Electronic device

Abstract

The application relates to the technical field of electronic equipment, and discloses an electronic equipment. The electronic equipment comprises a circuit board, a shielding cover, a functional device, a support, a camera and a buffer structure. The shielding cover is arranged on the circuit board along the thickness direction of the circuit board and cooperates with the circuit board to form a containing cavity, and the functional device is arranged in the containing cavity. The support is arranged on the side of the shielding cover away from the circuit board, and the camera is mounted on the shielding cover through the support. Along the thickness direction, the buffer structure is arranged between the shielding cover and the support, and the buffer structure is used for buffering when the support is subjected to an impact force along a first direction, and the first direction is parallel to the thickness direction. In this way, the camera can be mounted, the circuit board has sufficient space for the layout of the functional device, and the buffer structure can have a buffering protection effect.

Description

Technical Field

[0001] This application relates to the field of electronic equipment technology, and more particularly to an electronic device. Background Technology

[0002] Electronic devices such as mobile phones and tablets are equipped with cameras to enable shooting functions. However, current camera installation methods occupy a significant amount of space on the motherboard of these devices, which limits the placement of more functional components and makes it difficult to meet the functional design requirements of the electronic devices. Utility Model Content

[0003] Some embodiments of this application provide an electronic device for mounting a camera while freeing up layout space on a circuit board, so that more space can be placed on the circuit board for functional devices. The electronic device provided by this application is described below.

[0004] In a first aspect, embodiments of this application provide an electronic device, which includes a circuit board, a shielding cover, functional components, a bracket, a camera, and a buffer structure. The shielding cover is disposed on the circuit board along its thickness direction, forming a receiving cavity together with the circuit board, and the functional components are disposed within the receiving cavity. The bracket is disposed on the side of the shielding cover facing away from the circuit board, and the camera is mounted on the shielding cover via the bracket. Along the thickness direction, a buffer structure is disposed between the shielding cover and the bracket, and the buffer structure is used to cushion the impact force on the bracket in a first direction parallel to the thickness direction.

[0005] In the aforementioned electronic device, the camera and functional components can be stacked on the same surface of the circuit board along its thickness direction. This means the camera can share layout space with the functional components instead of occupying separate space, thus providing sufficient space for the functional components. Furthermore, a buffer structure is provided between the support and the shielding cover. This buffer structure cushions the impact force on the support, preventing the shielding cover from compressing the functional components and causing damage. This effectively improves the reliability of the stacked structure formed by the camera, shielding cover, functional components, and support.

[0006] In one possible implementation of the first aspect described above, the buffer structure includes a support block disposed on the surface of the support facing the shield, and the support block protrudes along a first direction relative to the surface of the support facing the shield, so that there is a gap between the support and the shield. The orthographic projection of the support block on the first surface of the circuit board does not overlap with the orthographic projection of the functional device on the first surface, which is the surface of the circuit board facing the functional device.

[0007] In this way, when the electronic device is subjected to an impact force along the first direction, the impact force can be transmitted to the shielding cover via the support block, thus concentrating the force on the area of ​​the shielding cover connected to the support block. This causes the shielding cover to deform more significantly in that area and less significantly in other areas. Since the support block and the functional device are offset in the first direction, the area of ​​the shielding cover connected to the support block is also offset from the functional device in the first direction. Therefore, the deformation of the shielding cover caused by the impact force will not compress the functional device.

[0008] In one possible implementation of the first aspect described above, the support block includes a first support block and a second support block, which are respectively disposed at both ends of the bracket along a second direction, the second direction being perpendicular to the first direction. Thus, the first and second support blocks can stably support the bracket, thereby ensuring that the bracket is subjected to uniform force.

[0009] In one possible implementation of the first aspect described above, the buffer structure includes an elastic pad whose orthographic projection on a first surface of the circuit board at least partially overlaps with the orthographic projection of the functional device on the first surface, the first surface being the surface of the circuit board facing the functional device.

[0010] In this way, when the electronic device is subjected to an impact force along the first direction, the impact force can be transmitted to the shielding cover through the elastic pad. Under the action of the impact force, the elastic pad can produce elastic deformation to absorb the energy of the impact force, thereby reducing the impact of the impact force on the shielding cover, further reducing the deformation of the screen cover, and ultimately preventing the screen cover from squeezing the functional components.

[0011] In one possible implementation of the first aspect described above, the material of the elastic pad is rubber, foam, or thermoplastic polyurethane elastomer rubber.

[0012] In one possible implementation of the first aspect mentioned above, the support and the buffer structure are an integral structure.

[0013] By integrating the bracket and buffer structure into a single unit, the number of components in electronic devices can be effectively reduced, the structure of electronic devices can be simplified, and assembly efficiency can be improved.

[0014] In one possible implementation of the first aspect described above, the shielding cover includes a body and a reinforcing member. The body and the circuit board together form a receiving cavity, and the reinforcing member is disposed on the surface of the body facing away from the circuit board. The reinforcing member can enhance the strength of the shielding cover, making it less prone to deformation and ultimately preventing the shielding cover from pressing against the functional devices.

[0015] In one possible implementation of the first aspect described above, the reinforcing member includes a reinforcing plate and a first limiting portion, the reinforcing plate and the first limiting portion being arranged sequentially in the opposite direction of the first direction, and the reinforcing plate and the first limiting portion together forming a first limiting groove, at least a portion of the bracket being disposed in the first limiting groove.

[0016] The first limiting groove provides installation positioning for the shielding cover and the bracket, reducing the difficulty and time of installation. For example, when assembling the shielding cover and the bracket, the bracket can be placed in the first limiting groove. The first limiting groove restricts the relative range of motion between the shielding cover and the bracket, thus preventing uncontrollable relative movement between them during assembly. This ensures precise alignment of the shielding cover and the bracket during assembly, avoiding misalignment. Furthermore, the first limiting groove also improves the stability of the bracket installation, preventing uncontrollable movement of the bracket relative to the shielding cover in a direction perpendicular to the thickness direction after installation.

[0017] In one possible implementation of the first aspect described above, the bracket includes a support plate and a second limiting part, the support plate and the second limiting part are arranged sequentially in the opposite direction of the first direction, and the support plate and the second limiting part together form a second limiting groove, and a part of the camera is disposed in the second limiting groove.

[0018] The second limiting groove provides mounting positioning for the camera and bracket, reducing installation difficulty and time. For example, during camera and bracket assembly, a portion of the camera can be placed in the second limiting groove. This groove restricts the relative range of motion between the camera and bracket, preventing uncontrollable relative movement during assembly and ensuring precise alignment to avoid misalignment. Furthermore, the second limiting groove enhances camera installation stability, preventing uncontrollable movement relative to the bracket in a direction perpendicular to its thickness after installation.

[0019] In one possible implementation of the first aspect described above, the bracket further includes a third limiting portion, which is disposed opposite to a portion of the camera along a first direction.

[0020] The third limiting part can provide a thickness direction limit to the first part of the camera, preventing the camera from moving uncontrollably along the thickness direction after installation, effectively improving the installation stability of the camera.

[0021] In one possible implementation of the first aspect described above, the electronic device further includes a camera rear cover, which is disposed on the side of the camera facing away from the bracket. The camera rear cover includes a cover plate and a fourth limiting portion, which are arranged sequentially along a first direction and together form a third limiting groove, in which another part of the camera is disposed.

[0022] The third limiting groove provides mounting positioning for the camera back cover and the camera, reducing installation difficulty and time. For example, when assembling the camera back cover and the camera, another part of the camera can be placed in the third limiting groove. The third limiting groove restricts the relative range of movement between the camera back cover and the camera, preventing uncontrollable relative movement during assembly. This ensures precise alignment of the camera back cover and the camera during assembly, avoiding misalignment. Furthermore, the third limiting groove also improves the stability of the camera installation, preventing uncontrollable movement of the camera relative to the camera back cover in a direction perpendicular to the thickness direction after installation. Attached Figure Description

[0023] Figure 1A A perspective view of the mobile phone in an embodiment of this application is shown;

[0024] Figure 1B An exploded view of the mobile phone in an embodiment of this application is shown;

[0025] Figure 2 This illustrates some technical solutions for installing cameras in mobile phones;

[0026] Figure 3A This application illustrates the installation scheme of the camera in a mobile phone according to an embodiment of the present application;

[0027] Figure 3B The mobile phone edge shown in the embodiment of this application is illustrated. Figure 3A A sectional view obtained by cutting through section AA in the middle;

[0028] Figure 4 An exemplary structure of another buffer structure in an embodiment of this application is shown. Detailed Implementation

[0029] The specific embodiments of this application will be described in detail below with reference to the accompanying drawings.

[0030] This application provides an electronic device, which can be a computer, communication device, or consumer electronics (collectively referred to as "3C products"), such as a mobile phone, tablet computer, laptop computer, television, camera, in-vehicle equipment (e.g., a dashcam), security equipment, intelligent robot, and other electronic devices with shooting functions. For ease of description, a mobile phone is used as an example of this electronic device below.

[0031] Figure 1A and Figure 1B An exemplary structure of mobile phone 1 in an embodiment of this application is shown, wherein, Figure 1A This is a 3D image of phone 1. Figure 1B This is an exploded view of mobile phone 1, with dashed arrows indicating the assembly relationship of the components in mobile phone 1.

[0032] In the figures of this document, the X-axis represents the length of the phone 1; for example, the positive X-axis is the direction from bottom to top of the phone 1 in normal use. The Y-axis represents the width of the phone 1; for example, the positive Y-axis is the direction from right to left of the phone 1 in normal use. The Z-axis represents the thickness of the phone 1; for example, the positive Z-axis is the direction from front to back of the phone 1 in normal use. The X, Y, and Z axes intersect each other. For example, they can be perpendicular to each other. In this application, the height or thickness dimension refers to the dimension along the Z-axis, which will not be elaborated further below.

[0033] It is understood that the parallelism in this application is not absolute parallelism. Approximate parallelism due to processing and assembly errors is also within the scope of parallelism in this application. For example, when the included angle between two structural features is less than or equal to 2° (e.g., 0.1°, 0.2°, 2°, etc.), they can be considered parallel. Similarly, the perpendicularity in this application is not absolute perpendicularity. Approximate perpendicularity due to processing and assembly errors is also within the scope of perpendicularity in this application. For example, when the included angle between two structural features is 88° to 92° (e.g., 88°, 89°, 91°, etc.), they can be considered perpendicular. The limitations on parallelism and perpendicularity will not be repeated below.

[0034] Additionally, it should be noted that the directional terms such as "upper," "lower," "left," "right," "front," "back," "top," and "bottom" used in this document refer to the orientation of the mobile phone 1 in its normal use state (for example, in its normal use state, the back cover 10 described below is located on the back of the mobile phone 1), and do not indicate or imply that the components referred to must have a specific orientation. Their orientation can change accordingly based on actual use and should not be construed as a limitation of this application.

[0035] refer to Figure 1A and Figure 1B The mobile phone 1 may include a back cover 10, a mid-frame 20, a display screen 30, a camera 40, and a circuit board 50. The back cover 10, the mid-frame 20, and the display screen 30 may be arranged sequentially along the negative Z-axis, and the back cover 10, the mid-frame 20, and the display screen 30 together form a cavity (not shown), and the camera 40 and the circuit board 50 may be disposed in the cavity.

[0036] In this embodiment, the camera 40 can be a rear-facing camera, and the back cover 10 can include a camera back cover 100 (also referred to as a "camera deco" or "decorative ring"). The camera back cover 100 and the camera 40 are positioned opposite each other along the Z-axis. The camera back cover 100 protects the camera 40 and also serves as a decorative element, making the back cover 10 more aesthetically pleasing. The camera back cover 100 may have a light-entry hole 110, allowing external light from the phone 1 to enter the camera 40 and enable its shooting function. Exemplarily, the back cover 10 may also include a light-transmitting lens (e.g., as described below). Figure 2 and Figure 3A The light-transmitting lens 120 shown is placed over the light-entry hole 110 to allow light from outside the mobile phone 1 to pass through while also providing waterproofing and dustproofing.

[0037] The camera 40 is electrically connected to the circuit board 50 to transmit signals. For example, after capturing image data, the camera 40 can transmit the data to the circuit board 50, which then processes the data and displays it on the display screen 30. Alternatively, the circuit board 50 can also provide a current signal to the camera 40 to power it.

[0038] In some embodiments, circuit board 50 can be the motherboard of mobile phone 1, and functional devices such as chips, sensors, processors, memory, and communication modules can be integrated on circuit board 50. The memory and communication module are electrically connected to the processor, respectively. The memory stores instructions and data, and the communication module enables 3G / 4G / 5G wireless communication of mobile phone 1, as well as wireless local area networks (WLAN), Bluetooth (BT), and near field communication (NFC) technologies. It is understood that the functional devices on circuit board 50 are not limited to those described above, and other functional devices that can implement the functions of mobile phone 1 may also be provided, which are not listed here.

[0039] It is understandable that the above Figure 1A and Figure 1B The diagram only schematically shows some structural components contained within the phone 1; the actual construction and location of these components are not subject to change. Figure 1A and Figure 1B There are no limitations. For example, camera 40 can also be a front-facing camera. Alternatively, camera 40 can be installed in other locations on phone 1, such as the upper left or upper right corner. Furthermore, the number of cameras 40 can be multiple, such as two, three, or four, to achieve different shooting effects.

[0040] The installation scheme of camera 40 is described below with reference to the accompanying drawings.

[0041] Figure 2 The illustration shows several technical solutions for mounting the camera 40 in the mobile phone 1, with the field of view of one of the cameras 40 indicated by dashed lines. (Reference) Figure 2 In some technical solutions, the mobile phone 1 may include a mounting bracket 400, on which the camera 40 is fixed, and then mounted on the mid-frame 20 via the mounting bracket 400. The mid-frame 20 serves to support and position the mounting bracket 400. Multiple cameras 40 can be fixed on the mounting bracket 400 to form a large camera module. For example, in... Figure 2 In the solution shown, two cameras 40 can be integrated on the mounting bracket 400.

[0042] It is worth noting that to avoid the camera 40, a significant amount of layout space on the circuit board 50 needs to be sacrificed. For example, for Figure 2 In the illustrated scheme, the camera 40 on the right side has a clearance hole 500 on the circuit board 50. The clearance hole 500 extends through the circuit board 50 along its thickness direction (e.g., the Z-axis direction). The clearance hole 500 can accommodate the camera 40, allowing the circuit board 50 to avoid obstructing the camera 40. Figure 2 In the scheme shown, the surface of the circuit board 50 facing the camera 40 on the left cannot have any functional components, so that the circuit board 50 can avoid the camera 40.

[0043] Therefore, the above Figure 2 The installation scheme of the camera 40 shown occupies a large amount of layout space on the circuit board 50, which makes it impossible to place more functional components on the circuit board 50, thus making it difficult to meet the functional design requirements of the mobile phone 1. Especially as the shooting requirements of the mobile phone 1 become more and more complex, the number of cameras 40 also increases, and the available layout space on the circuit board 50 will be compressed even more severely.

[0044] The mobile phone provided in this application addresses the aforementioned problems. The mobile phone in this application embodiment may include a shielding cover and a bracket. The shielding cover is disposed on the circuit board along its thickness direction, forming a receiving cavity together with the circuit board. Functional components are disposed within this cavity. The bracket is located on the side of the shielding cover facing away from the circuit board. The camera is mounted on the shielding cover via the bracket. Thus, the camera and functional components can be stacked on the same surface of the circuit board along its thickness direction. That is, the camera can share layout space on the circuit board with the functional components, rather than occupying separate layout space. Therefore, the circuit board has sufficient space to accommodate the functional components. Furthermore, a buffer structure is provided between the bracket and the shielding cover. This buffer structure can cushion the impact force on the bracket, thereby preventing the shielding cover from compressing the functional components and causing damage. This effectively improves the reliability of the stacked structure formed by the camera, shielding cover, functional components, and bracket.

[0045] The technical solution of this application is described below with reference to the accompanying drawings.

[0046] Figure 3A This application illustrates the installation scheme of the camera 40 in the mobile phone 1 according to an embodiment of the present application. Figure 3B The mobile phone 1 shown in the embodiment of this application is shown along... Figure 3A A sectional view obtained by cutting along section AA. Among them, Figure 3A The field of view of camera 40 is also shown by dashed lines. Figure 3B It is based on Figure 3A Simplified diagram.

[0047] refer to Figure 3A and Figure 3B The mobile phone 1 may include a camera 40, a circuit board 50, a shielding cover 60, functional components 70, a bracket 80, and a buffer structure 90. The functions and structures of the camera 40 and the circuit board 50 are as described above. Figure 1A and Figure 1B The camera 40 and circuit board 50 in the illustrated embodiment are essentially the same, therefore, reference can be made to the above. Figure 1Aand Figure 1B The following description, in conjunction with the accompanying drawings, details the shielding cover 60, functional device 70, bracket 80, and buffer structure 90 in the mobile phone 1 provided in this application.

[0048] The shielding cover 60 is mounted on the circuit board 50 along the Z-axis, and the shielding cover 60 and the circuit board 50 together form a receiving cavity S1, in which the functional device 70 can be housed. The shielding cover 60 provides electromagnetic shielding, thereby preventing the functional device 70 from being interfered with and malfunctioning. In addition, the shielding cover 60 also provides waterproof, dustproof, and impact-resistant protection for the functional device 70.

[0049] It is understood that this application does not limit the specific type of the functional device 70. The functional device 70 may be, for example, a chip (such as a system on chip (SOC), graphics processing unit (GPU)), a sensor, a processor, a memory, and a communication module.

[0050] It is also understood that this application does not limit the number of functional devices 70, and the number of functional devices 70 can be one, two or more (e.g., three, four or five, etc.).

[0051] The bracket 80 is located on the side of the shielding cover 60 facing away from the circuit board 50. In other words, the circuit board 50, the shielding cover 60, and the bracket 80 are arranged sequentially along the positive Z-axis direction (e.g., the Z1 direction). The camera 40 is mounted on the shielding cover 60 via the bracket 80, so that the camera 40 and the functional device 70 can be stacked on the same surface of the circuit board 50 along the Z-axis direction to save layout space on the circuit board 50.

[0052] Along the Z-axis, a buffer structure 90 is disposed between the shield 60 and the support 80. The buffer structure 90 is used to buffer the force applied to the support 80 in the negative Z-axis direction (as an example of a first direction). The negative Z-axis direction could be, for example, […]. Figure 3A and Figure 3B The Z2 direction in the illustrated embodiment.

[0053] Compared to the above Figure 2The installation scheme of the camera 40 shown in this application involves mounting the camera 40 on the shielding cover 60 via a bracket 80. Therefore, the camera 40 and the functional device 70 can be stacked on the same surface of the circuit board 50 along the Z-axis. This means that the camera 40 and the functional device 70 can share the layout space on the circuit board 50, rather than occupying separate layout space. Increasing the number of cameras 40 will not reduce the available layout space on the circuit board 50. Thus, the circuit board 50 has more space to accommodate the functional device 70, thereby meeting the functional design requirements of the mobile phone 1. The installation scheme provided in this application is particularly suitable for the installation of miniaturized cameras.

[0054] Furthermore, by providing a buffer structure 90 between the shielding cover 60 and the bracket 80, force can be buffered and discharged, thereby effectively improving the reliability of the stacked structure composed of the camera 40, the shielding cover 60, the functional device 70, and the bracket 80. For example, when the mobile phone 1 is dropped or bumped, the mobile phone 1 may be subjected to an impact force F1 along the Z2 direction. The impact force F1 can be transmitted to the bracket 80 through the housing of the mobile phone 1 (e.g., the camera back cover 100) along the path shown by the dotted arrow. Since the buffer structure 90 is provided between the shielding cover 60 and the bracket 80, the buffer structure 90 can absorb the impact force F1 along the Z2 direction. Therefore, it can prevent the bracket 80 from causing a large impact on the shielding cover 60, thereby preventing the shielding cover 60 from squeezing the functional device 70 and causing damage to the functional device 70. This makes the reliability of the stacked structure composed of the camera 40, the shielding cover 60, the functional device 70, and the bracket 80 better.

[0055] Finally, by adjusting the dimensions of the bracket 80 along the Z-axis, the mounting height of the camera 40 in the Z-axis direction can be changed, making the mounting position of the camera 40 more flexible. For example, the dimensions of the bracket 80 along the Z-axis can be set larger so that the camera 40 can be positioned as close as possible to the camera back cover 100 along the Z-axis. In this way, light from outside the phone 1 can enter the camera 40 through a shorter path, and there is no need to open a large light-entry hole (not shown) on the camera back cover 100, thus improving the aesthetics of the phone 1.

[0056] The exemplary structures and configurations of the camera 40, circuit board 50, shielding cover 60, bracket 80, and buffer structure 90 in the mobile phone 1 provided in this application are described in detail below with reference to the accompanying drawings.

[0057] Continue reading Figure 3AIn some embodiments of this application, the mobile phone 1 may further include a connecting circuit board 200 and a connector 300. One end of the connecting circuit board 200 is connected to the camera 40, and the other end of the connecting circuit board 200 is connected to the circuit board 50 through the connector 300, thereby realizing signal transmission between the camera 40 and the circuit board 50.

[0058] In some implementations, the connecting circuit board 200 can be a flexible printed circuit board (FPC). Flexible circuit boards are flexible and easy to bend, which can meet the signal transmission requirements in various complex environments.

[0059] In some of these implementations, connector 300 may be, for example, a board-to-board (BTB) connector.

[0060] Continue reading Figure 3B In some embodiments of this application, the shielding cover 60 may include a body 600 and a reinforcing member 610. The body 600 and the circuit board 50 together form a receiving cavity S1, and the body 600 is used to implement the electromagnetic shielding function of the shielding cover 60. The reinforcing member 610 is disposed on the surface of the body 600 facing away from the circuit board 50. The reinforcing member 610 can enhance the strength of the shielding cover 60, making the shielding cover 60 less prone to deformation and ultimately preventing the shielding cover 60 from pressing against the functional device 70.

[0061] In some implementations, the reinforcing member 610 may include a reinforcing plate 611 and a first limiting portion 612. The reinforcing plate 611 and the first limiting portion 612 are arranged sequentially along the Z1 direction, and the reinforcing plate 611 and the first limiting portion 612 may together form a first limiting groove 613. At least a portion of the bracket 80 is disposed in the first limiting groove 613.

[0062] The first limiting groove 613 provides installation positioning for the shielding cover 60 and the bracket 80, reducing the installation difficulty and time. For example, when assembling the shielding cover 60 and the bracket 80, the bracket 80 can be placed in the first limiting groove 613. The first limiting groove 613 restricts the relative range of motion of the shielding cover 60 and the bracket 80. Therefore, during the assembly of the shielding cover 60 and the bracket 80, no uncontrollable relative movement occurs between them, ensuring precise alignment during assembly and avoiding misalignment. In addition, the first limiting groove 613 can also improve the stability of the bracket 80 installation, preventing uncontrollable movement of the bracket 80 relative to the shielding cover 60 in a direction perpendicular to the Z-axis (e.g., the X-axis or Y-axis direction) after installation.

[0063] In some embodiments of this application, the material of the reinforcing member 610 may be, for example, metal (e.g., steel), plastic or other composite materials, and this application does not impose specific limitations on this.

[0064] In some embodiments of this application, the shielding cover 60 and the circuit board 50 can be fixedly connected by means of bonding, welding, snap-fitting or fastener connection, and this application does not impose specific limitations on this.

[0065] In some embodiments of this application, the shielding cover 60 and the bracket 80 can be fixedly connected by means of bonding, welding, snap-fitting, or fastener connection, and this application does not impose specific limitations on this. For example, in Figure 3A In the embodiment shown, an adhesive 61 may be provided between the shielding cover 60 and the bracket 80 to bond the shielding cover 60 and the bracket 80 together, thereby achieving a fixed connection between the shielding cover 60 and the bracket 80.

[0066] Continue reading Figure 3B In some embodiments of this application, the bracket 80 may include a support plate 800 and a second limiting portion 810. The support plate 800 and the second limiting portion 810 are arranged sequentially along the Z1 direction, and the support plate 800 and the second limiting portion 810 may together form a second limiting groove 820. A portion of the camera 40 (e.g., the first portion 410) is disposed in the second limiting groove 820.

[0067] The second limiting groove 820 is used to provide installation positioning for the camera 40 and the bracket 80, thereby reducing the installation difficulty and time of the camera 40 and the bracket 80. For example, when assembling the camera 40 and the bracket 80, the first part 410 of the camera 40 can be placed in the second limiting groove 820. The second limiting groove 820 can limit the relative range of motion of the camera 40 and the bracket 80. Therefore, during the assembly process, no uncontrollable relative movement will occur between the camera 40 and the bracket 80, thereby ensuring that the camera 40 and the bracket 80 are precisely aligned during assembly and avoiding misalignment. In addition, the second limiting groove 820 can also improve the stability of the camera 40 installation, preventing the camera 40 from moving uncontrollably relative to the bracket 80 in a direction perpendicular to the Z-axis (e.g., the X-axis or Y-axis direction) after installation.

[0068] Continue reading Figure 3B In some embodiments of this application, the bracket 80 may further include a third limiting part 830, which is disposed opposite to the first part 410 of the camera 40 along the Z2 direction. Thus, the third limiting part 830 can provide a limit in the Z-axis direction to the first part 410 of the camera 40, preventing uncontrollable movement of the camera 40 along the Z-axis after installation, effectively improving the installation stability of the camera 40.

[0069] In some embodiments of this application, the material of the support 80 may be, for example, metal (e.g., steel), plastic or other composite materials, and this application does not impose any specific limitations on this.

[0070] In some embodiments of this application, the camera 40 and the bracket 80 can be fixedly connected by means of adhesive, welding, snap-fit ​​or fastener connection, and this application does not impose specific limitations on this.

[0071] Continue reading Figure 3A and Figure 3B As mentioned above, in some embodiments of this application, the mobile phone 1 may further include a camera back cover 100, which is disposed on the side of the camera 40 facing away from the bracket 80. The camera back cover 100 is used to protect the camera 40 and also serves as an aesthetic decoration, making the appearance of the mobile phone 1 more design-oriented.

[0072] The camera rear cover 100 may include a cover plate 101 and a fourth limiting part 102. The cover plate 101 and the fourth limiting part 102 are arranged sequentially along the Z2 direction. The cover plate 101 and the fourth limiting part 102 can jointly form a third limiting groove 103. Another part of the camera 40 (e.g., the second part 420) is disposed in the third limiting groove 103.

[0073] The third limiting groove 103 is used to provide installation positioning for the camera back cover 100 and the camera 40, thereby reducing the installation difficulty and time of the camera back cover 100 and the camera 40. For example, when assembling the camera back cover 100 and the camera 40, the second part 420 of the camera 40 can be placed in the third limiting groove 103. The third limiting groove 103 can limit the relative range of motion of the camera back cover 100 and the camera 40. Therefore, during the assembly of the camera back cover 100 and the camera 40, no uncontrollable relative movement will occur between the camera back cover 100 and the camera 40, thereby ensuring that the camera back cover 100 and the camera 40 are precisely aligned during assembly and avoiding misalignment. In addition, the third limiting groove 103 can also improve the stability of the camera 40 installation, preventing the camera 40 from moving uncontrollably relative to the camera back cover 100 in a direction perpendicular to the Z-axis (e.g., the X-axis or Y-axis direction) after installation.

[0074] In some embodiments of this application, a light inlet hole 110 may be provided on the camera back cover 100. The light inlet hole 110 and the camera 40 are arranged to overlap in the Z-axis direction. Light from outside the mobile phone 1 can enter the interior of the camera 40 through the light inlet hole 110 so as to enable the camera 40 to take pictures.

[0075] In some embodiments of this application, a light-transmitting lens 120 may be provided on the light-inlet hole 110. The light-transmitting lens 120 can allow light from outside the mobile phone 1 to pass through while also serving to prevent water and dust.

[0076] It is understood that this application does not impose specific restrictions on the structural form of the buffer structure 90, as long as it can perform the above-mentioned buffering function. Several exemplary structural forms of the buffer structure 90 are described below with reference to the accompanying drawings.

[0077] Continue to refer to Figure 3B In some embodiments of this application, the buffer structure 90 may include a support block 900. The support block 900 is disposed on the surface 840 of the support 80 facing the shield 60, and the support block 900 protrudes along the Z2 direction relative to the surface 840 of the support 80, so that a gap G1 exists between the shield 60 and the support 80. The orthographic projection of the support block 900 on the surface 510 of the circuit board 50 (as an example of a first surface) does not overlap with the orthographic projection of the functional device 70 on the surface 510 of the circuit board 50, wherein the surface 510 of the circuit board 50 is the surface of the circuit board 50 facing the functional device 70. That is, the support block 900 and the functional device 70 are offset in the Z-axis direction.

[0078] Thus, when the mobile phone 1 is subjected to an impact force F1 along the Z2 direction, the impact force F1 can be transmitted to the shielding cover 60 via the support block 900 along the path indicated by the dashed arrow. This force is concentrated in the region S2 of the shielding cover 60 connected to the support block 900, causing a larger deformation of the shielding cover 60 in region S2 and a smaller deformation in other regions. Since the support block 900 and the functional device 70 are offset in the Z-axis direction, region S2 and the functional device 70 are also offset in the Z-axis direction. Therefore, the deformation of the shielding cover 60 caused by the impact force F1 will not compress the functional device 70.

[0079] In some implementations, the support block 900 may include a first support block 900a and a second support block 900b. The first support block 900a and the second support block 900b may be respectively disposed at both ends of the bracket 80 along the X-axis direction (as an example of a second direction). In this way, the first support block 900a and the second support block 900b can stably support the bracket 80, thereby ensuring that the bracket 80 can be subjected to uniform force.

[0080] It is understandable that the above Figure 3B This illustration merely illustrates the structure of one support block 900 and does not constitute a limitation of this application. For example, in some other alternative implementations, the buffer structure 90 may include more or fewer support blocks, such as one, three, or four, etc. This application does not impose specific limitations on this, as long as the above-mentioned buffering effect can be achieved.

[0081] In some embodiments of this application, the material of the support block 900 may be, for example, plastic or metal, and this application does not impose specific limitations on it.

[0082] Figure 4 An exemplary structure of another buffer structure 90 in an embodiment of this application is shown. (See reference...) Figure 4 In other embodiments of this application, the buffer structure 90 may also include an elastic pad 910. The orthographic projection of the elastic pad 910 on the surface 510 of the circuit board 50 at least partially overlaps with the orthographic projection of the functional device 70 on the surface 510 of the circuit board 50, that is, the elastic pad 910 and the functional device 70 are arranged overlapping in the Z-axis direction.

[0083] Thus, when the mobile phone 1 is subjected to an impact force F1 along the Z2 direction, the impact force F1 can be transmitted to the shielding cover 60 via the elastic pad 910 along the path shown by the dashed arrow. Under the action of the impact force F1, the elastic pad 910 can undergo elastic deformation to absorb the energy of the impact force F1, thereby reducing the impact of the impact force F1 on the shielding cover 60, further reducing the deformation of the shielding cover 60, and ultimately preventing the shielding cover 60 from squeezing the functional device 70.

[0084] In some embodiments of this application, the material of the elastic pad 910 may be, for example, rubber, foam or thermoplastic polyurethane (TPU), and this application does not impose any specific limitations on it.

[0085] In some implementations, the elastic pad 910 can be made of foam. The elastic pad 910 can be attached to the bracket 80 by adhesive bonding.

[0086] In some embodiments of this application, the support 80 and the buffer structure 90 can be an integral structure, without the need for subsequent assembly of the support 80 and the buffer structure 90. That is, the structure formed by the support 80 and the buffer structure 90 is a single, indivisible integral structure, rather than being assembled from multiple independent parts. Alternatively, the support 80 and the buffer structure 90 can be integrally formed.

[0087] For example, in Figure 3A and Figure 3B In the scheme shown, the materials of the support 80 and the buffer structure 90 can be plastic, and the support 80 and the buffer structure 90 can be integrally molded by injection molding to obtain an integral support 80 and buffer structure 90.

[0088] For example, in Figure 4In the scheme shown, the materials of the support 80 and the buffer structure 90 can also be rubber or thermoplastic polyurethane. The support 80 and the buffer structure 90 can be integrally molded by two-color injection molding. Two-color injection molding can achieve the molding and combination of two materials on one part, so that an integral support 80 and buffer structure 90 can be obtained.

[0089] By integrating the bracket 80 and the buffer structure 90 into a single unit, the number of components in the mobile phone 1 can be effectively reduced, simplifying the structure of the mobile phone 1 and improving assembly efficiency.

[0090] The above description illustrates the implementation of this application through specific embodiments. Those skilled in the art can easily understand other advantages and effects of this application from the content disclosed in this specification. Although the description of this application is presented in conjunction with some embodiments, this does not mean that the features of this application are limited to these embodiments, and this application can also be implemented without using these details. Furthermore, to avoid confusion or obscuring the focus of this application, some specific details have been omitted in the description. It should be noted that, unless otherwise specified, the embodiments and features in the embodiments of this application can be combined with each other.

[0091] In the description of this application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "outer", "inner", "circumferential", "radial", "axial", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0092] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "set," "install," "connect," and "fit" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal communication between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

Claims

1. An electronic device, characterized in that, Includes circuit boards, shielding covers, functional components, brackets, cameras, and buffer structures, among which: The shielding cover is applied to the circuit board along its thickness direction and together with the circuit board forms a receiving cavity, in which the functional device is disposed; The bracket is located on the side of the shielding cover facing away from the circuit board, and the camera is mounted on the shielding cover via the bracket; Along the thickness direction, the buffer structure is disposed between the shield and the support, and the buffer structure is used to buffer the support when it is subjected to an impact force along a first direction, which is parallel to the thickness direction.

2. The electronic device according to claim 1, characterized in that, The buffer structure includes a support block disposed on the surface of the bracket facing the shield, and the support block protrudes along the first direction relative to the surface of the bracket facing the shield, so that there is a gap between the bracket and the shield. The orthographic projection of the support block onto the first surface of the circuit board does not overlap with the orthographic projection of the functional device onto the first surface, where the first surface is the surface of the circuit board facing the functional device.

3. The electronic device according to claim 2, characterized in that, The support block includes a first support block and a second support block, which are respectively disposed at both ends of the bracket along a second direction, the second direction being perpendicular to the first direction.

4. The electronic device according to claim 1, characterized in that, The buffer structure includes an elastic pad, the orthographic projection of which on a first surface of the circuit board at least partially overlaps with the orthographic projection of the functional device on the first surface, the first surface being the surface of the circuit board facing the functional device.

5. The electronic device according to claim 4, characterized in that, The elastic pad is made of rubber, foam, or thermoplastic polyurethane elastomer rubber.

6. The electronic device according to any one of claims 1 to 5, characterized in that, The support and the buffer structure are an integral part of each other.

7. The electronic device according to claim 1, characterized in that, The shielding cover includes a body and a reinforcing member. The body and the circuit board together form the receiving cavity, and the reinforcing member is disposed on the surface of the body facing away from the circuit board.

8. The electronic device according to claim 7, characterized in that, The reinforcing member includes a reinforcing plate and a first limiting part. The reinforcing plate and the first limiting part are arranged sequentially in the opposite direction to the first direction, and the reinforcing plate and the first limiting part together form a first limiting groove. At least a portion of the bracket is disposed in the first limiting groove.

9. The electronic device according to claim 1, characterized in that, The bracket includes a support plate and a second limiting part. The support plate and the second limiting part are arranged sequentially in the opposite direction to the first direction, and the support plate and the second limiting part together form a second limiting groove. A part of the camera is disposed in the second limiting groove.

10. The electronic device according to claim 9, characterized in that, The bracket also includes a third limiting part, which is disposed opposite to a portion of the camera along the first direction.

11. The electronic device according to claim 9, characterized in that, The electronic device also includes a camera rear cover, which is located on the side of the camera facing away from the bracket; The camera rear cover includes a cover plate and a fourth limiting part. The cover plate and the fourth limiting part are arranged sequentially along the first direction, and the cover plate and the fourth limiting part together form a third limiting groove. Another part of the camera is disposed in the third limiting groove.

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