Electronic component mounting housing, circuit board for IGBT module, IGBT module assembly, power converter and wind power generator set

Abstract

The utility model provides a kind of electronic component mounting shell, circuit board for IGBT module, IGBT module assembly, converter and wind generating set.The electronic component mounting shell includes hollow frame, hollow frame forms the accommodation cavity for installing electronic component, the side wall of hollow frame is provided with through hole and / or recess that pass through the thickness of side wall, immersion cooling system includes the cooling medium that is in contact with electronic component, through hole or recess can make cooling medium contact with the surface of electronic component;And / or, immersion cooling system includes the phase-change cooling medium that is in contact with electronic component, phase-change cooling medium can be converted into gaseous state by liquid state under certain temperature, through hole and / or recess can make gaseous cooling medium escape.In the side wall of hollow frame, through hole and / or recess are arranged, which can make the cooling medium directly contact with the side surface of electronic component, so that heat exchange between electronic component and cooling medium can be carried out, and heat exchange efficiency can be improved.

Description

Technical Field

[0001] This disclosure relates to the field of wind power generation technology, specifically to an electronic component mounting housing, a circuit board for an IGBT module, an IGBT module assembly, a converter, and a wind turbine generator set. Background Technology

[0002] The converter, through power conversion, enables the generator to output constant-frequency electricity and is a crucial component of wind turbine generator sets, playing a key role in their operation. The power module is the core component of the converter, responsible for power conversion. Because the power module contains numerous semiconductor devices, it generates heat during operation, especially the IGBT module, which is the primary heat-generating element. The cooling effect of the converter has a significant impact on the operating efficiency and stability of the wind turbine generator set. Traditional converters typically use surface-mount water-cooled plates for cooling. While this method is effective in heat dissipation to some extent, water-cooling systems often present problems such as potential leakage risks, complex maintenance requirements, and sensitivity to changes in ambient temperature. Utility Model Content

[0003] The main objective of this application is to provide an electronic component mounting housing, an IGBT module assembly, and an immersion cooling system to solve the cooling and heat dissipation problems of electronic components such as converters in related technologies.

[0004] To achieve the above objectives, a first aspect of this disclosure provides an electronic component mounting housing, comprising a hollow frame forming a receiving cavity for mounting electronic components. The hollow frame has through holes and / or grooves extending through its thickness on its sidewalls. An immersion cooling system includes a cooling medium in contact with the electronic components, the through holes and / or grooves enabling the cooling medium to contact the surface of the electronic components; and / or, the immersion cooling system includes a phase change cooling medium in contact with the electronic components, the phase change cooling medium being able to change from a liquid state to a gaseous state at a certain temperature, the through holes and / or grooves enabling the gaseous cooling medium to escape.

[0005] In some embodiments, the vias or recesses are configured such that the side surfaces of the electronic components can be exposed through the vias and / or recesses.

[0006] In some embodiments, the hollow frame includes a first sidewall and a second sidewall that are opposite to and spaced apart in a first direction, and the first sidewall and / or the second sidewall are provided with at least one through hole and / or groove.

[0007] In some embodiments, the receiving cavity is used to mount an IGBT module. The receiving cavity has a first opening and a second opening disposed opposite to each other. The chip side of the IGBT module can be exposed through the first opening, and the substrate side of the IGBT module can be exposed through the second opening.

[0008] In some embodiments, the hollow frame includes a third sidewall and a fourth sidewall that are distributed opposite to each other along a second direction perpendicular to the first direction, and the third sidewall and the fourth sidewall are respectively provided with a first electrical connection terminal and a second electrical connection terminal.

[0009] In some embodiments, the electronic component mounting housing further includes a third electrical connection terminal disposed on the hollow frame and located on one side of the first opening, for connecting a circuit board.

[0010] In some embodiments, the hollow frame is provided with a plurality of mounting holes, which are located on the outer periphery of the receiving cavity and at the corners of the hollow frame.

[0011] In some embodiments, the hollow frame is made of PP or PC material, and / or the through holes include circular, elliptical, or polygonal shapes.

[0012] A second aspect of this disclosure provides a circuit board for an IGBT module, used in an immersion cooling system. The circuit board is mounted on the chip side of the IGBT module. The circuit board has through holes. The immersion cooling system includes a cooling medium in contact with the IGBT module. The through holes allow the cooling medium to contact the surface of the IGBT module. And / or, the immersion cooling system includes a phase change cooling medium in contact with the IGBT module. The phase change cooling medium can change from a liquid state to a gaseous state at a certain temperature. The through holes allow the gaseous cooling medium to escape.

[0013] In some embodiments, the circuit board is an adapter board, and the through holes include circular, elliptical, or polygonal shapes.

[0014] A third aspect of this disclosure provides an IGBT module assembly, which includes an electronic component mounting housing as described in any of the first aspects of this disclosure, and an IGBT module. The IGBT module includes an IGBT chip, which is mounted in a receiving cavity of the electronic component mounting housing.

[0015] Furthermore, the IGBT module assembly also includes a circuit board for the IGBT module as described in any of the second aspect embodiments of this disclosure, the circuit board being mounted on the chip side of the IGBT module.

[0016] In some embodiments, the IGBT module assembly further includes a support substrate on which the IGBT module is disposed; and / or, there is a gap between the circuit board and the electronic component mounting housing.

[0017] A fourth aspect of this disclosure provides a converter that includes an electronic component mounting housing as described in any of the first aspect embodiments of this disclosure, and / or a converter that includes a circuit board for an IGBT module as described in any of the second aspect embodiments of this disclosure, and / or a converter that includes an IGBT module assembly as described in any of the third aspect embodiments of this disclosure.

[0018] A fifth aspect of this disclosure provides a wind turbine generator set, which includes a tower, a nacelle mounted on the tower, a hub mounted on one side of the nacelle, and a converter as described in the fourth aspect of this disclosure.

[0019] The electronic component mounting housing provided in this embodiment includes a hollow frame. Through holes or grooves are provided on the side walls of the hollow frame, allowing the cooling medium to directly contact the side surface of the electronic component. This enables heat exchange between the electronic component and the cooling medium, improving heat exchange efficiency and preventing the electronic component from overheating. In addition, when the electronic component is too hot and the cooling medium vaporizes, the gaseous cooling medium can also escape through the through holes or grooves, allowing the liquid cooling medium to be replenished around the electronic component in a timely manner. The cooling medium around the electronic component flows and exchanges, improving heat exchange efficiency and preventing the electronic component from overheating.

[0020] The circuit board for an IGBT module provided in this embodiment has through holes, allowing the cooling medium to pass through the circuit board and directly contact the chip side of the IGBT module located on the other side of the circuit board. This enables heat exchange between the chip side of the IGBT module and the cooling medium, improving heat exchange efficiency and preventing the chip side temperature of the IGBT module from becoming too high. In addition, if the cooling medium vaporizes due to the high temperature of the IGBT module chip side, the gaseous cooling medium can also escape through the through holes, allowing the liquid cooling medium to be replenished to the chip side of the IGBT module in a timely manner. The cooling medium on the chip side of the IGBT module flows and exchanges, improving heat exchange efficiency and preventing the chip side temperature of the IGBT module from becoming too high. Attached Figure Description

[0021] The above and other objects and features of the present invention will become clearer from the following description, taken in conjunction with the accompanying drawings, which exemplarily illustrate an example, wherein: Figure 1 This is a schematic diagram of a structure of an electronic component mounting housing according to an embodiment of this application; Figure 2 This is another structural schematic diagram of an electronic component mounting housing according to an embodiment of this application; Figure 3This is a schematic diagram of the structure of a circuit board for an IGBT module according to an embodiment of this application; Figure 4 This is a schematic diagram of the structure of an IGBT module assembly according to an embodiment of this application; Figure 5 This is a schematic diagram of the assembly structure of a support substrate and an electronic component mounting housing according to an embodiment of this application; Figure 6 This is a schematic diagram of the assembly structure of the housing and the supporting substrate according to an embodiment of this application.

[0022] Explanation of icon numbers: 10 Electronic component mounting housing, 110 Hollow frame, 111 First sidewall, 112 Second sidewall, 113 Third sidewall, 114 Fourth sidewall, 120 Receiving cavity, 131 Through hole, 132 Recess, 141 First electrical connection terminal, 142 Second electrical connection terminal, 150 Third electrical connection terminal, 160 Mounting hole, 20 Circuit board, 210 Through hole, 30 IGBT module assembly, 40 Housing, 50 Support substrate, 510 Connecting part, 520 First connecting hole, 530 Second connecting hole, 60 IGBT module. Detailed Implementation

[0023] The following detailed embodiments are provided to aid the reader in gaining a comprehensive understanding of the methods, apparatus, and / or systems described herein. However, various changes, modifications, and equivalents of the methods, apparatus, and / or systems described herein will become apparent upon understanding this disclosure. For example, the order of operations described herein is merely illustrative and is not limited to those orders set forth herein, but may be changed as will become clear upon understanding this disclosure, except for operations that must occur in a specific order. Furthermore, for clarity and conciseness, descriptions of features known in the art may be omitted.

[0024] The features described herein may be implemented in different forms and should not be construed as limited to the examples described herein. Rather, the examples described herein are provided only to illustrate some of the many feasible ways of implementing the methods, apparatus and / or systems described herein, many of which will become clear upon understanding the disclosure of this application.

[0025] Although terms such as “first” and “second” may be used herein to describe various components, assemblies, regions, layers, or parts, these components, assemblies, regions, layers, or parts should not be limited by these terms. Rather, these terms are used only to distinguish one component, assembly, region, layer, or part from another. Therefore, without departing from the teaching of the examples described herein, the first component, first assembly, first region, first layer, or first part referred to as the first component, first assembly, first region, first layer, or first part may also be referred to as the second component, second assembly, second region, second layer, or second part.

[0026] In the specification, when an element such as a layer, region, or substrate is described as being "on" another element, "connected to," or "bonded to" another element, the element may be directly "on" another element, directly "connected to," or "bonded to" the other element, or one or more other elements may be present in between. Conversely, when an element is described as being "directly on" another element, "directly connected to," or "directly bonded to" another element, no other elements may be present in between.

[0027] The terminology used herein is for the purpose of describing various examples only and is not intended to limit disclosure. Unless the context clearly indicates otherwise, the singular form is intended to include the plural form as well. The terms “comprising,” “including,” and “having” indicate the presence of the described features, quantities, operations, components, elements, and / or combinations thereof, but do not preclude the presence or addition of one or more other features, quantities, operations, components, elements, and / or combinations thereof. The term “a plurality” represents any quantity of two or more.

[0028] The directional terms such as "upper," "lower," "top," and "bottom" used in this application are all based on the orientation of the product when it is in normal use.

[0029] Unless otherwise defined, all terms used herein, including technical and scientific terms, shall have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains after understanding the invention. Unless expressly defined herein, terms such as those defined in a general dictionary shall be interpreted as having a meaning consistent with their meaning in the context of the relevant field and in this invention, and shall not be interpreted in an idealized or overly formalistic manner.

[0030] Furthermore, in the description of the examples, detailed descriptions of well-known related structures or functions will be omitted when it is believed that such detailed descriptions would lead to a vague interpretation of the present invention.

[0031] With the development of wind power generation technology, the power density and heat flux density of converters have significantly increased. Traditional air-cooling or water-cooling methods may suffer from insufficient heat dissipation efficiency in high-power-density applications. This application introduces phase change evaporative cooling technology, employing an immersion cooling system. The power modules of the converter are housed within a casing, and a cooling medium is placed within the casing, allowing the cooling medium to directly contact the electronic components of the converter. This immersion phase change method removes heat from the converter, thereby improving its heat dissipation efficiency and ensuring stable operation at high power densities. Evaporative cooling is a technology or process that utilizes the endothermic effect of liquid evaporation to lower the temperature. When a liquid (cooling medium) evaporates, it needs to absorb heat from the surrounding environment to overcome the binding forces between liquid molecules, thus transforming into a gaseous state. This process leads to a decrease in the temperature of the surrounding environment because the heat required for liquid evaporation is extracted from the surrounding environment.

[0032] The heat-generating components in a converter mainly include IGBT modules and various semiconductor electronic components such as diodes. During the cooling process using a phase-change cooling medium, the contact area between the cooling medium and the electronic components directly affects the cooling efficiency. Therefore, according to embodiments of this application, in order to maximize the contact between the heat-generating components and the cooling medium and improve heat dissipation efficiency when applying phase-change evaporative cooling technology, this application provides an electronic component mounting housing 10 for mounting electronic components within the enclosure of an immersion cooling system.

[0033] The following will combine Figures 1 to 4 This invention introduces an electronic component mounting housing 10, a circuit board 20 for an IGBT module, an IGBT module assembly 30, a converter, and a wind turbine generator set, all provided by embodiments of the present invention.

[0034] like Figure 1 and Figure 2 As shown, a first aspect of this disclosure provides an electronic component mounting housing 10 for use in an immersion cooling system. An immersion cooling system is a highly efficient heat dissipation solution that directly immerses heat-generating devices in a non-conductive, highly thermally conductive cooling medium, utilizing the convection, conduction, or phase change of the liquid to remove heat. Compared to traditional air cooling or plate-type water cooling, it can control temperature more uniformly, and is particularly suitable for high-density, high-power heat-generating scenarios.

[0035] Furthermore, the electronic component mounting housing 10 includes a hollow frame 110, which forms a receiving cavity 120 for mounting electronic components. The sidewall of the hollow frame 110 is provided with through holes 131 and / or grooves 132 extending through the thickness of the sidewall. The immersion cooling system includes a cooling medium in contact with the electronic components. The through holes 131 and / or grooves 132 enable the cooling medium to contact the surface of the electronic components. And / or, the immersion cooling system includes a phase change cooling medium in contact with the electronic components. The phase change cooling medium can change from a liquid state to a gaseous state at a certain temperature. The through holes 131 and / or grooves 132 enable the gaseous cooling medium to escape. This configuration, with through holes 131 and / or grooves 132 on the sidewalls of the hollow frame 110, allows the cooling medium to directly contact the side surfaces of the electronic components, enabling heat exchange between the electronic components and the cooling medium. This improves heat exchange efficiency and prevents the electronic components from overheating. Furthermore, if the cooling medium vaporizes due to the high temperature of the electronic components, the gaseous cooling medium can also escape through the through holes 131 and / or grooves 132, allowing the liquid cooling medium to replenish the area around the electronic components in a timely manner. This creates flow and exchange of cooling medium around the electronic components, further improving heat exchange efficiency and preventing the electronic components from overheating.

[0036] The cooling medium is an insulating cooling medium, such as fluorinated liquid. Fluorinated liquid usually refers to fluorinated organic liquid compounds, including perfluorocarbons, hydrofluoroethers, perfluoropolyethers, etc.

[0037] The cavity 120 is generally rectangular, which is more compatible with the shape of electronic components such as the IGBT module 60. Of course, this solution is not limited to this. The cavity 120 can also be designed as a circle, ellipse, pentagon or other irregular pattern shape according to the shape of the electronic components. Specific cases will not be listed here, but all of them are within the protection scope of this solution without departing from the design concept.

[0038] Furthermore, in some embodiments, such as Figure 1 and Figure 2 As shown, the through-hole 131 and / or groove 132 are configured to expose the side surface of the electronic component through the through-hole 131 or groove 132. This configuration allows the cooling medium to flow through the through-hole 131 or groove 132 to the position in contact with the side surface of the electronic component, ensuring that the mounting surface of the electronic component facing the hollow frame is also exposed to the cooling medium. This provides sufficient cooling for the electronic component and prevents localized overheating.

[0039] It is worth noting that, such as Figure 1 and Figure 2As shown, the through hole 131 is a hole provided on the side wall of the hollow frame 110 and extending through the wall thickness of the hollow frame 110, allowing the cooling medium to flow. The groove 132 also extends through the side wall of the hollow frame 110 along the wall thickness direction; however, unlike the through hole 131, the groove 132 has an opening in the width direction of the side wall of the hollow frame 110. The groove 132 can be regarded as a through hole 131 with an opening on the side.

[0040] Regarding the specific structure of the hollow frame 110, in some embodiments, such as Figure 1 and Figure 2 As shown, the hollow frame 110 includes a first sidewall 111 and a second sidewall 112 that are opposite to and spaced apart in a first direction. At least one through hole 131 and / or groove 132 is provided on the first sidewall 111 and / or the second sidewall 112. By providing the through hole 131 or groove 132, the cooling medium can contact the electronic components, thereby improving heat exchange efficiency. Furthermore, through holes 131 or grooves 132 can be provided on both the first sidewall 111 and the second sidewall 112, resulting in a larger contact area between the cooling medium and the electronic components, further improving heat exchange efficiency. Additionally, providing through holes 131 or grooves 132 on both the first sidewall 111 and the second sidewall 112 also facilitates the flow of the cooling medium.

[0041] Furthermore, in some embodiments, such as Figure 1 and Figure 2 As shown, the hollow frame 110 includes a third sidewall 113 and a fourth sidewall 114 that are distributed opposite to each other along a second direction perpendicular to the first direction, and together with the first sidewall 111 and the second sidewall 112, they enclose the hollow frame 110.

[0042] Furthermore, in some embodiments, such as Figure 1 As shown, the third sidewall 113 and the fourth sidewall 114 are respectively provided with a first electrical connection terminal 141 and a second electrical connection terminal 142. With this arrangement, the first electrical connection terminal 141 and the second electrical connection terminal 142 can be used to connect to an external power supply or an external circuit or to interconnect multiple IGBT modules 60, thereby realizing the electrical connection between electronic components and external power supplies or other components.

[0043] As an example, optionally, one of the first electrical connection terminal 141 and the second electrical connection terminal 142 is directly or indirectly connected to a DC busbar, and the other is directly or indirectly connected to an AC busbar.

[0044] In some embodiments, the hollow frame 110 is made of PP or PC material. PP and PC are both plastic materials with advantages such as good insulation properties, high temperature resistance, good chemical stability, and good processing adaptability, making them suitable as materials for frames that mount electronic components.

[0045] In some embodiments, the through hole 131 can be circular, elliptical, or square, making its structure simple and easy to manufacture. Of course, the through hole 131 can also be triangular or polygonal, etc. The groove 132 can be semi-circular, semi-elliptical, rectangular, etc.

[0046] In some embodiments, the hollow frame 110 is provided with a plurality of mounting holes 160, which are located on the outer periphery of the receiving cavity 120 and at the corners of the hollow frame 110. The hollow frame 110 can be fixed by cooperating with the mounting holes 160 and bolts or other connecting parts.

[0047] Specifically, such as Figure 5 and Figure 6 As shown, the immersion cooling system includes a housing 40, which is filled with a cooling medium or a phase change cooling medium. The housing 40 also has a support substrate for mounting electronic components. The support substrate has connection holes that correspond to the mounting holes 160. By using bolts or other connectors to pass through the mounting holes 160 and the connection holes in sequence, and by using nuts and bolts to fix the electronic component mounting housing 10 on the other side of the support substrate, the electronic component mounting housing 10 can be fixedly mounted on the support substrate. The connection method is simple and the connection is firm.

[0048] Furthermore, such as Figure 5 and Figure 6 As shown, the support substrate 50 also includes a connecting portion 510, which bends and extends a predetermined width relative to the support substrate 50 from a first end in the length or width direction. The connecting portion 510 can be connected to the wall of the housing 40, thereby fixing the support substrate 50 in the housing 40. The connecting portion 510 enables a certain distance to be maintained between the support substrate 50 and the wall of the housing 40, forming a space for mounting electronic components.

[0049] Furthermore, such as Figure 5 and Figure 6 As shown, the support substrate 50 also has multiple electronic component mounting areas. Each electronic component mounting area has a first connecting hole 520, allowing the electronic component, after being mounted in the mounting area, to be exposed to the other side of the support substrate 50 through the first connecting hole 520. This ensures that the surface of the electronic component facing the support substrate 50 is also exposed, allowing the electronic component to fully contact the cooling medium and be adequately cooled. This prevents localized overheating of the electronic component and reduces the risk of failure due to localized overheating.

[0050] Furthermore, such as Figure 5 and Figure 6As shown, the support substrate 50 is also provided with at least one second connecting hole 530, which is disposed between adjacent electronic component mounting areas. The second connecting hole 530 also allows cooling medium to pass through the support substrate 50, which is beneficial for the flow of cooling medium. Further, the following description uses an IGBT module 60 as an example of an electronic component.

[0051] In some embodiments, the receiving cavity 120 is used to mount the IGBT module 60. The receiving cavity 120 has a first opening and a second opening disposed opposite to each other. The chip side of the IGBT module 60 is exposed through the first opening, and the substrate side of the IGBT module 60 is exposed through the second opening. This allows both the chip side and the substrate side of the IGBT module 60 to be exposed to the cooling medium, ensuring sufficient cooling of the IGBT module 60, preventing excessively high local temperatures, and reducing the risk of failure due to local overheating of the IGBT module 60.

[0052] In some embodiments, the electronic component mounting housing 10 further includes a third electrical connection terminal 150, disposed on the hollow frame 110 and located on one side of the first opening, for connecting the circuit board 20. With this configuration, the circuit board 20 (e.g., an adapter board) can be fixed to one side of the first opening of the hollow frame 110 via the third electrical connection terminal 150, and located above the chip side of the IGBT module 60, resulting in a simple structure.

[0053] As an example, the third electrical connection terminal 150 may optionally be a PIN (i.e., a pin), with a fixing hole made on the circuit board 20 at the position corresponding to the PIN, the PIN being inserted into the fixing hole and fixed by soldering.

[0054] According to an embodiment of this application, an IGBT module 60 includes a substrate and a chip mounted on the substrate. A conventional IGBT module 60 also includes encapsulating adhesive, which is applied to the outer periphery of the chip. However, in the embodiments of this application, no encapsulating adhesive is used, allowing the semiconductor electronic components of the IGBT module 60 to directly contact the cooling medium, significantly improving cooling efficiency. Since the adapter board is placed on the chip side of the IGBT module 60, it effectively protects the semiconductor devices on the IGBT module 60. Therefore, even without encapsulating adhesive, the IGBT module 60 will not suffer any destructive impact.

[0055] like Figure 3 and Figure 4As shown, a second aspect of this disclosure provides a circuit board 20 for an IGBT module 60, used in an immersion cooling system. The circuit board 20 is mounted on the chip side of the IGBT module 60. A through-hole 210 is provided on the circuit board 20. The immersion cooling system includes a cooling medium in contact with the IGBT module 60. The through-hole 210 allows the cooling medium to contact the surface of the IGBT module 60. And / or, the immersion cooling system includes a phase change cooling medium in contact with the IGBT module 60. The phase change cooling medium can change from a liquid state to a gaseous state at a certain temperature. The through-hole 210 allows the gaseous cooling medium to escape.

[0056] The circuit board 20 for the IGBT module provided in this embodiment has a through hole 210, which allows the cooling medium to pass through the circuit board 20 and directly contact the chip side of the IGBT module 60 located on the other side of the circuit board 20. This allows heat exchange between the chip side of the IGBT module 60 and the cooling medium, improving heat exchange efficiency and preventing the chip side temperature of the IGBT module 60 from becoming too high. In addition, if the chip side temperature of the IGBT module 60 is high and the cooling medium vaporizes, the gaseous cooling medium can also escape through the through hole 210, allowing the liquid cooling medium to be replenished to the chip side of the IGBT module 60 in a timely manner. The cooling medium on the chip side of the IGBT module 60 flows and exchanges, which improves heat exchange efficiency and prevents the chip side temperature of the IGBT module 60 from becoming too high.

[0057] In some embodiments, the through hole 210 can be circular, elliptical, or square. This makes the structure of the through hole 210 simple and easy to process.

[0058] Furthermore, the through hole 210 is set in a blank area of ​​the circuit board 20 that avoids the wiring lines, so as to avoid affecting the lines.

[0059] like Figure 4 As shown, a third aspect embodiment of the present disclosure provides an IGBT module assembly 30, which includes an electronic component mounting housing 10 as described in any of the first aspect embodiments of the present disclosure and an IGBT module 60. The IGBT module 60 includes an IGBT chip, which is mounted in a receiving cavity 120 of the electronic component mounting housing 10.

[0060] The IGBT module assembly 30 provided in this embodiment has all the beneficial effects of the electronic component mounting housing 10 provided in any embodiment of the first aspect, which will not be listed here.

[0061] Furthermore, the IGBT module assembly 30 also includes a circuit board 20 for the IGBT module 60 as described in any of the second aspect embodiments of this disclosure, the circuit board 20 being mounted on the chip side of the IGBT module 60.

[0062] The IGBT module assembly 30 provided in this embodiment has all the beneficial effects of the circuit board 20 provided in any embodiment of the second aspect, which will not be listed one by one here.

[0063] In some embodiments, the IGBT module assembly 30 further includes a support substrate 50, on which the IGBT module 60 is disposed. The support substrate 50 is used to mount and fix the IGBT module 60.

[0064] Furthermore, the IGBT module assembly 30 includes multiple electronic component mounting housings 10 and multiple IGBT modules 60. The multiple IGBT modules 60 are mounted one-to-one in the receiving cavities 120 of the multiple electronic component mounting housings 10, and the multiple IGBT modules 60 share a single circuit board 20. This arrangement, where multiple IGBT modules 60 share a single circuit board 20, allows for integrated installation of the circuit board 20, simplifies the connection structure between the circuit board 20 and the IGBT modules 60, and improves production efficiency.

[0065] It is worth noting that multiple IGBT modules 60 can also share a single support substrate 50, which can further simplify the assembly of the IGBT module assembly 30 and improve production efficiency.

[0066] In some embodiments, a gap exists between the circuit board 20 and the electronic component mounting housing 10. This allows the cooling medium to pass through the circuit board 20 via the gap and directly contact the chip side of the IGBT module 60 located on the other side of the circuit board 20. This enables heat exchange between the chip side of the IGBT module 60 and the cooling medium, improving heat exchange efficiency and preventing the chip side temperature of the IGBT module 60 from becoming too high. Furthermore, if the chip side temperature of the IGBT module 60 becomes too high and the cooling medium vaporizes, the gaseous cooling medium can also escape through the gap, allowing the liquid cooling medium to replenish the chip side of the IGBT module 60 in a timely manner. This flow and exchange of cooling medium on the chip side of the IGBT module 60 further improves heat exchange efficiency and prevents the chip side temperature of the IGBT module 60 from becoming too high.

[0067] As an example, optionally, the gap between the circuit board 20 and the electronic component mounting housing 10 is greater than or equal to 1 mm.

[0068] A fourth aspect of this disclosure provides a converter that includes an electronic component mounting housing 10 as described in any of the first aspect embodiments of this disclosure, and thus has all the beneficial effects of the electronic component mounting housing 10 provided in any of the first aspect embodiments, which will not be listed here.

[0069] Furthermore, the converter may also include a circuit board 20 for the IGBT module 60 as in any of the second aspect embodiments of this disclosure, thus having all the beneficial effects of the circuit board 20 for the IGBT module 60 provided in any of the second aspect embodiments, which will not be listed here one by one.

[0070] Furthermore, and / or the converter includes an IGBT module assembly 30 as described in any of the third aspect embodiments of this disclosure, and thus has all the beneficial effects of the IGBT module assembly 30 provided in any of the third aspect embodiments, which will not be listed here.

[0071] Furthermore, as an example, optionally, the converter is provided with multiple enclosures 40, which can be stacked vertically and / or arranged side by side horizontally.

[0072] A fifth aspect of this disclosure provides a wind turbine generator set, which includes a tower, a nacelle mounted on the tower, a hub mounted on one side of the nacelle, and a converter as described in the fourth aspect of this disclosure. The converter may be installed in the tower, the nacelle, or the hub.

[0073] The wind turbine generator provided in this embodiment has all the beneficial effects of the converter provided in any embodiment of the fourth aspect, which will not be listed here.

[0074] While the embodiments of the present invention have been described in detail above, those skilled in the art can make various modifications and variations to the embodiments of the present invention without departing from the spirit and scope thereof. It should be understood that, to those skilled in the art, these modifications and variations will still fall within the spirit and scope of the embodiments of the present invention as defined in the claims.

Claims

1. An electronic component mounting housing for an immersion cooling system, characterized in that, The electronic component mounting housing (10) includes a hollow frame (110) forming a receiving cavity (120) for mounting electronic components. The sidewalls of the hollow frame (110) are provided with through holes (131) and / or grooves (132) extending through the thickness of the sidewalls. The immersion cooling system includes a cooling medium in contact with the electronic components. The through holes (131) and / or the grooves (132) allow the cooling medium to contact the surface of the electronic components; and / or... The immersion cooling system includes a phase change cooling medium in contact with the electronic components. The phase change cooling medium can change from a liquid state to a gaseous state at a certain temperature. The through-hole (131) and / or groove (132) allow the gaseous cooling medium to escape.

2. The electronic component mounting housing according to claim 1, characterized in that, The through hole (131) or the groove (132) is configured such that the side surface of the electronic component can be exposed through the through hole (131) and / or the groove (132).

3. The electronic component mounting housing according to claim 1, characterized in that, The hollow frame (110) includes a first sidewall (111) and a second sidewall (112) that are opposite to and spaced apart in a first direction, and the first sidewall (111) and / or the second sidewall (112) are provided with at least one through hole (131) and / or groove (132).

4. The electronic component mounting housing according to claim 1, characterized in that, The receiving cavity (120) is used to install the IGBT module (60). The receiving cavity (120) has a first opening and a second opening that are disposed opposite to each other. The chip side of the IGBT module (60) can be exposed through the first opening, and the substrate side of the IGBT module (60) can be exposed through the second opening.

5. The electronic component mounting housing according to claim 3, characterized in that, The hollow frame (110) includes a third sidewall (113) and a fourth sidewall (114) distributed opposite to each other along a second direction perpendicular to the first direction. The third sidewall (113) and the fourth sidewall (114) are respectively provided with a first electrical connection terminal (141) and a second electrical connection terminal (142).

6. The electronic component mounting housing according to claim 4, characterized in that, The electronic component mounting housing (10) also includes: A third electrical connection terminal (150) is disposed on the hollow frame (110) and located on one side of the first opening, for connecting the circuit board (20).

7. The electronic component mounting housing according to any one of claims 1 to 6, characterized in that, The hollow frame (110) is provided with a plurality of mounting holes (160), which are located on the outer periphery of the receiving cavity (120) and at the corners of the hollow frame (110).

8. The electronic component mounting housing according to any one of claims 1 to 6, characterized in that, The hollow frame (110) is made of PP or PC material, and / or the through hole (131) includes a circle, an ellipse, or a polygon.

9. A circuit board for an IGBT module, used in an immersion cooling system, characterized in that, The circuit board (20) is used for mounting on the chip side of the IGBT module (60). The circuit board (20) is provided with a through hole (210). The immersion cooling system includes a cooling medium in contact with the IGBT module (60). The through hole (210) allows the cooling medium to contact the surface of the IGBT module (60); and / or, The immersion cooling system includes a phase change cooling medium in contact with the IGBT module (60). The phase change cooling medium can change from liquid to gas at a certain temperature, and the through hole (210) allows the gaseous cooling medium to escape.

10. The circuit board for an IGBT module according to claim 9, characterized in that, The circuit board (20) is an adapter board, and the through hole (210) includes circular, elliptical or polygonal shapes.

11. An IGBT module assembly, characterized in that, The IGBT module assembly (30) includes an electronic component mounting housing (10) as described in any one of claims 1 to 8 and an IGBT module (60), wherein the IGBT module (60) includes an IGBT chip, and the IGBT chip is mounted in a receiving cavity (120) of the electronic component mounting housing (10).

12. The IGBT module assembly according to claim 11, characterized in that, It also includes a circuit board (20) for an IGBT module as described in claim 9 or 10, the circuit board (20) being mounted on the chip side of the IGBT module (60).

13. The IGBT module assembly according to claim 12, characterized in that, The IGBT module assembly (30) further includes a support substrate (50), and the IGBT module (60) is disposed on the support substrate (50); And / or, there is a gap between the circuit board (20) and the electronic component mounting housing (10).

14. A converter, characterized in that, The converter includes an electronic component mounting housing as described in any one of claims 1 to 8, and / or a circuit board for an IGBT module as described in claim 9 or 10, and / or an IGBT module assembly as described in any one of claims 11 to 13.

15. A wind turbine generator set, characterized in that, The wind turbine generator set includes a tower, a nacelle mounted on the tower, a hub mounted on one side of the nacelle, and a converter as described in claim 14.

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