A wireless access gateway device and an interface slot thereof

Abstract

The utility model discloses a wireless access gateway equipment and interface slot thereof, and the gold finger of interface slot includes high -speed signal area and control signal area, high -speed signal area adopts differential banding, and the main control chip of bearing access optical signal to wireless access gateway equipment, control signal area includes at least two groups of user-defined pin, and transmission access wireless dispatching instruction to main control chip. Can realize humidity power generation with low cost, high efficiency. Through the design of high integration, the physical interface of 10G PON module and wireless bridge main control board card is established, and high -speed, stable, flexible wireless network access service is provided.

Description

Technical Field

[0001] This utility model relates to the field of wireless technology, specifically to a wireless access gateway device and its interface slot. Background Technology

[0002] With the explosive growth of high-bandwidth applications such as 4K / 8K ultra-high-definition video transmission, massive access to industrial IoT devices, and real-time VR / AR interaction, the transmission bandwidth of existing equipment has shown significant bottlenecks. To address the insufficient speed issue, traditional industry solutions require the additional deployment of a separate 10G PON (Passive Optical Network) gateway device.

[0003] A standalone 10G PON gateway and wireless bridge need to be interconnected via an external SFP+ (Small Form-factor Pluggableplus) interface and an Ethernet cable. The architecture requires at least two SFP+ slots and more than four RJ45 ports to enable wireless network access services. Existing interface architecture solutions occupy a large area, accounting for 35%-40% of the total PCB area, and the cable connections are complex, requiring additional deployment of fiber optic patch cords and network cables, making it difficult to miniaturize the device. Utility Model Content

[0004] Compared with the prior art, the wireless access gateway device and its interface slot proposed in this utility model provide a highly integrated interface architecture for wireless network access services, with a small PCB footprint and easy integration.

[0005] This utility model provides an interface slot for a wireless access gateway device, wherein the gold fingers of the interface slot include a high-speed signal area and a control signal area;

[0006] The high-speed signal zone uses differential strip cabling to carry the incoming optical signals to the main control chip of the wireless access gateway device;

[0007] The control signal area includes at least two sets of custom pins that transmit the accessed wireless scheduling commands to the main control chip.

[0008] Preferably, the bottom of the interface slot is integrated with a metal shield of a predetermined thickness;

[0009] The metal shield is grounded via spring contacts.

[0010] Preferably, the interface slot is mounted on the PCB board using a fixing structure made of glass fiber reinforced LCP material.

[0011] Preferably, a micro heat pipe is integrated on the back of the PCB board;

[0012] The evaporation end of the micro heat pipe is in close contact with the metal housing of the interface slot, and the condensation end of the micro heat pipe is connected to a heat dissipation device configured on the device housing.

[0013] This utility model embodiment also provides a wireless access gateway device, the device including a PCB board, an interface slot configured on the PCB board, and a main control chip;

[0014] The gold fingers of the interface slot include a high-speed signal area and a control signal area;

[0015] The high-speed signal zone uses differential strip cabling to carry the incoming optical signals to the main control chip of the wireless access gateway device;

[0016] The control signal area includes at least two sets of custom pins that transmit the accessed wireless scheduling commands to the main control chip.

[0017] Preferably, the bottom of the interface slot is integrated with a metal shield of a predetermined thickness;

[0018] The metal shield is grounded via spring contacts.

[0019] Preferably, the metal shield is a beryllium copper alloy shield.

[0020] Preferably, the wiring between the slot and the main control chip adopts a serpentine routing, and a shielded ground hole is provided on at least one side of the wiring.

[0021] Preferably, the device further includes a wireless power amplifier and a voltage adjustment module;

[0022] The voltage adjustment module is used to adjust the power supply voltage of the wireless power amplifier.

[0023] Preferably, a micro heat pipe is integrated on the back of the PCB board;

[0024] The evaporation end of the micro heat pipe is in close contact with the metal housing of the interface slot, and the condensation end of the micro heat pipe is connected to a heat dissipation device configured on the device housing.

[0025] Preferably, the interface slot is mounted on the PCB board using a fixing structure made of glass fiber reinforced LCP material.

[0026] Compared with existing technologies, this utility model provides a wireless access gateway device and its interface slot. The gold fingers of the interface slot include a high-speed signal area and a control signal area. The high-speed signal area uses differential strip wiring to carry the accessed optical signal to the main control chip of the wireless access gateway device. The control signal area includes at least two sets of custom pins to transmit the accessed wireless scheduling commands to the main control chip. This enables low-cost and high-efficiency humidity-based power generation. This application's solution, through a highly integrated design, establishes a physical interface between the 10G PON module and the wireless bridge main control board, providing high-speed, stable, and flexible wireless network access services. Attached Figure Description

[0027] Figure 1 This is a schematic diagram of the interface slot of a wireless access gateway device provided in an embodiment of the present invention;

[0028] Figure 2 This is a schematic diagram of the structure of the wireless access gateway device provided in this embodiment of the utility model. Detailed Implementation

[0029] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0030] To address the aforementioned technical issues, this application proposes an interface slot for a wireless access gateway device, wherein the gold fingers of the interface slot include a high-speed signal area and a control signal area.

[0031] The high-speed signal zone uses differential strip cabling to carry the incoming optical signals to the main control chip of the wireless access gateway device;

[0032] The control signal area includes at least two sets of custom pins that transmit the accessed wireless scheduling commands to the main control chip.

[0033] For specific implementation, see Figure 1 This is a schematic diagram of the interface slot of a wireless access gateway device provided in an embodiment of this utility model;

[0034] The gold fingers of the interface slot include a high-speed signal area and a control signal area;

[0035] The gold fingers of the interface slot plan the transmission paths of high-speed signals and control signals in a partitioned manner, so as to realize the efficient and stable transmission of different types of signals and meet the collaborative processing requirements of optical signals and wireless scheduling commands in wireless access gateway devices.

[0036] From the perspective of signal characteristics, high-speed signals (such as electrical signals converted from optical signals) have extremely high requirements for transmission bandwidth and anti-interference capabilities. Differential strip wiring can utilize the common-mode rejection characteristics of differential signals to reduce external interference while ensuring high-speed signal transmission. Although control signals have a lower speed, it is necessary to ensure the accuracy and independence of command transmission. Different commands can be isolated and transmitted by custom pin grouping to avoid mutual interference.

[0037] An enhanced slot compatible with the SFP+ standard (IEEE 802.3ae) is designed on the PCB board, with a dual-channel signal isolation layout: the slot gold fingers are divided into a high-speed signal area Zone-H and a control signal area Zone-C.

[0038] Among them, the high-speed signal zone-H adopts differential stripline wiring with a line width / spacing of 8mil / 6mil, carrying 10.3125Gbps XGS-PON optical signals, namely SFP+TX / RX.

[0039] Differential strip cabling is employed, consisting of multiple pairs of differential signal lines. The line width and spacing of each pair of differential lines are consistent to ensure signal transmission integrity and impedance matching. When the optical module is inserted into the slot, the optical signal is converted into an electrical signal by the module and then transmitted to the main control chip of the wireless access gateway device through the differential lines in the high-speed signal area. This supports high-speed data transmission, such as 10Gbps and above, meeting the bandwidth requirements of optical communication. The high-speed signal area is typically concentrated on one side of the gold finger, with the cabling path as short and straight as possible, minimizing bends and crossings, while maintaining a certain distance from the control signal area to reduce signal crosstalk.

[0040] The control signal zone (Zone-C) adds two new sets of custom pins, Pin11 and Pin12, for transmitting wireless scheduling commands, such as MU-MIMO beam switching trigger signals to the main control chip. The control signal zone contains at least two sets of custom pins, each corresponding to a specific wireless scheduling command transmission function. For example, one set of pins might transmit wireless channel switching commands, while the other might transmit power adjustment commands; specific functions can be defined according to actual needs. Control signals are transmitted as single-ended signals through the custom pins, with independent wiring between pins. Each set of pins has its own ground pin, forming shielding and isolation to ensure that command signals are not affected by high-speed signals or other external interference during transmission. The pins are directly connected to the main control chip's control interface, achieving fast command transmission through simple level signals with short response times, meeting real-time scheduling requirements.

[0041] This project utilizes a composite SPF+ slot interface framework to provide a highly integrated wireless network access service interface architecture. Through a highly integrated design, it establishes a physical interface between the 10G PON module and the wireless bridge main control board, achieving optoelectronic collaboration and functional integration, and providing high-speed, stable, and flexible wireless network access services.

[0042] In another embodiment of this utility model, a metal shield of preset thickness is integrated at the bottom of the interface slot and grounded through spring contacts. By utilizing the electromagnetic shielding characteristics of the metal material and the reliable grounding connection, a closed electromagnetic protection space is constructed to block external electromagnetic interference (EMI) from entering the slot and prevent electromagnetic radiation generated by high-speed signals and control signals in the slot from leaking out, thereby ensuring the stability of signal transmission.

[0043] Metal shielding covers can reflect and absorb electromagnetic waves based on the principle of electromagnetic shielding, thus weakening the intensity of external interference signals. Reliable grounding achieved through spring contacts can quickly conduct the interference charges induced on the shielding cover into the ground, preventing charge accumulation and secondary interference, and further enhancing the shielding effect.

[0044] Metal shielding covers are typically made of metal materials with good conductivity and shielding properties, such as nickel silver and tinplate. The preset thickness needs to be determined according to the actual electromagnetic environment, generally between 0.2-0.5mm, which can ensure sufficient structural strength and shielding effect without excessively increasing the overall thickness of the slot.

[0045] Preferably, the metal shielding cover can be a beryllium copper alloy shielding cover with a thickness of 0.2mm. It is grounded to the PON module shell through spring contacts to achieve EMI suppression of the plug-in contact surface and reduce radiation by 15dB in the 30MHz-6GHz frequency band.

[0046] The metal shield is box-shaped or cover-shaped, completely covering the bottom and sides of the interface slot (with an opening reserved at the top for inserting the optical module), forming a relatively enclosed space that encloses the high-speed signal area and control signal area of ​​the gold finger, blocking the intrusion of external electromagnetic signals and the leakage of internal signals.

[0047] The metal shielding cover is fixed to the bottom of the interface slot by welding, clips, or screws to ensure a firm installation and a seamless fit with the slot, avoiding gaps that could reduce the shielding effect.

[0048] Multiple spring contacts are installed at the edge or specific locations of the metal shielding cover. These contacts are made of a material with excellent conductivity and possess a certain degree of elasticity and flexibility. When the interface slot is installed onto the device motherboard, the spring contacts make tight contact with the grounding pad on the motherboard, forming a reliable electrical connection that connects the metal shielding cover to the device's grounding system.

[0049] It should be noted that the number of spring contacts is determined based on the size of the shield and the grounding requirements. They are generally evenly distributed around the shield to ensure that the charge in each part of the shield can be quickly released through the grounding path.

[0050] In another embodiment of this utility model, the interface slot is mounted on the PCB board using a fixing structure made of glass fiber reinforced LCP (Liquid Crystal Polymer) material. The excellent mechanical properties, thermal stability and electrical insulation of glass fiber reinforced LCP material provide a stable and reliable mounting support for the interface slot. At the same time, it can adapt to environmental changes during equipment operation, such as temperature fluctuations and vibrations, to ensure the stability of the connection between the slot and the PCB board, thereby ensuring the continuity of signal transmission.

[0051] The dielectric constant of the glass fiber reinforced LCP material is ε=2.9, and the insertion and extraction force remains stable at 0.5-1.5N within the range of -40℃ to 85℃, which conforms to the IEC 61754-7 standard.

[0052] After being reinforced with glass fiber, the strength, rigidity and impact resistance of glass fiber reinforced LCP material are significantly improved, and it can withstand the mechanical stress generated when the optical module is inserted and removed from the interface slot. At the same time, the material has an extremely low coefficient of thermal expansion and good high temperature resistance, which can reduce structural deformation caused by temperature changes and prevent the connection between the slot and the PCB board from loosening.

[0053] In another embodiment of this utility model, a micro heat pipe is integrated on the back of the PCB board, with its evaporation end in close contact with the metal shell of the interface slot and its condensation end connected to the heat dissipation device of the equipment shell. Through the excellent phase change heat transfer capability of the micro heat pipe, the heat generated by the interface slot during operation is quickly conducted out and dissipated, thereby achieving efficient heat dissipation and ensuring the stable operation of the interface and the equipment.

[0054] The miniature heat pipes used typically have a diameter between 2-5mm, and their length is determined by the distance between the PCB board and the heat dissipation device on the equipment casing, generally 50-150mm, to fit the compact internal space of the equipment. The heat pipes are arranged along the wiring gaps on the back of the PCB board to avoid interference with components or solder joints on the back, ensuring installation feasibility.

[0055] The evaporation end of the miniature heat pipe is tightly attached to the metal housing of the interface slot using thermally conductive silicone or welding to ensure minimal thermal resistance between the two. The metal housing acts as a heat collection surface, transferring heat generated by the interface slot, including the operation of the optical module and signal transmission, to the evaporation end of the heat pipe through thermal conduction.

[0056] The condenser end connects to the heat dissipation device on the device housing via thermal pads or direct contact. Common heat dissipation devices include heat sink fins, cooling fans, or heat dissipation protrusions on the housing itself. If heat sink fins are used, the condenser end must fit tightly against the fins, which can be secured with clips or screws. If connected to the housing, the housing must be made of a high thermal conductivity material and designed with a structure that increases the heat dissipation area.

[0057] Miniature heat pipes are mounted on the back of the PCB board using clamps, thermally conductive adhesive, or dedicated mounting brackets. The mounting points avoid the evaporation and condensation ends of the heat pipe to prevent interference with heat transfer and to ensure that the heat pipe does not loosen or shift during equipment vibration or transportation.

[0058] The miniature heat pipe is filled with a working medium, such as pure water or ethanol. When the evaporation end absorbs heat from the metal shell of the interface slot, the medium will quickly evaporate into steam and flow to the condensation end under a small pressure difference. After reaching the condensation end, the steam exchanges heat with the heat dissipation device of the device shell, releases heat and condenses into liquid. The liquid then flows back to the evaporation end through capillary force. This cycle repeats, forming a continuous heat transfer path, which can achieve the transfer of a large amount of heat with low thermal resistance.

[0059] Another embodiment of this utility model provides a wireless access gateway device, the device including a PCB board, an interface slot configured on the PCB board, and a main control chip;

[0060] The gold fingers of the interface slot include a high-speed signal area and a control signal area;

[0061] The high-speed signal zone uses differential strip cabling to carry the incoming optical signals to the main control chip of the wireless access gateway device;

[0062] The control signal area includes at least two sets of custom pins that transmit the accessed wireless scheduling commands to the main control chip.

[0063] In the specific implementation of this embodiment, please refer to Figure 2 This is a schematic diagram of the structure of a wireless access gateway device provided in an embodiment of the present invention. The device includes a PCB board, interface slots configured on the PCB board, and a main control chip;

[0064] By using a PCB board as a carrier, a high degree of integration is achieved, organically connecting the interface slots and the main control chip. Utilizing the partitioned design of the high-speed signal area and control signal area of ​​the interface slot's gold fingers, the classified transmission of optical signals and wireless scheduling commands is realized. Finally, the main control chip completes data processing and wireless access control, forming an efficient and stable wireless access gateway system.

[0065] The board layout needs to optimize signal routing. The differential lines in the high-speed signal area and the pin connections in the control signal area should be routed separately to avoid crosstalk. At the same time, interface slots and mounting pads for the main control chip should be reserved to ensure a firm physical connection between the two.

[0066] The gold fingers are the components that connect the interface slot to the optical module, and they are divided into a high-speed signal area and a control signal area.

[0067] The high-speed signal area employs differential strip cabling, consisting of multiple pairs of parallel differential signal lines. The line width and spacing of each pair of differential lines are strictly designed according to characteristic impedance requirements to ensure impedance matching. This area is responsible for transmitting the electrical signals converted from the optical signals received by the optical modules to the main control chip, supporting high-bandwidth data transmission, such as 10Gbps and above.

[0068] The control signal area contains at least two sets of custom pins, each set corresponding to a specific function. For example, one set is used to transmit wireless channel switching commands, and the other set is used to transmit power control commands. The pins use single-ended wiring, and each set of pins is equipped with an independent ground pin to reduce signal interference and ensure that wireless scheduling commands are accurately transmitted to the main control chip.

[0069] The high-speed signal area uses differential strip cabling, which leverages the anti-interference characteristics of differential signal transmission to ensure that the high-speed data after optical signal conversion can be transmitted to the main control chip with low loss and low bit error rate. The control signal area uses custom pin grouping to achieve independent and accurate transmission of wireless scheduling commands, enabling the main control chip to respond in real time and adjust wireless access parameters. The two work together to meet the dual requirements of the wireless access gateway for high-speed data communication and flexible scheduling control.

[0070] In another embodiment of this utility model, a metal shield of preset thickness is integrated at the bottom of the interface slot and grounded through spring contacts. By utilizing the electromagnetic shielding characteristics of the metal material and the reliable grounding connection, a closed electromagnetic protection space is constructed to block external electromagnetic interference (EMI) from entering the slot and prevent electromagnetic radiation generated by high-speed signals and control signals in the slot from leaking out, thereby ensuring the stability of signal transmission.

[0071] Metal shielding covers can reflect and absorb electromagnetic waves based on the principle of electromagnetic shielding, thus weakening the intensity of external interference signals. Reliable grounding achieved through spring contacts can quickly conduct the interference charges induced on the shielding cover into the ground, preventing charge accumulation and secondary interference, and further enhancing the shielding effect.

[0072] The metal shielding cover is fixed to the bottom of the interface slot by welding, clips, or screws to ensure a firm installation and a seamless fit with the slot, avoiding gaps that could reduce the shielding effect.

[0073] Multiple spring contacts are installed at the edge or specific locations of the metal shielding cover. These contacts are made of a material with excellent conductivity and possess a certain degree of elasticity and flexibility. When the interface slot is installed onto the device motherboard, the spring contacts make tight contact with the grounding pad on the motherboard, forming a reliable electrical connection that connects the metal shielding cover to the device's grounding system.

[0074] It should be noted that the number of spring contacts is determined based on the size of the shield and the grounding requirements. They are generally evenly distributed around the shield to ensure that the charge in each part of the shield can be quickly released through the grounding path.

[0075] In another embodiment of this utility model, the metal shielding cover is a beryllium copper alloy shielding cover.

[0076] The embedded electromagnetic shielding structure integrates a 0.2mm thick beryllium copper alloy shielding cover at the bottom of the slot, which is grounded to the PON module housing through spring contacts, thereby achieving EMI suppression of the plug-in contact surface and reducing radiation by 15dB in the 30MHz-6GHz frequency band.

[0077] The metal shield is box-shaped or cover-shaped, completely covering the bottom and sides of the interface slot (with an opening reserved at the top for inserting the optical module), forming a relatively enclosed space that encloses the high-speed signal area and control signal area of ​​the gold finger, blocking the intrusion of external electromagnetic signals and the leakage of internal signals.

[0078] In another embodiment of this utility model, crosstalk is suppressed in the PCB traces from the SFP+ slot to the main control chip by using a serpentine routing and shielded ground vias.

[0079] In the PCB traces from the SFP+ slot to the main control chip, the length is ≤50mm. For high-speed differential pairs, serpentine routing and shielded ground vias are implemented to suppress crosstalk in the 5GHz band of adjacent wireless RF traces to below -40dB.

[0080] In PCB layout and routing software, a serpentine routing path should be rationally planned along the main transmission path of the high-speed differential pair. The routing should be kept as uniform and smooth as possible, avoiding sharp turns or acute angles to reduce signal reflection and loss.

[0081] The line width and spacing of the serpentine winding should be set according to the characteristic impedance requirements of the high-speed differential pair. Generally, the line width and spacing are kept consistent to ensure the continuity of the characteristic impedance. At the same time, the amplitude and period of the winding, i.e., the height of the serpentine and the distance between two adjacent bends, also need to be reasonably controlled. Usually, the amplitude should not be too large and the period should not be too close to avoid negatively affecting the signal quality.

[0082] Shielded ground vias should be evenly distributed around the high-speed differential pair, especially on the side closest to adjacent radio frequency traces. The vias should be placed as close as possible to the signal lines of the high-speed differential pair to achieve effective shielding.

[0083] The spacing of ground vias needs to be determined based on factors such as signal frequency, number of PCB layers, and shielding requirements. For 5GHz wireless RF signals, the spacing between ground vias can generally be set between 1mm and 3mm to effectively suppress crosstalk.

[0084] The shielding via needs to be reliably connected to the PCB's ground plane to form a continuous shielding layer. This can be achieved by creating a dedicated ground plane on an inner layer of the PCB and connecting the via to the ground plane using a via, or by directly connecting the via to the PCB's surface ground plane.

[0085] It should be noted that, in addition to setting shielded ground vias, a shielding layer can be added above or below the high-speed differential pair to further improve the shielding effect. The shielding layer can be a complete copper foil layer or a grid-like structure composed of multiple ground vias.

[0086] In another embodiment of this utility model, an intelligent power management circuit (IPMC) is developed to monitor the power consumption of the PON module in real time (0.5-3W dynamic range) and adjust the power supply voltage of the wireless PA (5V→3.3V adjustable), thereby improving the overall energy efficiency by 22%.

[0087] Specifically, the IPMC mainly consists of four parts: a power consumption monitoring unit, a core control unit, a voltage regulation unit, and a feedback compensation unit. The power consumption monitoring unit is used to collect the power consumption of the PON module in real time (0.5-3W dynamic range); the core control unit is used to calculate the optimal PA supply voltage based on the monitoring data; the voltage regulation unit is used to dynamically adjust the PA supply voltage from 5V to 3.3V; and the feedback compensation unit is used to ensure the PA performance is stable during the voltage adjustment process.

[0088] The wireless PA voltage regulation unit uses a high-efficiency DC-DC converter, such as the synchronous buck chip MP2307, which supports continuously adjustable input 5V and output 3.3-5V with a conversion efficiency ≥90%; the MCU controls the voltage regulation via PWM signal or I... 2 The C interface controls the feedback network of the DC-DC converter, enabling dynamic adjustment of the output voltage with an adjustment accuracy of ±0.05V.

[0089] The power consumption of a wireless power supply (PA) is proportional to the square of the supply voltage. By reducing the supply voltage when not under full load, the static power consumption of the PA can be significantly reduced.

[0090] In another embodiment of this utility model, a micro heat pipe is integrated on the back of the PCB board, with its evaporation end in close contact with the metal shell of the interface slot and its condensation end connected to the heat dissipation device of the equipment shell. Through the excellent phase change heat transfer capability of the micro heat pipe, the heat generated by the interface slot during operation is quickly conducted out and dissipated, thereby achieving efficient heat dissipation and ensuring the stable operation of the interface and the equipment.

[0091] The evaporation end of the miniature heat pipe is tightly attached to the metal housing of the interface slot using thermally conductive silicone or welding to ensure minimal thermal resistance between the two. The metal housing acts as a heat collection surface, transferring heat generated by the interface slot, including the operation of the optical module and signal transmission, to the evaporation end of the heat pipe through thermal conduction.

[0092] The condenser end connects to the heat dissipation device on the device housing via thermal pads or direct contact. Common heat dissipation devices include heat sink fins, cooling fans, or heat dissipation protrusions on the housing itself. If heat sink fins are used, the condenser end must fit tightly against the fins, which can be secured with clips or screws. If connected to the housing, the housing must be made of a high thermal conductivity material and designed with a structure that increases the heat dissipation area.

[0093] Miniature heat pipes are mounted on the back of the PCB board using clamps, thermally conductive adhesive, or dedicated mounting brackets. The mounting points avoid the evaporation and condensation ends of the heat pipe to prevent interference with heat transfer and to ensure that the heat pipe does not loosen or shift during equipment vibration or transportation.

[0094] The miniature heat pipe is filled with a working medium, such as pure water or ethanol. When the evaporation end absorbs heat from the metal shell of the interface slot, the medium will quickly evaporate into steam and flow to the condensation end under a small pressure difference. After reaching the condensation end, the steam exchanges heat with the heat dissipation device of the device shell, releases heat and condenses into liquid. The liquid then flows back to the evaporation end through capillary force. This cycle repeats, forming a continuous heat transfer path, which can achieve the transfer of a large amount of heat with low thermal resistance.

[0095] In another embodiment of this utility model, the interface slot is mounted on the PCB board using a fixing structure made of glass fiber reinforced LCP (Liquid Crystal Polymer) material. The excellent mechanical properties, thermal stability and electrical insulation of glass fiber reinforced LCP material provide a stable and reliable mounting support for the interface slot. At the same time, it can adapt to environmental changes during equipment operation, such as temperature fluctuations and vibrations, to ensure the stability of the connection between the slot and the PCB board, thereby ensuring the continuity of signal transmission.

[0096] The dielectric constant of the glass fiber reinforced LCP material is ε=2.9, and the insertion and extraction force remains stable at 0.5-1.5N within the range of -40℃ to 85℃, which conforms to the IEC 61754-7 standard.

[0097] After being reinforced with glass fiber, the strength, rigidity and impact resistance of glass fiber reinforced LCP material are significantly improved, and it can withstand the mechanical stress generated when the optical module is inserted and removed from the interface slot. At the same time, the material has an extremely low coefficient of thermal expansion and good high temperature resistance, which can reduce structural deformation caused by temperature changes and prevent the connection between the slot and the PCB board from loosening.

[0098] It should be noted that, for those skilled in the art, several improvements and modifications can be made without departing from the principle of this utility model, and these improvements and modifications are also considered to be within the scope of protection of this utility model.

Claims

1. An interface slot for a wireless access gateway device, characterized in that, The gold fingers of the interface slot include a high-speed signal area and a control signal area; The high-speed signal zone uses differential strip cabling to carry the incoming optical signals to the main control chip of the wireless access gateway device; The control signal area includes at least two sets of custom pins that transmit the accessed wireless scheduling commands to the main control chip.

2. The interface slot of the wireless access gateway device according to claim 1, characterized in that, The bottom of the interface slot is integrated with a metal shield of a preset thickness. The metal shield is grounded via spring contacts.

3. The interface slot of the wireless access gateway device according to claim 1, characterized in that, The interface slot is mounted on the PCB board using a fixing structure made of glass fiber reinforced LCP material.

4. A wireless access gateway device, characterized in that, The device includes a PCB board, interface slots configured on the PCB board, and a main control chip; The gold fingers of the interface slot include a high-speed signal area and a control signal area; The high-speed signal zone uses differential strip cabling to carry the incoming optical signals to the main control chip of the wireless access gateway device; The control signal area includes at least two sets of custom pins that transmit the accessed wireless scheduling commands to the main control chip.

5. A wireless access gateway device according to claim 4, characterized in that, The bottom of the interface slot is integrated with a metal shield of a preset thickness; The metal shield is grounded via spring contacts.

6. A wireless access gateway device according to claim 5, characterized in that, The metal shielding cover is a beryllium copper alloy shielding cover.

7. A wireless access gateway device according to claim 4, characterized in that, The wiring between the slot and the main control chip adopts a serpentine routing, and a shielded ground hole is configured on at least one side of the wiring.

8. A wireless access gateway device according to claim 4, characterized in that, The device also includes a wireless power amplifier and a voltage adjustment module; The voltage adjustment module is used to adjust the power supply voltage of the wireless power amplifier.

9. A wireless access gateway device according to claim 4, characterized in that, The back of the PCB board is integrated with a micro heat pipe; The evaporation end of the micro heat pipe is in close contact with the metal housing of the interface slot, and the condensation end of the micro heat pipe is connected to a heat dissipation device configured on the device housing.

10. A wireless access gateway device according to claim 4, characterized in that, The interface slot is mounted on the PCB board using a fixing structure made of glass fiber reinforced LCP material.

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