mapping device

Abstract

The application provides a mapping device, which comprises a first shell, a control panel, an algorithm chip, a heat dissipation plate and a moving wheel. The first shell forms a first cavity. The control panel is located in the first cavity and fixedly installed on the first shell. The algorithm chip is installed on the control panel. The heat dissipation plate is connected with the algorithm chip and fixedly installed on the first shell. At least two openings are arranged on the first shell and configured to communicate the heat dissipation plate with the outside. The moving wheel supports the first shell. The application can reduce the possibility of overheat damage of the control panel of the mapping device to a certain extent.

Description

Technical Field

[0001] This application relates to the field of power tool technology, and more particularly to a mapping device. Background Technology

[0002] Existing mapping equipment includes positioning sensors and a main control board. The positioning sensors are configured to collect positioning data, while the main control board, located inside the mapping equipment, is configured to process the positioning data to generate a regional map. Equipping the mapping equipment with various positioning sensors, such as RTK, GNSS, and visual positioning sensors, can improve positioning accuracy and make the regional map more complete and accurate. However, this also increases the computational load of the mapping process. As the computational load increases, the heat generated by the computing units and electronic components on the main control board increases, making the main control board prone to overheating and damage. Summary of the Invention

[0003] In view of this, the purpose of this application is to propose a mapping device to solve the problem that the control board of existing mapping devices is prone to overheating and damage.

[0004] To achieve the above objectives, this application provides a mapping device, the mapping device comprising:

[0005] A first housing, the first housing forming a first cavity;

[0006] A control board, which is located in the first cavity and is fixedly installed in the first housing;

[0007] An algorithm chip, which is mounted on the control board;

[0008] A heat sink is connected to the algorithm chip and is fixedly installed on the first housing; the first housing has at least two openings configured to connect the heat sink to the outside.

[0009] A movable wheel that supports the first housing.

[0010] Furthermore, the heat sink includes:

[0011] The first heat sink is approximately parallel to the control board;

[0012] The second heat sink is set at an angle to the first heat sink. Multiple second heat sinks are spaced apart and are roughly parallel. Both the first and second heat sinks are connected to the outside through openings.

[0013] Furthermore, the second heat sink extends along the front-rear direction of the mapping device.

[0014] Furthermore, at least one of the openings is located on the front side of the first housing, and at least one of the openings is located on the rear side of the first housing.

[0015] Furthermore, the heat sink is a metal plate.

[0016] Furthermore, the mapping device also includes a first information acquisition sensor, which is electrically connected to the control board and configured to acquire environmental data of the mapping device in the direction of travel;

[0017] The first information acquisition sensor is located in the first cavity, and the projection of the first information acquisition sensor on the horizontal plane is located inside the projection of the first housing on the horizontal plane.

[0018] Furthermore, the mapping device also includes a second housing forming a second cavity; a second information acquisition sensor located within the second cavity; the second housing being located above the first housing, the projection of the second housing onto the horizontal plane exceeding the projection of the first housing onto the horizontal plane; and the second information acquisition sensor being configured to acquire satellite positioning information.

[0019] Furthermore, the mapping device also includes a battery pack, which is disposed outside the first housing. The battery pack is connected to the control board via a wiring harness, and the heat sink and the first housing are provided with through holes for the wiring harness to pass through.

[0020] Furthermore, the moving wheels are made of honeycomb tires.

[0021] Furthermore, the mapping device also includes:

[0022] A push rod, which is connected to the first housing;

[0023] A battery pack compartment, which is connected to the push rod and located on the rear side of the first housing;

[0024] A support assembly, detachably connected to the battery pack compartment, is configured to cooperate with the casters to support the first housing, the battery pack compartment, and the push rod.

[0025] In the mapping device provided in this application embodiment, the algorithm chip is connected to a heat sink. When the algorithm chip generates heat, the heat generated by the algorithm chip can be quickly conducted to the heat sink. Simultaneously, the heat-absorbing heat sink can communicate with the outside air through at least two openings on the first housing, achieving heat exchange between the heat sink and the outside air. This can improve the heat dissipation efficiency and effect of the mapping device to a certain extent, reduce the possibility of overheating damage to the control board containing the algorithm chip, and improve the service life and stability of the control board. Attached Figure Description

[0026] To more clearly illustrate the technical solutions in this application or related technologies, the drawings used in the description of the embodiments or related technologies will be briefly introduced below. Obviously, the drawings described below are only embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0027] Figure 1 This is a cross-sectional view of the mapping equipment as described in this application embodiment;

[0028] Figure 2 This is a partial cross-sectional view of the mapping device according to an embodiment of this application;

[0029] Figure 3 for Figure 2 A magnified view of a portion of the image;

[0030] Figure 4 This is a top view of the mapping device according to an embodiment of this application;

[0031] Figure 5 This is a side view of the mapping device according to an embodiment of this application;

[0032] Figure 6 This is a front view of the mapping device according to an embodiment of this application;

[0033] Figure 7 This is a rear view of the mapping device according to an embodiment of this application;

[0034] Figure 8 This is a schematic diagram of the outer surface of a movable wheel according to an embodiment of this application;

[0035] Figure 9 This is a structural schematic diagram of a honeycomb tire according to an embodiment of this application;

[0036] Figure 10 This is a bottom view of the mapping device according to an embodiment of this application;

[0037] Figure 11 This is a schematic diagram of the operation section according to an embodiment of this application.

[0038] The symbols in the attached image are explained as follows:

[0039] 100. First housing; 200. Control board; 300. Heat sink; 310. First heat sink; 320. Second heat sink; 400. Caster wheel; 500. First information acquisition sensor; 600. Second housing; 700. Second information acquisition sensor; 800. Battery pack; 900. Push rod; 1000. Support assembly; 1100. Shielding cover; 1200. Operating unit; 1210. Mapping pause button; 1220. Power switch; 1230. Mapping start button; 1240. Mapping stop button; 1300. Handle. Detailed Implementation

[0040] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with specific embodiments and the accompanying drawings.

[0041] It should be noted that, unless otherwise defined, the technical or scientific terms used in the embodiments of this application should have the ordinary meaning understood by one of ordinary skill in the art to which this application pertains. The terms "first," "second," and similar terms used in the embodiments of this application do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Terms such as "comprising" or "including" mean that the element or object preceding the word encompasses the elements or objects listed after the word and their equivalents, without excluding other elements or objects. Terms such as "connected" or "linked" are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. Terms such as "upper," "lower," "left," and "right" are only used to indicate relative positional relationships; when the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0042] For ease of explanation, this manual defines "forward" as the direction in which the mapping equipment moves forward and "backward" as the direction in which the mapping equipment moves backward. The direction in which the mapping equipment is away from the working surface and perpendicular to it is defined as "up" and the direction in which the mapping equipment is close to the working surface and perpendicular to it is defined as "down".

[0043] The mapping device provided in one embodiment of this application can, to a certain extent, solve the problem of overheating and damage to the control board 200 of existing mapping devices. For example... Figure 1 and Figure 2As shown, the mapping device provided in this embodiment includes a first housing 100, a control board 200, an algorithm chip, a heat sink 300, and casters 400. The casters 400 are configured to support the first housing 100 and move under user control. The first housing 100 forms a first cavity, the control board 200 is located in the first cavity and fixedly mounted on the first housing 100, the algorithm chip is mounted on the control board 200, and the heat sink 300 is connected to the algorithm chip and fixedly mounted on the first housing 100. When the algorithm chip generates heat, the heat generated by the algorithm chip can be quickly transferred to the heat sink 300. Simultaneously, the first housing 100 has at least two openings configured to connect the heat sink 300 to the outside environment. After absorbing heat, the heat sink 300 can communicate with the outside air through the at least two openings on the first housing 100, achieving heat exchange between the heat sink 300 and the outside air. In this embodiment, the heat dissipation plate 300 allows the heat of the control board 200 to be dissipated from the opening more quickly, which can improve the heat dissipation efficiency and effect of the mapping equipment to a certain extent, reduce the possibility of overheating damage to the control board 200, and improve the service life and stability of the control board 200.

[0044] In some embodiments, such as Figure 3 As shown, the heat sink 300 includes a first heat sink 310 and a second heat sink 320. The first heat sink 310 is generally parallel to the control board 200, and the second heat sink 320 is angled to the first heat sink 310. Multiple second heat sinks 320 are spaced apart and generally parallel, with a guide channel for air passage formed between adjacent second heat sinks 320. The heat sink 300 structure used in this embodiment can maximize the heat transfer area and improve the heat dissipation efficiency and effect of the mapping equipment. Specifically, the angle between the second heat sink 320 and the first heat sink 310 can be set according to actual needs; for example, the angle can be 90 degrees, 60 degrees, 30 degrees, etc., and this embodiment is not limited to this.

[0045] exist Figure 1 and Figure 2 In the second housing 600, the arrow above indicates the direction of travel of the mapping device, and the arrow inside the mapping device indicates the movement trajectory of air within the first housing 100. In some embodiments, combined with Figure 1 , Figure 2 and Figure 3As shown, at least one opening is located on the front side of the first housing 100, which is in front of the first housing 100 in the forward direction of the mapping equipment. At least one opening is located on the rear side of the first housing 100, which is behind the first housing 100 in the forward direction of the mapping equipment. As the mapping equipment moves, airflow can flow into the interior of the first housing 100 from the opening on the front side and then flow out from the opening on the rear side. This achieves forced convection of air within the first housing 100, increasing the airflow speed and volume. Under the premise that the heat dissipation capacity of the heat sink 300 is the same, increasing the airflow speed obviously brings better heat dissipation efficiency and effect.

[0046] In some embodiments, the mapping device may further include a cooling fan and a motor. The cooling fan is electrically connected to the motor and can rotate under the drive of the motor to promote the entry of outside air into the guide channel from the front opening of the first housing 100, further enhancing the forced air convection effect inside the first housing 100 and increasing the air flow speed.

[0047] In this embodiment, the number of openings on the front and rear sides of the first housing 100 can be set according to actual needs, and this embodiment is not limited thereto. Specifically, for example, the first housing 100 may have one opening on the front side and one opening on the rear side, with the flow channels between the heat sinks 300 communicating with the outside through the openings, allowing the heat from the heat sinks 300 to be transferred to the outside air. Alternatively, the first housing 100 may have multiple openings on the front side and one opening on the rear side, so that the air entering the first housing 100 can fully contact the heat sinks 300, improving the heat dissipation effect. Yet another example is that the first housing 100 may have multiple openings on the front side and multiple openings on the rear side, increasing airflow and improving heat dissipation efficiency and effect.

[0048] In some embodiments, the second heat sink 320 extends along the front-rear direction of the mapping device, and the guide channel between adjacent second heat sinks 320 extends along the front-rear direction of the mapping device. This allows the entire surface 320 of the second heat sink 320 to fully contact the air entering the first housing 100 and exchange heat. In other words, by setting the second heat sink 320 to extend along the front-rear direction of the mapping device, this embodiment increases the effective heat exchange area of ​​the second heat sink 320, which is beneficial to improving heat dissipation efficiency and heat dissipation effect.

[0049] In some embodiments, the second heat sink 320 has at least one heat dissipation fin on its side. The heat dissipation fin can increase the contact area between the second heat sink 320 and the air, thereby improving heat dissipation efficiency and effect by increasing the effective heat exchange area. Specifically, the heat dissipation fin can be disposed on one or both sides of the second heat sink 320. Specifically, the shape of the heat dissipation fin includes, but is not limited to, straight tooth type, spade tooth type, needle type, cylindrical type, or rhomboid type.

[0050] In some embodiments, the heat sink 300 is a metal plate, and the material of the metal plate includes, but is not limited to, copper, iron, aluminum, etc.

[0051] In some embodiments, the heat sink 300 has a thermally conductive layer configured to contact the control board 200 to facilitate heat transfer between the control board 200 and the heat sink 300. The positional relationship between the control board 200 and the heat sink 300 can be as follows: Figure 3 As shown. This thermally conductive layer can be made of flexible thermally conductive materials, including but not limited to thermal grease, thermal gel, or thermal pads.

[0052] In some embodiments, such as Figure 3 As shown, the mapping device also includes a first information acquisition sensor 500, which is electrically connected to the control board 200 and configured to acquire environmental data of the mapping device in its direction of travel. The first information acquisition sensor 500 is located in the first cavity, and its projection on the horizontal plane is located inside the projection of the first housing 100 on the horizontal plane to prevent collisions between the first information acquisition sensor 500 and obstacles during the mapping device's movement. The horizontal plane is defined by the forward / backward direction of the mapping device as the x-axis and the left / right direction as the y-axis. The forward / backward direction of the mapping device is parallel to its normal operating direction, and the left / right direction is perpendicular to its normal operating direction, as well as perpendicular to its vertical direction.

[0053] In this embodiment, the first information sensor can be a visual sensor, such as a monocular camera or a depth camera. Other types of first information sensors can also be used as needed. In this embodiment, the first information acquisition sensor 500 is at least 220mm above the horizontal ground to accommodate scenes with 200mm tall grass and prevent tall grass from obstructing the camera's field of view. In this embodiment, the first information acquisition sensor 500 is horizontally positioned to allow for a wider field of view and more accurate positioning when collecting images. In this embodiment, the horizontal field of view of the first information acquisition sensor 500 is at least 150°. For example, it could be... Figure 4The 150° shown could also be 160°, 170°, etc. The vertical field of view of the first information acquisition sensor 500 is not less than 80°. For example, it could be... Figure 5 The 80° shown could also be 85°, 90°, etc. Here, the horizontal field of view is the angle between the field of view (also known as the field of vision) and the horizontal plane; while the vertical field of view is the angle between the field of view and the horizontal plane. In other embodiments, the height, angle, and field of vision of the first information acquisition sensor 500 above the horizontal ground can be set according to actual needs.

[0054] In this embodiment, the projection of the first information acquisition sensor 500 on the horizontal plane is located inside the projection of the first housing 100 on the horizontal plane, which can be implemented as follows: Figure 6 The structure shown has a mounting hole on the front side of the first housing 100, and the first information acquisition sensor 500 is disposed in the mounting hole and does not protrude from the front side of the first housing 100. In other embodiments, a collision protection member may also be provided on the front side of the first information acquisition sensor 500. The collision protection member is made of a light-transmitting material, including but not limited to glass and light-transmitting plastic.

[0055] In some embodiments, the mapping device further includes a second information acquisition sensor 700, which is configured to acquire satellite positioning information. The second information acquisition sensor 700 is located in the first cavity and above the first information acquisition sensor 500. In this embodiment, the first signal acquisition sensor and the second signal acquisition sensor are connected to the control board 200 via a wiring harness. In other embodiments, other connection methods may be used between the first signal acquisition sensor, the second signal acquisition sensor, and the control board 200.

[0056] In some embodiments, such as Figure 1 , Figure 2 and 3 As shown, the mapping device also includes a second housing 600 and a second information acquisition sensor 700. The second housing 600 forms a second cavity, and the second information acquisition sensor 700 is located within the second cavity. The second information acquisition sensor 700 is configured to acquire satellite positioning information. The second housing 600 is located above the first housing 100, and the projection of the second housing 600 on the horizontal plane exceeds the projection of the first housing 100 on the horizontal plane. Thus, during the movement of the mapping device, the second housing 600 can first collide with obstacles whose height exceeds that of the first housing 100, providing a certain degree of protection for the first information acquisition sensor 700.

[0057] In this embodiment, the first signal acquisition sensor 500 is connected to the control board 200 via a wiring harness, and the second signal acquisition sensor 700 passes through the second housing 600 and the first housing 100 before connecting to the control board 200 via the wiring harness. The first housing 100 and the second housing 600 are provided with through holes for the wiring harness to pass through. In other embodiments, the first signal acquisition sensor, the second signal acquisition sensor, and the control board 200 may employ other connection methods, including but not limited to one or more of pin connection, connector connection, soldering connection, and connector connection.

[0058] In this embodiment, the second information acquisition sensor 700 is an RTK positioning sensor. In other embodiments, the second information acquisition sensor 700 can also be other types of positioning sensors, such as an inertial measurement unit (IMU) or an odograph (ODO).

[0059] In some embodiments, such as Figure 3 As shown, the mapping device also includes a shield 1100, which is disposed between the control board 200 and the second information acquisition sensor 700. By setting the shield 1100, the signal of the control board 200 can be prevented from affecting the second information acquisition sensor 700 in transmitting and receiving positioning signals.

[0060] In some embodiments, the mapping device further includes a battery pack 800, which is disposed outside the first housing 100. The battery pack 800 is connected to the control board 200 via a wiring harness, and the heat sink 300 and the first housing 100 are provided with through holes for the wiring harness to pass through. In this embodiment, as... Figure 1 , Figure 5 and Figure 7 As shown, the battery pack 800 is disposed on the rear side of the first housing 100. In other embodiments, the battery pack 800 may also be disposed in other locations as needed.

[0061] In some embodiments, such as Figure 8 As shown, the outer surface of the movable wheel 400 has a continuous tread pattern. Compared with the discontinuous protrusions on the outer surface of tires in related technologies, the continuous tread pattern on the outer surface of the tire makes the wheel move more smoothly. At the same time, the outer surface of the movable wheel 400 is made of at least one material such as hard rubber or PVC. Hard rubber and PVC are softer than ordinary plastics and are more wear-resistant and slip-resistant, which can reduce wheel wear and running noise, providing users with a better pushing experience.

[0062] In some embodiments, the movable wheel 400 may be implemented as Figure 9The honeycomb tire shown has a honeycomb structure that makes the moving wheel 400 softer, providing shock absorption and improving the user's pushing experience.

[0063] In some embodiments, such as Figure 1 , Figure 4 , Figure 5 , Figure 7 and Figure 10 As shown, the mapping equipment also includes a push rod 900, a battery pack compartment, and a support assembly 1000. The push rod 900 is connected to the first housing 100; the battery pack compartment is connected to the push rod 900 and located at the rear of the first housing 100; the support assembly 1000 is detachably connected to the battery pack compartment and is configured to cooperate with casters 400 to support the first housing 100, the battery pack compartment, and the push rod 900. The support assembly 1000 allows the mapping equipment to be easily placed upright on the ground.

[0064] In this embodiment, the support component 1000 may include a foot support bracket. When the mapping equipment is in operation, such as... Figure 4 and Figure 10 As shown, its foot support bracket retracts and fits snugly against the push rod 900°; when the mapping equipment needs to be placed upright, the user can lower the foot support bracket with their feet, as shown. Figure 1 , Figure 5 , Figure 6 and Figure 7 As shown, one end of the foot support can pivot to contact the ground to support the mapping equipment. In other embodiments, the support assembly 1000 can also be adaptively configured with other structural forms.

[0065] In this embodiment, the support assembly 1000 may further include a connector. The foot support is detachably connected to the battery pack compartment via the connector. The connector is made of plastic, and it is prone to wear as the support assembly 1000 is used continuously. The foot support can be reused by disassembling and replacing the connector. The detachable connection between the foot support and the battery pack compartment via the connector includes, but is not limited to, threaded connections, pin connections, snap-fit ​​connections, and key connections; this specification does not limit the types of connections.

[0066] In some embodiments, such as Figure 1 , Figure 4 , Figure 5 and Figure 6 As shown, the mapping equipment also includes an operation unit 1200, which is electrically connected to the control board 200 and configured to generate a pause command in response to a pause operation of the operation unit 1200. The control board 200, in response to the pause command, controls the mapping equipment to pause mapping. Wherein, as Figure 11As shown, the operation unit 1200 includes a map-building pause button 1210, which can be triggered by the user. When the user needs to pause map building, they can trigger the map-building pause button 1210 to control the map-building equipment to pause map building. Compared with related technologies where users can only control the map-building equipment to pause map building through the map-building terminal, the map-building equipment provided in this embodiment makes the map-building process more convenient by setting the map-building pause button 1210.

[0067] Specifically, such as Figure 11 As shown, the operation unit 1200 also includes a power switch 1220, a mapping start button 1230, and a mapping stop button 1240. The power switch 1220 is configured to control the power on and off of the mapping device, the mapping start button 1230 is configured to control the mapping device to start mapping and record positioning data, and the mapping stop button 1240 is configured to control the mapping device to stop mapping and terminate the recording of positioning data.

[0068] Specifically, such as Figure 1 , Figure 4 , Figure 5 , Figure 7 and Figure 10 As shown, the mapping device also includes a handle 1300, which is located near the end of the push rod 900. The handle 1300 is connected to the push rod 900 and is used for the user to hold.

[0069] According to the above embodiments, in the mapping device provided in this specification, the algorithm chip is connected to the heat sink 300. When the algorithm chip generates heat, the heat generated by the algorithm chip can be quickly conducted to the heat sink 300. Simultaneously, the heat sink 300, after absorbing heat, can communicate with the outside air through at least two openings provided on the first housing 100, realizing heat exchange between the heat sink 300 and the outside air. This can improve the heat dissipation efficiency and effect of the mapping device to a certain extent, reduce the possibility of overheating damage to the control board 200 where the algorithm chip is installed, and improve the service life and stability of the control board 200.

[0070] Those skilled in the art should understand that the discussion of any of the above embodiments is merely exemplary and is not intended to imply that the scope of this application (including the claims) is limited to these examples; within the framework of this application, the technical features of the above embodiments or different embodiments can also be combined, the steps can be implemented in any order, and there are many other variations of different aspects of the embodiments of this application as described above, which are not provided in the details for the sake of brevity.

[0071] Although this application has been described in conjunction with specific embodiments thereof, many substitutions, modifications and variations of these embodiments will be apparent to those skilled in the art from the foregoing description.

[0072] The embodiments of this application are intended to cover all such substitutions, modifications, and variations that fall within the broad scope of the appended claims. Therefore, any omissions, modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the embodiments of this application should be included within the protection scope of this application.

Claims

1. A mapping device, comprising: The mapping equipment includes: A first housing (100) forms a first cavity; A control board (200) is located in the first cavity and is fixedly installed in the first housing (100); An algorithm chip is mounted on the control board (200); A heat sink (300) is connected to the algorithm chip and is fixedly installed on the first housing (100); the first housing (100) is provided with at least two openings, which are configured to connect the heat sink (300) to the outside. A movable wheel (400) supports the first housing (100).

2. The mapping device of claim 1, wherein, The heat sink (300) includes: The first heat sink (310) is approximately parallel to the control board (200); The second heat sink (320) is set at an angle to the first heat sink (310). Multiple second heat sinks (320) are spaced apart and are generally parallel. Both the first heat sink (310) and the second heat sink (320) are connected to the outside through openings.

3. The mapping device of claim 2, wherein, The second heat sink (320) extends along the front-back direction of the mapping device.

4. The mapping device of claim 1 or 3, wherein, At least one of the openings is located on the front side of the first housing (100), and at least one of the openings is located on the rear side of the first housing (100).

5. The mapping device of claim 1, wherein, The heat sink (300) is a metal plate.

6. The mapping device of claim 1, wherein, The mapping device further includes a first information acquisition sensor (500), which is electrically connected to the control board (200) and configured to acquire environmental data of the mapping device in the direction of travel. The first information acquisition sensor (500) is located in the first cavity, and the projection of the first information acquisition sensor (500) on the horizontal plane is located inside the projection of the first housing (100) on the horizontal plane.

7. The mapping equipment according to claim 6, characterized in that, The mapping device further includes a second housing (600) forming a second cavity; a second information acquisition sensor (700) located within the second cavity; the second housing (600) being located above the first housing (100), the projection of the second housing (600) on the horizontal plane exceeding the projection of the first housing (100) on the horizontal plane, and the second information acquisition sensor (700) being configured to acquire satellite positioning information.

8. The mapping equipment according to claim 1, characterized in that, The mapping device also includes a battery pack (800), which is disposed outside the first housing (100). The battery pack (800) is connected to the control board (200) via a wiring harness. The heat sink (300) and the first housing (100) are provided with through holes for the wiring harness to pass through.

9. The mapping equipment according to claim 1, characterized in that, The moving wheels (400) are made of honeycomb tires.

10. The mapping equipment according to claim 1, characterized in that, The mapping equipment also includes: A push rod (900) is connected to the first housing (100); A battery pack compartment, which is connected to the push rod (900) and located on the rear side of the first housing (100); A support assembly (1000), detachably connected to the battery pack compartment, is configured to cooperate with the caster wheel (400) to support the first housing (100), the battery pack compartment, and the push rod (900).

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