Optical fiber laser heat sink

Abstract

The utility model discloses a kind of optical fiber type laser cooling device, including heat dissipation pedestal, optical fiber type laser, TEC refrigeration sheet, same direction fin finned heat sink, cooling fan and temperature sensor.Optical fiber type laser is embedded in the inner chamber of the heat dissipation pedestal coated with silicon grease, TEC refrigeration sheet is crimped on the top of laser, and fin is fixed in pedestal by screw thread and uses same direction fin structure (middle part is opened to take away line port), and cooling fan is fixed on the top of fin.Temperature sensor is embedded in the recess of pedestal, and temperature is monitored in real time and controls TEC refrigeration sheet start-stop.Working, laser heat is conducted to fin and pedestal through silicon grease, and fan drives airflow along same direction fin air duct to escape efficiently.The utility model controls TEC refrigeration and optimizes air duct design by temperature feedback, so that 10W laser operating temperature is ≤31.23 ℃ in 25 ℃ environment, solve the problem of low heat exchange efficiency of traditional heat dissipation structure.

Description

Technical Field

[0001] This utility model belongs to the technical field of laser heat dissipation accessories, specifically relating to a fiber laser heat dissipation device. Background Technology

[0002] Lasers have immense application value in six fields: industry, medicine, commerce, scientific research, information technology, and the military. During operation, lasers generate a significant amount of heat. If this heat is not dissipated in a timely manner, it can lead to performance degradation or even damage to laser components. Therefore, designing a structure that can achieve stable heat dissipation and maintain the normal operation of lasers is of great value. Utility Model Content

[0003] In order to solve the technical problems mentioned in the background art, this utility model proposes a heat dissipation device for fiber lasers.

[0004] The technical solution of this utility model is as follows:

[0005] A fiber laser heat dissipation device includes:

[0006] The heat sink base has its inner cavity coated with thermal grease.

[0007] Fiber laser, embedded in the cavity of heat sink and coated with silicone grease;

[0008] The TEC cooling element has silicone grease applied to the contact surface with the fiber laser and is fixed above the laser by pressure.

[0009] The heatsink, with its contact surface with the TEC cooling plate coated with thermal grease, is fixed to the heatsink base by threads and adopts a unidirectional fin structure with a cable routing port in the middle.

[0010] The cooling fan is fixed to the top of the heatsink by threads.

[0011] The temperature sensor, embedded in a square groove in the heat sink base, is used to monitor the temperature in real time and trigger the TEC cooling chip to operate.

[0012] In the above technical solution, the heat sink base is made of brass and the heat sink is made of 6061 aluminum alloy.

[0013] In the above technical solution, the fin direction of the co-directional fin structure is parallel to the airflow direction of the fan, and the width of the central wiring opening is greater than or equal to twice the fin spacing.

[0014] In the above technical solution, the TEC cooling chip has a size of 15mm×15mm and the operating threshold temperature is set to 30℃±2℃.

[0015] In the above technical solution, the maximum speed of the cooling fan is 8200 RPM, the maximum air volume is 10.1 cfm, and the blade diameter is 25 mm.

[0016] In the above technical solution, the temperature sensor is connected to the control module, and the TEC cooling chip is automatically activated when the temperature exceeds the set threshold.

[0017] In the above technical solution, the thermally conductive gaps between the heat sink and the heat sink base, and between the TEC cooling chip and the fiber laser, are filled with silicone grease.

[0018] In the above technical solution, when a fiber laser heat dissipation device is in use, a temperature sensor monitors the temperature of the heat dissipation base in real time; if the temperature exceeds a set threshold, the TEC cooling chip is activated for cooling; and a cooling fan drives airflow through a co-directional finned structure to dissipate heat.

[0019] In the above technical solution, the airflow of the cooling fan blows vertically toward the heat sink base and escapes from both sides of the fins.

[0020] A fiber laser integrating the heat dissipation device described in claim 1.

[0021] Beneficial effects:

[0022] 1. This structure can use a temperature sensor to provide real-time feedback on the temperature of the fiber laser during operation, and control the TEC cooling system based on the feedback structure to regulate the temperature of the fiber laser, so that the operating temperature of the fiber laser is kept within a certain range.

[0023] 2. The unidirectional fin design enables a high heat exchange rate with the external environment, ensuring that the device has a good heat dissipation effect. Attached Figure Description

[0024] Figure 1 This is a schematic diagram of the overall heat dissipation device for a fiber laser.

[0025] Figure 2 A schematic diagram of the heat sink assembly for a fiber laser device.

[0026] Figure 3 This is a schematic diagram of a unidirectional fin structure design.

[0027] Figure 4 A schematic diagram of the working simulation of the heat dissipation device for a fiber laser.

[0028] Figure 5 A schematic diagram of the system fan airflow trajectory (I).

[0029] Figure 6 Schematic diagram of the system fan airflow trajectory (II).

[0030] The components include: 1. Cooling fan; 2. Heat sink; 3. Heat sink base; 4. TEC cooling chip; and 5. Fiber laser. Detailed Implementation

[0031] The present invention will now be described in detail with reference to the accompanying drawings and specific embodiments. However, the following embodiments are only for explaining the present invention, and the scope of protection of the present invention should include all the contents of the claims. Moreover, through the description of the following embodiments, those skilled in the art can fully implement all the contents of the claims of the present invention.

[0032] Example

[0033] This embodiment discloses the structure of a fiber laser heat dissipation device, including a cooling fan 1, a heat sink 2, a heat dissipation base 3, a TEC cooling chip 4, and a fiber laser 5;

[0034] like Figure 1 As shown, the heat sink 3 is placed at the bottom, and thermal grease is applied to the inner cavity of the heat sink 3. The fiber laser 5 is placed inside the grease-covered inner cavity of the heat sink 3, and thermal grease is also applied to the fiber laser. The contact portion of the TEC cooler 4 with the fiber laser 5 is covered with thermal grease, and the TEC cooler 4 is pressed onto the fiber laser 5. The contact portion of the heat sink 2 with the TEC cooler 4 is covered with thermal grease and is fixed to the heat sink 3 by threads. The cooling fan 1 is fixed to the heat sink 2 by threads. During operation, the heat generated by the laser is conducted to the heat sink 2 and the heat sink 3 through the thermal grease, and the heat is then blown away by the cooling fan 1.

[0035] like Figure 2 As shown, the heat sink 3 is made of brass, and the heat sink 2 is made of 6061 aluminum alloy. Figure 3 As shown, the heat sink 2 adopts a unidirectional fin design, and a cable routing port is opened in the middle to facilitate heat dissipation and allow the connection cable of the fiber laser 5 and the TEC cooling chip 4 to run out.

[0036] like Figure 4 As shown, a heat dissipation simulation was performed on the designed fiber laser. The laser power was set to 10W, the rotatable diameter of the fan blades was 25mm, the maximum fan speed was 8200RPM, and the maximum air volume was 10.1cfm. The simulation results showed that the maximum operating temperature of the laser reached 31.23℃ under normal indoor temperature of 25℃, and the design results met the requirements.

[0037] The design process takes into account real-time temperature monitoring. A square groove is designed in the heat sink base 3 to install a temperature sensor. When the temperature value exceeds the critical temperature of the laser, the TEC cooling chip 4 is activated to cool the laser.

[0038] Furthermore, the TEC cooling element measures 15mm x 15mm.

[0039] Furthermore, since the traditional fin structure covers the entire heat sink 2 and then dissipates heat by airflow, this structure suffers from poor airflow and low heat exchange efficiency. This invention designs the heat sink 2 with unidirectional fins and opens a large slot in the middle where the airflow is stronger. This structure, combined with a fan, allows stronger airflow to blow directly to the bottom and escape through the fins on both sides, thus improving the heat exchange rate.

[0040] Furthermore, to verify that the directional fin design has a good airflow dissipation effect, a heat dissipation simulation was performed on the 3D model. The fan blade rotation diameter was set to 25mm, the maximum fan speed to 8200RPM, and the maximum airflow to 10.1cfm. The simulation results are shown in the schematic diagram below. Figure 5 and Figure 6 As shown in the simulation results, the co-directional fin design can effectively exchange the heat generated by the laser with the outside environment in a timely manner.

[0041] The above description is merely a specific embodiment of this application, enabling those skilled in the art to understand or implement this application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of this application. Therefore, this application is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features claimed herein.

Claims

1. A fiber laser heat sink, comprising: include: Heat sink base (3), with thermal grease applied to the inner cavity; A fiber laser (5) is embedded in the cavity of a heat sink (3) and its surface is coated with silicone grease. The TEC cooling chip (4) is coated with silicone grease on the contact surface with the fiber laser (5) and fixed above the laser by pressure; The heat sink (2) is coated with silicone grease on the contact surface with the TEC cooling plate (4), and is fixed to the heat sink base (3) by threads. It adopts a unidirectional fin structure and has a cable routing port in the middle. A cooling fan (1) is fixed to the top of a heat sink (2) by threads; A temperature sensor is embedded in a square groove in the heat sink base (3) to monitor the temperature in real time and trigger the TEC cooling chip (4) to work.

2. The apparatus as described in claim 1, characterized in that: The heat sink base (3) is made of brass, and the heat sink (2) is made of 6061 aluminum alloy.

3. The apparatus as described in claim 1, characterized in that: The fins of the unidirectional fin structure are parallel to the airflow direction of the fan, and the width of the central wiring opening is greater than or equal to twice the fin spacing.

4. The apparatus as claimed in claim 1, characterized in that: The TEC cooling chip (4) has a size of 15mm×15mm and a working threshold temperature of 30℃±2℃.

5. The apparatus as claimed in claim 1, characterized in that: The maximum speed of the cooling fan (1) is 8200 RPM, the maximum air volume is 10.1 cfm, and the blade diameter is 25 mm.

6. The apparatus as claimed in claim 1, characterized in that: The temperature sensor is connected to the control module, and automatically starts the TEC cooling chip (4) when the temperature exceeds the set threshold.

7. The apparatus as claimed in claim 1, characterized in that: The heat sink (2) and the heat sink base (3), and the TEC cooling chip (4) and the fiber laser (5) are separated by thermally conductive gaps filled with silicone grease.

8. The apparatus as claimed in claim 1, characterized in that: During use, the temperature sensor monitors the temperature of the heat sink (3) in real time; if the temperature exceeds the set threshold, the TEC cooling chip (4) is activated to cool; the cooling fan (1) drives the airflow through the air duct of the unidirectional fin structure to dissipate heat.

9. The apparatus as claimed in claim 1, characterized in that: The airflow from the cooling fan (1) blows vertically toward the heat sink base (3) and escapes from both sides of the fins.

10. A fiber laser, characterized in that: Integrate the heat dissipation device according to any one of claims 1-7.

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