vibration. The anti-slip texture adapts to automated gripping and manual operation, and the chamfered guide of the through-hole pins improves PCB board docking efficiency and reduces assembly time.

[0025] The above are merely embodiments of this utility model and are not intended to limit the scope of this utility model. Various modifications and variations can be made to this utility model by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principle of this utility model should be included within the scope of the claims of this utility model.

Claims

1. A surface mount terminal block, characterized in that, The device includes a terminal body, which is a single sheet of metal, comprising a side wall and a top wall connected by a fastening part. The two edges of the side wall are longitudinally rolled and interlocked by a first snap-fit ​​connection structure to form a cylindrical structure. The fastening part folds over to cover one end of the cylindrical structure and is mechanically locked by a second snap-fit ​​connection structure, thus forming a semi-closed cylindrical cavity. The top wall has a threaded hole that extends into the interior of the cylindrical cavity. The bottom of the cylindrical structure has a mounting pad and downwardly extending insert pins, which together with the mounting pad form a dual soldering interface.

2. The surface mount terminal block according to claim 1, characterized in that, The first snap-fit ​​connection structure includes a first snap arm disposed on the edge of one side wall of the terminal body, and a first snap groove disposed on the edge of the opposite side wall. The first snap arm is embedded in the first snap groove to achieve mechanical locking of the side wall in a curled-up state. The second snap-fit ​​connection structure includes a second snap arm disposed around the edge of the top surface of the terminal body, and a second snap groove disposed on the outer side of the top of the side wall. The second snap arm and the second snap groove engage with each other to achieve circumferential mechanical locking between the top wall and the side wall.

3. The surface mount terminal block according to claim 1, characterized in that, The ends of the plug pins are provided with guide chamfers with rounded transitions.

4. The surface mount terminal block according to claim 1, characterized in that, The number of pins on the insert plate is two or more, and they are symmetrically distributed on both sides of the central axis at the bottom of the cylindrical structure.

5. The surface mount terminal block according to claim 1, characterized in that, The surface of the mounting pads has rough textures or pits.

6. The surface mount terminal block according to claim 5, characterized in that, The depth of the texture or pit is 0.02-0.03 mm.

7. The surface mount terminal block according to claim 1, characterized in that, The outer surface of the side wall of the terminal body is provided with anti-slip texture.

8. The surface mount terminal block according to claim 1, characterized in that, The surface of the metal sheet is provided with an electroplated layer with a thickness of 0.01-0.05 mm.

9. The surface mount terminal block according to claim 8, characterized in that, The electroplated layer is one or more composite layers selected from tin plating, nickel plating, or silver plating.

10. The surface mount terminal block according to claim 1, characterized in that, The bottom of the threaded hole is provided with an annular protrusion, and the inner wall of the threaded hole is provided with an anti-rust coating.

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