Circuit board production device

Abstract

The circuit board production device provided by the application comprises a board surface processing assembly, an identification module and a reflow channel; the board surface processing assembly is used for processing at least one of the front surface and the back surface of a circuit board; the identification module is used for detecting whether the circuit board surface processed by the board surface processing assembly is the front surface or the back surface; and the reflow channel is electrically connected with the identification module and is used for reflowing the circuit board to the board surface processing assembly for processing in the case that the detection result of the identification module meets a default condition. Through cooperation of the identification module and the reflow channel, the circuit board can be transmitted back without being processed completely and is continuously processed by the board surface processing assembly, so that two production lines do not need to be separately arranged, the device is more simple, the cost is reduced, and the production efficiency is improved.

Description

Technical Field

[0001] This application belongs to the technical field of circuit board manufacturing, specifically relating to a circuit board manufacturing apparatus. Background Technology

[0002] In the manufacturing process of circuit boards, some circuit boards require processing of at least one of their front and back sides. Related production equipment includes two separate production lines. When processing is required for either the front or back side, one production line is activated; when processing is required for both the front and back sides separately, two production lines are activated to process the front and back sides of the circuit board respectively.

[0003] However, this method leads to a complex production equipment structure, increases floor space and costs, and requires frequent machine switching when processing both the front and back sides, resulting in reduced production efficiency. Utility Model Content

[0004] The purpose of this application is to provide a circuit board manufacturing apparatus that can solve problems such as complex production line structure and low production efficiency.

[0005] To solve the above-mentioned technical problems, this application is implemented as follows:

[0006] This application provides a circuit board manufacturing apparatus, including: a board surface processing component, an identification module, and a return channel;

[0007] The board surface processing component is used to process at least one of the front and back sides of the circuit board;

[0008] The identification module is used to detect whether the circuit board surface processed by the board surface processing component is the front side or the back side;

[0009] The return channel is electrically connected to the identification module and is used to return the circuit board to the board surface processing component for processing when the detection result of the identification module meets the default conditions.

[0010] This embodiment of the application uses an identification module to detect the surface of the circuit board, thereby determining whether the surface being processed by the board surface processing component is the front or the back. Through a return channel in conjunction with the identification module, the circuit board can be returned to the input of the board surface processing component even if processing is incomplete, allowing for further processing to meet production requirements. Compared to related technologies that involve two separate production lines, this embodiment eliminates the need for two separate production lines, using a single shared production line to process the circuit boards. This simplifies the production line, reduces its size and cost, and eliminates the need for frequent machine transfers when processing the front and back of the circuit board separately, thus improving production efficiency. Attached Figure Description

[0011] Figure 1 This is a schematic diagram of the circuit board manufacturing apparatus disclosed in the embodiments of this application.

[0012] Explanation of reference numerals in the attached figures:

[0013] 10-Panel processing assembly; 11-First processing component; 12-Second processing component; 13-Common processing component; 131-Processing path; 14-First translation track; 15-Second translation track;

[0014] 20 - Recognition Module;

[0015] 30 - Return channel;

[0016] 41 - Transfer station; 42 - Receiving station;

[0017] 51-First lifting assembly; 52-Second lifting assembly;

[0018] 60 - Flip-over component. Detailed Implementation

[0019] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0020] The terms "first," "second," etc., used in the specification and claims of this application are used to distinguish similar objects and not to describe a specific order or sequence. It should be understood that such use of data can be interchanged where appropriate so that embodiments of this application can be implemented in orders other than those illustrated or described herein, and the objects distinguished by "first," "second," etc., are generally of the same class and the number of objects is not limited; for example, a first object can be one or more. Furthermore, in the specification and claims, "and / or" indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.

[0021] The embodiments of this application will be described in detail below with reference to the accompanying drawings and specific examples and application scenarios.

[0022] refer to Figure 1 This application discloses a circuit board manufacturing apparatus for processing the circuit board surface of a circuit board. The disclosed circuit board manufacturing apparatus includes a board surface processing component 10, an identification module 20, and a return channel 30.

[0023] The board surface processing component 10 can process the board surface. The board surface processing component 10 can process one of the front and back sides of the board. Of course, it can also process the front and back sides separately, such as processing the front and back sides separately according to a preset order.

[0024] Optionally, the board surface processing component 10 can first process the front side of the circuit board, and then process the back side of the circuit board again to meet the production requirements of the circuit board. Of course, in other embodiments, the board surface processing component 10 can also first process the back side of the circuit board, and then process the front side of the circuit board again.

[0025] The recognition module 20 is used to detect whether the circuit board surface processed by the board surface processing component 10 is the front or the back. Optionally, the recognition module 20 can be a vision recognition module, or it can be other types of recognition modules 20, which are not specifically limited here. For example, the recognition module 20 can be an online camera, and of course, it can be other components, which are not specifically limited here.

[0026] The return channel 30 is electrically connected to the identification module 20 and is used to return the circuit board to the board surface processing component 10 for processing when the detection result of the identification module 20 meets the default conditions.

[0027] Optionally, the default condition can be, for example, recognizing the front or the back.

[0028] In some embodiments, the panel processing assembly 10 may include a first processing component 11, a second processing component 12, and a common processing component 13, wherein the first processing component 11 and the second processing component 12 are arranged side by side, the first processing component 11 is used to process the front side, the second processing component 12 is used to process the back side, and the common processing component 13 is located in the downstream region of the first processing component 11 and the second processing component 12 for processing the front side or the back side.

[0029] Based on the above configuration, the front and back sides of the circuit board can be processed by different processes through the first processing component 11 and the second processing component 12, while the front or back sides can be processed by the same process through the shared processing component 13. In this way, while meeting the process requirements, the structural complexity can be reduced by sharing the process, making the device simpler and also helping to reduce costs.

[0030] For cases where the board surface processing assembly processes the front and back sides of the 10 pairs of circuit boards sequentially, the return channel 30 can return the circuit board to the second processing unit 12 to process the back side once the identification module 20 detects the front side. Based on this, it can be ensured that both the front and back sides of the circuit board can be processed simultaneously and uninterruptedly to meet the production requirements of the circuit board.

[0031] It should be noted that the return channel 30 can be driven by a motor as a power source, and the motor can be directly electrically connected to the identification module 20, or both the motor and the identification module 20 can be electrically connected to the control module to facilitate signal transmission between the motor and the identification module 20.

[0032] In addition, the recognition module 20 or the control module may pre-store a preset front and a preset back as a reference. When the recognition module 20 recognizes the front, it can compare it with the preset front. If the parameters (such as shape, image, etc.) are basically the same, the circuit board surface processed by the first processing unit 11 can be determined to be the front. When the recognition module 20 recognizes the back, it can compare it with the preset back. If the parameters (such as shape, image, etc.) are basically the same, the circuit board surface processed by the second processing unit 12 can be determined to be the back.

[0033] Based on the above settings, the identification module 20 in this embodiment can detect the surface of the circuit board to determine whether the processed circuit board surface is the front or the back. By cooperating with the identification module 20 through the return channel 30, the circuit board can be returned to the input end of the second processing component 12 of the board surface processing component 10 if the processing is not completed, so that the circuit board surface can be processed again by the second processing component 12, thereby realizing the processing of the front and the back respectively to meet the production requirements of the circuit board.

[0034] Compared to the related technologies that use two separate production lines to process the front and back of the circuit board respectively, the embodiments of this application do not require two separate production lines. Instead, a single shared production line is used to process the front and back of the circuit board separately. This makes the production line simpler, reduces its size and cost, and eliminates the need for frequent machine transfers during the production of the front and back sides, thereby improving production efficiency.

[0035] In some embodiments, the circuit board production apparatus may further include a transfer station 41 located in the downstream region of the board surface processing component 10, so that the circuit boards processed by the board surface processing component 10 can be transferred to the transfer station 41 located in the downstream region for transfer.

[0036] The input end of the return channel 30 can be located at the transfer station 41, so that the circuit board can enter the return channel 30 from the transfer station 41 and finally return to the input end of the second processing unit 12 through the return channel 30, so that the circuit board can be processed again by the second processing unit 12.

[0037] For example, after the first processing unit 11 finishes processing the front side of the circuit board, the circuit board is transferred to the transfer station 41. At this time, the transfer station 41 can transfer the circuit board to the return channel 30 so that the circuit board can be returned to the second processing unit 12 through the return channel 30 to process the back side of the circuit board again.

[0038] After the second processing unit 12 finishes processing the reverse side of the circuit board, the circuit board is transferred to the transfer station 41. At this time, the transfer station 41 can directly transfer the circuit board downstream to facilitate subsequent process processing of the circuit board.

[0039] The identification module 20 can be located in the upstream area of ​​the transfer station 41 to detect the front or back of the circuit board before it enters the transfer station 41.

[0040] When the identification module 20 identifies the front side, the circuit board is transferred from the identification module 20 to the downstream transfer station 41. The transfer station 41 then transfers the circuit board to the return channel 30 and returns it to the second processing unit 12 for processing the reverse side again. When the identification module 20 identifies the reverse side, the circuit board is transferred from the identification module 20 to the downstream transfer station 41. The transfer station 41 then continues to transfer the circuit board downstream.

[0041] In other embodiments, the identification module 20 may also be located at the transfer station 41 to detect the front or back of the circuit board when it is transferred to the transfer station 41.

[0042] In some embodiments, at least a portion of the return channel 30 may be located above the board surface processing assembly 10, thereby making full use of the space in the height direction and reducing the floor area occupied by the circuit board production equipment.

[0043] Optionally, the return channel 30 may include an input section, an output section, and an intermediate section. The input section and the output section are located at the two ends of the intermediate section, respectively. The input section and the output section extend along the height direction, while the intermediate section extends along the horizontal direction. The bottom end of the input section is located at the transfer station 41, and the bottom end of the output section is located at the input end of the second processing unit 12.

[0044] In order to transfer the circuit board from the transfer station 41 to the return channel 30, the circuit board production apparatus may also include a first lifting component 51, which is located at the transfer station 41 and is used to lift the circuit board at the transfer station 41 to the input end of the return channel 30, so that the circuit board can be transferred back to the input end of the second processing unit 12 via the return channel 30 for further surface processing.

[0045] Optionally, the first lifting assembly 51 may include a lifting plate and a drive module. The drive module is connected to the lifting plate and is used to drive the lifting plate to move up and down, so as to drive the circuit board to move up and down through the lifting plate. The power source of the drive module may be a motor, cylinder, hydraulic cylinder, etc.

[0046] In some embodiments, the circuit board manufacturing apparatus may further include a receiving station 42 located in the upstream region of the board surface processing assembly 10, with the output end of the return channel 30 located at the receiving station 42. Based on this, the circuit boards returned by the return channel 30 can enter the receiving station 42 and then pass through the receiving station 42 into the second processing component 12 of the board surface processing assembly 10 for processing.

[0047] Optionally, the bottom end of the output section of the return channel 30 can be located at the receiving station 42 to facilitate the return of the circuit board to the receiving station 42. Of course, the receiving station 42 can also be used to receive unprocessed circuit boards.

[0048] In some more specific embodiments, the first processing unit 11 and the second processing unit 12 can be arranged along the lifting direction (i.e., the height direction); correspondingly, the receiving station 42 can extend along the lifting direction to facilitate the transfer of the circuit board to the second processing unit 12.

[0049] Furthermore, the circuit board production apparatus may also include a second lifting assembly 52, which is located at the receiving station 42 and is used to lower the circuit boards that have returned to the receiving station 42 via the return channel 30 to the second processing unit 12. Based on this, the circuit boards can be transferred to the appropriate position according to actual needs for corresponding processing.

[0050] Optionally, the second lifting assembly 52 may include a lifting plate and a drive module. The drive module is connected to the lifting plate and is used to drive the lifting plate to move up and down, so as to drive the circuit board to move up and down through the lifting plate. The power source of the drive module may be a motor, cylinder, hydraulic cylinder, etc.

[0051] In some embodiments, the circuit board production apparatus may further include a flipping assembly 60, which is disposed between the second lifting assembly 52 and the second processing component 12, for flipping the circuit board as the second lifting assembly 52 descends.

[0052] Optionally, the flipping assembly 60 can flip the circuit board from the front to the back, so that the flipped circuit board can be transferred to the second processing unit 12 for processing of the back side.

[0053] It should be noted that after the first processing component 11 processes the front side, the common processing component 13 processes the front side again and transmits it downstream. When the circuit board is transmitted to the identification module 20, the identification module 20 identifies that the circuit board is in the front side state. Then, it can send signals to the first lifting component 51 and the return channel 30 respectively. The first lifting component 51 is activated to lift the circuit board located at the transfer station 41, so that the circuit board enters the return channel 30, and then is transmitted back to the receiving station 42 through the return channel 30. Then, the second lifting component 52 drives the circuit board to descend.

[0054] During the above process, the circuit board is in the front position. If the back side needs to be processed, the circuit board can be flipped from the front to the back by the flipping component 60 so that the back side can be processed by the second processing component 12.

[0055] Optionally, the flipping assembly 60 may include a clamping plate and a rotation drive. The clamping plate can hold the circuit board, and the rotation drive is connected to the clamping plate to drive the clamping plate to flip, so that the circuit board can be flipped 180° through the clamping plate, that is, the circuit board can be flipped from the front to the back.

[0056] In some embodiments, the board surface processing assembly 10 may further include a first translation track 14, which is disposed between the output terminals of the first processing unit 11 and the second processing unit 12 and the input terminal of the common processing unit 13. Based on this, after the first processing unit 11 completes the processing of the front side, the board surface on the front side can be transferred to the input terminal of the common processing unit 13 via the first translation track 14, so that the front side can be processed by the common processing unit 13; after the second processing unit 12 completes the processing of the back side, the board surface on the back side can be transferred to the input terminal of the common processing unit 13 via the first translation track 14, so that the back side can be processed by the common processing unit 13.

[0057] Optionally, the first translation track 14 may extend in the lifting direction to connect to the respective output ends of the first processing unit 11 and the second processing unit 12.

[0058] In some embodiments, the common processing component 13 may include two processing paths 131, which are respectively connected to the first processing component 11 and the second processing component 12. In this way, the front and back sides of the circuit board can be processed by the two processing paths 131 respectively, so as to perform different processes on the front and back sides, ensuring the independence between the front and back side processing and preventing interference between the processing of the front and back sides.

[0059] Furthermore, the board surface processing assembly 10 may also include a second translation track 15, which is respectively connected to the output end of each of the two processing paths 131, so as to receive the board circuit board transmitted from each processing path 131.

[0060] In addition, the board surface processing assembly 10 may also include other processing components to facilitate other processing techniques on the board.

[0061] Optionally, other processing components may be connected to the downstream area of ​​the second translation track 15 to transfer the circuit board to other processing components via the second translation track 15. In addition, other processing components may also be connected to the downstream area of ​​the transfer station 41 to facilitate other processing processes on the circuit board after the front and back sides have been processed.

[0062] The embodiments of this application have been described above with reference to the accompanying drawings. However, this application is not limited to the specific embodiments described above. The specific embodiments described above are merely illustrative and not restrictive. Those skilled in the art can make many other forms under the guidance of this application without departing from the spirit and scope of the claims, and all of these forms are within the protection scope of this application.

Claims

1. A circuit board production apparatus characterized by comprising: include: The board surface processing component (10), the identification module (20), and the return channel (30) are included. The board surface processing component (10) is used to process at least one of the front and back sides of the circuit board; The identification module (20) is used to detect whether the circuit board surface processed by the board surface processing component (10) is the front side or the back side; The return channel (30) is electrically connected to the identification module (20) and is used to return the circuit board to the board surface processing component (10) for processing when the detection result of the identification module (20) meets the default conditions.

2. The circuit board production apparatus according to claim 1, wherein The circuit board production apparatus further includes a transfer station (41), which is located in the downstream area of ​​the board surface processing assembly (10); The identification module (20) is located in the upstream area of ​​the transfer station (41) and is used to detect the front or the back side of the circuit board before it enters the transfer station (41). The input end of the return channel (30) is located at the transfer station (41).

3. The circuit board production apparatus according to claim 2, wherein At least a portion of the return channel (30) is located above the panel processing assembly (10); The circuit board production apparatus further includes a first lifting component (51), which is located at the transfer station (41) and is used to lift the circuit board at the transfer station (41) to the input end of the return channel (30).

4. The circuit board production apparatus according to any one of claims 1 to 3, characterized by The panel processing assembly (10) includes a first processing component (11), a second processing component (12), and a common processing component (13); The first processing component (11) and the second processing component (12) are arranged side by side. The first processing component (11) is used to process the front side, and the second processing component (12) is used to process the back side. The common processing component (13) is located in the downstream region of the first processing component (11) and the second processing component (12) for processing the front or the back.

5. The circuit board production apparatus according to claim 4, wherein The circuit board production apparatus further includes a receiving station (42), which is located in the upstream region of the board surface processing assembly (10); The output end of the return channel (30) is located at the receiving station (42).

6. The circuit board production apparatus according to claim 5, wherein The first processing unit (11) and the second processing unit (12) are arranged along the lifting direction; The circuit board production apparatus further includes a second lifting assembly (52), which is located at the receiving station (42) and is used to lower the circuit board that has been returned to the receiving station (42) via the return channel (30) to the second processing unit (12).

7. The circuit board production apparatus according to claim 6, wherein The circuit board production apparatus further includes a flipping assembly (60), which is disposed between the second lifting assembly (52) and the second processing component (12) for flipping the circuit board as it is lowered by the second lifting assembly (52).

8. The circuit board production apparatus according to claim 4, wherein The panel processing assembly (10) further includes a first translation track (14), which is located between the output ends of the first processing component (11) and the second processing component (12) and the input end of the common processing component (13).

9. The circuit board production apparatus according to claim 4 or 8, wherein The shared processing component (13) includes two processing paths (131) arranged side by side, and the two processing paths (131) are respectively connected to the first processing component (11) and the second processing component (12).

10. The circuit board production apparatus according to claim 1, wherein The identification module (20) is an online camera.

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