Graphene composite heat-conducting shielding member and electronic device

Abstract

The utility model discloses a kind of graphene composite heat-conducting shielding, including following structure: graphene heat-conducting matrix;Foam, foam connects the periphery of graphene heat-conducting matrix, and part surface or all surface of foam is covered by conductive cloth, the graphene composite heat-conducting shielding provided by the utility model gives consideration to the heat dissipation and shielding demand of electronic component in electronic equipment, and overall has flexible characteristics, air gap can be filled, the close fit between graphene composite heat-conducting shielding and heating component, heat-dissipating component in electronic component can be realized.

Description

Technical Field

[0001] This utility model relates to the field of thermal management, specifically to a graphene-based composite thermally conductive shielding component. Background Technology

[0002] The internal electromagnetic environment of electronic devices is extremely complex. High-speed components such as processors (CPU chips / GPU chips), memory, radio frequency modules (4G / 5G, Wi-Fi, Bluetooth), and power management chips all generate high-frequency electromagnetic waves during operation. For example, a CPU generates strong electromagnetic noise under heavy load. If a nearby radio frequency module is receiving weak Wi-Fi or GPS signals, which may be millions of times weaker than the noise generated by the CPU, without isolation, the CPU noise will completely "drows over" the useful signals, leading to problems such as network interruptions, GPS location drift, and intermittent Bluetooth audio.

[0003] Therefore, it is necessary to isolate some chips or electronic components using shielding components to confine the electromagnetic waves they generate within the shielding components, while also preventing external electromagnetic waves from entering the shield and interfering with the chips. This provides a "quiet" working environment for sensitive components.

[0004] Meanwhile, electronic components release a lot of heat during operation. For example, for every 20% increase in heat in a chip, its performance drops by 50%. Therefore, while achieving electromagnetic shielding, it is also necessary to consider the heat dissipation of each electronic component. Utility Model Content

[0005] Based on the above reasons, the first aspect of this application provides a graphene composite thermal conductive shield to meet the heat dissipation and shielding requirements of electronic components within electronic devices. Furthermore, the graphene composite thermal conductive shield provided by this application possesses overall flexibility, capable of filling air gaps and achieving a tight fit between the graphene composite thermal conductive shield and heat-generating and heat-dissipating components. This graphene composite thermal conductive shield has the following structure: Graphene, as a thermally conductive substrate, serves a thermal conductivity function, allowing it to closely adhere to the heat-generating and heat-dissipating components of electronic devices, filling air gaps and providing a thermal conduction path. Simultaneously, because graphene is a two-dimensional honeycomb lattice structure formed by a single layer of carbon atoms with sp2 hybridization, the electrons between carbon atoms have extremely high degrees of freedom, resulting in extremely high electrical conductivity. When electromagnetic waves propagate to the surface of the graphene material, free electrons move rapidly under the influence of the electric field, forming an induced current opposite to the direction of the incoming electromagnetic wave. This induced current generates a new electromagnetic field, which cancels out the incoming electromagnetic field, thus reflecting most of the electromagnetic energy back. Therefore, the graphene thermally conductive substrate also acts as an electromagnetic shield. The graphene composite thermally conductive shielding component provided in this application also includes foam connected around the graphene thermally conductive substrate, and part or all of the surface of the foam is covered with conductive cloth. Exposed graphene is prone to side powder shedding during use. Graphene is also a highly conductive material, and this shedding powder can cause short circuits on the circuit board. Encasing the graphene thermally conductive substrate with foam effectively prevents this powder shedding. Simultaneously, covering part or all of the foam's surface with conductive fabric—woven from conductive fibers—provides excellent electrical conductivity and electromagnetic wave reflection capabilities. The fabric's weave structure, with gaps between the conductive fibers, helps absorb some of the energy from high-frequency electromagnetic waves, thus providing electromagnetic shielding to the foam.

[0006] This structural design enables the graphene composite thermally conductive shielding component to possess both thermal conductivity and electromagnetic shielding capabilities, while also exhibiting flexibility.

[0007] Furthermore, the compressive stress of the foam is less than that of the graphene thermal conductive substrate. That is, the foam has greater elasticity than the graphene thermal conductive substrate. When the graphene composite thermal conductive shielding component provided in this application is assembled, under assembly pressure, the foam requires less pressure to produce greater elastic deformation, resulting in less resistance. This ensures a tight fit between the graphene thermal conductive substrate and the heat-generating and heat-dissipating components. Simultaneously, the foam is bonded with conductive cloth, which has better flexibility than conventional shielding materials such as metal foil and metal plates, thus having less impact on the compressive stress of the foam.

[0008] The connection between the graphene thermal conductive substrate and the foam can be achieved through mortise and tenon joints, adhesive bonding, mechanical fastening, etc., without specific limitations.

[0009] Preferably, based on the characteristics of soft and highly elastic foam, the graphene composite thermal conductive shielding component provided in this application further includes an adhesive layer, which is disposed on the periphery of the graphene thermal conductive substrate to bond the foam to the graphene thermal conductive substrate.

[0010] Furthermore, the adhesive layer is a conductive adhesive to prevent it from affecting the shielding performance of the graphene composite thermally conductive shield; even further, the adhesive layer is a pressure-sensitive conductive adhesive, which has initial tack and allows for position adjustment before curing, reducing the scrap rate.

[0011] Furthermore, the thickness of the foam is greater than the thickness of the graphene thermal conductive substrate, and one bottom surface of the foam is at the same horizontal plane as one bottom surface of the graphene thermal conductive substrate. When heat-generating components such as chips are mounted on a PCB substrate, there is usually a height difference between the foam and the substrate, while the heat dissipation components opposite the PCB substrate are macroscopically flat and horizontal. Given that the foam thickness is greater than the graphene thermal conductive substrate thickness, and one bottom surface of the foam is at the same horizontal plane as one bottom surface of the graphene thermal conductive substrate, the graphene composite thermal conductive shielding component provided in this application has an overall "concave" structure. The horizontal side of the graphene composite shielding component contacts the heat dissipation component, while on the side with the uneven height difference, the graphene thermal conductive substrate directly contacts the heat-generating components such as chips, and the protruding foam portion abuts against the PCB substrate. This structural design has the following two beneficial effects: The thermal resistance of graphene thermal conductive substrate can be as low as 0.06 K·cm² / W, while the thermal resistance of air is >1700 K·cm² / W. Directly contacting the graphene thermal conductive substrate with the heat-generating and heat-dissipating components can improve the heat transfer efficiency from the heat-generating components to the heat-dissipating components. Conventional foam usually does not have good thermal conductivity. The fact that the foam does not directly contact the heat-generating components can also prevent the thermal conductivity from decreasing. Graphene composite thermally conductive shielding components act like a closed shell enveloping heat-generating parts. This closed shell creates a Faraday cage effect, providing excellent electromagnetic shielding performance. Specifically, its shielding effectiveness is ≥75dB, and it can attenuate electromagnetic wave intensity by more than 99.9%.

[0012] Furthermore, grooves are provided around the foam, and the graphene thermal conductive substrate is embedded in the grooves, thereby providing a larger bonding area between the graphene thermal conductive substrate and the foam, resulting in a stronger connection.

[0013] Furthermore, the foam can be any one of polyurethane foam, polyethylene foam, rubber foam, silicone foam, or polyolefin foam.

[0014] Furthermore, the graphene thermal conductive substrate can be any one of the following: a graphene thermal conductive film, a graphene TIM film with micron- and / or nano-sized pores inside, or a graphene thermal conductive pad formed by vertically stacking multiple graphene TIM sheets.

[0015] Specifically, graphene thermal conductive film refers to graphene oxide slurry prepared by oxidizing graphite with strong acid (such as sulfuric acid) and strong oxidant (such as potassium permanganate), which is then coated and dried to obtain graphene oxide film, and then reduced at high temperature. The horizontal thermal conductivity of graphene thermal conductive film is ≥1000W / (m·K). Specifically, graphene TIM film refers to graphene oxide slurry prepared by oxidizing graphite with strong acid (such as sulfuric acid) and strong oxidant (such as potassium permanganate), which is then coated and dried to obtain graphene oxide film. After foaming with chemical reducing agent (such as hydrazine hydrate) and high-temperature reduction, it is obtained. Because the graphene TIM film has nano-scale and / or micro-scale pores, it has good compression and buffering capacity. It can fill the tiny gaps on the surface of heat-generating and heat-dissipating devices, greatly reducing the impact of air thermal resistance. Moreover, the pore wall interface can provide a large number of multiple reflection and scattering opportunities for electromagnetic waves. In this process, the electromagnetic wave energy is continuously attenuated and absorbed. Therefore, using graphene TIM film as a graphene thermal conductive layer not only plays a role in heat conduction, but also has a better electromagnetic shielding effect. Specifically, the graphene thermal pad is formed by vertically stacking multiple graphene TIM sheets. Since the in-plane (horizontal) thermal conductivity of the graphene TIM film is higher than that in the thickness (vertical) direction, stacking multiple layers of it vertically transfers its excellent thermal conductivity in the original horizontal direction to the vertical direction, resulting in higher thermal conductivity and heat dissipation efficiency. At the same time, the in-plane thermal resistance of the graphene TIM film is much lower than its thermal resistance in the thickness direction. Therefore, vertically arranging the TIM film can also reduce the thermal resistance of the material itself.

[0016] The second aspect of this application provides an electronic device, which includes the graphene composite thermally conductive shielding component provided in the first aspect of this application, and also includes a heat dissipation component and a heat-generating component, wherein the graphene composite thermally conductive shielding component is disposed between the heat dissipation component and the component. The heat-generating component can be one of the following: processor chip, power management chip, memory chip, or radio frequency module chip. The heat dissipation component can be either a heat sink or a heat dissipation backplate.

[0017] Furthermore, the heating element is encased in the graphene composite thermally conductive shield. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 This is a schematic diagram showing the presence of air gaps between interfaces; Figure 2 A top view of the graphene composite thermally conductive shielding component provided in some embodiments of this application. Figure 3 for Figure 2 AA section diagram Figure 4 A cross-sectional view of the graphene composite thermally conductive shielding component provided in some embodiments of this application. Figure 5 A cross-sectional view of the graphene composite thermally conductive shielding component provided in some embodiments of this application. Figure 6 A top view of the graphene composite thermally conductive shielding component provided in some embodiments of this application. Figure 7 for Figure 6 AA section diagram Figure 8 A cross-sectional view of the graphene composite thermally conductive shielding component provided in some embodiments of this application. Figure 9 A cross-sectional view of the graphene composite thermally conductive shielding component provided in some embodiments of this application. Figure 10 This is a schematic diagram illustrating the installation of the graphene composite thermally conductive shielding component provided in some embodiments of this application within an electronic device. Detailed Implementation

[0020] To make the utility model's objectives, features, and advantages more apparent and understandable, the technical solutions in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the embodiments described below are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present utility model.

[0021] Electronic devices (such as mobile phones, tablets, computers, smartwatches, AR devices, etc.) have an extremely complex electromagnetic environment inside. In order to prevent interference from different electromagnetic waves, some chips or electronic components need to be isolated using shielding components to confine the electromagnetic waves they generate within the shielding components. At the same time, it can also prevent external electromagnetic waves from entering the shield and interfering with the chip. This provides a "quiet" working environment for sensitive components.

[0022] Meanwhile, electronic components release a lot of heat during operation. For example, for every 20% increase in heat in a chip, its performance drops by 50%. Therefore, while ensuring that each electronic component is in an electromagnetically shielded environment, its heat dissipation must also be taken into account.

[0023] Traditional shielding components in existing technologies are metal shielding covers, such as nickel silver shielding covers. However, these covers are made of rigid materials and have virtually no flexibility. In contrast, [the following text appears to be a separate, unrelated section:] Figure 1 As shown, when a metal shield comes into direct contact with electronic components and heat dissipation parts, a large air gap exists between the surfaces of the two materials at the microscopic level. Since air has a high thermal resistance, this significantly affects the heat dissipation of chips and other electronic components. Although existing technologies use thermal grease or similar materials to fill the space between the chip and the shield to aid heat dissipation, the application of thermal grease carries the risk of pumping out.

[0024] This application provides a graphene composite thermal conductive shield to meet the heat dissipation and shielding requirements of electronic components in electronic devices. The graphene composite thermal conductive shield provided by this application has overall flexibility, which can fill air gaps and achieve a tight fit between the graphene composite thermal conductive shield and the heat-generating and heat-dissipating components.

[0025] Figure 2 This is a top view of the graphene composite thermally conductive shielding component provided in some embodiments of this application. Figure 3 for Figure 2 The AA cross-sectional view of the graphene composite thermally conductive shielding component provided in the embodiment is shown in the figure below. Figures 2-3 The graphene composite thermal conductive shielding component includes a graphene thermal conductive substrate 2 and foam 3. The foam is connected around the graphene thermal conductive substrate, and part of the surface of the foam 3 is covered with conductive cloth 4.

[0026] The connection between the graphene thermal conductive substrate 2 and the foam 3 can be achieved by mortise and tenon joints, adhesive bonding, mechanical fastening, etc., and no specific restrictions are imposed here.

[0027] The foam can be any one of polyurethane foam, polyethylene foam, rubber foam, silicone foam, or polyolefin foam. The foam only needs to have compression and resilience properties, and no specific restrictions are imposed here.

[0028] The graphene thermally conductive substrate 2 serves both as a heat conductor and a shield in this graphene composite thermally conductive shield. This is because, firstly, the graphene thermally conductive substrate 2 has high thermal conductivity and compressibility and resilience, allowing it to closely adhere to the heat-generating and heat-dissipating components of electronic devices, filling air gaps and providing a heat conduction path. Secondly, graphene has extremely high electrical conductivity. When electromagnetic waves are transmitted to the surface of the graphene material, free electrons move rapidly under the influence of the electric field, forming an induced current opposite to the direction of the incoming electromagnetic wave. This induced current generates a new electromagnetic field, which cancels out the incoming electromagnetic field, thus reflecting most of the electromagnetic energy back. Consequently, the graphene thermally conductive substrate 2 also serves as an electromagnetic shield.

[0029] The exposed graphene thermal conductive substrate 2 is prone to side powder shedding during use. Placing foam 3 around the graphene thermal conductive substrate can effectively prevent powder shedding. Moreover, placing foam 3 around the graphene thermal conductive substrate 2 does not affect the heat conduction path of the graphene thermal conductive substrate.

[0030] Meanwhile, conductive cloth 4 is wrapped around the surface of foam 3. Conductive cloth 4 is woven from conductive fibers. It has good electrical conductivity and good electromagnetic wave reflection capability. The weaving structure of the conductive cloth creates gaps between the conductive fibers, which helps to absorb some of the energy of high-frequency electromagnetic waves. Therefore, the foam wrapped with conductive cloth also has electromagnetic shielding capability.

[0031] This structural design enables the graphene composite thermally conductive shielding component to possess both thermal conductivity and electromagnetic shielding capabilities.

[0032] In some embodiments of this application, the compressive stress of the foam 3 is less than that of the graphene thermally conductive substrate 2. That is, the foam has greater elasticity than the graphene thermally conductive substrate. When the graphene composite thermally conductive shielding component provided in this application is assembled, under the assembly pressure, the foam only needs less pressure to produce greater elastic deformation, and the resulting resistance is also smaller. Therefore, it can ensure a tight fit between the graphene thermally conductive substrate and the heat-generating and heat-dissipating components. At the same time, the foam is bonded with conductive cloth. Compared with conventional shielding materials such as metal foil and metal plate, conductive cloth has better flexibility and has less impact on the compressive stress of the foam.

[0033] Figure 4 This is a cross-sectional view of a partial embodiment of the graphene composite thermally conductive shielding device provided in this application, with reference to... Figure 4 The graphene composite thermal conductive shield also includes an adhesive layer 5, which is disposed on the edge area around the graphene thermal conductive substrate 2 so that the graphene thermal conductive substrate can bond the foam.

[0034] In some embodiments, the adhesive layer 5 is a conductive adhesive to prevent the adhesive layer from affecting the shielding performance of the graphene composite thermally conductive shield; in some embodiments, the adhesive layer 5 is a pressure-sensitive conductive adhesive, which has initial tack and allows for position adjustment before curing, thereby reducing the scrap rate.

[0035] Figure 5 This is a cross-sectional view of a partial embodiment of the graphene composite thermally conductive shielding device provided in this application, with reference to... Figure 5 The thickness of foam 3 is greater than that of graphene thermal conductive substrate 2. One bottom surface of foam 3 is on the same horizontal plane as one bottom surface of graphene thermal conductive substrate 2, thus making the graphene composite thermal conductive shielding component have an overall "concave" structure.

[0036] When heat-generating components such as chips are mounted on a PCB substrate, there is usually a height difference between them and the substrate, while the heat dissipation components opposite the PCB substrate are macroscopically flat and horizontal. In this design, one horizontal side of the graphene composite shielding component contacts the heat dissipation component, while the graphene thermally conductive substrate on the other side directly contacts the heat-generating component, and the protruding foam portion abuts against the PCB substrate. This structural design offers two advantages: 1. The thermal resistance of the graphene thermally conductive substrate can be as low as 0.06 K·cm² / W, while the thermal resistance of air is >1700 K·cm² / W. Directly contacting the graphene thermally conductive substrate with both the heat-generating and heat dissipation components improves the efficiency of heat conduction. Conventional foam typically lacks good thermal conductivity, and the fact that the foam does not directly contact the heat-generating component also prevents a reduction in heat conduction capacity. 2. The graphene composite thermally conductive shielding component acts like a closed shell enveloping the heat-generating component. This closed shell creates a Faraday cage effect, providing excellent electromagnetic shielding performance. Specifically, according to the standard ASTM-D4935-99, the graphene thermally conductive substrate and the conductive cloth were tested respectively, and their shielding effectiveness was ≥75dB, and the electromagnetic wave intensity could be weakened by more than 99.9%.

[0037] Figure 6 This is a top view of the graphene composite thermally conductive shielding component provided in some embodiments of this application. Figure 7 for Figure 6 The AA cross-sectional view of the graphene composite thermally conductive shielding component provided in the embodiment is shown in the reference diagram. Figures 6-7 The foam 3 has grooves around its perimeter, and the graphene thermal conductive substrate 2 is embedded in the grooves, thereby providing a larger bonding area between the graphene thermal conductive substrate 2 and the foam 3, resulting in a stronger connection.

[0038] refer to Figure 7In some embodiments of this application, the graphene thermally conductive substrate 2 is a graphene thermally conductive film. Specifically, the graphene thermally conductive film refers to graphite oxidized by 98% concentrated sulfuric acid and strong oxidant potassium permanganate, then washed and filtered to remove the strong acid, and then mixed with an aqueous solution to prepare a graphene oxide slurry with a solid content of 5%. Subsequently, the slurry is coated and dried to obtain a graphene oxide film, and then subjected to high-temperature reduction methods such as pretreatment at about 300°C, carbonization at about 1000°C, and graphitization at about 3000°C. The graphene thermally conductive film has a horizontal thermal conductivity ≥1000W / (m·K) and has a certain degree of flexibility, possessing good thermal conductivity.

[0039] Figure 8 This is a cross-sectional view of a partial embodiment of the graphene composite thermally conductive shielding device provided in this application, with reference to... Figure 8 The graphene thermally conductive substrate 2 is a graphene TIM film. The graphene TIM film is prepared by oxidizing graphite with 98% concentrated sulfuric acid and strong oxidant potassium permanganate, washing and filtering off the strong acid, and then mixing it with an aqueous solution to prepare a graphene oxide slurry with a solid content of 5%. After coating and drying, a graphene oxide film is obtained. Then, it is obtained by high-temperature reduction methods such as foaming with chemical reducing agent, pretreatment at about 300℃, carbonization at about 1000℃, and graphitization at about 3000℃. Because the graphene TIM film has nano-scale and / or micro-scale pores, it has good compression buffering capacity and can fill the tiny gaps on the surface of heat-generating and heat-dissipating devices, greatly reducing the influence of air thermal resistance. Moreover, the pore wall interface can provide a large number of multiple reflection and scattering opportunities for electromagnetic waves. In this process, the electromagnetic wave energy is continuously attenuated and absorbed. Therefore, using a graphene TIM film as a graphene thermally conductive layer, in addition to its thermal conductivity, also has better electromagnetic shielding and superior compression resilience.

[0040] Figure 9 This is a cross-sectional view of a partial embodiment of the graphene composite thermally conductive shielding device provided in this application, with reference to... Figure 9 The graphene thermal conductive substrate 2 is a graphene thermal conductive pad, which is formed by vertically stacking multiple graphene TIM sheets. Since the in-plane (horizontal) thermal conductivity of the graphene TIM film is higher than that in the thickness (vertical) direction, stacking multiple layers and arranging them vertically transfers the excellent thermal conductivity in the original horizontal direction to the vertical direction, resulting in higher thermal conductivity and heat dissipation efficiency. At the same time, the in-plane thermal resistance of the graphene TIM film is much lower than its thermal resistance in the thickness direction. Therefore, vertically arranging the TIM film can also reduce the thermal resistance of the material itself. In addition, the graphene thermal conductive pad also has good compression resilience and electromagnetic shielding performance.

[0041] Figure 10 This is a schematic diagram illustrating the installation of the graphene composite thermally conductive shielding component provided in some embodiments of this application within an electronic device. (Refer to...) Figure 10 This application also provides an electronic device, which includes the graphene composite thermally conductive shielding provided in the first aspect of this application, as well as a heat dissipation component 6 and a heat-generating component 7. The graphene composite thermally conductive shielding is disposed between the heat dissipation component 6 and the heat-generating component 7, and the heat-generating component is mounted on a PCB board 8. The heat-generating component can be one of a processor chip, a power management chip, a memory chip, or an RF module chip; the heat dissipation component can be any one of a heat sink or a heat dissipation backplate. The heat-generating component 7 is enveloped by the graphene composite thermally conductive shielding.

[0042] Other components in the electronic device are existing technologies and are not shown separately.

[0043] During the installation of the graphene composite thermal conductive shield, pressure is applied. Due to its excellent compressibility, the graphene composite thermal conductive shield can make close contact with the heat-generating device and both sides during heat dissipation to fill air gaps. Furthermore, thanks to the pressure-sensitive conductive adhesive, the structural strength of the graphene composite thermal conductive shield is also higher. Simultaneously, the thermal resistance of the graphene thermal conductive substrate can be as low as 0.06 K·cm² / W. Direct contact between the graphene thermal conductive substrate and the heat-generating and heat-dissipating components can improve the heat conduction efficiency from the heat-generating components to the heat-dissipating components. The foam 3 does not directly contact the heat-generating components, preventing a reduction in heat conduction capacity. The graphene composite thermal conductive shield is similar to a closed shell enveloping the heat-generating components; this closed shell creates a Faraday cage effect, providing excellent electromagnetic shielding performance.

[0044] The above-described embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit it. Although this utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this utility model.

Claims

1. A graphene composite thermally conductive shielding component, characterized in that, Includes the following structure: Graphene thermally conductive substrate; Foam, which is connected to the periphery of the graphene thermally conductive substrate, and part or all of the surface of the foam is covered with conductive cloth.

2. The graphene composite thermally conductive shielding component according to claim 1, characterized in that, The compressive stress of the foam is less than that of the graphene thermally conductive matrix.

3. The graphene composite thermally conductive shielding component according to claim 1, characterized in that, It also includes an adhesive layer disposed on the edge region around the graphene thermally conductive substrate to bond the foam to the graphene thermally conductive substrate.

4. The graphene composite thermally conductive shielding component according to claim 1, characterized in that, The thickness of the foam is greater than the thickness of the graphene thermal conductive substrate, and one bottom surface of the foam and one bottom surface of the graphene thermal conductive substrate are located on the same horizontal plane.

5. The graphene composite thermally conductive shielding component according to claim 4, characterized in that, The foam has grooves around its perimeter, and the graphene thermally conductive substrate is embedded in the grooves.

6. The graphene composite thermally conductive shielding component according to claim 1, characterized in that, The foam is any one of polyurethane foam, polyethylene foam, rubber foam, silicone foam, and polyolefin foam.

7. The graphene composite thermally conductive shielding component according to claim 1, characterized in that, The graphene thermally conductive substrate is any one of the following: a graphene thermally conductive film, a graphene TIM film with micron- and / or nano-sized pores inside, or a graphene thermally conductive pad formed by vertically stacking multiple graphene TIM sheets.

8. The graphene composite thermally conductive shielding component according to claim 3, characterized in that, The adhesive layer is a conductive adhesive, and preferably, the tape is a pressure-sensitive conductive adhesive.

9. An electronic device, characterized in that, The invention includes the graphene composite thermally conductive shield, heat dissipation component, and heat-generating component as described in any one of claims 1-8, wherein the graphene composite thermally conductive shield is disposed between the heat dissipation component and the heat-generating component; Preferably, the heat-generating component is one of a processor chip, a power management chip, a memory chip, and a radio frequency module chip; Preferably, the heat dissipation component is either a heat sink or a heat dissipation backplate.

10. An electronic device as claimed in claim 9, characterized in that, The heating element is encased in the graphene composite thermally conductive shield.

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