Flexible circuit board anti-fault structure, flexible circuit board and electronic device

Abstract

The utility model discloses a kind of flexible circuit board anti-fault structure and flexible circuit board, electronic equipment, wherein, flexible circuit board anti-fault structure includes first conductor circuit layer and second conductor circuit layer;First conductor circuit layer is printed with first insulating layer, and the first insulating layer is equipped with first via hole;Second insulating layer is printed on the first insulating layer with second insulating layer, and the position corresponding to the first via hole of second insulating layer is equipped with second via hole, and the diameter of the second via hole is greater than the diameter of the first via hole;First via hole and second via hole are filled with intermediate conductor;Second conductor circuit layer is printed on the second insulating layer, and the first conductor circuit layer and second conductor circuit layer are electrically connected by the intermediate conductor.The flexible circuit board anti-fault structure disclosed by the utility model effectively solves the incomplete connection of adjacent layers of flexible circuit board circuit or even electrical disconnection, which leads to abnormal circuit conditions, greatly reducing the production failure rate.

Description

Technical Field

[0001] This utility model relates to the field of flexible circuit board technology, and in particular to a flexible circuit board anti-fracture structure, a flexible circuit board, and electronic equipment. Background Technology

[0002] One method for manufacturing flexible circuit boards is the fully additive printing process, which forms circuit patterns by directly printing conductive layers (such as silver nano-inks or carbon pastes) and insulating layers onto a substrate. This process has advantages such as low cost, mass production capability, and high flexibility of the finished product.

[0003] In actual production, the insulating layer typically needs a certain thickness to isolate electromagnetic interference between adjacent circuit layers. The existing printing process involves printing the first conductive layer, then the insulating layer, with vias created in the insulating layer, followed by the printing of the second conductive layer. During the printing of the second conductive layer, conductive ink fills the vias and contacts the first conductive layer to establish an electrical connection between the upper and lower circuit layers. However, because the conductive layer is thinner than the insulating layer, the conductive ink in the vias may not be fully filled during the printing of the second conductive layer, leading to incomplete connections or even electrical disconnections between the upper and lower circuit layers, increasing the defect rate in flexible circuit board production. Utility Model Content

[0004] To solve the above-mentioned technical problems, this utility model provides a flexible circuit board anti-fracture structure, a flexible circuit board, and an electronic device. The flexible circuit board anti-fracture structure includes a first conductor circuit layer and a second conductor circuit layer. A first insulating layer is printed on the first conductor circuit layer, and the first insulating layer is provided with a first via. A second insulating layer is printed on the first insulating layer, and a second via is provided at a position corresponding to the first via on the second insulating layer. The diameter of the second via is larger than the diameter of the first via. The sum of the thicknesses of the first insulating layer and the second insulating layer is 10-40µm. The first and second vias are filled with intermediate conductors; The second conductor circuit layer is printed on the second insulating layer and electrically connects the first conductor circuit layer and the second conductor circuit layer through the intermediate conductor; the thickness of the second conductor circuit layer is 5-6µm.

[0005] Preferably, the thickness of both the first insulating layer and the second insulating layer is 5-20µm.

[0006] Preferably, the thickness of both the first insulating layer and the second insulating layer is 10-15µm.

[0007] Preferably, the difference in diameter between the first via and the second via is 0.15-0.3 mm.

[0008] Preferably, the difference in diameter between the first via and the second via is 0.2 mm.

[0009] Preferably, the diameters of the first and second vias are 0.8-1.2 mm.

[0010] This utility model also provides a multi-layer flexible circuit board anti-fracture structure, including two or more conductor circuit layers, wherein the conductor circuit layers adopt any of the above-described flexible circuit board anti-fracture structures.

[0011] This utility model also provides a flexible circuit board, which adopts the flexible circuit board anti-fracture structure as described above.

[0012] This invention also provides an electronic device that uses the flexible circuit board described above.

[0013] The flexible circuit board anti-fracture structure provided by this utility model involves printing two insulating layers between the first and second conductor circuit layers to form a stepped or flared via structure with a diameter larger than that of the first via. This structure effectively enlarges the via entrance, reduces the resistance to conductive ink filling, and allows the ink to flow in more easily and fully fill the via. Furthermore, by first forming an intermediate conductor within the first via and then printing the second conductor circuit layer on the second insulating layer and the intermediate conductor, the problem of incomplete or even electrically disconnected circuit connections between adjacent layers of the flexible circuit board, leading to circuit abnormalities, can be effectively solved, greatly reducing the production defect rate. Attached Figure Description

[0014] Figure 1 A cross-sectional view of the flexible circuit board anti-fracture structure provided in an embodiment of this utility model; Wherein: 111, first conductor circuit layer; 112, second conductor circuit layer; 121, first insulating layer; 2111, first via; 122, second insulating layer; 1221, second via. Detailed Implementation

[0015] To make the technical means, creative features, objectives and effects of this utility model easier to understand, the present utility model is further described below in conjunction with specific embodiments. However, the following embodiments are merely preferred embodiments of this utility model and not all of them. Other embodiments obtained by those skilled in the art based on the embodiments in the implementation methods without creative effort are all within the protection scope of this utility model. Unless otherwise specified, the experimental methods in the following embodiments are conventional methods. Unless otherwise specified, the materials and reagents used in the following embodiments can be obtained commercially.

[0016] In the description of this utility model, it should be noted that the terms "upper," "lower," "inner," "outer," "front end," "rear end," "both ends," "one end," and "the other end," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. In addition, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0017] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installed," "equipped with," "connected," etc., should be interpreted broadly. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be a connection within two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0018] This utility model provides a flexible circuit board anti-fracture structure, a flexible circuit board, and an electronic device. The flexible circuit board anti-fracture structure includes a first conductor circuit layer 111 and a second conductor circuit layer 112. A first insulating layer 121 is printed on the first conductor circuit layer 111, and the first insulating layer 121 is provided with a first via 1211; A second insulating layer 122 is printed on the first insulating layer 121. A second via 1221 is provided at a position corresponding to the first via 1211 on the second insulating layer 122. The diameter of the second via 1221 is larger than the diameter of the first via 1211. The sum of the thicknesses of the first insulating layer 121 and the second insulating layer 122 is 10-40µm. The first via 1211 and the second via 1221 are filled with intermediate conductors; The second conductor circuit layer 112 is printed on the second insulating layer 122 and is electrically connected to the first conductor circuit layer 111 and the second conductor circuit layer 112 through the intermediate conductor; the thickness of the second conductor circuit layer 112 is 5-6µm.

[0019] In specific implementation, such as Figure 1 As shown, the flexible circuit board anti-fracture structure includes a first conductor circuit layer 111 and a second conductor circuit layer 112; A first insulating layer 121 is printed on the first conductor circuit layer 111, and the first insulating layer 121 is provided with a first via 1211; the thickness of the first conductor circuit layer 111 is set according to actual needs, and the thickness of the first conductor circuit layer 111 can be the same as or different from that of the second conductor circuit layer 112. A second insulating layer 122 is printed on the first insulating layer 121. A second via 1221 is provided at a position corresponding to the first via 1211 on the second insulating layer 122. The diameter of the second via 1221 is larger than the diameter of the first via 1211. The sum of the thicknesses of the first insulating layer 121 and the second insulating layer 122 is 10-40µm. For example, thicknesses including but not limited to 10µm, 15µm, 20µm, 30µm, and 40µm can be used. This thickness range can ensure effective isolation of electromagnetic interference between the upper and lower conductive circuit layers. Intermediate conductors are formed in the first via 1211 and the second via 1221 by filling or printing conductive ink. Preferably, the upper end face of the intermediate conductor is flush with the upper surface of the second insulating layer 122. The second conductor circuit layer 112 is printed on the second insulating layer 122 and is electrically connected to the first conductor circuit layer 111 and the second conductor circuit layer 112 through an intermediate conductor; the thickness of the second conductor circuit layer 112 is 5-6µm. The printing process of each conductor circuit layer and insulating layer in this embodiment is existing technology and will not be described in detail here.

[0020] The flexible circuit board anti-fracture structure provided in this embodiment of the invention involves printing two insulating layers between the first and second conductor circuit layers to form a stepped or flared via structure with a diameter larger than that of the first via. This structure effectively enlarges the via entrance, reduces the resistance to conductive ink filling, and allows the ink to flow in more easily and fully fill the via. Furthermore, by first forming an intermediate conductor within the first via and then printing the second conductor circuit layer on the second insulating layer and the intermediate conductor, the problem of incomplete or even electrically disconnected circuit connections between adjacent layers of the flexible circuit board, leading to circuit abnormalities, can be effectively solved, greatly reducing the production defect rate.

[0021] In specific implementation, the thickness of the first insulating layer 121 and the second insulating layer 122 is 5-20µm, for example, thicknesses including but not limited to 5µm, 10µm, and 15µm can be used; in this embodiment, the thickness of the first insulating layer 121 and the second insulating layer 122 is further limited to 5-20µm; this thickness range ensures that each insulating layer has good flatness and processability during the printing process, avoiding printing defects or via deformation that may be caused by excessive thickness of a single insulating layer; by uniformly distributing the insulating layer thickness, it is beneficial to the formation of vias and the uniform filling of conductive ink, further enhancing the stability of interlayer connection.

[0022] Furthermore, the thickness of both the first insulating layer 121 and the second insulating layer 122 is 10-15µm. In this embodiment, the thickness of the first insulating layer 121 and the second insulating layer 122 is optimized to 10-15µm, for example, thicknesses including but not limited to 10µm, 11µm, 12µm, 13µm, 14µm, and 15µm can be used; this thickness range is the optimal balance point between insulation performance and printing process, providing sufficient insulation strength to resist electromagnetic interference, while ensuring the fluidity and curing effect of the insulating layer during printing, making the via shape more regular, thereby improving the uniformity of conductive ink filling and connection reliability, and reducing the defect rate.

[0023] In specific implementation, the diameter difference between the first via 1211 and the second via 1221 is 0.15-0.3mm. This embodiment limits the diameter difference between the first and second vias to 0.15-0.3mm. For example, diameters including but not limited to 0.15mm, 0.2mm, 0.25mm, and 0.3mm can be used. This difference creates a significant step effect, and controlling the diameter difference ensures that the via structure is both conducive to filling and does not excessively occupy circuit space, maintaining the compactness of the circuit board.

[0024] Furthermore, the diameter difference between the first via 1211 and the second via 1221 is 0.2 mm. This preferred value of 0.2 mm has been verified in production, ensuring smooth filling of the conductive ink while further optimizing connection reliability.

[0025] In specific implementation, the diameters of the first via 1211 and the second via 1221 are 0.8-1.2 mm. The diameters of the first and second vias are limited to 0.8-1.2 mm, and for example, can include, but are not limited to, 0.8 mm, 0.9 mm, 1.0 mm, 1.1 mm, and 1.2 mm. This range covers common via sizes on flexible circuit boards, avoiding filling difficulties caused by excessively small vias and preventing the impact of excessively large vias on circuit pattern density. By reasonably setting the via diameter, the feasibility of conductive ink filling and the flexibility of circuit design are ensured.

[0026] This invention also provides a multilayer flexible circuit board anti-fracture structure, comprising two or more conductor circuit layers, wherein the conductor circuit layers are connected using any of the above-described flexible circuit board anti-fracture structures. In this embodiment, the anti-fracture structure is extended to a multilayer flexible circuit board. By employing any of the above-described anti-fracture structures between each conductor circuit layer, reliable interconnection between multilayer circuits is achieved. This design ensures the integrity of interlayer connections in complex structures, improves the overall performance and yield of the flexible circuit board, and is suitable for high-density integration applications.

[0027] This utility model also provides a flexible circuit board, which adopts the flexible circuit board anti-fracture structure as described above, so that the flexible circuit board has reliable interlayer connection characteristics, which can reduce the problem of poor via filling during the production process, reduce the defect rate, and at the same time maintain the advantages of the flexible circuit board being thin, light and flexible, and is suitable for various flexible electronic devices.

[0028] This invention also provides an electronic device that uses the flexible circuit board described above, which improves the stability and durability of the electronic device and reduces the risk of device failure due to circuit connection failure.

[0029] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A flexible circuit board anti-fracture structure, characterized in that, It includes a first conductor circuit layer (111) and a second conductor circuit layer (112); A first insulating layer (121) is printed on the first conductor circuit layer (111), and the first insulating layer (121) is provided with a first via (1211). A second insulating layer (122) is printed on the first insulating layer (121). The second insulating layer (122) has a second via (1221) at a position corresponding to the first via (1211). The diameter of the second via (1221) is larger than the diameter of the first via (1211). The sum of the thicknesses of the first insulating layer (121) and the second insulating layer (122) is 10-40µm. The first via (1211) and the second via (1221) are filled with an intermediate conductor; The second conductor circuit layer (112) is printed on the second insulating layer (122) and electrically connects the first conductor circuit layer (111) and the second conductor circuit layer (112) through the intermediate conductor; the thickness of the second conductor circuit layer (112) is 5-6µm.

2. The flexible circuit board anti-fracture structure according to claim 1, characterized in that: The thickness of the first insulating layer (121) and the second insulating layer (122) is 5-20µm.

3. The flexible circuit board anti-fracture structure according to claim 2, characterized in that: The thickness of the first insulating layer (121) and the second insulating layer (122) is 10-15µm.

4. The flexible circuit board anti-fracture structure according to any one of claims 1-3, characterized in that: The difference in diameter between the first via (1211) and the second via (1221) is 0.15-0.3 mm.

5. The flexible circuit board anti-fracture structure according to claim 4, characterized in that: The difference in diameter between the first via (1211) and the second via (1221) is 0.2 mm.

6. The flexible circuit board anti-fracture structure according to claim 4, characterized in that: The diameters of the first via (1211) and the second via (1221) are 0.8-1.2 mm.

7. A multilayer flexible circuit board anti-fracture structure, characterized in that: It includes two or more conductor circuit layers, wherein the conductor circuit layers are connected by a flexible circuit board anti-breakage structure as described in any one of claims 1-6.

8. A flexible circuit board, characterized in that: The flexible circuit board anti-fracture structure as described in any one of claims 1-6 is adopted.

9. An electronic device, characterized in that: The flexible circuit board as described in claim 8 is used.

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