Earphone production fitting device

Abstract

The utility model provides a kind of earphone production is attached device, including base, the top side of base is equipped with rack, the rack and the base are equipped with attaching mechanism between, the attaching mechanism includes docking assembly, pusher assembly and unloading assembly, the unloading assembly includes the storage cavity opened in the inside of base, the top of storage cavity is equipped with unloading port, unloading plate is connected in the inside of unloading port by hinge, telescopic pneumatic cylinder is installed in the inside of storage cavity, telescopic pneumatic cylinder is installed in the inside of storage cavity by mounting base, the top telescopic end of telescopic pneumatic cylinder is connected with push plate, the top of push plate and the bottom of unloading plate extrude together.The utility model has the beneficial effect as follows, by the design of attaching mechanism, the integrated processing action of earphone's feeding, attaching and unloading can be realized, and then the production efficiency of earphone is improved.

Description

Technical Field

[0001] This utility model is a bonding device for headphone production, belonging to the technical field of headphone production equipment. Background Technology

[0002] Bluetooth headsets apply Bluetooth technology to hands-free devices, freeing users from the hassle of annoying wires and allowing them to make calls easily and freely in various ways. Since their advent, Bluetooth headsets have been a great tool for mobile business professionals to improve efficiency.

[0003] Current headphones are manufactured through multiple steps, including gluing, bonding, and sealing. Each step is performed separately, which is time-consuming and labor-intensive, and production efficiency needs to be improved. Utility Model Content

[0004] In view of the shortcomings of the existing technology, the purpose of this utility model is to provide a bonding device for headphone production.

[0005] To achieve the above objectives, this utility model is implemented through the following technical solution: A bonding device for headphone production includes a base, a frame on one side of the top of the base, and a bonding mechanism between the frame and the base. The bonding mechanism includes a docking component, a pushing component, and a material unloading component. The material unloading component includes a storage cavity inside the base, a material unloading port at the top of the storage cavity, a material unloading plate connected to the material unloading port by a hinge, a telescopic cylinder installed at the bottom of the storage cavity, the telescopic cylinder being installed in the storage cavity by a mounting base, a push plate connected to the top telescopic end of the telescopic cylinder, the top of the push plate being pressed together with the bottom of the material unloading plate, and a discharge port extending through to the outer surface of the base at the bottom of one side of the storage cavity.

[0006] Furthermore, the docking assembly includes a turntable rotatably connected to the top of the base. The center of the turntable is connected to the top of a rotating shaft. The bottom end of the rotating shaft extends movably into the storage chamber and is connected to a motor. A partition is provided inside the storage chamber and between the motor and the discharge port. Several movable grooves are evenly formed on the outer circumference of the turntable. A placement seat is hinged inside the movable groove. A bottom vacuum suction cup is provided on the top of the placement seat.

[0007] Furthermore, a rotating column is fixedly connected to the top center of the turntable, a rotating plate is fixed to the middle of the rotating column, the rotating plate is rotatably sleeved on a collar, a connecting plate is fixed to the side of the collar, the connecting plate is connected and fixed to the frame, a number of through holes are opened on the rotating plate, a number of sliding grooves are evenly opened on the outer circumference of the rotating column above the rotating plate, a sliding plate is slidably connected inside the sliding groove, a damping spring is installed at the bottom of the sliding groove, the top of the damping spring is pressed together with the bottom of the sliding plate, a movable seat is fixed to the bottom of the sliding plate, the movable seat is slidably connected in the through hole, and a top vacuum suction cup is installed at the bottom of the movable seat.

[0008] Furthermore, the rotating column has a hollow structure, and a vacuum pump is installed inside the rotating column. The output end of the vacuum pump is connected to a gas supply main pipe. A set of top gas supply hoses and bottom gas supply hoses are provided on the gas supply main pipe. The top gas supply hose is connected to the top vacuum suction cup through the sliding plate and the vertical pipe. The bottom gas supply hose passes through the turntable and the placement seat and is connected to the bottom vacuum suction cup.

[0009] Furthermore, both the top gas delivery hose and the bottom gas delivery hose are equipped with solenoid valves.

[0010] Furthermore, an annular component is provided on the outer surface of the rotating column and above the frame, and the bottom of the annular component is rotatably connected to the top of the frame via a slide rail and a slider.

[0011] Furthermore, the pushing assembly includes a push cylinder mounted on the top of the frame, the bottom output end of the push cylinder extending through the frame and connected and fixed to the extrusion block, and the bottom of the extrusion block being adapted to the sliding plate.

[0012] Furthermore, an electrical control box is provided on one side of the base, and a power supply and wireless signal transceiver are provided inside the rotating column. The electrical control box is electrically connected to the wireless signal transceiver, the motor, the lifting cylinder, the pushing cylinder, the vacuum pump, and the solenoid valve.

[0013] The beneficial effects of this utility model are: The design of the bonding mechanism enables integrated processing of headphone loading, bonding, and unloading, thereby improving headphone production efficiency.

[0014] Through the design of the docking components, when in use, the vacuum pump is activated, and both the top vacuum suction cup on the movable seat and the bottom vacuum suction cup on the placement seat are in a negative pressure adsorption state. Subsequently, the two earphone components are placed one by one into the adsorption grooves on the top and bottom vacuum suction cups. During the process of workers placing them one by one, the motor drives the turntable, rotating column, and rotating plate to rotate synchronously. This allows the earphone components adsorbed in the top and bottom vacuum suction cups to be vertically aligned on the same central axis, while also allowing each earphone component to be rotated to the underside of the pushing component, facilitating the activation of the pushing component.

[0015] By pushing the component design, the top vacuum suction cup on the rotating plate rotates to the bottom of the push cylinder. The push cylinder then pushes the extrusion block down. The extrusion block pushes the sliding plate above the top vacuum suction cup, causing the top vacuum suction cup to descend. The top vacuum suction cup then causes the upper headphone component to descend, so that it fits together with the headphone component on the bottom vacuum suction cup below.

[0016] Through the design of the unloading component, after the push component presses the earphone component on the docking component into place, the motor continues to drive the turntable to rotate. The turntable drives the placement seat that has been properly attached to rotate to the unloading plate. Then, the lifting cylinder retracts to release the lifting support on the unloading plate. At this time, the unloading plate and the placement seat will tilt under the action of the hinge. During the tilting process, the properly attached earphone in the placement seat will fall into the storage cavity. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is a schematic diagram of the overall structure of a bonding device for headphone production according to the present invention; Figure 2 This is a schematic diagram of the base structure of a bonding device for headphone production according to the present invention; Figure 3 This is a schematic diagram of the connection structure of the docking component and the pushing component of the bonding device for headphone production according to this utility model; Figure 4 This is a partial structural diagram of the docking component of a bonding device for headphone manufacturing according to this utility model. Figure 1 ; Figure 5 This is a partial structural diagram of the docking component of a bonding device for headphone manufacturing according to this utility model. Figure 2 .

[0019] In the diagram, 1. Base; 2. Frame; 3. Rotating shaft; 4. Turntable; 5. Placement seat; 6. Bottom vacuum suction cup; 7. Unloading port; 8. Unloading plate; 9. Discharge port; 10. Connecting plate; 11. Collar; 12. Rotating plate; 13. Rotating column; 14. Slide groove; 15. Sliding plate; 16. Damping spring; 17. Vertical tube; 18. Movable seat; 19. Perforation; 20. Top vacuum suction cup; 21. Ring component; 22. Top push cylinder; 23. Extrusion block. Detailed Implementation

[0020] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0021] Please see Figures 1-5 This utility model provides a bonding device for headphone production, including a base 1, a frame 2 on one side of the top of the base 1, and a bonding mechanism between the frame 2 and the base 1. The bonding mechanism includes a docking component, a pushing component, and a material unloading component. The material unloading component includes a storage cavity inside the base 1, a material unloading port 7 at the top of the storage cavity, and a material unloading plate 8 connected to the material unloading port 7 via a hinge. A telescopic cylinder is installed at the bottom of the storage cavity, and the telescopic cylinder is installed in the storage cavity via a mounting base. A push plate is connected to the telescopic end of the telescopic cylinder, and the top of the push plate is pressed together with the bottom of the material unloading plate 8. A through-hole is provided on one side of the bottom of the storage cavity. The base 1 has a discharge port 9 on its outer surface. An electrical control box is provided on one side of the base 1. The rotating column 13 is equipped with a power supply and a wireless signal transceiver. The electrical control box is electrically connected to the wireless signal transceiver, the motor, the lifting cylinder, the push cylinder 22, the vacuum pump, and the solenoid valve. Through the design of the unloading assembly, after the push assembly attaches the earphone assembly on the docking assembly, the motor continues to drive the turntable 4 to rotate. The turntable 4 drives the attached placement seat 5 to rotate to the unloading plate 8. Then, the lifting cylinder retracts to release the lifting support of the unloading plate 8. At this time, the unloading plate 8 and the placement seat 5 will tilt under the action of the hinge. During the tilting process, the attached earphone in the placement seat 5 will fall into the storage cavity.

[0022] See Figures 3-5The docking assembly includes a turntable 4 rotatably connected to the top of the base 1. The center of the turntable 4 is connected to the top of the rotating shaft 3. The bottom end of the rotating shaft 3 extends movably into the storage chamber and is connected to the motor. A partition is provided inside the storage chamber and between the motor and the discharge port 7. Several movable grooves are evenly distributed on the outer circumference of the turntable 4. A placement seat 5 is hinged inside the movable groove. A bottom vacuum suction cup 6 is provided on the top of the placement seat 5. A rotating column 13 is fixedly connected to the center of the top of the turntable 4. A rotating plate 12 is fixed in the middle of the rotating column 13. The rotating plate 12 is rotatably sleeved on the collar 11. A connecting plate 10 is fixed to the side of the collar 11. The connecting plate 10 is fixedly connected to the frame 2. The rotating plate 12 has several through holes 19. The rotating column 13, located above the rotating plate 12, has several evenly spaced grooves 14 on its outer circumferential surface. A sliding plate 15 is slidably connected inside each groove 14. A damping spring 16 is installed at the bottom of each groove 14, with its top end pressed against the bottom of the sliding plate 15. The damping spring 16 is designed to push the movable seat 18 and the top vacuum suction cup 20 back up after the earphone is properly attached, facilitating subsequent loading and rotation of the top vacuum suction cup 20. However, after a period of use, the damping spring 16 may experience elastic fatigue and aging. When the problem occurs, it does not affect the normal operation of the equipment immediately; it only shortens the distance of the reset and rise. However, this application only requires the movable seat 18 and the top vacuum suction cup 20 to be disengaged from the turntable 4 and the placement seat 5. Moreover, the worker loading the material will discover the fault as soon as it shows signs of aging, and the parts can be replaced at this time. Finally, the damping spring 16 will be maintained regularly within the specified maintenance range, so the above situation will not occur under normal circumstances. The bottom of the sliding plate 15 is fixed with a movable seat 18, which is slidably connected in the through hole 19. The bottom of the movable seat 18 is equipped with a top vacuum suction cup 20. The rotating column 13 has a hollow structure, and the interior of the rotating column 13 is designed with... A vacuum pump is provided, and the output end of the vacuum pump is connected to a main gas supply pipe. A set of top gas supply hoses and bottom gas supply hoses are provided on the main gas supply pipe. The top gas supply hose is connected to the top vacuum suction cup 20 through the sliding plate 15 and the vertical pipe 17. The bottom gas supply hose passes through the turntable 4 and the placement seat 5 and is connected to the bottom vacuum suction cup 6. Both the top gas supply hose and the bottom gas supply hose are provided with solenoid valves. The start and stop actions of the bottom vacuum suction cup 6 and the top vacuum suction cup 20 are controlled by the solenoid valves. An annular part 21 is provided on the outer surface of the rotating column 13 and above the frame 2. The bottom of the annular part 21 is rotatably connected to the top of the frame 2 through a slide rail and a slider.Through the design of the docking components, during use, the vacuum pump is activated, and both the top vacuum suction cup 20 on the movable seat 18 and the bottom vacuum suction cup 6 on the placement seat 5 are in a negative pressure adsorption state. Subsequently, the two earphone components are placed one by one into the adsorption grooves on the top vacuum suction cup 20 and the bottom vacuum suction cup 6. During the process of workers placing them one by one, the motor drives the turntable 4, the rotating column 13, and the rotating plate 12 to rotate synchronously. This ensures that the earphone components adsorbed in the top vacuum suction cup 20 and the bottom vacuum suction cup 6 are vertically aligned on the same central axis, and each earphone component can be rotated one by one to the underside of the pushing component, facilitating the activation of the pushing component.

[0023] See Figure 1 and Figure 3 The pushing assembly includes a top-push cylinder 22 mounted on the top of the frame 2. The bottom output end of the top-push cylinder 22 extends through the frame 2 and is connected and fixed to the extrusion block 23. The bottom of the extrusion block 23 is adapted to the sliding plate 15. Through the design of the pushing assembly, after the top vacuum suction cup 20 on the rotating plate 12 rotates to below the top-push cylinder 22, the top-push cylinder 22 pushes the extrusion block 23 down. The extrusion block 23 pushes the sliding plate 15 above the top vacuum suction cup 20, causing the top vacuum suction cup 20 to descend. The top vacuum suction cup 20 causes the earphone assembly above to descend, so that it fits together with the earphone assembly on the bottom vacuum suction cup 6 below.

[0024] The circuits and electronic components, modules and controllers, or the heat dissipation holes and maintenance doors in the space of the adapted electrical equipment are all existing technologies, which can be fully implemented by those skilled in the art, and need not be elaborated. The content protected by this application does not involve improvements to software and methods or heat dissipation and maintenance.

[0025] During use, the vacuum pump is started, and both the top vacuum suction cup 20 on the movable seat 18 and the bottom vacuum suction cup 6 on the placement seat 5 are in a negative pressure adsorption state. Then, the two earphone components are placed one by one into the adsorption grooves on the top vacuum suction cup 20 and the bottom vacuum suction cup 6. During the placement process, the motor drives the turntable 4, the rotating column 13, and the rotating plate 12 to rotate synchronously. When the top vacuum suction cup 20 on the rotating plate 12 rotates to below the push cylinder 22, the push cylinder 22 pushes the extrusion block 23 to descend. The extrusion block 23 pushes the sliding plate 15 above the top vacuum suction cup 20, causing the top vacuum suction cup 20 to descend. The top vacuum suction cup 20 lowers the upper earphone assembly, making it fit together with the lower vacuum suction cup 6. After they fit together, the top push cylinder 22 retracts, causing the squeezing block 23 to rise and reset. Meanwhile, the top vacuum suction cup 20 rises and resets under the action of the damping spring 16. Subsequently, the motor continues to drive the turntable 4 to rotate, and the turntable 4 drives the fitted placement seat 5 to rotate to the unloading plate 8. Then, the lifting cylinder retracts to release the lifting support of the unloading plate 8. At this time, the unloading plate 8 and the placement seat 5 will tilt under the action of the hinge. During the tilting process, the fitted earphones in the placement seat 5 will fall into the storage cavity.

[0026] Although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole. The technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A bonding device for headphone manufacturing, characterized in that, The device includes a base (1), a frame (2) on one side of the top of the base (1), a fitting mechanism between the frame (2) and the base (1), the fitting mechanism including a docking component, a pushing component and a unloading component, the unloading component including a storage cavity opened inside the base (1), an unloading port (7) opened at the top of the storage cavity, an unloading plate (8) connected inside the unloading port (7) by a hinge, a telescopic cylinder installed at the bottom of the storage cavity, the telescopic cylinder being installed in the storage cavity by a mounting seat, a push plate connected to the top telescopic end of the telescopic cylinder, the top of the push plate being pressed together with the bottom of the unloading plate (8), and an outlet (9) extending through to the outer surface of the base (1) opened at the bottom of one side of the storage cavity.

2. The bonding device for headphone production according to claim 1, characterized in that, The docking assembly includes a turntable (4) rotatably connected to the top of the base (1). The center of the turntable (4) is connected to the top of the rotating shaft (3). The bottom end of the rotating shaft (3) extends movably into the storage chamber and is connected to the motor. A partition is provided inside the storage chamber and between the motor and the discharge port (7). Several movable slots are evenly opened on the outer circumference of the turntable (4). A placement seat (5) is hinged inside the movable slot. A bottom vacuum suction cup (6) is provided on the top of the placement seat (5).

3. The bonding device for headphone production according to claim 2, characterized in that, A rotating column (13) is fixedly connected to the top center of the turntable (4). A rotating plate (12) is fixed to the middle of the rotating column (13). The rotating plate (12) is rotatably sleeved on the collar (11). A connecting plate (10) is fixed to the side of the collar (11). The connecting plate (10) is connected and fixed to the frame (2). Several through holes (19) are opened on the rotating plate (12). The outer circumference of the rotating column (13) above the rotating plate (12) is... A plurality of sliding grooves (14) are evenly distributed. A sliding plate (15) is slidably connected inside the sliding groove (14). A damping spring (16) is installed at the bottom of the sliding groove (14). The top of the damping spring (16) is pressed together with the bottom of the sliding plate (15). A movable seat (18) is fixed at the bottom of the sliding plate (15). The movable seat (18) is slidably connected in the through hole (19). A top vacuum suction cup (20) is installed at the bottom of the movable seat (18).

4. The bonding device for headphone production according to claim 3, characterized in that, The rotating column (13) has a hollow structure. A vacuum pump is installed inside the rotating column (13). The output end of the vacuum pump is connected to a gas supply pipe. A set of top gas supply hoses and bottom gas supply hoses are installed on the gas supply pipe. The top gas supply hose is connected to the top vacuum suction cup (20) through the sliding plate (15) and the vertical pipe (17). The bottom gas supply hose passes through the turntable (4) and the placement seat (5) and is connected to the bottom vacuum suction cup (6).

5. A bonding device for headphone manufacturing according to claim 4, characterized in that, Both the top gas delivery hose and the bottom gas delivery hose are equipped with solenoid valves.

6. A bonding device for headphone manufacturing according to claim 5, characterized in that, An annular component (21) is provided on the outer surface of the rotating column (13) and above the frame (2). The bottom of the annular component (21) is rotatably connected to the top of the frame (2) via a slide rail and a slider.

7. A bonding device for headphone manufacturing according to claim 6, characterized in that, The pushing assembly includes a push cylinder (22) mounted on the top of the frame (2), the bottom output end of the push cylinder (22) extends through the frame (2) and is connected and fixed to the extrusion block (23), the bottom of the extrusion block (23) is adapted to the sliding plate (15).

8. A bonding device for headphone manufacturing according to claim 7, characterized in that, An electrical control box is provided on one side of the base (1), and a power supply and wireless signal transceiver are provided inside the rotating column (13). The electrical control box is electrically connected to the wireless signal transceiver, the motor, the lifting cylinder, the push cylinder (22), the vacuum pump and the solenoid valve.

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