Electronic oil pump driver heat dissipation structure
Patent Information
- Application Number
- CN202521911923.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-09-05
- Publication Date
- 2026-09-15
- Estimated Expiration
- 2035-09-05
AI Technical Summary
[0003]然而,现有对电子油泵驱动器的散热过程中,当采用油泵电机内油液内循环散热方式时,油泵内循环的散热方式对油泵工作的介质温度有要求,常见的油泵工作温度需要在最高120℃油温85℃环温,而依靠120℃的油温对驱动器的散热效果很局限;当采用导热硅胶片紧贴后盖的散热方式时,其需要驱动器贴近后盖一面大面积留白,对驱动器布局设计有较大考验;当采用驱动器封在塑料后盖中依靠导热性较好的塑料材质向外界环境散热的方式时,塑料材质的导热性能难以比得上金属材料的导热性能
[0012] 1. This utility model utilizes the cooperation between the pump body, driver body, heat dissipation holes, thermal conductive gel, heat dissipation stem, and heat dissipation cover plate. It adopts the method of opening heat dissipation holes at several high-power MOSFET positions with high heat dissipation demand on the outer shell, and filling the space between the MOSFET and the aluminum heat dissipation cover plate with thermal conductive gel through the heat dissipation holes. Combined with the installation of the aluminum heat dissipation cover plate and heat dissipation stem, it can effectively transfer the heat of the high heat dissipation component of the driver to the external environment through heat conduction and convection heat transfer.
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Figure CN224760516U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of oil pump technology, specifically to a heat dissipation structure for an electronic oil pump driver. Background Technology
[0002] An electric fuel pump is a fuel delivery device driven by electricity, widely used in modern automobiles, motorcycles, industrial equipment, and other fields. Compared with traditional mechanical fuel pumps, it achieves more precise fuel supply through electronic control, improving energy efficiency and response speed. The operation of an electric fuel pump is powered by a drive unit. As the drive unit is used for extended periods, the heat generated by the drive unit can damage the electronic components, thus affecting the normal operation of the electric fuel pump. To maintain the normal operation of the electric fuel pump, it is necessary to cool the drive unit and reduce the damage caused by the heat generated by the drive unit to the electric fuel pump and its electronic components.
[0003] However, in the existing heat dissipation process of electronic oil pump drivers, when the internal circulation of oil inside the oil pump motor is used for heat dissipation, this method has requirements on the temperature of the medium in which the oil pump operates. Common oil pumps require a maximum operating temperature of 120℃ oil temperature and 85℃ ambient temperature, but relying on an oil temperature of 120℃ has limited heat dissipation effect on the driver. When the heat dissipation method of using thermally conductive silicone pads tightly attached to the back cover is used, a large area of blank space is required on the side of the driver close to the back cover, which poses a significant challenge to the driver layout design. When the driver is sealed in a plastic back cover and relies on the thermally conductive plastic material to dissipate heat to the external environment, the thermal conductivity of the plastic material is difficult to match that of the metal material. Utility Model Content
[0004] In view of the shortcomings of the prior art, this utility model provides a heat dissipation structure for an electronic oil pump driver, which has the advantages of improving the heat dissipation effect of the electronic oil pump driver, reducing the damage caused by high temperature to the electronic oil pump driver, and extending the service life of the electronic oil pump driver, thus solving the problems mentioned in the background art.
[0005] This utility model provides the following technical solution: a heat dissipation structure for an electronic oil pump driver, including a pump body, a driver body fixedly installed on the right end of the pump body via an output shaft, a housing fixedly sleeved on the outside of the driver body, a cover movably connected to the side of the housing away from the pump body, a plurality of heat dissipation holes opened on the housing, heat dissipation cover plates movably installed on the heat dissipation holes, thermally conductive gel filling the space between the surface of the MOSFET inside the housing and the heat dissipation cover plates, a side plate fixedly connected to the outside of the heat dissipation cover plates, the side plates being movably connected to the housing via a quick-release assembly, heat dissipation stems fixedly installed on the left and right sides of the housing, and multiple heat dissipation stems being fixedly installed on both sides of the side plates.
[0006] Preferably, a base is fixedly installed at the lower end of the pump body, and a first mounting plate located on the left side of the outer casing is fixedly connected to the right side of the pump body. A first connecting bolt is threaded onto the inner wall of the first mounting plate.
[0007] Preferably, a second mounting plate located to the right of the first mounting plate is fixedly installed on the left side of the outer casing. The inner wall of the second mounting plate is connected to the first mounting plate by a first connecting bolt. The front and back of the outer casing are respectively fixedly installed with locking blocks located on the upper and lower sides of the side plate. The inner wall of the outer side of the locking block is movably connected to the quick-release assembly. A third mounting plate located to the left of the casing cover is fixedly installed on the right side of the outer casing.
[0008] Preferably, a fourth mounting plate located to the right of the third mounting plate is fixedly installed on the left side of the shell cover. The inner wall of the fourth mounting plate is threaded with a second connecting bolt. The fourth mounting plate is movably connected to the third mounting plate through the second connecting bolt. Several through holes are provided on the front and back of the shell cover.
[0009] Preferably, the quick-release assembly includes a fixing block, a spring, and a pressing block. The inner end of the fixing block is fixedly connected to the outer side of the side plate. One end of the spring is fixedly connected to the inner wall of the fixing block, and the other end of the spring is fixedly connected to the pressing block. The pressing block is movably connected to the locking block.
[0010] Preferably, a cylindrical hole is provided through the outer side of the locking block, and the inner wall of the cylindrical hole is movably sleeved with the outer wall of the pressing block.
[0011] Compared with the prior art, the present invention has the following beneficial effects:
[0012] 1. This utility model utilizes the cooperation between the pump body, driver body, heat dissipation holes, thermal conductive gel, heat dissipation stem, and heat dissipation cover plate. It adopts the method of opening heat dissipation holes at several high-power MOSFET positions with high heat dissipation demand on the outer shell, and filling the space between the MOSFET and the aluminum heat dissipation cover plate with thermal conductive gel through the heat dissipation holes. Combined with the installation of the aluminum heat dissipation cover plate and heat dissipation stem, it can effectively transfer the heat of the high heat dissipation component of the driver to the external environment through heat conduction and convection heat transfer.
[0013] 2. This utility model achieves the connection between the heat dissipation cover and the outer shell by cooperating with the driver body, heat dissipation holes, heat dissipation cover, and quick-release assembly. By changing the connection method between the quick-release assembly and the locking block, it is easy to remove the heat dissipation cover from the heat dissipation holes, and it is also easy to install the heat dissipation cover on the heat dissipation holes, thereby increasing the flexibility of the heat dissipation cover in actual use. Attached Figure Description
[0014] Figure 1 This is a schematic diagram of the structure of this utility model;
[0015] Figure 2 This is a rear view of the pump body of this utility model;
[0016] Figure 3 This is a side view of the heat dissipation hole of this utility model;
[0017] Figure 4 This is a cross-sectional view of the thermally conductive gel of this invention;
[0018] Figure 5 This is a cross-sectional view of the outer casing of this utility model;
[0019] Figure 6 This is a cross-sectional view of the quick-release assembly of this utility model.
[0020] In the diagram: 1. Pump body; 2. Driver body; 3. Housing; 4. Housing cover; 5. Heat dissipation hole; 6. Thermal conductive gel; 7. Heat dissipation cover plate; 8. Side plate; 9. Quick release assembly; 901. Fixing block; 902. Spring; 903. Pressing block; 10. Heat dissipation stem; 11. Base; 12. First mounting plate; 13. First connecting bolt; 14. Second mounting plate; 15. Clamping block; 16. Cylindrical hole; 17. Third mounting plate; 18. Through hole; 19. Fourth mounting plate; 20. Second connecting bolt. Detailed Implementation
[0021] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.
[0022] Please see Figure 1 and Figure 5A heat dissipation structure for an electronic oil pump driver includes a pump body 1. A driver body 2 is fixedly mounted on the right end of the pump body 1 via an output shaft. A housing 3 is fixedly sleeved around the driver body 2. A cover 4 is movably connected to the side of the housing 3 away from the pump body 1. The housing 3 has several heat dissipation holes 5, which are semi-circular open holes. A heat dissipation cover 7 is movably mounted on each heat dissipation hole 5, and the shape of the heat dissipation cover 7 is adapted to the shape of the heat dissipation hole 5. Thermally conductive gel 6 is filled between the surface of the MOSFET inside the housing 3 and the heat dissipation cover 7. The thermally conductive gel 6 connects the MOSFET at its location to the heat dissipation cover 7, transferring the heat generated by the MOSFET to the heat dissipation cover 7 through the thermally conductive gel 6. A side plate 8 is fixedly connected to the outside of the heat dissipation cover 7. The side plate 8 is movably connected to the housing 3 via a quick-release assembly 9. The quick-release assembly 9 enables the connection between the heat dissipation cover 7 and the housing 3. By changing the connection method between the quick-release assembly 9 and the housing 3, it is easier to remove the heat sink cover 7 from the heat dissipation hole 5, and it is also easier to install the heat sink cover 7 on the heat dissipation hole 5, thereby increasing the flexibility of the heat sink cover 7 in actual use. The heat sink cover 7 and the side plate 8 are both aluminum heat sinks and are integrally formed. Heat sink stems 10 are fixedly installed on the left and right sides of the housing 3, and multiple heat sink stems 10 are fixedly installed on both sides of the side plate 8. Several heat dissipation holes 5 opened on the housing 3 are directed to the high-power MOSFETs with high heat dissipation requirements. Since the MOSFETs are coated with thermal conductive gel 6, the thermal conductive gel 6 is used to conduct the heat on the MOSFETs to the aluminum heat sink cover 7. Furthermore, since the heat sink stems 10 are installed at both ends on the side plate 8, the heat of the high heat dissipation component of the driver body 2 is effectively transferred to the external environment through heat conduction and convection heat transfer.
[0023] A base 11 is fixedly installed at the lower end of the pump body 1. A first mounting plate 12 located on the left side of the outer casing 3 is fixedly connected to the right side of the pump body 1. The first mounting plate 12 is configured to provide support and platform for the installation of the first connecting bolt 13. The inner wall of the first mounting plate 12 is threaded with the first connecting bolt 13.
[0024] Please see Figure 2 and Figure 4 A second mounting plate 14 located to the right of the first mounting plate 12 is fixedly installed on the left side of the outer casing 3. The inner wall of the second mounting plate 14 is connected to the first mounting plate 12 by a first connecting bolt 13. The first connecting bolt 13 is used to connect the first mounting plate 12 and the second mounting plate 14. The front and back of the outer casing 3 are respectively fixedly installed with locking blocks 15 located on the upper and lower sides of the side plate 8. The inner wall of the outer side of the locking block 15 is movably connected to the quick-release assembly 9. A third mounting plate 17 located to the left of the cover 4 is fixedly installed on the right side of the outer casing 3.
[0025] A fourth mounting plate 19 is fixedly installed on the left side of the cover 4, located to the right of the third mounting plate 17. The inner wall of the fourth mounting plate 19 is threaded with a second connecting bolt 20. The fourth mounting plate 19 is movably connected to the third mounting plate 17 through the second connecting bolt 20. The second connecting bolt 20 serves to connect the fourth mounting plate 19 and the third mounting plate 17. Several through holes 18 are provided on the front and back of the cover 4.
[0026] Please see Figure 3 and Figure 6 The quick-release assembly 9 includes a fixing block 901, a spring 902, and a pressing block 903. The inner end of the fixing block 901 is fixedly connected to the outer side of the side plate 8. One end of the spring 902 is fixedly connected to the inner wall of the fixing block 901. The spring 902 is used to connect the fixing block 901 and the pressing block 903. The other end of the spring 902 is fixedly connected to the pressing block 903. The pressing block 903 is movably connected to the locking block 15.
[0027] A cylindrical hole 16 is provided through the outer side of the locking block 15, and the inner wall of the cylindrical hole 16 is movably sleeved with the outer wall of the pressing block 903. When the pressing block 903 is pressed, it moves into the interior of the fixing block 901. At the same time as the pressing block 903 moves, the spring 902 is compressed until the pressing block 903 is completely pressed into the interior of the fixing block 901. The fixing block 901 is placed into the interior of the locking block 15. The spring 902 rebounds and the pressing block 903 pops out from the interior of the cylindrical hole 16, so that the quick-release component 9 can connect the outer shell 3 and the side plate 8, and achieve the effect of pressing the heat dissipation cover 7 onto the heat dissipation hole 5.
[0028] Working principle: In use, firstly, the driver body 2 is installed inside the housing 3, and heat dissipation holes 5 are opened on the housing 3 at the positions of several high-power MOSFETs with high heat dissipation requirements. 5W of thermal conductive gel 6 is applied to the MOSFETs at the heat dissipation holes 5, and then an aluminum heat dissipation cover plate 7 is pressed on. The heat dissipation cover plate 7 is integrally formed with the side plate 8. Since the heat dissipation stem 10 adopts a two-end installation method on the side plate 8, the heat of the high heat dissipation components of the driver body 2 is effectively transferred to the external environment through heat conduction and convection heat transfer. Then, the heat dissipation cover plate is installed. At 7 o'clock, press the pressing block 903 to move it into the fixed block 901. While the pressing block 903 is moving, the spring 902 is compressed until the pressing block 903 is completely pressed into the fixed block 901. Place the fixed block 901 into the locking block 15. Use the rebound of the spring 902 to pop the pressing block 903 out of the cylindrical hole 16. This will connect the quick-release component 9 to the outer shell 3 and the side plate 8, and achieve the effect of pressing the heat dissipation cover 7 onto the heat dissipation hole 5. Finally, by changing the connection method between the quick-release component 9 and the cylindrical hole 16, the side plate 8 can be disassembled.
[0029] It should be noted that, in this document, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Additionally, in the accompanying drawings of this utility model, the fill patterns are merely for distinguishing layers and do not constitute any other limitation.
[0030] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.
Claims
1. A heat dissipation structure for an electronic oil pump driver, comprising a pump body (1), characterized in that: The right end of the pump body (1) is fixedly installed with a driver body (2) via an output shaft. The driver body (2) is fixedly fitted with a housing (3). The housing (3) is movably connected with a cover (4) on the side away from the pump body (1). The housing (3) has several heat dissipation holes (5). A heat dissipation cover plate (7) is movably installed on the heat dissipation holes (5). Thermal conductive gel (6) is filled between the surface of the MOS tube inside the housing (3) and the heat dissipation cover plate (7). A side plate (8) is fixedly connected to the outside of the heat dissipation cover plate (7). The side plate (8) is movably connected to the housing (3) via a quick-release assembly (9). Heat dissipation stems (10) are fixedly installed on the left and right sides of the housing (3), and multiple heat dissipation stems (10) are fixedly installed on both sides of the side plate (8).
2. The heat dissipation structure for an electronic oil pump driver according to claim 1, characterized in that: The pump body (1) is fixedly installed with a base (11) at the lower end, and a first mounting plate (12) located on the left side of the outer shell (3) is fixedly connected to the right side of the pump body (1). A first connecting bolt (13) is threadedly connected to the inner wall of the first mounting plate (12).
3. The heat dissipation structure for an electronic oil pump driver according to claim 2, characterized in that: The outer shell (3) is fixedly installed with a second mounting plate (14) located to the right of the first mounting plate (12). The inner wall of the second mounting plate (14) is connected to the first mounting plate (12) by a first connecting bolt (13). The front and back of the outer shell (3) are fixedly installed with locking blocks (15) located on the upper and lower sides of the side plate (8). The inner wall of the outer side of the locking block (15) is movably connected to the quick-release assembly (9). The right side of the outer shell (3) is fixedly installed with a third mounting plate (17) located to the left of the shell cover (4).
4. The heat dissipation structure for an electronic oil pump driver according to claim 3, characterized in that: The left side of the cover (4) is fixedly installed with a fourth mounting plate (19) located to the right of the third mounting plate (17). The inner wall of the fourth mounting plate (19) is threaded with a second connecting bolt (20). The fourth mounting plate (19) is movably connected to the third mounting plate (17) through the second connecting bolt (20). Several through holes (18) are provided on the front and back of the cover (4).
5. The heat dissipation structure for an electronic oil pump driver according to claim 3, characterized in that: The quick-release assembly (9) includes a fixing block (901), a spring (902) and a pressing block (903). The inner end of the fixing block (901) is fixedly connected to the outer side of the side plate (8). One end of the spring (902) is fixedly connected to the inner wall of the fixing block (901). The other end of the spring (902) is fixedly connected to the pressing block (903). The pressing block (903) is movably connected to the locking block (15).
6. The heat dissipation structure for an electronic oil pump driver according to claim 5, characterized in that: The outer side of the locking block (15) is provided with a cylindrical hole (16), and the inner wall of the cylindrical hole (16) is movably sleeved with the outer wall of the pressing block (903).