A pad and system for heating

Abstract

The application provides a heating cushion and system, which comprises an operation area and a heating area, and the operation area and the heating area are fixedly connected; the operation area comprises a circuit board and an operation interface, and the operation interface and the circuit board are electrically connected; the heating area comprises a heating wire, and the operation interface sends an electric signal to the circuit board to control the temperature of the heating wire to reach a preset ideal temperature. The application does not need to set multiple gears, and by setting the preset ideal temperature, the heating process of the whole heating cushion is more simplified and intelligent. The heating cushion provided by the application has good heating effect and good safety performance.

Description

[0001] This application claims priority to and is based on Chinese Patent Application No. 202520084257.3, filed on January 14, 2025, with the invention title "A Mat and System for Heating," in parts of which are incorporated herein by reference. Technical Field

[0002] This application relates to the field of heated mat technology, and more specifically, to a heated mat and system. Background Technology

[0003] In daily life, people often encounter situations where food, clothing, or other daily necessities become cold or damp, requiring heating or drying. For example, in cold winters, milk needs to be heated, but pouring it into a pot for separate heating is inconvenient; similarly, in damp weather, clothes easily become damp, requiring additional drying; and in colder seasons, food cools down easily over time during meals. Based on these various applications, a heating pad was developed to heat or dry food, clothing, or other daily necessities.

[0004] For example, patent number CN217744141U discloses a flexible food warmer, which includes an electronic control device and a food warmer body. The food warmer body is formed by processing a flexible material. The food warmer body can be laid flat or rolled up for storage. The food warmer body is equipped with an electric heating component, which includes a heating device electrically connected to the electronic control device.

[0005] Patent number US20060241730A1 discloses a heat treatment pad for skin surfaces, and more particularly relates to a low-pressure, high-performance climate control pad for skin surfaces, wherein an air circulation loop is formed on the pad body for arranging heating elements thereon. This provides a uniform heating / cooling treatment surface on the pad body for application to the skin surface.

[0006] However, market research and actual use revealed that existing heating pads are complex to operate, generally have multiple settings, and make it difficult to quickly select the desired working mode. This leads to operational errors by many consumers, resulting in the inability to quickly heat food, clothing, or other daily necessities, leading to poor heating performance, a poor customer experience, and technical issues related to safety. Summary of the Invention

[0007] To address the aforementioned technical issues, this application provides a heating pad, comprising an operating area and a heating area. The operating area includes an upper shell and a lower shell, the upper shell being a shell-like structure with through holes; the lower shell is disposed opposite to the upper shell, and the upper shell and the lower shell are fixedly connected to form an accommodating space; the operating area also includes a circuit board and an operating interface, the circuit board being mounted in the accommodating space; the operating interface is disposed at the through hole of the upper shell, and the operating interface and the circuit board are electrically connected.

[0008] The operating area and the heating area are fixedly connected. The heating area includes a pad body made of flexible material, comprising an upper surface and a lower surface, which are arranged opposite to each other. The heating area includes several support pillars disposed on the lower surface and extending outward from it, with the height of each support pillar greater than the thickness of the pad body. The heating area includes a heating wire mounted on the lower surface; gaps exist between the support pillars, and the heating wire is disposed within these gaps. The operating interface sends electrical signals to the circuit board to control the temperature of the heating wire to reach a preset ideal temperature.

[0009] The heating zone also includes an open mounting groove; the mounting groove is located within the gap; the mounting groove includes a bottom wall, a first side wall, and a second side wall, with the second side wall opposite to the first side wall. The bottom wall, the first side wall, and the second side wall are integrally designed, forming a groove-shaped space; the heating wire is disposed in the groove-shaped space. Within the mounting groove, the distance between the first side wall and the second side wall gradually decreases as it extends from the upper surface to the lower surface.

[0010] In some embodiments of this application, the height of the support column is at least twice the thickness of the mat body. Attached Figure Description

[0011] The accompanying drawings, which are included to provide a further understanding of this application and form part of this application, illustrate exemplary embodiments and their descriptions to explain this application, but do not constitute an undue limitation of this application. Some specific embodiments of this application will be described in detail below with reference to the accompanying drawings in an exemplary and non-limiting manner. The same reference numerals in the drawings designate the same or similar parts or components. It should be understood by those skilled in the art that these drawings are not necessarily drawn to scale, wherein: Figure 1 This is a schematic flowchart of a heating method provided in this application; Figure 2 This is a flowchart of step S2 in one embodiment provided in this application; Figure 3 This is a flowchart of step S2 in another embodiment provided in this application; Figure 4 This is a flowchart illustrating step S3; Figure 5 This is a flowchart of step S5; Figure 6 This is a flowchart of step S6. Figure 7 This is a schematic flowchart of the method for heating. Figure 8 This is a schematic diagram of a heating circuit. Figure 9 This is another schematic diagram of a heating circuit provided in this application; Figure 10 This is a schematic diagram of the processing module provided in this application; Figure 11 This is a schematic diagram of the structure of the processing unit 032 provided in this application; Figure 12 This is a schematic diagram of the structure of the processing unit 032 provided in this application; Figure 13 This is a schematic diagram of the structure of a heating circuit according to another embodiment provided in this application; Figure 14 This is a structural view of the front of a heating pad 001 provided in this application; Figure 15 This is a structural schematic diagram of the back side of a heating pad 001 provided in this application; Figure 16 This is a schematic diagram of the disassembled structure of a heating pad 001 provided in this application; Figure 17 This is a structural schematic diagram of the back of the heating pad 001 of this application; Figure 18 of Figure 17 A partial cross-sectional view of the heating zone 03, taken along line BB. Figure 19 for Figure 17 A partial schematic diagram of the heating pad 001 in region C; Figure 20 This is a schematic diagram of the unfolded state of the heating pad 001 of this application; Figure 21 This is a schematic diagram of the storage state of the heating pad 001 of this application; Figure 22 This is a schematic diagram from another perspective showing the stored state of the heating pad 001 of this application; Figure 23 This is a structural diagram showing the disassembled operating area and heating area in this application; Figure 24This is a structural schematic diagram of the operating area from one perspective in this application; Figure 25 This is a structural schematic diagram of the operating area from another perspective in this application; Figure 26 This is a schematic diagram of the disassembled structure of the operating area in this application; Figure 27 This is a cross-sectional view of the heating zone 03 of a heating pad 001 provided in this application; Figure 28 This is a partial cross-sectional view of the heating area 03 of a heating pad 001 according to this application; Figure 29 This is a partial cross-sectional view of the heating area 03 in another embodiment of this application; Figure 30 This is a schematic diagram of the mounting slot in another embodiment; Figure 31A This is a schematic diagram of the groove-shaped space 376 provided in this application; Figure 31B This is a second schematic diagram of the slotted space 376 provided in this application; Figure 31C This is a third schematic diagram of the slotted space 376 provided in this application; Figure 32 This application provides Figure 20 Sectional view along line EE; Figure 33 This is a schematic diagram of a heating system according to this application. Detailed Implementation

[0012] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0013] It should be noted that all directional indications (such as up, down, left, right, front, back, etc.) in the embodiments of this application are only used to explain the relative positional relationship and movement of each component in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indication will also change accordingly.

[0014] Furthermore, the use of terms such as "first," "second," etc., in this application is for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0015] In this application, unless otherwise expressly specified and limited, the terms "connection," "fixed," etc., should be interpreted broadly. For example, "fixed" can mean a fixed connection, a detachable connection, or an integral part; it can mean a mechanical connection or an electrical connection; it can mean a direct connection or an indirect connection through an intermediate medium; it can mean the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0016] The accompanying drawings appearing in this application are merely illustrative, and the dimensions and shapes involved are only representations of one embodiment and should not be regarded as limiting the scope of protection of the claims.

[0017] Furthermore, the technical solutions of the various embodiments of this application can be combined with each other, but only if they are based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be considered that such combination of technical solutions does not exist and is not within the scope of protection claimed by this application.

[0018] like Figure 1 As shown, Figure 1 This is a schematic flowchart illustrating a heating method provided in this application. It includes: S1. Preset an ideal temperature; S2. Turn on the power so that the circuit reaches the first temperature; S3, trigger the switch to bring the circuit to the second temperature; S4. Determine whether the second temperature and the ideal temperature are the same; S5. When the second temperature is lower than the ideal temperature, the circuit continues to heat up so that the second temperature continues to rise. S6. When the second temperature is greater than or equal to the ideal temperature, heating of the circuit shall be stopped. The first temperature is lower than the second temperature.

[0019] It should be noted that, unless otherwise specified, the designations such as S1, S2, and S3 mentioned above are only for the purpose of making it easier to understand the relationship between the method steps and for the convenience of marking in the diagram, and do not uniquely limit the order of the steps.

[0020] It should be noted that the ideal temperature values ​​can be preset at the factory according to actual needs, and will not be listed here. This application will not limit the specific values ​​of the ideal temperatures.

[0021] In one embodiment of this application, the step of turning on the power in step S2 to make the circuit reach a first temperature is a temperature that is lower than the second temperature, which is a preheating process before reaching the second temperature.

[0022] For example, before heating milk, the operator first needs to reach 30 degrees Celsius. This temperature serves two purposes: first, it signals to the operator that the equipment has started working and further heating can begin; second, it preheats the items to be heated, preventing hazards caused by rapid heating (such as explosions, food spoilage, or burning). For example, in a cold winter, where the room temperature might be 0 degrees Celsius, the first temperature setting could be 40 degrees Celsius, and the second temperature setting could be 100 degrees Celsius.

[0023] In another embodiment of this application, the first temperature can be the temperature at which the device is in standby mode after the power is turned on. This temperature is not specifically set; it could be room temperature or a preheated temperature.

[0024] It should be noted that, in a preferred embodiment of this application, the difference between the first temperature and the second temperature is greater than or equal to 40 degrees Celsius.

[0025] For example, when the first temperature is 40 degrees Celsius, the second temperature is greater than or equal to 80 degrees Celsius; when the first temperature is 50 degrees Celsius, the second temperature is greater than or equal to 90 degrees Celsius.

[0026] In this application, by setting a second temperature and an ideal temperature, the heating process of the entire circuit is simplified and made more intelligent. During the heating process, consumers do not need to adjust various working modes or different speed settings; they can directly use the "one-button heating" method. That is, after triggering the switch, the ideal working temperature is reached and then maintained at a constant temperature. This operation method requires less operation and is less prone to errors.

[0027] like Figure 2 As shown, Figure 2 This is a flowchart of step S2 in one embodiment provided in this application. Step S2 includes: S21. Turn on the power supply to put the circuit into standby mode; S22. Turn on the first switch, detect the change in the resistance value of the circuit, and detect that the circuit has reached the first temperature.

[0028] At this point, step S2 includes two steps. The first step is in standby mode, during which no heating is performed, and the standby temperature is the same as room temperature. In the second step, the first switch is triggered, causing the entire circuit to start heating, but the heating temperature is not high, remaining at a low, constant temperature.

[0029] The "low temperature" mentioned here is relative to the second temperature. Any temperature lower than the second temperature can be called low temperature.

[0030] like Figure 3 As shown, Figure 3 This is a flowchart of step S2 in another embodiment provided in this application. Step S2 includes: S021. Turn on the power supply so that the circuit reaches the first temperature.

[0031] In this embodiment, it means that the heating step is started after the power is turned on, so that the temperature of the circuit reaches the first temperature.

[0032] like Figure 4 As shown, the Figure 4 The flowchart for step S3 includes: S31. Turn on the second switch; S32. Detect the change in the resistance value of the circuit and detect the actual temperature value of the circuit, which is defined as the second temperature.

[0033] like Figure 5 As shown, the Figure 5 This is a flowchart of step S5, which includes: S51. Collect the value of the second temperature; S52. Convert the numerical value of the second temperature to form a second digital signal; S53. Compare the magnitude of the second digital signal with the numerical value of the ideal temperature; S54. When the value of the second digital signal is less than the value of the ideal temperature, the circuit continues to heat up so that the second temperature continues to rise.

[0034] like Figure 6 As shown, the Figure 6 This is a flowchart of step S6, which includes: S61. Collect the value of the second temperature; S62. Convert the numerical value of the second temperature to form a second digital signal; S63. Compare the magnitude of the second digital signal with the numerical value of the ideal temperature; S64. When the value of the second digital signal is greater than or equal to the value of the ideal temperature, the circuit stops heating.

[0035] like Figure 7 As shown, Figure 7 This is a schematic flowchart of the heating method, which further includes: S01, Preset a time threshold; S02. Calculate the heating time of the circuit. When the heating time of the circuit is greater than or equal to the time threshold; S03 then puts the circuit into standby mode or causes the circuit to reach a first temperature.

[0036] It should be noted that the above steps adjust the circuit's operation based on changes in time, determining whether it needs to be put into standby mode or reach a first temperature to achieve energy-saving and environmentally friendly effects. When the circuit is not used for an extended period, it can be put into standby mode or allowed to reach the first temperature to reduce power consumption.

[0037] It should be noted that, in some embodiments, the second temperature mentioned in this application is a value that changes in real time.

[0038] like Figure 8 As shown, Figure 8 This is a schematic diagram of a heating circuit, which includes: Power module 01 is configured to connect to an external power source to bring the circuit to a first temperature; it is also used to trigger a switch to bring the circuit to a second temperature. The heating module 02 is electrically connected to the power module 01, and the power module 01 supplies power to the heating module 02 so that the temperature of the heating module 02 changes. Processing module 03 is configured to preset an ideal temperature and to determine whether the second temperature and the ideal temperature are the same. When the second temperature is less than the ideal temperature, the circuit continues to heat up so that the second temperature continues to rise. When the second temperature is greater than or equal to the ideal temperature, the heating of the circuit is stopped. The first temperature is lower than the second temperature; Circuit board 04, the power module 01 and the processing module 03 are both mounted on the circuit board 04, and the power module 01, the processing module 03 and the heating module 02 are electrically connected to each other.

[0039] It should be noted that, in another embodiment of this application, a circuit board is also provided, the circuit board comprising: The power module is used to trigger the switch so that the circuit reaches the second temperature; The processing module is used to preset the ideal temperature and to determine whether the second temperature and the ideal temperature are the same. When the second temperature is less than the ideal temperature, the circuit continues to heat up so that the second temperature continues to rise. When the second temperature is greater than or equal to the ideal temperature, the heating of the heating wire is stopped. The circuit board, the power module and the processing module are both mounted on the circuit board, and the power module and the processing module are electrically connected to each other; The heating wire is electrically connected to the power module, and the power module supplies power to the heating wire so that the temperature of the heating wire changes.

[0040] It should be noted that the power module here can be a power switch, which can connect to an external power source to supply power to the heating wire. The external power source can be connected to AC power or a battery. The heating module is the heating wire itself, and the processing module can control the heating parameters of the heating wire (switching, time, temperature, etc.). The processing module can be a combination that implements computing functions, such as a combination of one or more microprocessors, a combination of digital signal processing (DSP) and a microprocessor, or a higher-level concept that includes a processor and memory. These will not be listed individually here.

[0041] It should be noted that the circuit board can be at least one of the following: ceramic circuit board, alumina ceramic circuit board, aluminum nitride ceramic circuit board, circuit board, PCB (Printed Circuit Board), aluminum substrate, high frequency board, thick copper board, impedance board, ultra-thin circuit board, ultra-thin circuit board, and printed (copper etching technology) circuit board.

[0042] like Figure 9 As shown, Figure 9 This is a schematic diagram of another circuit for heating provided in this application, which includes: Power module 01 is configured to connect to an external power source to bring the circuit to a first temperature; it is also used to trigger a switch to bring the circuit to a second temperature. The heating module 02 is electrically connected to the power module 01, and the power module 01 supplies power to the heating module 02 so that the temperature of the heating module 02 changes. Processing module 03 is configured to preset an ideal temperature; it is also used to determine whether the second temperature and the ideal temperature are the same; when the second temperature is less than the ideal temperature, the circuit continues to heat up so that the second temperature continues to rise; when the second temperature is greater than or equal to the ideal temperature, the heating of the circuit is stopped. The first temperature is lower than the second temperature; The power supply module 01 and the processing module 03 are both mounted on the circuit board 04, and the power supply module 01, the processing module 03 and the heating module 02 are electrically connected to each other.

[0043] Display module 05, which is electrically connected to power module 01 and processing module 03; display module 05 includes: Indicator unit 051; Drive unit 052 is configured to drive indicator unit 051; Display unit 053, the indicator light unit 051 and the display unit 053 are electrically connected; The indicator light unit 051, the drive unit 052, and the display unit 053 are electrically connected.

[0044] It should be noted that, in one embodiment of this application, the basic principle of the processing module in determining whether the second temperature and the ideal temperature are the same is as follows: In this embodiment, a thermistor, such as an NTC (Negative Temperature Coefficient), is provided. This thermistor exhibits a negative temperature coefficient, meaning its resistance decreases exponentially with increasing temperature. This embodiment also includes a microcontroller unit (MCU), as a specific embodiment of the processing module 03.

[0045] It should be noted that using NTC or MUC does not mean excluding other electronic components with similar functions, especially electronic components such as temperature sensors.

[0046] The discussion continues as follows: The resistance of the NTC changes with the temperature of the heating wire in the heating module. The change in the resistance of the NTC will change the voltage of the MCU detection pin, and then the module conversion circuit will convert the signal into a digital signal, thus forming the digital signal of the second temperature.

[0047] Then, during the process of setting an ideal temperature, there is already a digital signal of the ideal temperature.

[0048] Finally, the magnitudes of the digital signals for the second temperature and the ideal temperature are compared and judged.

[0049] It should be noted that the display module can display information through at least one of acoustic, optical, and visual dimensions. For example, the indicator unit 051 can be one of an LED (light-emitting diode), a fluorescent lamp, or a halogen lamp; in this embodiment, an LED lamp is preferred. The display unit 053 can be at least one of an LED display screen, an LCD display screen, or a LOD display screen. The function of the display module 05 is to display parameters of the heating pad, such as at least one of the following: on / off status, heating time, or heating temperature.

[0050] like Figure 10 As shown, Figure 10 This is a schematic diagram of the processing module provided in this application, which includes: Storage unit 031 is configured to store the ideal temperature; Processing unit 032 is configured to determine whether the second temperature and the ideal temperature are the same; when the second temperature is less than the ideal temperature, the circuit continues to heat up so that the second temperature continues to rise; when the second temperature is greater than or equal to the ideal temperature, the heating of the circuit is stopped. Temperature control unit 033 is electrically connected to the processing unit 032. Temperature control unit 033 is used to receive the numerical values ​​of the first temperature and the second temperature.

[0051] like Figure 11 As shown, Figure 11 This is a schematic diagram of the structure of the processing unit 032 provided in this application, which includes: Acquisition subunit 0321 is configured to acquire the numerical value of the second temperature; The conversion subunit 0322 is configured to convert the numerical value of the second temperature to form a second digital signal; Comparison subunit 0323 is used to compare the magnitude of the second digital signal with the numerical value of the ideal temperature; Heating subunit 0324 is configured to cause the circuit to continue heating when the value of the second digital signal is less than the value of the ideal temperature, so that the second temperature continues to rise.

[0052] like Figure 12 As shown, Figure 12 This is a schematic diagram of the structure of the processing unit 032 provided in this application, which includes: Acquisition subunit 0321 is configured to acquire the numerical value of the second temperature; The conversion subunit 0322 is configured to convert the numerical value of the second temperature to form a second digital signal; Comparison subunit 0323 is configured to compare the magnitude of the second digital signal with the numerical value of the ideal temperature; The heating stop subunit 0325 is configured to stop heating when the value of the second digital signal is greater than or equal to the value of the ideal temperature.

[0053] like Figure 13 As shown, Figure 13 This is a schematic diagram of a heating circuit according to another embodiment of this application, which includes: Preset time module 01 is configured to preset a time threshold; The time calculation module 02 is configured to calculate the heating time of the circuit, when the heating time of the circuit is greater than or equal to the time threshold. The state processing module 03 is configured to put the circuit into a standby state or to make the circuit reach a first temperature.

[0054] It should be noted that the above steps adjust the circuit's operation based on changes in time, determining whether it needs to be put into standby mode or reach a first temperature to achieve energy-saving and environmentally friendly effects. When the circuit is not used for an extended period, it can be put into standby mode or allowed to reach the first temperature to reduce power consumption.

[0055] like Figure 14 , Figure 15 as well as Figure 16 As shown, Figure 14 This is a structural diagram of the front of a heating pad 001 provided in this application. Figure 15 This is a schematic diagram of the back of a heating pad 001 provided in this application. Figure 16 This is a schematic diagram of the disassembled structure of a heating pad 001 provided in this application.

[0056] The heating pad 001 employs any of the heating methods described above. All heating methods and / or heating circuits mentioned in this application can be applied to the heating pad 001; therefore, they will not be elaborated further here. The heating pad 001 includes an operating area 01 and a heating area 03, which are fixedly connected. The fixed connection can be achieved through screw connection, riveting, interference fit, clamping, adhesive bonding, etc. In this application, a screw connection is used to detachably connect the operating area 01 and the heating area 03.

[0057] The heating zone 03 includes a pad body 31, which is made of flexible material. The pad body 31 includes an upper surface 313 and a lower surface 311, which are arranged opposite to each other. The upper surface 313 is a generally flat and smooth surface, which is used to place items to be heated. In actual application scenarios, the items to be heated can be food, clothes, milk, meat to be thawed, etc.

[0058] In this application, the flexible material of the pad body 31 can be silicone, rubber, or other rollable materials, which will not be listed here. Silicone is preferred in this application.

[0059] The heating zone 03 also includes several support columns 33, which are disposed on the lower surface 311 and extend outward from the lower surface 311. The height of the support columns 33 is greater than the thickness of the pad body 31. The support columns 33 and the pad body 31 are an integrated design; in actual production, the support columns 33 and the pad body 31 are formed simultaneously in the mold. It should be noted that the thickness of the pad body 31 is the shortest distance between the upper surface 313 and the lower surface 311, and the height of the support column 33 is the distance between the top of the support column 33 and the lower surface 311.

[0060] It should be noted that the support columns 33 are arranged in an array on the lower surface 311, and there are gaps between different support columns 33. The cross-sectional shape of the support column 33 can be triangular, quadrilateral, pentagonal, hexagonal, heptagonal, octagonal, circular, elliptical and various irregular shapes.

[0061] In actual use, the free end of the support column 33 is usually in contact with the table, that is, the pad body 31 is placed on the table, and then the item to be heated is placed on the upper surface 313.

[0062] In a preferred embodiment of this application, the height of the support column 33 is at least twice the thickness of the pad body 31.

[0063] The heating zone 03 also includes a heating wire 35, which is installed on the lower surface 311; there are gaps between the plurality of support columns 33, and the heating wire 35 is disposed in the gaps, surrounding the support columns 33 to form an "S"-shaped winding state. The heating wire 35 is also made of flexible material.

[0064] It should be noted that in the application scenario of this application, the item to be heated is placed on the upper surface 313, and the lower surface 311 is generally placed on a table. Since the heating wire 35 is close to the lower surface 311, the heat from the heating wire 35 is ultimately transferred to the item to be heated through heat conduction from the mat body 31. However, if the lower surface 311, where the heating wire 35 is close, is too close to the table, it may cause excessively high temperatures that could damage the table or even cause a fire. Therefore, in this application, a support column 33 is provided, and the height of the support column 33 is greater than the thickness of the mat body 31. In the optimal embodiment, the height of the support column 33 is at least twice the thickness of the mat body 31.

[0065] When a consumer places the heating pad 001 on a table, which is typically made of wood or painted material, if the heating pad 001 is not equipped with a support post 33, the lower surface 311 of the heating pad 001 will directly contact the table. In this case, the temperature will be too high, which may burn the wood or char the paint, posing a safety hazard.

[0066] After the support columns 33 are installed, the support columns 33 isolate the lower surface 311 from the desktop. Moreover, the support columns 33 are arranged in an array with different support columns spaced apart to facilitate air circulation and heat dissipation, thus solving the technical problem of potential safety hazards that could burn the desktop.

[0067] In some embodiments of this application, the height of the support column 33 is two, three, four, or five times the thickness of the pad body 31, and generally does not exceed twenty times.

[0068] Please see Figure 17 and Figure 18 As shown, Figure 17 This is a structural schematic diagram of the back side of the heating pad 001 of this application, and a cross-section is taken along line BB to obtain... Figure 18 This application provides a partial cross-sectional view of the heating zone 03. In a preferred embodiment of this application, the height of the support column 33 is approximately five times the thickness of the pad body 31. Figure 17 In the diagram, letter A represents the thickness of the mat body 31, and letter B represents the height of the support column 33.

[0069] Please see Figure 19 As shown, Figure 19 for Figure 17A partial schematic diagram of the heating pad 001 in region C. The support columns 33 in this application can be divided into proximal support columns 331 and distal support columns 335 according to their cross-sectional area and arrangement. Both proximal support columns 331 and distal support columns 335 are located on the lower surface 311 and extend outward from it. The proximal support column 331 is closer to the operating area 01, and the distal support column 335 is farther from the operating area 01. In this application, the support columns 33 and the pad body 31 can be integrally formed or fixedly connected. The fixed connection can be achieved by adhesive bonding, adhesion, snap-fitting, riveting, etc. In this application, the process of integrally forming the support columns 331 and the pad body 31 is selected.

[0070] The cross-sectional area of ​​the proximal support column 331 is larger than that of the distal support column 335, and the heights of the proximal support column 331 and the distal support column 335 are approximately the same. In this application, since the operating area 01 is made of rigid material and the heating area 03 is made of flexible material, in order to prevent a collapse area between the rigid and flexible materials during the transition from rigid to flexible material, the proximal support column 331, which is located near the operating area 01 (rigid material), has a larger cross-sectional area. The proximal support column 331 is more stable, has a stronger load-bearing capacity, and can play a better supporting role, preventing collapse between the operating area 01 and the heating area 03. The distal support column 335, with a smaller cross-sectional area, is used in areas far from the operating area 01. In this application, the heights of the proximal support column 331 and the distal support column 335 are approximately the same, and both serve a supporting function. Because the heights are approximately the same, the upper surface 313 appears relatively flat. When consumers place bowls, plates, cups, or other utensils to be heated on the upper surface 313, the food in the bowls, plates, or cups will not spill out.

[0071] like Figure 19 As shown, the cross-sectional shape of the proximal support column 331 in this application is a cross shape, and the cross-sectional shape of the distal support column 335 is a long strip with a central protrusion. The number of distal support columns 335 is greater than the number of proximal support columns 331. Setting the cross-section of the distal support column 335 to a long strip with a central protrusion facilitates heat dissipation and ventilation between different support columns 33.

[0072] Please see Figure 20 , Figure 20This is a schematic diagram of the unfolded state of the heating pad 001 of this application. The upper surface 313 includes a central region 3131 and an edge region 3133, which together constitute the upper surface 313. The area of ​​the central region 3131 is larger than the area of ​​the edge region 3133, and there is a height difference between the central region 3131 and the edge region 3133, with the central region 3131 being higher than the edge region 3133. The height difference between the central region 3131 and the edge region 3133 is between 0.1 mm and 1 mm. When there is a height difference between the central region 3131 and the edge region 3133, if liquid is spilled on the upper surface 313 of the pad body 31 during use, it can more easily flow from the central region 3131 to the edge region 3133, and will not accumulate on the upper surface 313 for a long time. Simultaneously, the upper surface 313 is divided into a central region 3131 and an edge region 3133, with the central region 3131 designated as the heating area. Therefore, users can be advised to place the food to be heated in the central region 3131 as much as possible to improve heating efficiency. See also... Figure 17 and Figure 20 The heating wire 35 is located on the lower surface 311 area corresponding to the central region 3131.

[0073] Please also refer to Figure 20 , Figure 21 as well as Figure 22 ,in, Figure 21 This is a schematic diagram of the stored state of the heating pad 001 of this application. Figure 22This is a schematic diagram from another perspective of the stored state of the heating pad 001 of this application. The operating area 01 of the heating pad 001 in this application is elongated, specifically, the overall shape of the operating area 01 is a long, narrow racetrack shape, with rounded ends. After the consumer finishes using the heating pad 001, it can be rolled up. During the rolling process, the heating area 03 is rotated around the operating area 01. As the heating area 03 rotates around the operating area 01 repeatedly, the overall shape of the heating pad 001 becomes a roll. The rigid operating area 01 serves as the central axis of the roll, while the flexible heating area 03 wraps around the central axis several times, continuously rolling from the inner layer to the outer layer, ultimately forming a roll. During the outward extension, the distance between the heating areas 03 of different layers is approximately the height of the support column 33. At this point, after the consumer finishes using the heating pad 001, the heating pad 001 is rolled up as described above. Since the heat from the heating pad 001 has not completely dissipated, support columns 33 are provided in this application. This creates gaps between the different heating zones 03 during the rolling process, and the array of different support columns 33 allows for better heat dissipation from the different heating zones 03, reducing safety hazards caused by overheating. In another rolling method, the flexible heating zone 03 can be rolled up first, and the rigid operating area 01 can be rolled up to the outermost layer of the heating zone 03. This provides support and protection for the entire heated pad 001 after rolling, saving space when not in use and preventing it from unraveling and becoming inconvenient to store.

[0074] Please also refer to Figure 23 , Figure 24 as well as Figure 25 , Figure 23 This application presents a structural diagram showing the disassembled operating area and heating area. Figure 24 This diagram shows a structural view of the operating area. Figure 25 A structural schematic diagram of the operating area from another perspective is shown. The operating area 01 includes an upper shell 11, which is a shell-like structure with through holes 111. The shape of the through holes 111 is not specifically limited; it can be elliptical, circular, quadrilateral, triangular, etc. Furthermore, the number of through holes 111 is not specifically limited; it can be a single, relatively large through hole 111, or several through holes 111. In this application, the through holes 111 are configured as several through holes of different shapes, namely quadrilaterals and circles.

[0075] The operating area 01 also includes a lower shell 13, which is disposed opposite to the upper shell 11. The upper shell 11 and the lower shell 13 are fixedly connected to form an accommodating space. The fixed connection between the upper shell 11 and the lower shell 13 can be achieved by snap-fitting, screw connection, adhesive bonding, interference fit, riveting, hinge connection, etc. In this embodiment, the selected connection method is screw connection.

[0076] Please also refer to Figure 20 , Figure 23 , Figure 24 , Figure 25 as well as Figure 26 , Figure 26 This is a disassembled schematic diagram of the operating area 01. The upper shell 11 includes a circumferential sidewall 118 and a top wall 119, which together form the upper shell 11. The lower shell 13 includes a lower peripheral sidewall 138 and a bottom wall 139, which together form the lower shell 13. The top wall 119 and bottom wall 139 are positioned opposite each other, as are the upper shell 11 and lower shell 13. The circumferential sidewall 118 and lower peripheral sidewall 138 together form the peripheral sidewall 1138 of the operating area. The surface of the top wall 119 has an upper recessed area 1191, and the bottom wall 139 has a lower recessed area 1391. The upper and lower recessed areas 1191 communicate to form a receiving through hole 125. The receiving through hole 125 includes an inner wall 1251, and the distance between the inner wall 1251 and the peripheral sidewall 1138 is at least 1 mm. When it is necessary to store the heating pad 001, a rope can be passed through the storage hole 125 to suspend the entire heating pad 001 on the wall, or the heating pad 001 can be rolled into a cylindrical shape using the rope. Furthermore, in daily use, the operator can also pass their fingers through the storage hole 125 to easily carry the heating pad 001.

[0077] It is worth mentioning that during routine cleaning, the heating pad 001 can be vertically suspended using external nails or hooks through the storage hole 125, and then the pad body 31 can be cleaned with tap water. At this time, due to the effect of gravity, the tap water will not flow into the operating area 01 where the storage hole 125 is located, thus preventing tap water or other liquids from entering the operating area 01 and damaging the circuit board 17 inside the operating area 01.

[0078] It should be further noted that in some preferred embodiments, the top wall 119 has an axisymmetric shape, which has an axis of symmetry that passes through the area where the receiving through hole 125 is located.

[0079] In some other preferred embodiments, the top wall 119 has an axis of symmetry, defined as the first axis of symmetry; the receiving hole 125 also has an axis of symmetry, defined as the second axis of symmetry, and the first and second axes of symmetry coincide. In this case, because the first and second axes of symmetry coincide, when the heating pad 001 is suspended through the receiving hole 125, the heating pad 001 will not tilt or swing, but will remain vertically downwards under the influence of gravity, facilitating cleaning and drying.

[0080] In some other preferred embodiments, the peripheral sidewall 1138 includes a side closer to the pad body 31, defined as the inner side; and a side farther from the pad body 31, defined as the outer side; wherein the area where the receiving through hole 125 is located is closer to the outer side.

[0081] It should be noted that both the upper shell 11 and the lower shell 13 are made of rigid materials. Specifically, the rigid material can be at least one of plastic, metal, and carbon fiber.

[0082] Please continue reading. Figure 17 , Figure 23 , Figure 24 , Figure 25 as well as Figure 26 A slot 18 is provided between the upper shell 11 and the lower shell 13. Specifically, a slot 18 is formed on the upper side wall 118 or the lower side wall 138. The overall shape of the slot 18 is elongated, and the pad body 31 enters the receiving space through the slot 18. The height of the slot 18 ranges from 1 mm to 20 mm. The slot 18 is also provided with at least one wiring notch 181, through which the heating wire 35 enters the receiving space.

[0083] It should be noted that the height of the slot 18 is adapted to the thickness of the pad body 31, and the width of the slot 18 is adapted to the width of the pad body 31. The pad body 31, the upper shell 11, and the lower shell 13 are fixedly connected. It should also be noted that the fixed connection can be achieved through one or more methods such as screw connection, riveting, gluing, interference fit, and magnetic attraction. In this application, the pad body 31, the upper shell 11, and the lower shell 13 are connected by screws.

[0084] The pad body 31 has at least two mounting holes 317, the upper shell 11 has at least four upper mounting holes 117, and the lower shell 13 has at least four lower mounting holes 137. When the pad body 31 is inserted into the slot 18, the positions of the upper mounting holes 117, mounting holes 317, and lower mounting holes 137 correspond from top to bottom, allowing the same screw to pass through. In this embodiment, at least one of the upper mounting holes 117, mounting holes 317, and lower mounting holes 137 has an internal thread on its inner wall. Then, an external screw is used to pass through the upper mounting holes 117, mounting holes 317, and lower mounting holes 137 in sequence to achieve a fixed connection between the pad body 31, the upper shell 11, and the lower shell 13.

[0085] Since the height of the slot 18 is compatible with the thickness of the pad body 31, and "compatible" here means that the height of the slot 18 and the thickness of the pad body 31 are approximately the same, when the pad body 31, the upper shell 11, and the lower shell 13 are connected by screws, it can be ensured that, apart from the slot 18 accommodating the pad body 31, the connection between the upper shell 11 and the lower shell 13 at other locations is directly achieved by screws passing through the lower mounting hole 137 and the upper mounting hole 117, so that the upper shell 11 and the lower shell 13 fit together snugly without any cracked areas.

[0086] It should be noted that in some embodiments of this application, the number of lower mounting holes 137 is twice that of mounting holes 317, and the number of upper mounting holes 117 is also twice that of mounting holes 317.

[0087] For example, there are 12 lower mounting holes 137 and 12 upper mounting holes 117, and 6 mounting holes 317.

[0088] Please see Figure 16 24 and Figure 26 The operating area 01 also includes wires (not shown), a circuit board 17, an operating interface 19, and a terminal block 14. The terminal block 14, the circuit board 17, the operating interface 19, and the heating wire 35 are electrically connected by wires.

[0089] In this application, an upper notch 1181 is provided on the upper sidewall 118; a lower notch 1381 is provided on the lower sidewall 138. The upper notch 1181 and the lower notch 1381 are positioned correspondingly and together form a wiring port 141. A wiring terminal 14 is located at the wiring port 141 and is configured to be electrically connected to an external power source.

[0090] In some other preferred embodiments, the peripheral sidewall 1138 includes a side closer to the pad body 31, defined as the inner side; and a side farther from the pad body 31, defined as the outer side; wherein the connection port 141 is located on the outer side.

[0091] In this application, circuit board 17 is mounted in the receiving space. Operating interface 19 is disposed at through hole 111, and is electrically connected to circuit board 17. The shape of operating interface 19 is adapted to the shape of through hole 111. During actual operation, operating interface 19 sends electrical signals to circuit board 17 to control the temperature of heating wire 35 to reach a preset ideal temperature.

[0092] Please see Figure 17 , Figure 23 as well as Figure 25 In actual use, the terminal block 14 is connected to an external power supply, which is then input to the circuit board 17. The circuit board 17 performs various judgments and processes on the input current, ultimately achieving the following functions: heating the heating wire 35, detecting the temperature of the heating wire 35, or controlling the heating time of the heating wire 35, etc. The operation interface 19 sends an electrical signal to the circuit board 17 to control the temperature of the heating wire 35 to reach the preset ideal temperature. In this state, the operator operates on the operation interface 19, inputting the required parameters. After recognizing the input parameters, the operation interface sends an electrical signal to the circuit board 17 to control the temperature of the heating wire 35 to reach the preset ideal temperature.

[0093] In conjunction with the provisions mentioned in this application Figures 1 to 13 The heating method and heating circuit described herein, along with the heating pad 001 in this application, will be used to discuss the operation steps of the heating pad 001. The process by which the operation interface 19 sends an electrical signal to the circuit board 17 to control the temperature of the heating wire 35 to reach the preset ideal temperature is roughly as follows: The operator inserts the power cord plug into terminal 14; The operator operates on the operation interface 19, and the operation interface 19 sends electrical signals to the circuit board 17. The processing module 03 receives the electrical signal and controls the temperature of the heating wire 35 to reach the preset ideal temperature.

[0094] It should be noted that the ideal temperature is a value that can be preset in the heating pad 001 before leaving the factory according to actual needs and stored in the heating pad 001. It will not be listed here, and this application will not limit the specific value range of the ideal temperature.

[0095] In some embodiments of this application, the preset ideal temperature is pre-programmed into the processing module 03. When the operator uses the device, the processing module 03 compares the actual temperature of the heating wire with the preset ideal temperature to determine whether to continue heating or stop heating. For example, if the processing module 03 detects that the actual temperature of the heating wire is lower than the preset ideal temperature, it continues heating; if the processing module 03 detects that the actual temperature of the heating wire is greater than or equal to the preset ideal temperature, it stops heating.

[0096] It is worth mentioning that the solution provided in this application can have multiple pre-approved ideal temperatures, thus corresponding to different heating objects. For example, for milk, the required preset ideal temperature is 50 degrees Celsius; for clothing, the required preset ideal temperature is 60 degrees Celsius; and for cooked food, the required preset ideal temperature is 100 degrees Celsius. Further details are omitted.

[0097] It should be noted that the operation interface 19 can also be at least one of a touch screen or a display screen. When the operation interface 19 is a touch screen, the operator can operate the touch buttons on the touch screen to change parameters such as the working time, working temperature, or on / off status of the heating pad 001. When the operation interface 19 is a display screen, the operation interface 19 is equipped with mechanical buttons, which are used to change parameters such as the working time, working temperature, or on / off status of the heating pad 001.

[0098] The touchscreen can be at least one of capacitive touchscreen, electromagnetic touchscreen, or resistive touchscreen. During use, the operator can touch the touchscreen with their fingers to perform operations on the heating pad, such as turning on the heating pad, adjusting the working temperature, adjusting the working time, and locking the heating pad.

[0099] The display screen can be at least one of LED display screen, LCD display screen, and LOD display screen.

[0100] Please see Figure 16 , 17 20 and Figure 26 In some embodiments of this application, the user interface 19 may further include at least one button 199 and at least one display 198, with the button 199 and the display 198 electrically connected. The display 198 is used to display temperature values, and the button 199 is used to adjust the heating parameters of the heating pad 001. For example, the operator can press the button 199 to change parameters such as the heating time and heating temperature of the heating pad 001. Furthermore, in some embodiments, a protective cover 197 may be provided on the surfaces of the button 199 and the display 198.

[0101] It should be noted that the overall shape of the operating interface 19 and the protective cover 197 are compatible, and the upper shell 11 is provided with an installation area, which allows the protective cover 197 to be installed on the upper shell 11.

[0102] The protective cover 197 can be installed onto the upper shell 11 by at least one of the following methods: adhesive, screw connection, magnetic attraction, or snap-fit. Furthermore, the protective cover 197 is made of a transparent or semi-transparent material, allowing the operator to see the parameters displayed on the buttons 199 and the display 198. The protective cover can be made of at least one of the following materials: glass, plastic, or ceramic.

[0103] In a preferred embodiment, the location of the button 199 corresponding to the protective cover 197 is marked with a corresponding operation prompt, for example: the heating button 199 is marked with "+", and the cooling button 199 is marked with "-".

[0104] In a preferred embodiment, the button 199 may be a capacitive touch button, and the circuit board 17 may include a sensor chip and sensing electrodes 196 corresponding to each button 199. The sensing electrodes 196 may be metal sheets or springs; in this embodiment, they are springs. The sensor chip is configured to sense the electric field signal of the sensing electrodes 196, and the circuit board 17 is used to process the electric field signal.

[0105] It should be noted that the sensor chip can be composed of a microprocessor and analog circuits. When the operator touches the sensing electrode 196 via button 199, the electric field on the sensing electrode 196 changes, and the sensor chip can detect this change in electric field through analog circuits.

[0106] In one embodiment of this application, the circuit board is configured to receive and process signals transmitted by the sensor chip. The circuit board may consist of digital and logic circuits, and touch operation is achieved by processing the electric field change signal generated by the sensing electrode 196. Thus, the button 199 uses touch sensing, eliminating the need for physical pressing; a simple touch triggers the response. Capacitive touch buttons also offer advantages such as waterproofing, durability, and sensitivity.

[0107] In one embodiment of this application, at least one light-emitting element is also provided in the circuit board 17. Specifically, the light-emitting element in this application is an LED lamp, and the position of the LED lamp in the circuit board 17 corresponds to the position of at least one button 199.

[0108] Button 199 includes at least one of the following: power button, unlock button, timer button, heating button, and cooling button. The power button, unlock button, timer button, heating button, and cooling button each have a different pattern, allowing the operator to distinguish the function of each button.

[0109] When the operator uses the device, for example by pressing the heating button with their finger, the heating pad 001 begins to heat up. Simultaneously, the sensor chip is configured to detect changes in the electric field signal of the sensing electrode 196 at the heating button, causing the LED at the heating button to turn on. This LED illuminates the pattern corresponding to the heating button, creating a visual effect that the heating button is lit, alerting the operator that the heating pad 001 has entered the heating stage. At the same time, the processing module in the circuit board 17 controls the heating wire 35 to start heating, causing the temperature of the heating pad 001 to continuously rise.

[0110] In this application, the circuit board 17 serves as the carrier for the heating circuit, and all its functions are implemented through the circuit board 17. The terms "module," "unit," and "subunit" used in this application for the heating circuit refer to separate areas with different functions, artificially defined by this application.

[0111] like Figure 27 As shown, Figure 27 This is a cross-sectional view of the heating zone 03 of a heating pad 001 provided in this application. Figure 28 This is a partial cross-sectional view of the heating area 03 of a heating pad 001 according to this application. Figure 29 This is a partial cross-sectional view of the heating zone 03 according to another embodiment of this application. In another embodiment of this application, the heating zone 03 includes a mounting groove 37 with an opening on the lower surface 311, the opening being away from the upper surface 313; the mounting groove 37 is positioned in the gap between the different support columns 33; the mounting groove 37 includes a bottom wall 371, a first side wall 373, and a second side wall 375, the second side wall 375 being disposed opposite to the first side wall 373; The bottom wall 371, the first side wall 373, and the second side wall 375 are integrated into a single design, forming a groove-shaped space 376; the heating wire 35 is disposed in the groove-shaped space 376.

[0112] It should be noted that the bottom wall 371, the first side wall 373, and the second side wall 375 shown in the accompanying drawings are only one embodiment. In other embodiments, the bottom wall 371, the first side wall 373, or the second side wall 375 may be a curved surface, a plane, an arc surface, a folded surface, or other irregular planes. That is to say, the shape of the bottom wall 371, the first side wall 373, and the second side wall 375 is not specifically limited here, as long as they can form a groove-shaped space 376.

[0113] like Figure 30 As shown, Figure 30This is a schematic diagram of the mounting groove in another embodiment. In another embodiment of this application, the groove-shaped space 376 gradually narrows as it extends from the bottom wall 371 towards the opening. That is, in the mounting groove, as it extends from the bottom wall 371 towards the opening of the groove-shaped space 376, the distance between the first sidewall and the second sidewall gradually decreases. This gradual reduction in the distance between the first and second sidewalls is to better secure the second encapsulation layer 39, the first encapsulation layer 38, and the heating wire 35 within the groove-shaped space 376. During the bending and flattening process of the heating pad 001, it is highly likely that the second encapsulation layer 39, the first encapsulation layer 38, and the heating wire 35 will be squeezed out of the groove-shaped space 376. Therefore, narrowing the groove-shaped space 376 at the opening prevents the second encapsulation layer 39, the first encapsulation layer 38, and the heating wire 35 from being squeezed out of the groove-shaped space 376.

[0114] It should be noted that, throughout the entire process of extending from the bottom wall 371 to the opening of the groove-shaped space 376, the distance between the first side wall 373 and the second side wall 375 can gradually decrease at a certain stage.

[0115] In one embodiment of this application, during the entire process of extending from the bottom wall 371 to the opening of the groove space 376, the distance between the first sidewall 373 and the second sidewall 375 first gradually increases and then gradually decreases.

[0116] like Figure 28 and Figure 29 As shown, in another embodiment of this application, the heating zone 03 further includes an insulating and thermally conductive layer 38 and a potting filler 39. The insulating and thermally conductive layer 38 surrounds the heating wire 35, serving both insulating and thermally conductive functions. The potting filler 39 is poured into the groove-shaped space 376, encapsulating the heating wire 35 and the insulating and thermally conductive layer 38 within the groove-shaped space 376. The height of the first sidewall 373 is approximately the same as the height of the second sidewall 375, while the height of the potting filler 39 is greater than the height of both the first and second sidewalls. The heating wire 35 is made of a heating metal material.

[0117] In the actual processing, the technological steps are as follows: The first step is to place the heating wire 35, which is wrapped with an insulating and heat-conducting layer 38, into the groove-shaped space 376; The second step is to heat the potting filler 39 so that it becomes liquid. The third step is to pour the liquid filler 39 into the trough-shaped space 376; The fourth step is to cool the potting filler 39 so that it becomes solid.

[0118] The insulating and thermally conductive layer 38 can be made of at least one of polyamide ester, polyethylene, and polyvinylidene fluoride. The heating wire 35 can be made of at least one of constantan alloy, zinc-copper alloy, nickel-chromium alloy, or copper-nickel alloy. The temperature of the heating wire 35 changes with its resistance value, thereby converting electrical energy into heat energy to achieve heating.

[0119] The height of the filler 39 is greater than the height of the first sidewall 373 and the second sidewall 375, which means that in the third step above, the filler 39 will overflow the groove-shaped space 376 appropriately. It should be noted that when the filler 39 overflows the groove-shaped space 376 appropriately, the height difference between the filler 39 and the first sidewall 373 does not exceed 3 mm, and the height difference between the filler 39 and the second sidewall 375 does not exceed 3 mm.

[0120] In this embodiment, the glue filler 39 is appropriately overflowed from the groove-shaped space 376 in order to fill the groove-shaped space 376 with as much glue filler 39 as possible. When the heating wire 35 undergoes multiple thermal expansion and contraction processes during operation, the glue filler 39 has good elastic properties, which can minimize the volume change of the heating pad 001 caused by the thermal expansion and contraction process, and prevent the heating pad 001 from becoming wrinkled or uneven.

[0121] It should be noted that you can continue to refer to this. Figure 28 and Figure 29 The heating wire 35 is cylindrical in shape, and its diameter is smaller than the width of the opening. The difference between the diameter of the heating wire 35 and the width of the opening is at least 1 mm. This design allows the heating wire 35 to pass through the opening more easily into the grooved space 376, while also providing more space between the heating wire 35, the first sidewall 373, and the second sidewall 375, allowing more potting filler 39 to be filled into the grooved space 376.

[0122] In the embodiments of this application, the heating wire 35 is fixed by means of glue filler 39. First, the more glue filler 39 there is, the more effectively the odor generated by the heating wire can be prevented from escaping. Second, the more glue filler 39 there is, the more the volume change of the pad 001 used for heating caused by the thermal expansion and contraction of the heating wire 35 can be buffered, preventing wrinkles or unevenness.

[0123] Please refer to the following documents separately. Figure 31A , Figure 31B as well as Figure 31C , Figure 31A This is a schematic diagram of the slotted space 376 provided in this application. Figure 31B This is a second schematic diagram of the slotted space 376 provided in this application. Figure 31C This is a third schematic diagram of the slotted space 376 provided in this application.

[0124] Please refer to Figure 28 and Figure 31A In one embodiment of this application, the grooved space 376 has an opening. As it extends from the bottom wall 371 to the opening of the grooved space 376, the distance between the first sidewall 373 and the second sidewall 375 gradually decreases. The overall shape of the grooved space formed by the bottom wall 371, the first sidewall 373, and the second sidewall 375 is teardrop-shaped. The surface curvature of the first sidewall 373 and the second sidewall 375 changes relatively gently. Therefore, when the heating wire 35 expands and contracts due to heat, the extrusion force F on the potting filler 39 is relatively uniform, and the direction of the extrusion force F is lateral extrusion, so that the heating wire 35 will not easily detach from the grooved space. At the same time, since the direction of the extrusion force F is lateral extrusion, after the extrusion force F is transmitted to the potting filler 39, it will not transmit too much force to the upper surface 313, and will not cause wrinkles or unevenness to occur on the upper surface 313.

[0125] Please refer to Figure 28 and Figure 31B In the second embodiment of this application, the groove-shaped space 376 has an opening, the first sidewall 373 is perpendicular to the lower surface 311, and the second sidewall 375 forms an acute angle with the lower surface 311, extending along the bottom wall 371 towards the opening. The distance between the first sidewall 373 and the second sidewall 375 continuously decreases. In this embodiment, the first sidewall 373 can be used as a reference. The heating wire 35, wrapped with an insulating heat-conducting layer 38, is placed into the groove-shaped space along the first sidewall 373, and then the potting filler 39 is poured in. At the same time, since the angle between the first sidewall 373 and the lower surface 311 is acute, the extrusion force F mainly comes from the second sidewall 375, and the direction of the extrusion force F is downward. Therefore, after the extrusion force F is transmitted to the potting filler 39, it will not transmit too much force to the upper surface 313, and will not cause wrinkles or unevenness on the upper surface 313.

[0126] It should be noted that the angle between the second sidewall 375 and the lower surface 311 is an acute angle. This acute angle is the angle between the plane containing the second sidewall and the plane containing the lower surface, and the range of this angle is 30 degrees to 85 degrees.

[0127] Please refer to Figure 28 and Figure 31CIn the third embodiment of this application, the groove-shaped space 376 has an opening, the first sidewall 373 is perpendicular to the lower surface 311 and extends along the bottom wall 371 towards the opening, and the distance between the first sidewall 373 and the second sidewall 375 continuously decreases. At this time, the second sidewall is a curved wall, and the surface curvature of the second sidewall 375 changes relatively gently. Therefore, when the heating wire 35 expands and contracts due to heat, the extrusion force F on the potting filler 39 is relatively uniform, and the direction of the extrusion force F is the extrusion at the center of the circle corresponding to the curvature, so that the heating wire 35 will not easily detach from the groove-shaped space; at the same time, since the direction of the extrusion force F is the extrusion at the center of the circle corresponding to the curvature, after the extrusion force F is transmitted to the potting filler 39, it will not transmit too much force to the upper surface 313, and will not cause wrinkles or unevenness to occur on the upper surface 313.

[0128] It should be noted that, as Figure 31A , Figure 31B as well as Figure 31C Compared with the existing technology that sets protrusions on the first and second sidewalls respectively, the above-mentioned technical solution of this application can reduce the stress concentration between the first sidewall 373 and the second sidewall 375 during the thermal expansion and contraction of the heating wire 35, so as to prevent the heating pad 001 from becoming uneven or wrinkled. Unevenness or wrinkles can cause food placed on the upper surface 313 to easily tip over and burn the user.

[0129] It should be noted that, in order to solve the stress concentration problem mentioned above, the transition area between the bottom wall 371, the first side wall 373 and the second side wall 375 in this application is treated with rounded corners. Preferably, the first side wall 373 and the second side wall 375 are also treated with rounded corners at the opening of the groove space 376 to reduce the stress concentration that occurs in the groove space 376.

[0130] It should be noted that the first sidewall 373 and the lower surface 311 in this application are perpendicular. Due to the limitations of processing technology and materials, it is impossible for them to be exactly 90 degrees to the left and right. In actual products, the angle between the first sidewall 373 and the lower surface 311 can be considered to be perpendicular as mentioned in this application if it is between 80 and 110 degrees.

[0131] Please see Figure 17 It should also be noted that the layout of the grooved space 376 on the lower surface is not specifically limited. It can be a meandering "S" shape, with the heating wire 35 placed within its meandering trajectory; or it can be a "straight line or broken line" layout.

[0132] In this application, the grooved space 376 may be recessed between the upper surface 313 and the lower surface 311, that is, the grooved space 376 is carved into the pad body 31. In this case, the heating wire 35 is disposed in the grooved space 376, and the heating wire 35 is closer to the upper surface 313, resulting in better heating effect. The grooved space 376 may also protrude outward from the lower surface 311, in which case both the first sidewall 373 and the second sidewall 375 protrude outward from the lower surface 311.

[0133] Please continue reading. Figures 27 to 29 The heating zone 03 also includes a first encapsulation layer 38 and a second encapsulation layer 39. The first encapsulation layer 38 wraps around the heating wire 35, and both the heating wire 35 and the first encapsulation layer 38 are disposed in the groove-shaped space 376. The second encapsulation layer 39 is disposed in the opening of the mounting groove 37, so that the bottom wall 371, the first side wall 373, the second side wall 375, and the second encapsulation layer 39 form a sealed space, in which the first encapsulation layer 38 and the heating wire 35 are disposed.

[0134] It should be noted that in some application scenarios of this application, the material of the first encapsulation layer 38 can be flexible materials such as silicone or rubber; the material of the second encapsulation layer 39 can be flexible materials such as adhesive, silicone, or rubber. The first encapsulation layer 38 and the second encapsulation layer 39 reduce the occurrence of localized overheating within the mat body 31, thereby extending the lifespan of the mat body 31. Simultaneously, the first and second encapsulation layers 38 and 39 ensure that the heating wire 35 does not produce any odor after being energized (or rather, the odor is sealed in), providing consumers with a pleasant dining experience.

[0135] It should be noted that in some embodiments of this application, the lower surface 311 is also provided with reinforcing ribs (not shown). The reinforcing ribs are arranged between different support columns 33, and their height is less than that of the support columns 33. The material of the reinforcing ribs is the same as that of the pad body 31. During use, the heating pad 001 is in a state of thermal expansion and contraction due to the long-term cyclical heating and cooling. Therefore, the pad body 31 is prone to local shrinkage and local expansion, resulting in unevenness of the pad body 31. This affects the use of the heating pad 001. For example, when the pad body 31 is uneven, especially when the upper surface 313 is uneven, it is easy for the food to be heated to spill, causing inconvenience to use.

[0136] Please see Figure 20 , Figure 23 as well as Figure 32 , Figure 32 This application provides Figure 20 A cross-sectional view along line EE.

[0137] As shown in the figure above, the pad body 31 of the heating pad 001 also includes at least one waterproof baffle 315, the height of which ranges from 1 mm to 10 mm, and the thickness of which ranges from 0.5 mm to 5 mm. The waterproof baffle 315 is substantially perpendicular to the upper surface 313.

[0138] The upper shell 11 also includes at least one partition 112 extending downward from the top wall; the partition 112 and the upper side wall 118 are spaced apart, and at least one waterproof groove 114 is formed between the partition 112 and the upper side wall 118; the width of the waterproof groove 114 is adapted to the thickness of the waterproof baffle 315. When the pad body 31 extends into the receiving space through the slot 18, the waterproof baffle 315 is installed in the waterproof groove 114.

[0139] In one embodiment of this application, the pad body 31 of the heating pad 001 includes two waterproof baffles 315. The upper shell 11 includes a partition 112 extending downward from the top wall; the lower shell includes a partition 112 extending upward from the bottom wall 139. At least one waterproof groove 114 is formed between the partition 112 and the lower peripheral side wall 138. The width of the waterproof groove 114 is adapted to the thickness of the waterproof baffle 315. When the pad body 31 extends into the receiving space through the slot 18, the waterproof baffle 315 is installed in the waterproof groove 114.

[0140] In another embodiment of this application, the waterproof baffle 315 has curved areas at both ends and a straight area in the middle. The waterproof groove 114 has curved areas at both ends and a straight area in the middle. The waterproof baffle 315 is installed in the waterproof groove 114.

[0141] During the cleaning process of the heating pad 001, because the waterproof baffle 315 is installed in the waterproof groove 114, water will not easily flow over the waterproof baffle 315 into the circuit board 17, thus improving waterproofing. Furthermore, the curved areas at both ends of the waterproof groove 114 further prevent external water from entering the circuit board 17.

[0142] like Figure 33 As shown, Figure 33 This is a schematic diagram of a heating system according to this application.

[0143] This application may also provide a heating system 100, comprising: the heating pad 200 and a terminal device 300, wherein the terminal device 300 is electrically connected to the heating pad 200 via a wired or wireless means. The heating pad 200 is as described above and will not be repeated here.

[0144] The electrical connection mentioned in this application can be a physical connection made with wires, or a wireless connection made with electrical signals. The electrical signal can be at least one of the following: current signal, voltage signal, resistance signal, Bluetooth signal, WiFi signal, etc. The terminal device 300 can be at least one of a computer, mobile phone, tablet, smartwatch, or smart ring.

[0145] The descriptive terms “approximately,” “about,” and “close to” used in this application mean that the range of variation relative to the standard value can vary within ±20%.

[0146] The term "at least one" as used in this application means that it can refer to one of the possible scenarios or the coexistence of multiple scenarios. For example, "at least one of A, B, and C" includes all possible combinations such as A appearing alone, B appearing alone, C appearing alone, A and B coexisting, and A and C coexisting. These will not be elaborated upon further.

[0147] The above description is merely an embodiment of this application. It should be noted that those skilled in the art can make improvements without departing from the inventive concept of this application, but these improvements all fall within the protection scope of this application.

Claims

1. A heating pad, characterized in that, include: Operation area, the operation area includes: The upper shell is a shell-like structure with through holes; The lower shell is disposed opposite to the upper shell, and the upper shell and the lower shell are fixedly connected to form an accommodating space; A circuit board, which is mounted in the receiving space; The user interface is located at the through hole of the upper shell, and the user interface and the circuit board are electrically connected. The heating zone is fixedly connected to the operating area; the heating zone includes: The mat body is made of a flexible material, and the mat body includes an upper surface and a lower surface, which are disposed opposite to each other; A plurality of support columns are disposed on the lower surface and extend outward from the lower surface, wherein the height of the support columns is greater than the thickness of the mat body; A heating wire is mounted on the lower surface; gaps exist between the plurality of support columns, and the heating wire is disposed in the gaps; The operating interface sends electrical signals to the circuit board to control the temperature of the heating wire to reach a preset ideal temperature.

2. The heating pad as described in claim 1, characterized in that, The height of the support column is at least twice the thickness of the mat body.

3. The heating pad as described in claim 1, characterized in that, The heating zone also includes: A mounting slot having an opening; the mounting slot is positioned within the gap; the mounting slot includes: bottom wall; First sidewall; The second sidewall is disposed opposite to the first sidewall; The bottom wall, the first side wall, and the second side wall are designed as an integrated unit, and the bottom wall, the first side wall, and the second side wall form a groove-shaped space. The heating wire is disposed in the groove-shaped space.

4. The heating pad as described in claim 3, characterized in that, The bottom wall is disposed between the upper surface and the lower surface.

5. The heating pad as described in claim 3, characterized in that, The bottom wall protrudes outward from the lower surface.

6. The heating pad as described in claim 3, characterized in that, The heating zone also includes: A first encapsulation layer is wrapped around the heating wire, and both the heating wire and the first encapsulation layer are disposed in the groove-shaped space; The second encapsulation layer is disposed at the opening of the mounting groove, such that the bottom wall, the first side wall, the second side wall and the second encapsulation layer form a sealed space, and the first encapsulation layer and the heating wire are disposed in the sealed space.

7. The heating pad as described in claim 3, characterized in that, The heating zone also includes: An insulating and thermally conductive layer is wrapped around the heating wire; A potting filler is poured into the groove-shaped space, configured to encapsulate the heating wire and the insulating and thermally conductive layer in the groove-shaped space; The height of the first sidewall is approximately the same as the height of the second sidewall; The height of the potting filler is greater than the height of the first sidewall, and the height of the potting filler is greater than the height of the second sidewall; The heating wire is made of a heating metal.

8. The heating pad as described in claim 6, characterized in that, The heating wire is cylindrical in shape, and the diameter of the heating wire is smaller than the width of the opening. The difference between the diameter and the width is at least 1 millimeter.

9. The heating pad as claimed in claim 6, characterized in that, The groove-shaped space has an opening that extends along the bottom wall toward the opening, and the distance between the first sidewall and the second sidewall gradually decreases.

10. The heating pad as claimed in claim 6, characterized in that, The groove-shaped space has an opening, the first sidewall is perpendicular to the lower surface, the second sidewall forms an acute angle with the lower surface, and extends along the bottom wall toward the opening, with the distance between the first sidewall and the second sidewall continuously decreasing.

11. The heating pad as claimed in claim 1, characterized in that, The upper surface includes: Central area; Edge area; The central region and the edge region together constitute the upper surface. There is a height difference between the central region and the edge region, with the central region being higher than the edge region. The height difference between the central region and the edge region is between 0.1 mm and 1 mm.

12. The heating pad as claimed in claim 1, characterized in that, The circuit board includes: The power module is used to trigger the switch so that the circuit reaches the second temperature; The processing module is used to preset the ideal temperature and to determine whether the second temperature and the ideal temperature are the same. When the second temperature is less than the ideal temperature, the circuit continues to heat up so that the second temperature continues to rise. When the second temperature is greater than or equal to the ideal temperature, the heating of the heating wire is stopped. The circuit board, the power module and the processing module are both mounted on the circuit board, and the power module and the processing module are electrically connected to each other; The heating wire is electrically connected to the power module, and the power module supplies power to the heating wire so that the temperature of the heating wire changes.

13. The heating pad as claimed in claim 12, characterized in that, The circuit board also includes: The display module is electrically connected to the power module and the processing module; The display module includes: Indicator light unit; A driving unit is used to drive the indicator light unit; The display unit is electrically connected to the indicator light unit. The indicator light unit, the drive unit, and the display unit are electrically connected.

14. The heating pad as claimed in claim 1, characterized in that, The operating area is elongated and made of a rigid material, while the heating area is made of a flexible material. The heating area can be flexibly rolled around the operating area, making the overall shape of the mat cylindrical.

15. The heating pad as claimed in claim 1, characterized in that, The support column includes: Proximal support column; Distal support column; Both the proximal support column and the distal support column are disposed on the lower surface and extend outward from the lower surface, wherein the proximal support column is close to the operating area and the distal support column is far from the operating area; The cross-sectional area of ​​the proximal support column is larger than that of the distal support column, and the heights of the proximal support column and the distal support column are approximately the same.

16. The heating pad as claimed in claim 1, characterized in that, The user interface includes at least one of buttons or a display screen.

17. A heating pad, characterized in that, include: Operation area, the operation area includes: The upper shell is a shell-like structure with through holes; The lower shell is disposed opposite to the upper shell, and the upper shell and the lower shell are fixedly connected to form an accommodating space; A circuit board, which is mounted in the receiving space; The user interface is located at the through hole of the upper shell, and the user interface and the circuit board are electrically connected. The heating zone is fixedly connected to the operating area; the heating zone includes: The mat body is made of a flexible material, and the mat body includes an upper surface and a lower surface, which are disposed opposite to each other; A plurality of support columns are disposed on the lower surface and extend outward from the lower surface, wherein the height of the support columns is greater than the thickness of the mat body; A heating wire is mounted on the lower surface; gaps exist between the plurality of support columns, and the heating wire is disposed in the gaps; The upper shell includes: Last week's sidewall; The top wall, the upper side wall, and the top wall together form the upper shell; The lower shell includes: Next week's sidewall; The bottom wall, the lower peripheral side wall, and the bottom wall together form the lower shell; The top wall and the bottom wall are arranged opposite to each other, and the upper shell and the lower shell are arranged opposite to each other; The upper and lower sidewalls together form a circumferential sidewall; The top wall has an upper recessed area, and the bottom wall has a lower recessed area. The upper recessed area and the lower recessed area are connected to form a receiving through hole. The receiving hole includes an inner wall, and the distance between the inner wall and the peripheral sidewall is at least 1 mm.

18. The heating pad as claimed in claim 17, characterized in that, It also includes wires and terminals, wherein the terminals, the circuit board, and the heating wire are electrically connected via the wires; The upper sidewall of the previous week has an upper notch; the lower sidewall has a lower notch, and the upper and lower notches are positioned correspondingly to form a connection port. The terminal block is located at the connection port and is configured to be electrically connected to an external power source.

19. The heating pad as claimed in claim 17, characterized in that, A slot is formed in the upper or lower sidewall. The slot is elongated and the pad body extends into the receiving space through the slot. The height of the slot ranges from 1 mm to 20 mm. The slot also has at least one wiring notch through which the heating wire enters the receiving space.

20. The heating pad as claimed in claim 19, characterized in that, The mat body has at least two mounting holes, the upper shell has at least four upper mounting holes, and the lower shell has at least four lower mounting holes. When the mat body extends into the receiving space through the slot, the positions of the upper mounting holes, the mounting holes, and the lower mounting holes correspond from top to bottom.

21. A heating pad, characterized in that, include: Operation area, the operation area includes: The upper shell is a shell-like structure with through holes; The lower shell is disposed opposite to the upper shell, and the upper shell and the lower shell are fixedly connected to form an accommodating space; A circuit board, which is mounted in the receiving space; The user interface is located at the through hole of the upper shell, and the user interface and the circuit board are electrically connected. The heating zone is fixedly connected to the operating area; the heating zone includes: The mat body is made of a flexible material, and the mat body includes an upper surface and a lower surface, which are disposed opposite to each other; A plurality of support columns are disposed on the lower surface and extend outward from the lower surface, wherein the height of the support columns is greater than the thickness of the mat body; A heating wire is mounted on the lower surface; gaps exist between the plurality of support columns, and the heating wire is disposed in the gaps; The mat body also includes at least one waterproof baffle, the height of which ranges from 1 mm to 10 mm and the thickness of which ranges from 0.5 mm to 5 mm; The lower shell includes: Next week's sidewall; The bottom wall, the lower peripheral side wall, and the bottom wall together form the lower shell; The upper shell includes: Last week's sidewall; The top wall, the upper side wall, and the top wall together form the upper shell; The top wall and the bottom wall are arranged opposite to each other, and the upper shell and the lower shell are arranged opposite to each other; The upper shell also includes at least one partition extending downward from the top wall; The partition and the upper sidewall are spaced apart, and at least one waterproof groove is formed between the partition and the upper sidewall; A slot is formed in the upper or lower sidewall. The slot is elongated in shape. The pad body extends into the receiving space through the slot. The waterproof baffle is installed in the waterproof groove.

22. A system for heating, characterized in that, include: A heating pad, the heating pad comprising: Operation area, the operation area includes: The upper shell is a shell-like structure with through holes; The lower shell is disposed opposite to the upper shell, and the upper shell and the lower shell are fixedly connected to form an accommodating space; A circuit board, which is mounted in the receiving space; The user interface is located at the through hole of the upper shell, and the user interface and the circuit board are electrically connected. The heating zone is fixedly connected to the operating area; the heating zone includes: The mat body is made of a flexible material, and the mat body includes an upper surface and a lower surface, which are disposed opposite to each other; A plurality of support columns are disposed on the lower surface and extend outward from the lower surface, wherein the height of the support columns is greater than the thickness of the mat body; A heating wire is mounted on the lower surface; gaps exist between the plurality of support columns, and the heating wire is disposed in the gaps; The operating interface sends electrical signals to the circuit board to control the temperature of the heating wire to reach the preset ideal temperature. A terminal device that is electrically connected to the heating pad in a wired or wireless manner.

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