Decorative packaging structure for solar substrates

Abstract

The present application relates to a kind of solar substrate's decorative package structure, include: soft solar substrate, inner layer encapsulation layer and outer layer reinforcing layer.Soft solar substrate is sequentially stacked with soft transparent substrate, lower conductive layer, electrode wire, photovoltaic layer and upper conductive layer.Inner layer encapsulation layer includes: transparent encapsulation glue, upper inner layer encapsulation layer and lower inner layer encapsulation layer, to transparent encapsulation glue, upper inner layer encapsulation layer and lower inner layer encapsulation layer are encapsulated with soft solar substrate between it.Outer layer reinforcing layer includes: filling encapsulation glue, upper outer layer reinforcing layer and lower outer layer reinforcing layer, to filling encapsulation glue, upper outer layer reinforcing layer and lower outer layer reinforcing layer are encapsulated with inner layer encapsulation layer between it.Decorative pattern layer is arranged on the surface of upper outer layer reinforcing layer and lower outer layer reinforcing layer, to provide soft solar cell more with the function of appearance decorative beautification.

Description

[0001] This application claims priority to Taiwan Patent Application No. 114206610, filed on June 26, 2025, the entire contents of which are incorporated herein by reference. Technical Field

[0002] This application relates to a solar cell encapsulation structure, and more particularly to a decorative encapsulation structure for a solar substrate that can improve weather resistance, water and gas barrier properties, and has a decorative pattern layer. Background Technology

[0003] Flexible solar cells are widely used in portable electronic devices, wearable technology, and building-integrated photovoltaics (BIPV) due to their lightweight, thinness, and flexibility.

[0004] In recent years, with the popularization of solar energy application products, flexible solar cells can be installed in outdoor or semi-indoor environments and meet the aesthetic design requirements of the surrounding environment. It is hoped that the appearance of solar products can be integrated with the surrounding appearance. However, the current method can only beautify and decorate the light or non-light areas and the back of solar energy application products by attaching decorative panels. Utility Model Content

[0005] Therefore, the main objective of this application is to provide a multilayer encapsulation technology that can further design and improve the outer reinforcing layer of the multilayer encapsulation structure, directly adapt to environmental decoration requirements, and reduce the overall product cost, thereby providing flexible solar cells with a more aesthetically pleasing appearance.

[0006] To achieve the above objectives, this application provides a multilayer encapsulation structure for a solar substrate, comprising: a flexible solar substrate, an inner encapsulation layer, and an outer reinforcement layer. The flexible solar substrate includes: a flexible transparent substrate, a lower conductive layer, electrode wires, a photovoltaic layer, and an upper conductive layer; the lower conductive layer, the electrode wires, the photovoltaic layer, and the upper conductive layer are sequentially stacked on the side surface of the flexible transparent substrate. The inner encapsulation layer includes: a transparent encapsulant, an upper inner encapsulation layer, and a lower inner encapsulation layer; the flexible solar substrate is encapsulated therebetween by the transparent encapsulant, the upper inner encapsulation layer, and the lower inner encapsulation layer. The outer reinforcement layer includes: a filling encapsulant, an upper outer reinforcement layer, and a lower outer reinforcement layer; the inner encapsulation layer is encapsulated therebetween by the filling encapsulant, the upper outer reinforcement layer, and the lower outer reinforcement layer. A decorative pattern layer is provided on the surfaces of the upper outer reinforcement layer and the lower outer reinforcement layer.

[0007] In one embodiment of this application, the decorative pattern layer is a hollowed-out pattern.

[0008] In one embodiment of this application, the filling encapsulant is a colored filling encapsulant.

[0009] In one embodiment of this application, a light-transmitting color layer is further provided between the surface of the upper outer reinforcing layer and the lower outer reinforcing layer and the decorative pattern layer.

[0010] In one embodiment of this application, the lower conductive layer and the electrode wire are disposed on one side surface of the flexible transparent substrate; the photovoltaic layer is composed of a plurality of photovoltaic units, each photovoltaic unit is disposed on one side surface of the lower conductive layer and the electrode wire, and a gap is formed between each photovoltaic unit; the upper conductive layer is disposed on one side surface of each photovoltaic unit, and the upper conductive layer of each photovoltaic unit is electrically connected in series with the lower conductive layer of another photovoltaic unit.

[0011] In one embodiment of this application, the lower conductive layer is electrically connected to the outside via the electrode wire, and the electrode wire is a flat cable connection area.

[0012] In one embodiment of this application, the photovoltaic layer sequentially comprises an electron transport layer, an active layer, and a hole transport layer, or the photovoltaic layer sequentially comprises the hole transport layer, the active layer, and the electron transport layer disposed on one side surface of the lower conductive layer.

[0013] In one embodiment of this application, a through hole is provided on one side of the upper inner encapsulation layer corresponding to the position of the electrode wire and the lower conductive layer, and the through hole provides electrical connection between the electrode wire and the outside.

[0014] In one embodiment of this application, the flexible solar substrate, after being encapsulated in the inner encapsulation layer, has a thickness of 50 μm to 1 mm.

[0015] In one embodiment of this application, a through hole is also provided on one side of the upper outer reinforcing layer corresponding to the through hole position of the upper inner encapsulation layer, providing electrical connection between the electrode wires of the flexible solar substrate and the outside.

[0016] In one embodiment of this application, the outer reinforcing layer covers the outside of the inner encapsulation layer and has a thickness of 50um-5mm. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of a semi-finished flexible solar cell substrate according to the first embodiment of this application;

[0018] Figure 2 for Figure 1 A schematic diagram of a flexible solar substrate semi-finished product encapsulated in an inner encapsulation layer;

[0019] Figure 3 for Figure 2 A schematic diagram of an inner encapsulation layer encapsulated in an outer reinforcement layer;

[0020] Figure 4 For the second embodiment of this application Figure 3 A schematic diagram showing the addition of a decorative pattern layer to the surface of the outer reinforcement layer;

[0021] Figure 5 for Figure 4 A top-view diagram.

[0022] Explanation of reference numerals in the attached figures:

[0023] 1: Flexible solar panel substrate;

[0024] 11: Flexible transparent substrate;

[0025] 12: Lower conductive layer;

[0026] 13: Electrode wires;

[0027] 14: Photovoltaic layer;

[0028] 14a: Photovoltaic unit;

[0029] 15: Upper conductive layer;

[0030] 2: Inner encapsulation layer;

[0031] 21: Transparent encapsulating adhesive;

[0032] 22: Upper inner encapsulation layer;

[0033] 23: Lower inner encapsulation layer;

[0034] 24: Through hole;

[0035] 3: Outer reinforcement layer;

[0036] 31: Filler encapsulant;

[0037] 32: Upper outer reinforcement layer;

[0038] 33: Lower outer reinforcement layer;

[0039] 34: Through hole;

[0040] 4: Decorative pattern layer;

[0041] 5: Translucent color layer. Detailed Implementation

[0042] The technical content and detailed description of this application are explained below with reference to the accompanying drawings:

[0043] Please see Figure 1This is a schematic diagram of a semi-finished flexible solar substrate according to the first embodiment of this application. As shown in the figure: the decorative packaging structure of the solar substrate of this application includes at least a flexible solar substrate 1, which includes: a flexible transparent substrate 11, a lower conductive layer 12, an electrode wire 13, a photovoltaic layer 14, and an upper conductive layer 15.

[0044] In the fabrication of the flexible solar substrate 1, a flexible transparent substrate 11 is first provided, wherein the flexible transparent substrate 11 is polyimide (PI), polyethylene terephthalate (PEN), or polyethylene terephthalate (PET).

[0045] A lower conductive layer 12 and electrode wires 13 are formed on one side surface of the flexible transparent substrate 11 by silver paste coating and printing or by indium tin oxide (ITO) sputtering or evaporation. In the embodiments of this application, the lower conductive layer 12 is electrically connected to the outside via the electrode wires 13, which can be fabricated as a flat cable connection area.

[0046] After the lower conductive layer 12 and the electrode wire 13 are fabricated as described above, a photovoltaic layer 14 is coated and fabricated on the side surface of the lower conductive layer 12. In the embodiments of this application, the photovoltaic layer 14 sequentially includes an electron transport layer (not shown), an active layer (not shown), and a hole transport layer (not shown), or the photovoltaic layer 14 sequentially includes a hole transport layer (not shown), an active layer (not shown), and an electron transport layer (not shown) disposed on one side surface of the lower conductive layer 12.

[0047] More notably, the photovoltaic layer 14 of this application can be an organic photovoltaic cell (OPV), a perovskite solar cell (PSC), or a copper indium gallium diselenide (CIGS) thin-film photovoltaic cell. However, organic photovoltaic cells (OPV) are preferred.

[0048] Next, processing is carried out in this application. Laser etching is performed with a specific laser energy in a manner that does not damage the flexible transparent substrate 11 to etch the photovoltaic layer 14 and the lower conductive layer 12 to form a plurality of photovoltaic units 14a, with a gap 141a formed between each photovoltaic unit 14a.

[0049] Next, an upper conductive layer 15 is fabricated on the side surface of the photovoltaic layer 14 using silver paste coating printing or indium tin oxide (ITO) sputtering or evaporation combined with laser etching. This allows the upper conductive layer 15 of the photovoltaic unit 14a to be electrically connected to the lower conductive layer 12 of the second photovoltaic unit 14a, forming a series connection of multiple photovoltaic units 14a on the semi-finished flexible solar substrate 1.

[0050] Please see Figure 2 ,for Figure 1 A schematic diagram of a flexible solar substrate semi-finished product encapsulated in an inner encapsulation layer; see also [reference needed]. Figure 1 As shown in the figure: When the flexible solar substrate 1 semi-finished product of this application is encapsulated with the inner encapsulation layer 2, two pieces of upper inner encapsulation layer 22 and lower inner encapsulation layer 23 containing transparent encapsulating adhesive 21 are placed between them, and then the flexible solar substrate 1 is encapsulated therebetween. In the embodiments of this application, the upper inner encapsulation layer 22 and the lower inner encapsulation layer 23 are polymer layers with water and gas barrier properties. The polymer layer is polyethylene terephthalate (PET), polyethylene terephthalate (PEN) or a polymer composite material.

[0051] Next, the flexible solar substrate 1 is bonded together by vacuum hot pressing, so that it is encapsulated between the upper inner encapsulation layer 22 and the lower inner encapsulation layer 23.

[0052] Finally, through holes 24 are provided on one side of the upper inner encapsulation layer 22, corresponding to the positions of the electrode wires 13 and the lower conductive layer 12. These through holes 24 provide electrical connection between the electrode wires 13 of the flexible solar substrate 1 and an external control device (not shown in the figure). Furthermore, after the flexible solar substrate 1 of this application is encapsulated in the inner encapsulation layer 2, its thickness is 50 μm to 1 mm. In this figure, the transparent encapsulant 21 is a thermosetting epoxy resin, a thermoplastic ethylene-vinyl acetate copolymer (EVA), a thermoplastic polyolefin elastomer (POE), or a photocurable acrylic resin.

[0053] Please see Figure 3 ,for Figure 2 A schematic diagram showing the inner encapsulation layer encapsulated within the outer reinforcement layer; see also [reference needed]. Figures 1-2As shown in the figure: After the flexible solar substrate 1 is encapsulated by the inner encapsulation layer 2 in this application, the outer reinforcement layer 3 structure is prepared. Two upper outer reinforcement layers 32 and lower outer reinforcement layers 33, each containing a filling encapsulant 31, are placed between them, and the aforementioned inner encapsulation layer 2 structure is encapsulated therebetween. In this example, the upper outer reinforcement layer 32 and the lower outer reinforcement layer 33 are fluoroplastic film (Ethylene tetrafluoroethylene, ETFE), fluorinated ethylene propylene copolymer (FEP), polyethylene terephthalate (PET), polycarbonate (PC), or polymer composite materials.

[0054] Next, a through hole 34 is also provided on one side of the outer reinforcing layer 32 corresponding to the through hole 24 of the inner encapsulation layer 22, providing electrical connection between the electrode wires 13 of the flexible solar substrate 1 and an external control device (not shown in the figure). Then, it is bonded by vacuum hot pressing to complete this application. The outer reinforcing layer 3 covers the outside of the inner encapsulation layer 2, with a thickness of 50 μm (micrometer) to 5 mm (millimeters). In this figure, the filling encapsulant 31 is a thermosetting epoxy resin, thermoplastic ethylene-vinyl acetate copolymer (EVA), thermoplastic polyolefin elastomer (POE), or photocurable acrylic resin.

[0055] Please see Figure 4 , 5 , Figure 4 This is the second embodiment of the present application. Figure 3 Schematic diagram of adding decorative pattern layer to the surface of outer reinforcement layer and Figure 4 The top view diagram; also refer to... Figures 1-3 As shown in the figure: Then, the layers are bonded using a vacuum hot-pressing method. However, to prevent wrinkles from forming on the surface of the outer reinforcing layer 3, a release liner (not shown in the figure) of Teflon fiber cloth needs to be attached to the outer surfaces of the upper outer reinforcing layer 32 and the lower outer reinforcing layer 33 during the vacuum hot-pressing operation. The original function of the Teflon fiber cloth is to act as a barrier between the product and the surface of the vacuum hot-pressing equipment, preventing product adhesion. In this application, a decorative pattern layer 4 with a hollowed-out pattern is hot-pressed onto the surface of the Teflon fiber cloth, or the decorative pattern layer 4 can be formed using printing technology. In this figure, a translucent color layer 5 is also provided between the outer reinforcing layer 3 and the decorative pattern layer 4. The translucent color layer 5 is dyed to have a translucent color, or the filling encapsulant 31 can be dyed with a colored filling encapsulant to have a translucent color.

[0056] In summary, the decorative encapsulation structure of the solar cell substrate provided in this application, through the water and gas barrier function of the inner encapsulation layer 2 and the decorative pattern layer 4 with the raised structure on the surface of the outer reinforcing layer 3, can be decorated to meet the surrounding appearance design requirements. At the same time, the outer reinforcing layer 3 can also be colored to better meet the requirements of decorative aesthetics. Therefore, it is more suitable for the aesthetic decoration needs of diverse application fields such as portable electronic devices, wearable technology, and building-integrated photovoltaics (BIPV).

[0057] However, the above description is only a preferred embodiment of this application and is not intended to limit the scope of patent protection of this application. Therefore, all equivalent changes made based on the content of this application's specification or drawings are similarly included within the scope of protection of this application and are hereby stated.

Claims

1. A decorative encapsulation structure for a solar substrate, characterized in that, Include: A flexible solar cell substrate includes a flexible transparent substrate, a lower conductive layer, electrode wires, a photovoltaic layer, and an upper conductive layer; the lower conductive layer, the electrode wires, the photovoltaic layer, and the upper conductive layer are sequentially stacked on one side surface of the flexible transparent substrate. The inner encapsulation layer comprises: a transparent encapsulating adhesive, an upper inner encapsulation layer, and a lower inner encapsulation layer; the flexible solar substrate is encapsulated therebetween by the transparent encapsulating adhesive, the upper inner encapsulation layer, and the lower inner encapsulation layer. and An outer reinforcing layer comprises: a filling encapsulant, an upper outer reinforcing layer, and a lower outer reinforcing layer; the inner encapsulant layer is encapsulated therebetween by the filling encapsulant, the upper outer reinforcing layer, and the lower outer reinforcing layer; A decorative pattern layer is provided on the surface of the upper outer reinforcing layer and the lower outer reinforcing layer; A translucent color layer is provided between the surfaces of the upper outer reinforcing layer and the lower outer reinforcing layer and the decorative pattern layer.

2. The decorative encapsulation structure of the solar substrate as described in claim 1, characterized in that, The decorative pattern layer is a hollowed-out openwork pattern.

3. The decorative encapsulation structure of the solar substrate as described in claim 1, characterized in that, The filling encapsulant is a colored filling encapsulant.

4. The decorative encapsulation structure of the solar substrate as described in claim 1, characterized in that, The lower conductive layer and the electrode wire are disposed on one side surface of the flexible transparent substrate; the photovoltaic layer is composed of multiple photovoltaic units, each photovoltaic unit is disposed on the side surface of the lower conductive layer and the electrode wire, and a gap is formed between each photovoltaic unit; the upper conductive layer is disposed on one side surface of each photovoltaic unit, and the upper conductive layer of each photovoltaic unit is electrically connected in series with the lower conductive layer of another photovoltaic unit.

5. The decorative encapsulation structure of the solar substrate as described in claim 1, characterized in that, The lower conductive layer is electrically connected to the outside via the electrode wires, which are flat cable connection areas.

6. The decorative encapsulation structure of the solar substrate as described in claim 1, characterized in that, The photovoltaic layer sequentially comprises an electron transport layer, an active layer, and a hole transport layer, or the photovoltaic layer sequentially comprises the hole transport layer, the active layer, and the electron transport layer disposed on one side surface of the lower conductive layer.

7. The decorative encapsulation structure of the solar substrate as described in claim 1, characterized in that, A through hole is provided on one side of the upper inner encapsulation layer corresponding to the position of the electrode wire and the lower conductive layer, and the through hole provides electrical connection between the electrode wire and the outside.

8. The decorative encapsulation structure of the solar substrate as described in claim 7, characterized in that, A through hole is also provided on one side of the upper outer reinforcing layer corresponding to the through hole position of the upper inner encapsulation layer, providing electrical connection between the electrode wires of the flexible solar substrate and the outside.

9. The decorative encapsulation structure of the solar substrate as described in claim 1, characterized in that, The flexible solar substrate, after being encapsulated in the inner encapsulation layer, has a thickness of 50µm to 1mm.

10. The decorative encapsulation structure of the solar substrate as described in claim 1, characterized in that, The outer reinforcing layer covers the outside of the inner encapsulation layer and has a thickness of 50um-5mm.

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