A combined heat dissipation structure of a high-power power supply module

Abstract

The utility model aims at providing a combination heat dissipation structure of high power supply module which has high heat dissipation performance and supports high complexity and high density wiring. The utility model discloses a multilayer printed circuit board and heat dissipation baseplate, one side of heat dissipation baseplate is connected with multilayer printed circuit board electricity and heat conduction, the other side of heat dissipation baseplate is pasted with external heat dissipation structure, heat dissipation baseplate sets up several high power devices. The utility model is applied to the technical field of heat dissipation structure.

Description

Technical Field

[0001] This invention relates to the technical field of heat dissipation structures, and in particular to a combined heat dissipation structure for a high-power power module. Background Technology

[0002] As power electronic devices evolve towards higher power density and miniaturization, thermal management of power modules using conductive heat dissipation methods becomes particularly critical. Traditional structures, to ensure sufficient heat dissipation and complete electrical connections, typically employ a single structure based on a multi-layered metal substrate, such as an aluminum substrate, copper substrate, or all-ceramic substrate with multi-layer wiring capabilities. While such structures offer good thermal conductivity, they are expensive to manufacture, involve complex processes, and are limited by the processing characteristics of metal substrates, restricting the maximum number of wiring layers and wiring flexibility. This makes it difficult to meet the demands of highly complex signal and power routing while simultaneously maintaining low cost.

[0003] In existing high-power power module designs, some solutions employ FR4 multilayer boards for electrical wiring and external heat sinks for cooling. While this approach allows for high wiring density using FR4 material, the low thermal conductivity of FR4 means heat must travel a long path to reach the external heat sink, resulting in high thermal resistance and inefficient heat dissipation. This solution is ill-suited for the thermal management requirements of modular, form-factory power module units that demand small size, high power density, and where the system dictates the use of conductive cooling.

[0004] Therefore, a heat dissipation structure that can achieve high heat dissipation performance and support highly complex, high-density wiring is needed to solve the above-mentioned technical problems. Utility Model Content

[0005] The technical problem to be solved by this utility model is to overcome the shortcomings of the prior art and provide a combined heat dissipation structure for high-power power modules with high heat dissipation performance and support for high-complexity and high-density wiring.

[0006] The technical solution adopted by this utility model is as follows: This utility model includes a multilayer printed circuit board and a heat dissipation substrate. One side of the heat dissipation substrate is electrically and thermally connected to the multilayer printed circuit board, and the other side of the heat dissipation substrate is attached to an external heat dissipation structure. The heat dissipation substrate is provided with several high-power devices.

[0007] As can be seen from the above solution, the heat dissipation substrate serves as the carrier circuit board for high-power devices, leveraging its high thermal conductivity to rapidly dissipate heat from these devices. Simultaneously, it utilizes the advantages of multilayer printed circuit boards (PCBs) in handling complex multilayer wiring, improving the overall circuit integration and overcoming the limitation of a single high-thermal-conductivity circuit board in handling highly complex wiring. Furthermore, the composite stacked structure of the multilayer PCB and the heat dissipation substrate facilitates heat dissipation from the multilayer PCB and achieves rapid heat dissipation.

[0008] In a preferred embodiment, several of the high-power devices are connected to each other via interconnects on the multilayer printed circuit board.

[0009] In a preferred embodiment, the multilayer printed circuit board is connected to the heat dissipation substrate by soldering or pressing.

[0010] In a preferred embodiment, the heat dissipation substrate is provided with heat-conducting pillars, and the multilayer printed circuit board is provided with corresponding conductive holes that cooperate with the heat-conducting pillars.

[0011] A preferred embodiment is that a non-heat-generating control device is disposed on the multilayer printed circuit board.

[0012] In a preferred embodiment, the heat dissipation substrate is a metal substrate or a ceramic substrate. Attached Figure Description

[0013] Figure 1 This is a schematic diagram of the structure of this utility model. Detailed Implementation

[0014] like Figure 1 As shown, in this embodiment, the present invention includes a multilayer printed circuit board 1 and a heat dissipation substrate 2. One side of the heat dissipation substrate 2 is electrically and thermally connected to the multilayer printed circuit board 1, and the other side of the heat dissipation substrate 2 is attached to an external heat dissipation structure. The heat dissipation substrate 2 is provided with a plurality of high-power devices 3, and the multilayer printed circuit board 1 is provided with non-heat-generating control devices 6. The heat dissipation substrate 2 is an aluminum substrate, a copper substrate, or a ceramic substrate, and the multilayer printed circuit board 1 is a multilayer FR4 printed circuit board. Through the composite stacked structure of the multilayer printed circuit board 1 and the heat dissipation substrate 2, high-complexity wiring and high integration are achieved while efficient heat dissipation is achieved using the heat dissipation substrate 2, reducing the need for high-cost and difficult-to-process high thermal conductivity substrates, thereby reducing the overall cost. The high-power devices 3 are disposed on the heat dissipation substrate 2 so that the generated heat is directly conducted to the heat dissipation structure through the heat dissipation substrate 2 itself, thereby effectively controlling the operating temperature.

[0015] In this embodiment, several high-power devices 3 are connected to each other via interconnecting lines on the multilayer printed circuit board 1. When it is impossible to connect several high-power devices 3 using a single-layer trace, interconnecting lines are used as power lines to cross over onto the multilayer printed circuit board 1, thereby achieving multilayer traces for the high-power devices 3 located on the heat dissipation substrate 2, where multilayer circuits are difficult to fabricate. In this embodiment, the multilayer printed circuit board 1 and the heat dissipation substrate 2 are connected by soldering or pressing. Soldering or pressing achieves a low thermal resistance and high reliability connection between the layers of the multilayer printed circuit board 1 and the heat dissipation substrate 2.

[0016] In this embodiment, a heat-conducting pillar 4 is provided on the heat dissipation substrate 2, and a conductive hole 5 corresponding to the heat-conducting pillar 4 is provided on the multilayer printed circuit board 1. The heat-conducting pillar 4 and the conductive hole 5 work together to enhance local heat conduction. At the same time, the conductive hole 5 also accommodates the winding circuit of the high-power device 3, ensuring that the heat generated by the high-power device 3 does not affect the rest of the structure on the multilayer printed circuit board 1.

[0017] Although the embodiments of this utility model are described with reference to actual solutions, they do not constitute a limitation on the meaning of this utility model. For those skilled in the art, modifications to the implementation schemes and combinations with other schemes based on this specification are obvious.

Claims

1. A combined heat dissipation structure for a high-power power supply module, characterized in that: It includes a multilayer printed circuit board (1) and a heat dissipation substrate (2). One side of the heat dissipation substrate (2) is electrically and thermally connected to the multilayer printed circuit board (1), and the other side of the heat dissipation substrate (2) is attached to an external heat dissipation structure. The heat dissipation substrate (2) is provided with several high-power devices (3).

2. The combined heat dissipation structure for a high-power power module according to claim 1, characterized in that: Several of the high-power devices (3) are connected to each other via winding lines on the multilayer printed circuit board (1).

3. The combined heat dissipation structure for a high-power power module according to claim 1, characterized in that: The multilayer printed circuit board (1) is connected to the heat dissipation substrate (2) by brazing or pressing.

4. The combined heat dissipation structure for a high-power power module according to claim 3, characterized in that: The heat dissipation substrate (2) is provided with heat-conducting pillars (4), and the multilayer printed circuit board (1) is provided with conductive holes (5) that cooperate with the heat-conducting pillars (4).

5. The combined heat dissipation structure for a high-power power module according to claim 1, characterized in that: A non-heat-generating control device (6) is provided on the multilayer printed circuit board (1).

6. The combined heat dissipation structure for a high-power power module according to claim 1, characterized in that: The heat dissipation substrate (2) is a metal substrate or a ceramic substrate.

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