A high hermeticity quartz crystal oscillator alloy base plate

Abstract

The utility model provides a kind of high air-tightness quartz crystal oscillator alloy bottom plate, it is related to quartz crystal oscillator technical field, including bottom plate main body, the top surface of bottom plate main body is equipped with recess, the inside of recess is equipped with heat conduction sheet, the bottom surface horizontal array of bottom plate main body is equipped with radiating fin, the bottom surface of bottom plate main body is equipped with four bosses, the surface of four bosses is equipped with through-hole, the inside of four through-holes is equipped with insulator, wave-shaped miniature radiating fin with horizontal array is equipped in the bottom surface of bottom plate main body to enhance the heat dissipation capacity of natural convection, recess is opened simultaneously in the top surface of bottom plate main body, recess is rectangular shallow groove, it is the place of heat conduction sheet installation, heat conduction sheet is glued with bottom plate main body by silicone resin base heat-conducting adhesive, local heat is quickly conducted to bottom plate main body by the high thermal conductivity of heat conduction sheet, to form the collaborative heat dissipation structure of inner guide-outer dispersion, solve the shortcoming that traditional alloy bottom plate does not carry out the special heat dissipation structure optimization of bottom plate surface.

Description

Technical Field

[0001] This utility model relates to the field of quartz crystal oscillator technology, and in particular to a high-airtightness quartz crystal oscillator alloy base plate. Background Technology

[0002] A temperature-compensated quartz crystal oscillator, disclosed in Chinese Publication No. CN217469906U, includes a base plate. First pins are fixedly connected to both ends of the bottom surface of the base plate. A mounting plate is fixedly connected to the upper surface of the base plate, and an oscillator body is fixedly connected to the upper surface of the mounting plate. A protective cover is fixedly connected to the upper surface of the base plate, and the oscillator body is located inside the protective cover. A temperature compensation component is provided on the protective cover. A horizontal plate is fixedly connected between the left and right side walls of the inner cavity of the temperature compensation component. A vertical plate is fixedly connected to the upper surface of the horizontal plate, and a first thermistor is fixedly connected to the left end of the upper surface of the horizontal plate. This temperature-compensated quartz crystal oscillator, by incorporating a temperature compensation component within the protective cover, allows for temperature adjustment, ensuring that the temperature of the oscillator body dynamically fluctuates within a fixed range. This guarantees that the oscillator body can maintain mechanical vibration at a relatively stable output frequency, resulting in good stability and ease of use.

[0003] The quartz crystal oscillator alloy base plate of the above-mentioned and existing technologies still adopts a single planar structure and has not been optimized for heat dissipation on the surface of the base plate, resulting in a long heat conduction path and low efficiency. Utility Model Content

[0004] The purpose of this invention is to address the shortcomings of existing technologies that do not have a dedicated heat dissipation structure for the base plate surface, and to propose a high-airtightness quartz crystal oscillator alloy base plate.

[0005] To achieve the above objectives, the present invention adopts the following technical solution: a high airtightness quartz crystal oscillator alloy base plate, comprising a base plate body, a groove on the top surface of the base plate body, a heat-conducting sheet inside the groove, heat dissipation fins arranged in a horizontal array on the bottom surface of the base plate body, and four protrusions on the bottom surface of the base plate body, with through holes on the surface of the four protrusions, and insulators inside the four through holes.

[0006] Preferably, the groove on the top surface of the base plate is a rectangular shallow groove, and a heat-conducting sheet is provided inside the groove, which is bonded to the base plate.

[0007] Preferably, the four protrusions are mirror-image arranged in pairs on the bottom surface of the base plate body, and the protrusions are integrally formed with the base plate body.

[0008] Preferably, the through holes on the four boss surfaces are all located at the center of the boss surface, and the through holes all penetrate the base plate body.

[0009] Preferably, one section of each of the four insulators is installed inside the through hole, and each insulator is welded to the boss.

[0010] Preferably, the heat dissipation fins of the horizontal array on the bottom surface of the base plate are integrally formed with the base plate, and the base plate, heat dissipation fins and bosses are all made of Kovar alloy.

[0011] Preferably, the two ends of the heat dissipation fins are straight, and the middle of the heat dissipation fins is wavy.

[0012] Beneficial effects In this invention, a horizontal array of wave-shaped micro heat dissipation fins is provided on the bottom surface of the base plate to enhance the heat dissipation capacity of natural convection. At the same time, a groove is provided on the top surface of the base plate. The groove is a shallow rectangular groove, which is the place for installing the heat-conducting plate. The heat-conducting plate is bonded to the base plate with silicone resin-based thermally conductive adhesive. The high thermal conductivity of the heat-conducting plate quickly conducts local heat to the base plate, thereby forming a synergistic heat dissipation structure of internal conduction and external dissipation. This solves the shortcomings of traditional alloy base plates that do not have a dedicated heat dissipation structure optimization on the surface of the base plate. Attached Figure Description

[0013] Figure 1 This is an isometric drawing of the present invention; Figure 2 This is a bottom view of the present invention; Figure 3 For the present utility model Figure 2 Sectional view at point AA; Figure 4 This is a partial perspective view of the present invention.

[0014] Legend: 1. Base plate; 2. Groove; 3. Heat-conducting plate; 4. Boss; 5. Heat dissipation fins; 6. Through hole; 7. Insulator. Detailed Implementation

[0015] To make the technical means, creative features, and achieved objectives and effects of this utility model easier to understand, the present utility model is further described below with reference to specific embodiments and accompanying drawings. However, the following embodiments are merely preferred embodiments of this utility model and not all of them. Other embodiments obtained by those skilled in the art based on the embodiments described in the implementation plan without creative effort are all within the protection scope of this utility model.

[0016] The specific embodiments of this utility model are described below with reference to the accompanying drawings. Specific Implementation Example 1: Reference Figure 1-4 A high-airtightness quartz crystal oscillator alloy base plate includes a base plate body 1. The top surface of the base plate body 1 has a groove 2, and the interior of the groove 2 contains a heat-conducting plate 3. The bottom surface of the base plate body 1 has a horizontal array of heat dissipation fins 5, and the bottom surface of the base plate body 1 has four protrusions 4. The surfaces of the four protrusions 4 have through holes 6, and each of the four through holes 6 contains an insulator 7. The groove 2 on the top surface of the base plate body 1 is a rectangular shallow groove, and the interior of the groove 2 contains the heat-conducting plate 3. The four protrusions 4 are arranged in pairs on the base plate body in a mirror image. The bottom surface of the base plate 1 is integrally formed with the base plate body 1, and the through holes 6 on the surface of the four protrusions 4 are all located at the center of the surface of the protrusions 4, and the through holes 6 all penetrate the base plate body 1. One section of each of the four insulators 7 is installed inside the through holes 6, and the insulators 7 are all welded to the protrusions 4. The heat dissipation fins 5 arranged horizontally on the bottom surface of the base plate body 1 are integrally formed with the base plate body 1. The base plate body 1, the heat dissipation fins 5 and the protrusions 4 are all made of Kovar alloy. The two ends of the heat dissipation fins 5 are straight, and the middle of the heat dissipation fins 5 is wavy.

[0018] The base plate 1 is made of Kovar alloy, which has good thermal conductivity and mechanical strength. The base plate 1 serves as a support platform for the quartz crystal oscillator, and simultaneously facilitates heat transfer and dissipation through a groove 2 on the top surface and heat dissipation fins 5 on the bottom surface. The groove 2, located on the top surface of the base plate 1, is a shallow rectangular groove designed to accommodate a heat-conducting plate 3. The heat-conducting plate 3 evenly diffuses heat from a concentrated heat source throughout the entire base plate 1, thereby reducing the internal temperature difference of the quartz crystal oscillator and improving heat conduction efficiency. It should be noted that the groove 2 in this application is not the final shape; the specific shape can be modified according to the location and shape of the internal electrical components of different quartz crystal oscillators. The heat-conducting plate 3 is installed inside the groove 2 using silicone-based thermally conductive adhesive. The heat-conducting plate 3 is a graphite sheet, and its high thermal conductivity rapidly conducts heat from localized hot spots to the alloy base plate, reducing the internal temperature difference of the crystal oscillator and preventing component failure due to overheating. It is important to note that when using silicone-based thermally conductive adhesive for installation, contact with the quartz crystal plate, crystal support, and electrode pins should be avoided. The four bosses 4 are distributed in pairs on the bottom surface of the base plate 1, integrally formed with it. Through holes 6 on the surface of the bosses 4 penetrate the base plate 1, providing structural support for the installation of the insulators 7. One end of the insulator 7 is installed inside the through hole 6 and welded to the bosses 4. This insulator wraps around the pins of the quartz crystal oscillator, providing electrical insulation and preventing current paths between the base plate 1 and external connection points, ensuring stable electrical performance of the quartz crystal oscillator. Simultaneously, the height of the bosses 4 is flush with the heat sink fins 5, where the quartz crystal oscillator is soldered to the circuit board. The heat sink fins 5 are horizontally arrayed on the bottom surface of the base plate 1, featuring a wave-shaped design with straight ends, integrally formed with the base plate 1. The wave-shaped structure increases the surface area, enhancing natural convection heat dissipation and efficiently dissipating heat transferred from the heat-conducting plates 3 into the environment. Specific Implementation Example 2: Reference Figure 1-4A high-airtightness quartz crystal oscillator alloy base plate is further based on the basic structure in Specific Embodiment 1. The base plate body 1 serves as a support platform, and the groove 2 on the top surface accommodates the heat-conducting fins 3. The heat-conducting fins 3 rapidly conduct local heat to the base plate body 1 through their high thermal conductivity. The heat is then transferred through the base plate body 1 to the heat dissipation fins 5 on the bottom surface. The wave-shaped design of the heat dissipation fins 5 increases the surface area, enhances natural convection heat dissipation, and efficiently dissipates heat into the environment, thereby reducing internal temperature differences and preventing component failure due to high temperatures. Simultaneously, four bosses 4, through holes 6, and insulators 7 work together. The bosses 4 provide welding support, preventing the alloy base plate from being unable to be soldered to the circuit board due to the heat dissipation fins 5. The through holes 6 and insulators 7 ensure electrical insulation of the pins, preventing current paths between the base plate body 1 and external circuits, and ensuring stable electrical performance of the oscillator. All components are integrally molded from Kovar alloy, and the adjustable groove shape 2 and wave-shaped heat dissipation fins 5 design adapt to the needs of different quartz crystal oscillators, improving overall thermal management and mechanical performance.

[0020] In summary: 1. A horizontal array of wave-shaped micro heat dissipation fins 5 is provided on the bottom surface of the base plate body 1 to enhance the heat dissipation capacity of natural convection. At the same time, a groove 2 is provided on the top surface of the base plate body 1. The groove 2 is a shallow rectangular groove, which is the place for the heat conduction plate 3 to be installed. The heat conduction plate 3 is bonded to the base plate body 1 with silicone resin-based thermal conductive adhesive. The high thermal conductivity of the heat conduction plate 3 quickly conducts local heat to the base plate body 1, thereby forming a synergistic heat dissipation structure of internal conduction and external dissipation. This solves the shortcomings of traditional alloy base plates that do not have a special heat dissipation structure optimization on the surface of the base plate.

[0021] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0022] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely preferred examples and are not intended to limit the utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claimed utility model. The scope of protection of this utility model is defined by the appended claims and their equivalents.

Claims

1. A high-airtightness quartz crystal oscillator alloy base plate, comprising a base plate body (1), characterized in that: The top surface of the base plate body (1) is provided with a groove (2), and the interior of the groove (2) is provided with a heat-conducting plate (3). The bottom surface of the base plate body (1) is provided with a horizontal array of heat dissipation fins (5). The heat dissipation fins (5) on the bottom surface of the base plate body (1) are all integrally formed with the base plate body (1). The bottom surface of the base plate body (1) is provided with four bosses (4). The surfaces of the four bosses (4) are provided with through holes (6). The interior of the four through holes (6) is provided with insulators (7).

2. The high-airtightness quartz crystal oscillator alloy base plate according to claim 1, characterized in that: The groove (2) on the top surface of the base plate body (1) is a rectangular shallow groove, and a heat-conducting sheet (3) is provided inside the groove (2), and the heat-conducting sheet (3) is bonded to the base plate body (1).

3. The high-airtightness quartz crystal oscillator alloy base plate according to claim 1, characterized in that: The four protrusions (4) are mirror images of each other in pairs on the bottom surface of the base plate body (1), and the protrusions (4) are integrally formed with the base plate body (1).

4. The high-airtightness quartz crystal oscillator alloy base plate according to claim 1, characterized in that: The through holes (6) on the surface of the four bosses (4) are all located at the center of the surface of the bosses (4), and the through holes (6) all penetrate the bottom plate body (1).

5. The high-airtightness quartz crystal oscillator alloy base plate according to claim 1, characterized in that: One section of each of the four insulators (7) is installed inside the through hole (6), and each insulator (7) is welded to the boss (4).

6. The high-airtightness quartz crystal oscillator alloy base plate according to claim 1, characterized in that: The base plate body (1), heat dissipation fins (5) and boss (4) are all made of Kovar alloy.

7. The high-airtightness quartz crystal oscillator alloy base plate according to claim 1, characterized in that: The two ends of the heat dissipation fins (5) are straight, and the middle of the heat dissipation fins (5) is wavy.

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