A gold wire bonding jig for a direct insertion BOX device

Abstract

The utility model discloses a gold wire bonding jig for direct insertion type BOX device for automatic wire bonder, including the material strip, the material strip is equipped with two step grooves at intervals, the carrier is placed in the step groove, the locating recess that is in rectangular alignment is seted up on the carrier, the bottom of locating recess is equipped with through -hole, the locating recess is used for placing the BOX device, and the pin of BOX device passes through the through -hole, the width of material strip is same with the track width on automatic wire bonder, and the interval of two step grooves is same with the interval of heating station and blanking station on automatic wire bonder, is suitable for the direct insertion type BOX device positioning and satisfies in automatic wire bonder matching automatic gold wire bonding processing.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor laser packaging technology, and in particular to a gold wire bonding fixture for through-hole BOX devices. Background Technology

[0002] Common packaging forms for semiconductor lasers used in laser sensing include TO packaging and BOX packaging. BOX packaging methods are further divided into butterfly type and through-hole type. The packaging process of through-hole BOX devices involves an automated gold wire bonding process, which needs to be completed on an automated wire bonding machine. Since the pins of through-hole BOX devices are vertically downward, while the heating stage on the automated wire bonding machine has a planar structure, it is impossible to bond through-hole BOX devices. Therefore, it is necessary to design a fixture based on the automated wire bonding machine to meet the bonding requirements of through-hole BOX devices. Utility Model Content

[0003] The purpose of this invention is to provide a gold wire bonding fixture for through-hole BOX devices, which is suitable for positioning through-hole BOX devices and meets the requirements for automatic gold wire bonding processing in an automatic wire bonding machine.

[0004] To achieve the above objectives, this utility model provides the following technical solution: A gold wire bonding fixture for through-hole BOX devices, used in an automatic wire bonding machine, includes a strip of material with two stepped grooves spaced apart. A carrier is placed in each stepped groove, and the carrier has rectangularly arranged positioning grooves. A through hole is formed at the bottom of each positioning groove. The positioning groove is used to place the BOX device, and the pins of the BOX device pass through the through hole. The width of the strip is the same as the width of the track on the automatic wire bonding machine, and the distance between the two stepped grooves is the same as the distance between the heating station and the unloading station on the automatic wire bonding machine.

[0005] Preferably, the long edge of the material strip is provided with a stepped structure located on the bottom surface of the material strip.

[0006] Preferably, the corners of the stepped grooves are all provided with rounded corner structures.

[0007] Preferably, the carrier is provided with a positioning plate placed in the stepped groove and a positioning part passing through the stepped groove, the bottom of the positioning part is provided with a hollow structure, and the through hole is located inside the hollow structure.

[0008] Preferably, the corners of the positioning plate are provided with chamfered structures.

[0009] Preferably, the thickness of the positioning plate is less than the depth of the step groove.

[0010] Preferably, the opening edges of the positioning grooves are provided with guide surfaces that are inclined inward.

[0011] Preferably, each corner of the positioning groove is provided with a notch structure that connects to the interior, and the notch structure is C-shaped.

[0012] Preferably, the centerline of the notch structure is located outside the sidewall of the positioning groove, and the notch structure is provided with a conical surface structure centered on its centerline.

[0013] Beneficial effects: By creating stepped grooves on the material strip to place the carrier, the width of the material strip matches the width of the track on the automatic wire bonding machine, making it easy to place and move it directly on the track to achieve loading and unloading. At the same time, the placement positions of the two carriers meet the heating station and unloading station on the automatic wire bonding machine, thus facilitating synchronous operation of the two stations. Simultaneously, after placing the BOX device through the positioning groove on the carrier, the pins are passed through the through hole, allowing the BOX device to be stably placed in the positioning groove, meeting the requirements of automatic gold wire bonding. The bonding is completed through heat conduction by the carrier, and multiple BOX devices can be bonded at one time. Attached Figure Description

[0014] Figure 1 This is a schematic diagram of the structure of an embodiment of the present utility model; Figure 2 This is a first-view structural diagram of the material strip in an embodiment of the present invention; Figure 3 This is a second-view structural diagram of the material strip in an embodiment of the present invention; Figure 4 This is a first-view structural diagram of the vehicle in an embodiment of the present invention; Figure 5 This is a second-view structural diagram of the vehicle in an embodiment of the present invention; exist Figures 1 to 5 In the diagram, the correspondence between component names or lines and the drawing numbers is as follows: Material strip 1, stepped structure 101, stepped groove 2, rounded corner structure 20, carrier 3, positioning groove 31, through hole 32, positioning plate 33, positioning part 34, hollow structure 35, chamfered structure 36, guide surface 37, notched structure 38, conical surface structure 39. Detailed Implementation

[0015] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.

[0016] See Figures 1-5As shown in the figure, an embodiment of this utility model proposes a gold wire bonding fixture for through-hole BOX devices, used in an automatic wire bonding machine. The automatic wire bonding machine is used for stop-gold wire bonding of semiconductor devices. For BOX devices, whose leads extend downwards, it is difficult to place the BOX device flat to ensure bonding requirements. Furthermore, the bonding process on the automatic wire bonding machine is automated; only the positioning and movement of the BOX device to match the stop-gold bonding machine are required. Therefore, it is necessary to design a fixture that satisfies the positioning requirements when performing stop-gold wire bonding on the automatic wire bonding machine for BOX devices.

[0017] Specifically, the fixture includes a strip 1 with two stepped grooves 2 spaced apart. A carrier 3 is placed in each stepped groove 2, and the stepped grooves 2 position the carrier 3, allowing it to move synchronously with the strip 1 on the automatic wire bonding machine. The carrier 3 has a rectangular array of positioning grooves 31, with through holes 32 at the bottom. These positioning grooves 31 are used to place BOX devices, with the pins of the BOX devices passing through the through holes 32. Placing multiple BOX devices in the rectangular array of positioning grooves 31 allows for batch gold wire bonding. After the carrier 3 is placed on the heating block of the automatic wire bonding machine, heat is effectively transferred to the bonding positions of the BOX devices. Simultaneously, the through holes 32 ensure that the BOX devices are placed stably within the positioning grooves 31, preventing tilting and ensuring good gold wire bonding results.

[0018] Meanwhile, in order to make the material strip 1 suitable for use in the automatic wire bonding machine, the width of the material strip 1 is made the same as the width of the track on the automatic wire bonding machine, so that the material strip 1 can be placed on the track and moved. At the same time, the distance between the two stepped grooves 2 is the same as the distance between the heating station and the unloading station on the automatic wire bonding machine, thereby enabling the two carriers 3 to operate simultaneously at the heating station and the unloading station, improving the efficiency of the bonding process.

[0019] In order to facilitate the feeding gripper to pick up the material bar 1 and move it onto the track of the automatic wire bonding machine, a stepped structure 101 is provided at the long edge of the material bar 1 on the bottom surface of the material bar 1. By setting the stepped structure 101, the thickness of the long edge is kept to meet the requirements of the feeding gripper for clamping and moving.

[0020] Meanwhile, rounded corner structures 20 are provided at the corners of the stepped groove 2, so that when there is space to clamp the carrier 3, the clamping part of the workpiece can be inserted into the gap formed by the rounded corner structure 20 between the carrier 3 and the adjustment groove, and has a clamping force point.

[0021] In addition to positioning and placing the BOX devices, the carrier 3 also needs to conduct heat, transferring the heat from the heating block on the automatic wire bonding machine to the BOX devices to achieve gold wire bonding. The carrier 3 is equipped with a positioning plate 33 placed within the stepped groove 2 and a positioning part 34 passing through the stepped groove 2. The bottom of the positioning part 34 has a hollow structure 35, and the through hole 32 is located inside the hollow structure 35. The positioning plate 33 provides support for the entire carrier 3 within the stepped groove 2, while the positioning part 34, after passing through the stepped groove 2, can reliably contact the heating block for heat conduction when moving on the track to the heating station. To improve heat conduction efficiency, the hollow structure 35 at the bottom of the positioning part 34 allows the devices in the carrier 3 to heat up quickly to the required temperature, avoiding equipment temperature control alarms and improving production continuity.

[0022] Meanwhile, chamfered structures 36 are provided at the corners of the positioning plate 33. The chamfered structures 36 and rounded corner structures 20 form a larger gap, making it easier for the clamping part of the workpiece to extend in.

[0023] The thickness of the positioning plate 33 is less than the depth of the stepped groove 2 to prevent the material strip 1 from protruding from the surface of the carrier 3, thereby reducing the risk of interference during movement.

[0024] To facilitate the clamping of BOX devices when placing or removing them from the positioning groove 31, guide surfaces 37 inclined inward are provided at the opening edges of the positioning groove 31. The guide surfaces 37 guide the BOX devices during placement, thereby improving placement efficiency.

[0025] Meanwhile, at each corner of the positioning groove 31, a notch structure 38 communicating with the interior is provided. The notch structure 38 is C-shaped, which facilitates the insertion of the clamping part of the workpiece into the notch structure 38 to clamp the BOX device. Furthermore, the centerline of the notch structure 38 is located outside the side wall of the positioning groove 31. The notch structure 38 has a conical surface structure 39 centered on its centerline, which guides the insertion of the clamping part of the workpiece. After the clamping part of the workpiece is inserted into the notch structure 38, it has room to move during opening and closing movements.

[0026] By using a fixture-matched automatic wire bonding machine, BOX devices can be batch-bonded with stop wires, improving processing efficiency and yield.

[0027] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0028] In the description of this utility model, it should be noted that the terms "center," "upper," "lower," "left," "right," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product of this utility model is in use. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. In addition, the terms "first," "second," etc., are only used to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0029] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

Claims

1. A gold wire bonding fixture for through-hole BOX devices, used in an automatic wire bonding machine, characterized in that: Includes a material bar (1), on which two stepped grooves (2) are opened at intervals, and a carrier (3) is placed in the stepped grooves (2). The carrier (3) has a rectangular row of positioning grooves (31), and a through hole (32) is opened at the bottom of the positioning grooves (31). The positioning grooves (31) are used to place BOX devices, and the pins of the BOX devices pass through the through holes (32). The width of the material strip (1) is the same as the width of the track on the automatic wire bonding machine, and the distance between the two stepped grooves (2) is the same as the distance between the heating station and the unloading station on the automatic wire bonding machine.

2. The gold wire bonding fixture for through-hole BOX devices according to claim 1, characterized in that: Each of the material strips (1) has a stepped structure (101) located on the bottom surface of the material strip (1) at the long edge.

3. A gold wire bonding fixture for through-hole BOX devices according to claim 2, characterized in that: The corners of the stepped groove (2) are all provided with rounded corner structures (20).

4. A gold wire bonding fixture for through-hole BOX devices according to claim 3, characterized in that: The carrier (3) is provided with a positioning plate (33) placed in the step groove (2) and a positioning part (34) passing through the step groove (2). The bottom of the positioning part (34) is provided with a hollow structure (35), and the through hole (32) is located inside the hollow structure (35).

5. A gold wire bonding fixture for through-hole BOX devices according to claim 4, characterized in that: The corners of the positioning plate (33) are all provided with chamfered structures (36).

6. A gold wire bonding fixture for through-hole BOX devices according to claim 4, characterized in that: The thickness of the positioning plate (33) is less than the depth of the step groove (2).

7. A gold wire bonding fixture for through-hole BOX devices according to any one of claims 1-6, characterized in that: The opening edge of the positioning groove (31) is provided with a guide surface (37) that is inclined inward.

8. A gold wire bonding fixture for through-hole BOX devices according to claim 7, characterized in that: The corners of the positioning groove (31) are provided with notch structures (38) that connect to the interior, and the notch structures (38) are C-shaped.

9. A gold wire bonding fixture for through-hole BOX devices according to claim 8, characterized in that: The centerline of the notch structure (38) is located outside the sidewall of the positioning groove (31), and the notch structure (38) is provided with a conical structure (39) centered on its centerline.

Images