A heat dissipation module

Abstract

The application discloses a heat dissipation module. The heat dissipation module comprises: an electronic device; a heat sink comprising a heat dissipation piece, a top cover and an adjusting piece, the heat dissipation piece being connected to the electronic device, the top cover being movably connected to the heat dissipation piece, and the adjusting piece being arranged between the heat dissipation piece and the top cover; a shell, the heat sink and the electronic device being accommodated in the shell; wherein the adjusting piece is used for being adjusted to move, and then push the top cover to relatively move away from the heat dissipation piece and abut on a wall surface of the shell, so as to fix the heat sink and the electronic device in the shell. Through the above manner, the heat dissipation module provided by the application can ensure efficient installation and provide sufficient fixing stability.

Description

Technical Field

[0001] This application relates to the field of heat dissipation device technology, and in particular to a heat dissipation module. Background Technology

[0002] As electronic devices become more powerful and smaller, the heat generated by electronic devices during operation increases significantly, and the performance of the heat dissipation module directly affects the stability and lifespan of the device.

[0003] In the prior art, heat dissipation modules typically include electronic components, a heat sink, and a housing. The heat sink is fixed inside the housing by screws, clips, or adhesives.

[0004] However, traditional fixing methods have the following drawbacks: low installation efficiency, screw or clip connections require manual alignment, which is especially difficult to assemble in confined spaces and is not conducive to automated production; and insufficient stability in vibration environments, as vibration during equipment operation may cause the fixing structure to loosen. Utility Model Content

[0005] This application provides a heat dissipation module to solve the problems of low installation efficiency and insufficient stability after fixing of the heat sink and the housing in a small space.

[0006] To solve the above-mentioned technical problems, one technical solution adopted in this application is to provide a heat dissipation module. The heat dissipation module includes: an electronic device; a heat sink, including a heat sink component, a top cover, and an adjusting component, wherein the heat sink component is connected to the electronic device, the top cover is movably connected to the heat sink component, and the adjusting component is disposed between the heat sink component and the top cover; and a housing, in which the heat sink and the electronic device are housed; wherein the adjusting component is used to be adjusted and moved, thereby pushing the top cover away from the heat sink component and abutting against the inner wall surface of the housing, so as to fix the heat sink and the electronic device in the housing.

[0007] In some embodiments, a slide is formed between the top cover and the heat sink, the slide including a first plane and a second plane disposed opposite to each other, the distance between the first plane and the second plane gradually decreasing along the extension direction of the slide;

[0008] The adjusting member is movably disposed within the slide rail. The adjusting member is adjusted and moves along the extension direction of the slide rail, and acts on the first plane and the second plane, so that the top cover gradually moves away from the heat sink, thereby pressing and fixing the heat sink and the electronic device between the inner wall surface of the housing.

[0009] In some embodiments, the slide rail passes through the radiator, and the adjusting member has a through threaded hole, the threaded hole being threadedly connected to an adjusting screw; the adjusting member moves along the slide rail under the drive of the adjusting screw.

[0010] In some embodiments, the slide rail passes through the radiator, and a pulling part is installed at one end of the adjusting member along the extending direction; by pulling the pulling part, the adjusting member is moved along the slide rail.

[0011] In some embodiments, the first plane and the second plane are spaced apart along a first direction, the width of the slide in a second direction perpendicular to the first direction gradually decreases with the extension direction of the slide, the adjusting member enters the slide from a first end of the slide, and the second end of the slide can prevent the adjusting member from leaving the slide.

[0012] In some embodiments, the cross-sectional shape of the adjusting member is adapted to the cross-sectional shape of the slide; the two side surfaces of the adjusting member are in contact with the first plane and the second plane, respectively.

[0013] In some embodiments, the top cover is connected to the heat sink by a plurality of fasteners, and the top cover is movable relative to the fasteners.

[0014] In some embodiments, the heat sink includes a first heat sink and a second heat sink disposed on both sides of the electronic device, the first heat sink and the second heat sink are fixedly connected, and the top cover is movably connected to the side of the second heat sink opposite to the first heat sink; the inner wall surface of the housing is provided with a guide groove, and the first heat sink is slidably assembled with the guide groove.

[0015] In some embodiments, a heat dissipation channel parallel to the guide groove is formed between the second heat sink and the electronic device.

[0016] In some embodiments, the outer wall surfaces of the first heat sink and the second heat sink abut against the inner wall surface of the housing under the action of the adjusting member.

[0017] The beneficial effects of this application are as follows: Unlike the prior art, this application discloses a heat dissipation module. By pre-connecting a heat sink to an electronic device, with the heat sink component and top cover movably arranged within the heat sink, and an adjustable adjustment component provided between the heat sink component and the top cover, when the electronic device and the heat sink are housed in the housing, by adjusting the position of the adjustment component between the top cover and the heat sink component, the top cover is pushed relatively away from the heat sink component and abuts against the inner wall surface of the housing, and the heat sink component also abuts against the inner wall surface of the housing. Thus, both the top cover and the heat sink component of the heat sink can be pressed tightly against the inner wall surface of the housing, thereby achieving efficient fixed installation of the heat sink and the electronic device as a whole module in the housing, and forming a sufficiently large contact pressure between the heat sink and the inner wall surface of the housing, so that the heat dissipation module as a whole has sufficient stability with the housing, thereby meeting the requirements of various vibration environments. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort, wherein:

[0019] Figure 1 This is a schematic diagram of the structure of an embodiment of the heat dissipation module provided in this application;

[0020] Figure 2 yes Figure 1 A schematic diagram showing the separation structure of the housing, electronic components, and heat sink in the heat dissipation module.

[0021] Figure 3 yes Figure 1 A bottom view of the heat dissipation module shown.

[0022] Figure 4 yes Figure 3 A cross-sectional view of the heat dissipation module shown.

[0023] Figure 5 yes Figure 3 The diagram shows the exploded structure of the heat sink in the heat dissipation module. Detailed Implementation

[0024] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0025] The terms "first," "second," and "third" used in the embodiments of this application are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first," "second," or "third" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or device that includes a series of steps or units is not limited to the listed steps or units, but may optionally include steps or units not listed, or may optionally include other steps or units inherent to these processes, methods, products, or devices.

[0026] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a mutually exclusive, independent, or alternative embodiment. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0027] This application provides a heat dissipation module 100, see reference. Figures 1 to 3 , Figure 1 This is a schematic diagram of a structure of an embodiment of the heat dissipation module provided in this application. Figure 2 yes Figure 1 The diagram shows the separation structure of the housing, electronic components, and heat sink in the heat dissipation module. Figure 3 yes Figure 1 The diagram shows a bottom view of the heat dissipation module.

[0028] The heat dissipation module 100 includes an electronic device 10, a heat sink 20, and a housing 30. The heat sink 20 includes a heat dissipation component 21, a top cover 22, and an adjustment component 23. The heat dissipation component 21 is connected to the electronic device 10, the top cover 22 is movably connected to the heat dissipation component 21, and the adjustment component 23 is disposed between the heat dissipation component 21 and the top cover 22. The heat sink 20 and the electronic device 10 are housed in the housing 10. The adjustment component 23 is used to be adjusted and moved, thereby pushing the top cover 23 away from the heat dissipation component 21 and abutting against the wall of the housing 10, so as to fix the heat sink 20 and the electronic device 10 in the housing 30.

[0029] like Figures 1 to 3As shown, the heat sink 20 is pre-connected to the electronic device 10 to form an integral module, which is then installed together in the housing 30. By adjusting the position of the adjusting member 23 in the heat sink 20, the top cover 22 is brought into close contact with the inner wall of the housing 30. Under the action of the adjusting member 23, the outer wall surfaces of the top cover 22 and the heat sink 21 are pressed against the inner wall of the housing 30, thereby realizing the fixed installation of the heat sink 20 and the electronic device 10 integral module in the housing 30.

[0030] Electronic device 10 may be a circuit board device, a high-power chip or other heat-generating element, etc. It will generate a lot of heat during operation. If heat dissipation is not carried out in a timely and effective manner, it will affect the performance stability and service life of electronic device 10.

[0031] The heat sink 20 has the function of dissipating heat from the electronic device 10. At the same time, the structural design of the heat sink 20 enables a stable connection with the housing 30, ensuring the reliability of the overall installation.

[0032] Optionally, the heat sink 20 and the housing 30 can also be connected for auxiliary heat dissipation, so that the heat generated by the electronic device 10 during operation can be conducted to the housing 30 through the heat sink 20, and then the heat can be dissipated to the external environment through the housing 30, thereby further achieving efficient heat dissipation of the electronic device 10.

[0033] In this embodiment, the heat sink 21 is made of a metal material with good thermal conductivity, such as aluminum alloy or copper alloy, which can efficiently absorb and conduct the heat generated by the electronic device 10; the top cover 22 is a plate structure and is movably connected to the heat sink 21, so that the top cover 22 can float relative to the heat sink 21 under the action of the adjusting member 21. Then, by adjusting the adjusting member 23, the top cover 22 and the heat sink 21 are forced to abut against the inner wall surface of the housing 30 within the housing 10, thereby fixing the heat sink 20 and the electronic device 10 together in the housing 30.

[0034] In other words, by adjusting the position of the adjusting member 23 between the top cover 22 and the heat sink 21, the contact state and contact pressure between the heat sink 21, the top cover 22 and the housing 30 can be changed. For example, during initial assembly, the adjusting member 23 is in the first position, at which time there is a gap between the top cover 22 and / or the heat sink 21 and the housing 30, which facilitates the insertion of the heat sink 20 and the overall module of the electronic device 10 into the housing 30; subsequently, by adjusting the adjusting member 23 to move it to the second position, the top cover 22 and the heat sink 21 are pushed and abut against the inner wall surface of the housing 30, while forming sufficient contact pressure, so that the heat sink 20 is fixed inside the housing 30.

[0035] In this embodiment, the top cover 22 is connected to the heat sink 21 by a plurality of fasteners, and the top cover 22 is movable relative to the fasteners. The fasteners can be screws, which pass through through holes in the top cover 22 and are threadedly connected to the heat sink 21, and the top cover 22 can move along the axial direction of the screw under the guidance of the screw, so that the top cover 22 is movably set relative to the heat sink 21.

[0036] When the top cover 22 is attached to the heat sink 21, the heat sink 20 can move within the housing 30. When the top cover 22 is at its furthest from the heat sink 21 by the limiting distance of each fastener, the heat sink 20 cannot enter the housing 30. Therefore, when the heat sink 20 is housed within the housing 30, the adjusting member 23 can make both the heat sink 21 and the top cover 22 abut against the inner wall of the housing 30, so as to stably fix the heat sink 20 and the electronic device 10 in the housing 30.

[0037] See also Figures 3 to 5 ,in Figure 4 yes Figure 3 The diagram shows a cross-sectional view of the heat dissipation module. Figure 5 yes Figure 3 The diagram shows the exploded structure of the heat sink in the heat dissipation module.

[0038] The heat sink 21 includes a first heat sink 211 and a second heat sink 212 respectively disposed on both sides of the electronic device 10. The first heat sink 211 and the second heat sink 212 are fixedly connected and clamp the electronic device 10. The top cover 22 is movably connected to the side of the second heat sink 212 opposite to the first heat sink 211. Figure 2 As shown, the inner wall surface of the housing 30 is provided with a guide groove 302, and the first heat sink 211 is slidably assembled with the guide groove 302.

[0039] The electronic device 10 is disposed between the first heat sink 211 and the second heat sink 212. When the electronic device 10 and the heat sink 20 are fixed in the housing 30, there is no force generated by direct contact between the electronic device 10 and the housing 30, which can avoid deformation or damage to the electronic device 10 due to force. The fixing effect with the housing 30 is achieved by the contact pressure formed between the heat sink 20 and the housing 30.

[0040] Both the first heat sink 211 and the second heat sink 212 are made of thermally conductive materials and achieve efficient heat conduction by being closely attached to the electronic device 10, so as to quickly transfer the heat generated by the electronic device 10.

[0041] In this embodiment, the housing 30 is cylindrical, and the two opposite inner wall surfaces of the housing 30 are adapted to the outer wall surfaces of the first heat sink 211 and the second heat sink 212, so that the heat sink 20 can enter the housing 30 from either end of the housing 30. At the same time, under the action of the adjusting member 23, the top cover 22 and the heat sink 21 can be tightly fitted to the inner wall surface of the housing 30 with a large contact area and abut against the inner wall surface of the housing 30, so that the heat sink 20 and the electronic device 10 can be more stably fixed in the housing 30.

[0042] The inner wall of the housing 30 is provided with a guide groove 302, which extends along the extension direction of the housing 30. The outer wall of the first heat sink 211 is provided with a slider that matches the guide groove 302. The slider is embedded in and slides within the guide groove 302 to guide the heat sink 20 to move smoothly along the extension direction of the housing 30. This matching structure of the guide groove 302 and the slider not only ensures the movement accuracy of the heat sink 20 within the housing 30, but also effectively prevents the heat sink 20 from shifting or shaking during installation or use, thereby improving the stability and reliability of the overall assembly. Furthermore, the guide groove 302 also helps to improve the utilization rate of the internal space of the housing 30, allowing the heat sink 20 to be smoothly installed or removed from either end of the housing 30, facilitating assembly and maintenance.

[0043] Furthermore, a heat dissipation channel 214 parallel to the guide groove 302 is formed between the second heat sink 212 and the electronic device 10. The second heat sink 212 has a through groove, and the electronic device 10 cooperates with the groove to form the heat dissipation channel 214. The heat dissipation channel 214 is arranged along the extension direction of the housing 30 so that heat can be quickly transferred to the outside of the housing 30 along a straight path. In addition, each heat-generating component on the electronic device 10 can be accommodated in the heat dissipation channel 214.

[0044] In this embodiment, as Figure 4 and Figure 5 As shown, a slide 203 is formed between the top cover 22 and the heat sink 21. The slide 203 includes a first plane 201 and a second plane 202 that are disposed opposite to each other. The distance between the first plane 201 and the second plane 203 gradually decreases along the extension direction of the slide 203. An adjusting member 23 is movably disposed in the slide 203. The adjusting member 23 is adjusted and moves along the extension direction of the slide 203, and acts on the first plane 201 and the second plane 202, so that the top cover 22 gradually moves away from the heat sink 21, thereby pressing and fixing the heat sink 20 and the electronic device 10 between the inner wall surfaces of the housing 30.

[0045] A slide 203 is formed between the top cover 22 and the second heat sink 212. The slide 203 is through-type and can be disposed on one of the second heat sink 212 and the top cover 22, while the other is essentially covered by the slide 203; alternatively, the slide 203 can be disposed on both the second heat sink 212 and the top cover 22, and the two are joined together to form a complete slide structure. An adjusting member 23 passes through the slide 203 and can slide along the extension direction of the slide 203 to adjust the distance between the top cover 22 and the heat sink 21. By moving the adjusting member 23, the top cover 22 can be gradually moved away from the second heat sink 212 of the heat sink 21, thereby pressing the heat sink 20 and the electronic device 10 between the inner wall surface of the housing 30; when the fixed state of the heat sink 20 and the electronic device 10 with the housing 30 is released, by moving the adjusting member 23 in the opposite direction, the top cover 22 can be gradually moved closer to the second heat sink 212, thereby releasing the pressing effect on the heat sink 20 and the electronic device 10, making it easier to remove the heat sink 20 and the electronic device 10 from the housing 10.

[0046] The extension direction of the slide 203 is consistent with the extension direction of the housing 30. This arrangement allows the movement direction of the adjusting member 23 to be consistent with the extension direction of the housing 30, making it easier to adjust the adjusting member 23. It also helps to improve the overall structural compactness and assembly efficiency of the heat dissipation module 100.

[0047] The first plane 201 is on the top cover 22, and the second plane 202 is on the second heat sink 212. The distance between the first plane 201 and the second plane 202 gradually decreases along the extension direction of the slide 203, thus forming a gradually narrowing guide space. This allows the adjusting member 23 to exert force on the first plane 201 and the second plane 202 as it slides along the extension direction of the slide 203, thereby pushing the top cover 22 to float relative to the second heat sink 212. When both the top cover 22 and the first heat sink 212 are in contact with the inner wall of the housing 30, the adjusting member 23 is pushed to continue moving along the extension direction of the slide 203. This allows the top cover 22 and the heat sink 21 to generate a large interaction force with the inner wall of the housing 30. This force can then be used to fix the heat sink 20 and the electronic device 10 inside the housing 30, realizing an integrated design for quick disassembly and assembly and stable fixation of the heat dissipation module 100, while improving the stability and reliability of the overall structure. This design not only facilitates the maintenance and replacement of the heat dissipation module 100, but also ensures that the heat dissipation module 100 maintains structural stability under complex working conditions such as high-frequency vibration, which helps to extend the overall service life of the heat dissipation module 100.

[0048] Furthermore, the first plane 201 and the second plane 202 are spaced apart along the first direction A. The width of the slide 203 in the second direction B, which is perpendicular to the first direction A, gradually decreases with the extension direction of the slide 203. The adjusting member 23 enters the slide 203 from the first end of the slide 203, and the second end of the slide 203 can prevent the adjusting member 23 from leaving the slide 203.

[0049] The slide 203 is a converging slide, and its cross-sectional shape gradually narrows from the first end to the second end. The distance between the first plane 201 and the second plane 202 along the first direction A gradually narrows along the extension direction of the slide 203, and the width of the slide 203 in the second direction B also gradually narrows along the extension direction. As a result, the slide 203 as a whole presents a tapered channel that gradually narrows along the extension direction. Its first end port is larger, which makes it easier to assemble the adjusting member 23 into the slide 203. Its second end port is smaller, which can prevent the adjusting member 23 from detaching from the slide 203 from the second port.

[0050] In this embodiment, the adjusting member 23 is wedge-shaped, and its cross-sectional shape matches that of the slide 203. The two side surfaces of the adjusting member 23 contact the first plane 201 and the second plane 202, respectively, thereby enabling more efficient movement of the top cover 22 relative to the second heat sink 212 through surface contact. The wedge-shaped columnar structure of the adjusting member 23, combined with the tapered channel design of the slide 203, ensures stable guidance and force transmission during sliding, thereby ensuring that the top cover 22 and the heat sink 21 fit tightly against the inner wall of the housing 30, improving the fixing reliability and assembly efficiency of the heat sink 20.

[0051] Optionally, the user can use a pressure rod to push the adjusting component 23 to move along the extension direction of the slide 203. The operation is simple and can realize the quick locking or releasing of the entire heat dissipation module 100.

[0052] Optionally, such as Figure 4 and Figure 5 As shown, the slide 203 passes through the radiator 20, and the adjusting member 23 is provided with a through threaded hole 230, which is threadedly connected to an adjusting screw (not shown in the figure). By rotating the adjusting screw, the adjusting member 23 is driven to move along the slide 203, so as to realize the floating adjustment between the top cover 22 and the radiator 21.

[0053] By rotating the adjusting screw, the movement distance of the adjusting component 23 along the slide 203 can be precisely controlled, thereby achieving precise fine-tuning of the contact pressure between the top cover 22 and the heat sink 21 and the housing 30, ensuring a firm fit between the heat sink 20 and the electronic components 10 and the inner wall of the housing 30, and improving the operating efficiency of the adjusting component 23.

[0054] Optionally, the slide 203 passes through the radiator 20, and the adjusting member 23 is equipped with a pulling part (not shown) at one end along the extension direction of the slide 203; wherein, by pulling the pulling part, the adjusting member 23 is moved along the slide 203, thereby realizing the floating adjustment between the top cover 22 and the radiator 21.

[0055] The pulling part can be a pull ring or a pull hook. The pulling part can be screwed to one end of the adjusting member 23. The adjusting member 23 can be slidably moved in the slide rail 203 by pulling the pulling part with external force.

[0056] Unlike existing technologies, this application discloses a heat dissipation module. By pre-connecting a heat sink to an electronic device, with the heat sink component and top cover movably configured, and an adjustable adjustment member between the heat sink component and top cover, when the electronic device and heat sink are housed in a housing, adjusting the position of the adjustment member between the top cover and the heat sink component pushes the top cover away from the heat sink component and against the inner wall of the housing. The heat sink component also abuts against the inner wall of the housing. Thus, both the top cover and the heat sink component are pressed firmly against the inner wall of the housing, achieving efficient and secure installation of the heat sink and electronic device as a whole module within the housing. Sufficient contact pressure is formed between the heat sink and the inner wall of the housing, ensuring sufficient stability between the heat dissipation module and the housing, thereby meeting the requirements of various vibration environments.

[0057] The above descriptions are merely embodiments of this application and do not limit the patent scope of this application. Any equivalent structural or procedural transformations made based on the description and drawings of this application, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this application. The technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the protection scope of this application.

Claims

1. A heat dissipation module, characterized in that, The heat dissipation module includes: Electronic devices; A heat sink includes a heat sink component, a top cover, and an adjusting component. The heat sink component is connected to the electronic device, the top cover is movably connected to the heat sink component, and the adjusting component is disposed between the heat sink component and the top cover. The housing, the heat sink, and the electronic components are housed within the housing; The adjusting member is used to be adjusted and moved, thereby pushing the top cover away from the heat sink and abutting against the inner wall surface of the housing, so as to fix the heat sink and the electronic device in the housing.

2. The heat dissipation module according to claim 1, characterized in that, A slide is formed between the top cover and the heat sink. The slide includes a first plane and a second plane that are disposed opposite to each other. The distance between the first plane and the second plane gradually decreases along the extension direction of the slide. The adjusting member is movably disposed within the slide rail. The adjusting member is adjusted and moves along the extension direction of the slide rail, and acts on the first plane and the second plane, so that the top cover gradually moves away from the heat sink, thereby pressing and fixing the heat sink and the electronic device between the inner wall surface of the housing.

3. The heat dissipation module according to claim 2, characterized in that, The slide rail passes through the radiator, and the adjusting member has a through threaded hole, which is threadedly connected to an adjusting screw; the adjusting member moves along the slide rail under the drive of the adjusting screw.

4. The heat dissipation module according to claim 2, characterized in that, The slide rail passes through the radiator, and a pulling part is installed at one end of the adjusting member along the extending direction; by pulling the pulling part, the adjusting member is moved along the slide rail.

5. The heat dissipation module according to claim 2, characterized in that, The first plane and the second plane are spaced apart along a first direction. The width of the slide in a second direction perpendicular to the first direction gradually decreases with the extension direction of the slide. The adjusting member enters the slide from the first end of the slide, and the second end of the slide can prevent the adjusting member from leaving the slide.

6. The heat dissipation module according to claim 5, characterized in that, The cross-sectional shape of the adjusting component is adapted to the cross-sectional shape of the slide; the two side surfaces of the adjusting component are in contact with the first plane and the second plane, respectively.

7. The heat dissipation module according to claim 1, characterized in that, The top cover is connected to the heat sink by a plurality of fasteners, and the top cover is movable relative to the fasteners.

8. The heat dissipation module according to claim 1, characterized in that, The heat sink includes a first heat sink and a second heat sink respectively disposed on both sides of the electronic device. The first heat sink and the second heat sink are fixedly connected. The top cover is movably connected to the side of the second heat sink opposite to the first heat sink. The inner wall surface of the housing is provided with a guide groove, and the first heat sink is slidably assembled with the guide groove.

9. The heat dissipation module according to claim 8, characterized in that, A heat dissipation channel parallel to the guide groove is formed between the second heat sink and the electronic device.

10. The heat dissipation module according to claim 8, characterized in that, The outer walls of the first and second heat sinks abut against the inner wall of the housing under the action of the adjusting member.

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