A multi-level blind via interconnect structure circuit board capable of targeted heat dissipation

Abstract

This utility model relates to the field of circuit board technology, specifically a multi-level blind via interconnect structure circuit board with targeted heat dissipation. The circuit board body comprises, from bottom to top, a bottom heat dissipation substrate, an intermediate heat dissipation adhesive, an intermediate insulating substrate, and a surface component substrate. The intermediate insulating substrate has two dividing grooves that separate it into a high-heat-generating area, a medium-heat-generating area, and a low-heat-generating area. The intermediate insulating substrate also has multiple buried vias. The bottom rectangular array of the surface component substrate above the high-heat-generating area contains multiple third-order blind vias; the bottom rectangular array of the surface component substrate above the medium-heat-generating area contains multiple second-order blind vias; and the bottom rectangular array of the surface component substrate above the low-heat-generating area contains multiple first-order blind vias. By dividing the high, medium, and low-heat-generating areas through the dividing grooves and matching blind vias and buried vias of different orders and densities, combined with microgrooves to expand the heat diffusion area, the heat dissipation effect is improved.

Description

Technical Field

[0001] This utility model relates to circuit boards, specifically a multi-stage blind via interconnect structure circuit board with targeted heat dissipation, belonging to the field of circuit board technology. Background Technology

[0002] As electronic devices develop towards higher integration and higher power density, the differences in heat density of components on circuit boards are becoming increasingly significant. Power chips (such as IGBTs and CPUs) have high heat flux density and are prone to local heat accumulation, while signal interfaces, passive components, and other areas have low heat flux density.

[0003] However, existing circuit boards mostly use uniformly distributed blind and buried via structures, which do not adapt to the heat dissipation capacity according to the difference in heat density. This results in heat being difficult to dissipate quickly in high-heat areas, while blind and buried via resources are wasted in low-heat areas. The links between bottom-layer heat dissipation, middle-layer heat conduction, and surface-layer heat collection are not effectively connected. Although some designs have heat dissipation components, they are not linked with blind and buried vias, resulting in low overall heat dissipation efficiency. Utility Model Content

[0004] The purpose of this invention is to provide a multi-stage blind via interconnect structure circuit board with targeted heat dissipation in order to solve the above problems. By using partition design, differentiated blind via and buried via configuration, multi-heat dissipation structure collaboration and adjustable auxiliary heat dissipation, it can achieve "heat dissipation on demand" while ensuring installation stability and long-term working reliability.

[0005] This utility model achieves the above-mentioned objective through the following technical solution: a multi-level blind via interconnect structure circuit board with targeted heat dissipation, comprising a circuit board body, wherein the circuit board body is provided with a heat dissipation structure, the circuit board body being divided from bottom to top into a bottom heat dissipation substrate, an intermediate heat dissipation adhesive, an intermediate insulating substrate, and a surface component substrate, the heat dissipation structure including partition grooves, the intermediate insulating substrate being provided with two partition grooves, the two partition grooves dividing the intermediate insulating substrate into a high-heat-generating area, a medium-heat-generating area, and a low-heat-generating area, the intermediate insulating substrate being provided with multiple buried vias, the bottom rectangular array of the surface component substrate above the high-heat-generating area being provided with multiple third-order blind vias, the bottom rectangular array of the surface component substrate above the medium-heat-generating area being provided with multiple second-order blind vias, and the bottom rectangular array of the surface component substrate above the low-heat-generating area being provided with multiple first-order blind vias.

[0006] Preferably, the density of the buried holes in the high-heat zone is greater than that in the medium-heat zone, and the density of the buried holes in the medium-heat zone is greater than that in the low-heat zone.

[0007] Preferably, the density of the third-order blind holes is greater than the density of the second-order blind holes, and the density of the second-order blind holes is greater than the density of the first-order blind holes.

[0008] Preferably, a microgroove is provided around every twenty buried holes arranged in the rectangular array surrounding the high heat generation area. The interior of the microgroove is filled with a second insulating adhesive, the interior of the partition groove is filled with a first insulating adhesive, and the bottom end of the bottom heat dissipation substrate is provided with a grid-like heat dissipation groove.

[0009] Preferably, a mounting frame is installed at the edge of the circuit board body, and a fixing structure is provided on the mounting frame. The mounting frame is installed inside the mounting box through the fixing structure.

[0010] Preferably, the fixing structure includes fixing plates, four fixing plates are fixedly connected to the mounting frame, four fixing posts are fixedly connected inside the mounting box, and screws are rotatably connected to the fixing plates, with the screws threadedly connected to the fixing posts.

[0011] Preferably, the mounting box has an auxiliary structure inside, and heat dissipation windows are provided on both sides of the mounting box. The auxiliary structure includes two slide rails, and the two slide rails are fixedly connected inside the mounting box. Slide sleeves are fixedly connected to the slide rails, and slide brackets are fixedly connected to the two slide sleeves. Two fixing blocks are fixedly connected inside the mounting box, and a first screw is rotatably connected between the two fixing blocks. A threaded seat is threadedly connected to the first screw, and the threaded seat is fixedly connected to the slide bracket. A second screw is rotatably connected to the slide bracket, and a slide seat is threadedly connected to the second screw. A cooling fan is fixedly connected to the slide seat.

[0012] Preferably, a first driving member is fixedly connected to one of the fixed blocks, and the output end of the first driving member is fixedly connected to the first screw.

[0013] Preferably, a second driving member is fixedly connected to the slide, the output end of the second driving member is fixedly connected to the second screw, and two guide rods are fixedly connected to the slide, with the slide block slidably connected to the guide rods.

[0014] The beneficial effects of this utility model are as follows: The circuit board body is divided into a bottom heat dissipation substrate, a middle heat dissipation adhesive, a middle insulating substrate, and a surface component substrate from bottom to top. The middle insulating substrate is provided with two partition grooves, which divide the middle insulating substrate into a high-heat-generating area, a medium-heat-generating area, and a low-heat-generating area. The middle insulating substrate is provided with multiple buried vias. The bottom rectangular array of the surface component substrate above the high-heat-generating area is provided with multiple third-order blind vias. The bottom rectangular array of the surface component substrate above the medium-heat-generating area is provided with multiple second-order blind vias. The bottom rectangular array of the surface component substrate above the low-heat-generating area is provided with multiple first-order blind vias. By dividing the high, medium, and low-heat-generating areas through partition grooves, matching blind vias and buried vias of different orders and densities, and cooperating with microgrooves to expand the heat diffusion area, the heat dissipation effect is improved. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0016] Figure 2 for Figure 1 The diagram shown is an enlarged view of the structure of part A.

[0017] Figure 3 This is a schematic diagram of the connection structure between the fixing block and the first screw of this utility model;

[0018] Figure 4 for Figure 3 The diagram shown is an enlarged view of the structure of section B.

[0019] Figure 5 This is a schematic diagram of the connection structure between the intermediate insulating substrate and the surface element substrate of this utility model.

[0020] Figure 6 for Figure 5 The diagram shown is an enlarged view of the C-section structure.

[0021] Figure 7 This is a schematic diagram of the connection structure between the intermediate insulating substrate and the buried via of this utility model;

[0022] Figure 8 for Figure 7 The diagram shown is an enlarged view of the structure of part D.

[0023] Figure 9 This is a schematic diagram of the connection structure between the intermediate insulating substrate and the first insulating adhesive of this utility model;

[0024] Figure 10 for Figure 9 The diagram shows an enlarged view of the structure of part E.

[0025] In the diagram: 1. Circuit board body; 101. Bottom heat dissipation substrate; 102. Middle heat dissipation adhesive; 103. Middle insulating substrate; 104. Surface component substrate; 2. Heat dissipation structure; 201. Separator groove; 202. First insulating adhesive; 203. High heat generation area; 204. Medium heat generation area; 205. Low heat generation area; 206. Buried via; 207. First-order blind via; 208. Second-order blind via; 209. Third-order blind via; 210. Micro-groove; 211. Second insulating adhesive; 212. Heat dissipation groove; 3. Mounting frame; 4. Fixing structure; 401. Fixing plate; 402. Fixing post; 403. Screw; 5. Mounting box; 6. Heat dissipation window; 7. Auxiliary structure; 701. Slide rail; 702. Slide sleeve; 703. Slide bracket; 704. Fixing block; 705. First screw; 706. First driving component; 707. Threaded seat; 708. Second screw; 709. Slide block; 710. Cooling fan; 711. Guide rod; 712. Second driving component. Detailed Implementation

[0026] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0027] Please see Figures 1-10 As shown, a multi-level blind via interconnect structure circuit board with targeted heat dissipation includes a circuit board body 1, on which a heat dissipation structure 2 is provided. The circuit board body 1 is divided into a bottom heat dissipation substrate 101, an intermediate heat dissipation adhesive 102, an intermediate insulating substrate 103, and a surface component substrate 104 from bottom to top. The heat dissipation structure 2 includes partition grooves 201. The intermediate insulating substrate 103 has two partition grooves 201, which divide the intermediate insulating substrate 103 into a high-heat area 203, a medium-heat area 204, and a low-heat area 205. The intermediate insulating substrate 103 has multiple buried vias 206. The bottom rectangular array of the surface component substrate 104 above the high-heat area 203 has multiple third-order blind vias 209. The bottom rectangular array of the surface component substrate 104 above the medium-heat area 204 has multiple second-order blind vias 208. The surface component substrate 104 above the low-heat area 205 has multiple third-order blind vias 209. The bottom rectangular array of the substrate 104 is provided with multiple first-order blind vias 207; the density of buried vias 206 in the high-heat-generating area 203 is greater than that in the medium-heat-generating area 204, and the density of buried vias 206 in the medium-heat-generating area 204 is greater than that in the low-heat-generating area 205; the density of third-order blind vias 209 is greater than that of second-order blind vias 208, and the density of second-order blind vias 208 is greater than that of first-order blind vias 207; when the components on the surface component substrate 104 are working, the heat generated by the power components in the high-heat-generating area 203 is quickly transferred to the intermediate insulating substrate 103 through the third-order blind vias 209, the heat in the medium-heat-generating area 204 is transferred through the second-order blind vias 208, and the heat in the low-heat-generating area 205 is transferred through the first-order blind vias 207; the heat on the intermediate insulating substrate 103 is conducted to the bottom heat dissipation substrate 101 through the buried vias 206, and the micro-grooves 210 in the high-heat-generating area 203 expand the heat diffusion area and avoid local overheating.

[0028] As a technical optimization of this utility model, a micro-groove 210 is provided around every twenty buried holes 206 arranged in a rectangular array around the high heat generation area 203. The interior of the micro-groove 210 is filled with a second insulating adhesive 211, and the interior of the partition groove 201 is filled with a first insulating adhesive 202. The bottom end of the bottom heat dissipation substrate 101 is provided with a grid-shaped heat dissipation groove 212. The bottom heat dissipation substrate 101 is in full contact with the air through the grid-shaped heat dissipation groove 212 at the bottom end, so as to dissipate heat to the outside.

[0029] As a technical optimization of this utility model, a mounting frame 3 is installed on the edge of the circuit board body 1. The mounting frame 3 is provided with a fixing structure 4. The mounting frame 3 is installed inside the mounting box 5 through the fixing structure 4. The fixing structure 4 includes fixing pieces 401. Four fixing pieces 401 are fixedly connected to the mounting frame 3. Four fixing posts 402 are fixedly connected inside the mounting box 5. Screws 403 are rotatably connected to the fixing pieces 401. The screws 403 are threadedly connected to the fixing posts 402. The mounting frame 3 is placed into the mounting box 5, so that the fixing pieces 401 are aligned with the fixing posts 402. The screws 403 are rotated and screwed into the threaded holes of the fixing posts 402 until the fixing pieces 401 are tightly attached to the fixing posts 402, thus completing the stable installation of the circuit board body 1.

[0030] As a technical optimization of this utility model, the mounting box 5 has an auxiliary structure 7 inside, and heat dissipation windows 6 on both sides of the mounting box 5. The auxiliary structure 7 includes two slide rails 701. The two slide rails 701 are fixedly connected inside the mounting box 5. Slide sleeves 702 are fixedly connected to the slide rails 701. Slide brackets 703 are fixedly connected to the two slide sleeves 702. Two fixing blocks 704 are fixedly connected inside the mounting box 5. A first screw 705 is rotatably connected between the two fixing blocks 704. A threaded seat 707 is threadedly connected to the first screw 705. The threaded seat 707 is fixedly connected to the slide bracket 703. A second screw 708 is rotatably connected to the slide bracket 703. A slide seat 709 is threadedly connected to the second screw 708. A heat dissipation fan 710 is fixedly connected to the slide seat 709. A first driving member 706 is fixedly connected to one of the fixing blocks 704. The output end of the first driving member 706 is fixedly connected to the first screw 705. A second driving member 710 is fixedly connected to the slide bracket 703. The output end of the second driving component 712 is fixedly connected to the second screw 708. Two guide rods 711 are fixedly connected to the slide 703, and the slide seat 709 is slidably connected to the guide rods 711. When the temperature of the circuit board body 1 exceeds the preset threshold, the auxiliary structure 7 is activated. The first driving component 706 (preferably a motor) drives the first screw 705 to rotate, and the threaded seat 707 moves laterally along the first screw 705, driving the slide 703 to cover the lateral area of ​​the circuit board body 1 along the slide rail 701 through the sliding sleeve 702. At the same time, the second driving component 712 (preferably a motor) drives the second screw 708 to rotate, and the slide seat 709 moves longitudinally along the second screw 708 and the guide rods 711, so that the cooling fan 710 can be accurately moved to key areas such as the high heat generation area 203. When the cooling fan 710 is working, it draws in cold air from the outside through the heat dissipation windows 6 on both sides of the mounting box 5 and blows air in a directional manner to dissipate heat from the circuit board body 1 until the temperature of the circuit board body 1 drops to a safe range.

[0031] In use, this invention first stacks, from bottom to top, a bottom heat dissipation substrate 101, an intermediate heat dissipation adhesive 102, an intermediate insulating substrate 103, and a surface component substrate 104. The intermediate heat dissipation adhesive 102 achieves tight bonding of the four-layer structure. Two partition grooves 201 are processed on the intermediate insulating substrate 103 and filled with the first insulating adhesive 202 to form a high-heat area 203, a medium-heat area 204, and a low-heat area 205. Buried vias 206 are processed in the corresponding area of ​​the intermediate insulating substrate 103. The density is highest in the high-heat area 203 and lowest in the low-heat area 205. Microgrooves 210 are processed around every twenty buried vias 206 in the high-heat area 203 and filled with the second insulating adhesive 211. Multi-level blind vias are processed at the bottom of the surface component substrate 104 corresponding to the heat area to form a rectangular array.

[0032] Place the mounting frame 3 into the mounting box 5, align the fixing piece 401 with the fixing post 402, rotate the screw 403 and screw it into the threaded hole of the fixing post 402 until the fixing piece 401 is tightly attached to the fixing post 402, thus completing the stable installation of the circuit board body 1. When the components on the surface component substrate 104 are working, the heat generated by the power components in the high-heat area 203 is quickly transferred to the intermediate insulating substrate 103 through the third-order blind via 209, the heat in the medium-heat area 204 is transferred through the second-order blind via 208, and the heat in the low-heat area 205 is transferred through the first-order blind via 207. The heat on the intermediate insulating substrate 103 is conducted to the bottom heat dissipation substrate 101 through the buried via 206. The micro-grooves 210 of the high-heat area 203 expand the heat diffusion area and avoid local overheating. The bottom heat dissipation substrate 101 is in full contact with the air through the mesh-like heat dissipation grooves 212 at the bottom, dissipating the heat to the outside.

[0033] When the temperature of the circuit board body 1 exceeds a preset threshold, the auxiliary structure 7 is activated. The first driving component 706 (preferably a motor) drives the first screw 705 to rotate, and the threaded seat 707 moves laterally along the first screw 705, driving the slide 703 to cover the lateral area of ​​the circuit board body 1 along the slide rail 701 via the sliding sleeve 702. At the same time, the second driving component 712 (preferably a motor) drives the second screw 708 to rotate, and the slide 709 moves longitudinally along the second screw 708 and the guide rod 711, so that the cooling fan 710 can be precisely moved to key areas such as the high-heat area 203. When the cooling fan 710 is working, it draws in cold air from the outside through the heat dissipation windows 6 on both sides of the mounting box 5 and blows air in a directional manner to dissipate heat from the circuit board body 1 until the temperature of the circuit board body 1 drops to a safe range.

[0034] It will be apparent to those skilled in the art that this invention is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or essential characteristics of this invention. Therefore, the embodiments should be considered illustrative and non-limiting in all respects, and the scope of this invention is defined by the appended claims rather than the foregoing description. Thus, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this invention. No reference numerals in the claims should be construed as limiting the scope of the claims.

[0035] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A multi-stage blind via interconnect structure circuit board with targeted heat dissipation, comprising a circuit board body (1), characterized in that: The circuit board body (1) is provided with a heat dissipation structure (2). The circuit board body (1) is divided into a bottom heat dissipation substrate (101), a middle heat dissipation adhesive (102), a middle insulating substrate (103), and a surface component substrate (104) from bottom to top. The heat dissipation structure (2) includes a partition groove (201). The middle insulating substrate (103) is provided with two partition grooves (201). The two partition grooves (201) divide the middle insulating substrate (103) into a high heat generation area (203) and a medium heat generation area (204). The intermediate insulating substrate (103) has multiple buried vias (206) in the low-heating area (205), multiple third-order blind vias (209) in the bottom rectangular array of the surface element substrate (104) above the high-heating area (203), multiple second-order blind vias (208) in the bottom rectangular array of the surface element substrate (104) above the medium-heating area (204), and multiple first-order blind vias (207) in the bottom rectangular array of the surface element substrate (104) above the low-heating area (205).

2. The multi-stage blind via interconnect structure circuit board with targeted heat dissipation according to claim 1, characterized in that: The density of the buried holes (206) in the high-heat zone (203) is greater than that in the medium-heat zone (204), and the density of the buried holes (206) in the medium-heat zone (204) is greater than that in the low-heat zone (205).

3. The multi-stage blind via interconnect structure circuit board with targeted heat dissipation according to claim 1, characterized in that: The density of the third-order blind hole (209) is greater than the density of the second-order blind hole (208), and the density of the second-order blind hole (208) is greater than the density of the first-order blind hole (207).

4. The multi-stage blind via interconnect structure circuit board with targeted heat dissipation according to claim 1, characterized in that: A micro-groove (210) is provided around every twenty buried holes (206) arranged in a rectangular array around the high heat generation area (203). The interior of the micro-groove (210) is filled with a second insulating adhesive (211). The interior of the partition groove (201) is filled with a first insulating adhesive (202). The bottom end of the bottom heat dissipation substrate (101) is provided with a grid-shaped heat dissipation groove (212).

5. The multi-stage blind via interconnect structure circuit board with targeted heat dissipation according to claim 1, characterized in that: An installation frame (3) is installed on the edge of the circuit board body (1), and a fixing structure (4) is provided on the installation frame (3). The installation frame (3) is installed inside the installation box (5) through the fixing structure (4).

6. The multi-stage blind via interconnect structure circuit board with targeted heat dissipation according to claim 5, characterized in that: The fixing structure (4) includes a fixing plate (401), four fixing plates (401) are fixedly connected to the mounting frame (3), four fixing posts (402) are fixedly connected inside the mounting box (5), and screws (403) are rotatably connected to the fixing plate (401), and the screws (403) are threadedly connected to the fixing posts (402).

7. A multi-stage blind via interconnect structure circuit board with targeted heat dissipation according to claim 5, characterized in that: The mounting box (5) is provided with an auxiliary structure (7) inside. The mounting box (5) is provided with heat dissipation windows (6) on both sides. The auxiliary structure (7) includes two slide rails (701). The mounting box (5) is fixedly connected with two slide rails (701). Slide sleeves (702) are fixedly connected to the slide rails (701). Slide brackets (703) are fixedly connected to the two slide sleeves (702). The mounting box (5) is fixedly connected with two fixing blocks (704). A first screw (705) is rotatably connected between the two fixing blocks (704). A threaded seat (707) is threadedly connected to the first screw (705). The threaded seat (707) is fixedly connected to the slide bracket (703). A second screw (708) is rotatably connected to the slide bracket (703). A slide seat (709) is threadedly connected to the second screw (708). A cooling fan (710) is fixedly connected to the slide seat (709).

8. A multi-stage blind via interconnect structure circuit board with targeted heat dissipation according to claim 7, characterized in that: One of the fixed blocks (704) is fixedly connected to a first driving member (706), and the output end of the first driving member (706) is fixedly connected to a first screw (705).

9. A multi-stage blind via interconnect structure circuit board with targeted heat dissipation according to claim 7, characterized in that: A second driving member (712) is fixedly connected to the slide (703). The output end of the second driving member (712) is fixedly connected to the second screw (708). Two guide rods (711) are fixedly connected to the slide (703). The slide block (709) is slidably connected to the guide rods (711).

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