A light source inverted COB-DOB module and a lamp

Abstract

The utility model discloses a light source upside-down COB-DOB module and lamps and lanterns, including DOB substrate, COB light source and driving circuit component, DOB substrate is by base material, insulating layer and circuit layer in proper order laminated and constitutes, and the light hole that opens through three layers is established, COB light source has the electrode luminous surface and the radiating surface of opposite, and electrode luminous surface is equipped with luminophor and electrode pad, COB light source is through electrode luminous surface upside-down and is attached in DOB circuit layer, makes electrode pad and circuit layer electricity is connected, luminophor and light hole position correspond, and the radiating surface is directly exposed and conducts heat, and driving circuit component is located on DOB circuit layer. The utility model solves the technical problem of the prior art in conventional COB light source can not be used, and the long heat dissipation path of heat resistance is big, and driving circuit component is easy to interfere with secondary optical device.

Description

Technical Field

[0001] This utility model relates to the field of LED lighting technology, and in particular to a light source inverted COB-DOB module and luminaire. Background Technology

[0002] Currently, most COB-DOB modules on the market use a front-mounted method where the light source is mounted on the substrate. This method requires the COB light source to be packaged using a specially designed double-sided substrate, which is incompatible with the widely used conventional single-sided substrate COB light sources, increasing material costs and management complexity. Due to its structure, the double-sided substrate typically has higher thermal resistance than the single-sided substrate, resulting in a higher chip junction temperature under the same heat dissipation conditions, affecting the lifespan and luminous efficiency of the LED light source. Since the light-emitting surface of the COB light source and the driving circuit components are on the same side plane of the substrate, highly protruding components such as electrolytic capacitors and inductors are prone to dimensional interference with lenses or reflectors during secondary optical design. To avoid interference, the substrate size usually needs to be increased and the components moved outward, resulting in an increase in the overall size of the module and lamp, hindering the miniaturization and thinning of the lamp design. The heat from the COB light source must be conducted to the lamp body through the DOB substrate, resulting in a long heat conduction path and high thermal resistance, further exacerbating the heat dissipation bottleneck. Therefore, existing technologies suffer from many drawbacks, including high module cost, poor versatility, low heat dissipation efficiency, and easy interference with optical design. Utility Model Content

[0003] The main purpose of this invention is to propose an inverted COB-DOB module and luminaire, which aims to solve the technical problems of existing COB-DOB modules and luminaires, such as incompatibility with conventional COB light sources due to the front mounting method, long heat dissipation paths and high thermal resistance, and easy interference between driving circuit components and secondary optical components.

[0004] To achieve the above objectives, the first aspect of this utility model proposes an inverted COB-DOB module, comprising a DOB substrate, a COB light source, and driving circuit components; the DOB substrate comprises a DOB substrate, a DOB insulating layer, and a DOB circuit layer stacked sequentially; the DOB substrate has a light-emitting hole penetrating the DOB substrate layer, the DOB insulating layer, and the DOB circuit layer; the COB light source includes a heat dissipation surface with oppositely facing electrode light-emitting surfaces; a light-emitting element and an electrode pad are disposed on the electrode light-emitting surface, and the light-emitting element is electrically connected to the electrode pad; the COB light source is inverted and mounted on the DOB circuit layer of the DOB substrate through the electrode light-emitting surface, so that the electrode pad is electrically connected to the circuit on the DOB circuit layer, and the position of the light-emitting element corresponds to the light-emitting hole; the heat dissipation surface is used to conduct the heat generated by the COB light source during operation to the outside; the driving circuit components are disposed on the DOB circuit layer of the DOB substrate and are used to drive the COB light source.

[0005] Preferably, the COB light source has a single-sided substrate structure, comprising a COB substrate, a COB insulating layer, and a COB circuit layer stacked sequentially; the light emitter and electrode pads are disposed on the COB circuit layer to form the electrode light-emitting surface; the surface of the COB substrate facing away from the COB insulating layer forms the heat dissipation surface.

[0006] Preferably, the COB light source has a double-sided substrate structure, including a COB substrate, a first COB insulating layer, a first COB circuit layer, a second COB insulating layer, and a second COB circuit layer; the first COB insulating layer is disposed on a first surface of the COB substrate, and the first COB circuit layer is disposed on the surface of the first COB insulating layer facing away from the COB substrate; the second COB insulating layer is disposed on a second surface of the COB substrate facing away from the first surface, and the second COB circuit layer is disposed on the surface of the second COB insulating layer facing away from the COB substrate; the light emitter and electrode pads are disposed on the first COB circuit layer to form the electrode light-emitting surface; a thermal pad is disposed on the second COB circuit layer, and the surface of the thermal pad forms the heat dissipation surface.

[0007] Preferably, the orthographic projection of the light emitter on the DOB substrate is completely located within the area of ​​the light-emitting aperture, and the minimum inner diameter of the light-emitting aperture is greater than the maximum outer diameter of the light emitter.

[0008] Preferably, the light-emitting aperture is a circular aperture, and the light-emitting area of ​​the light-emitting body is circular.

[0009] Preferably, the DOB substrate is a metal substrate, and the heat dissipation surface of the COB light source is a metal surface.

[0010] The second aspect of this utility model provides a lamp, including an inverted COB-DOB light source module and a lamp body as described in any of the first aspects; the inverted COB-DOB light source module is mounted on the lamp body, and the heat dissipation surface of the COB light source is in thermal contact with the lamp body.

[0011] Preferably, the lamp body includes a mounting boss and a housing, the inverted COB-DOB light source module is mounted on the mounting boss, so that the heat dissipation surface of the COB light source is in thermal contact with the mounting boss; the side wall of the mounting boss and the housing form a cavity for accommodating the driving circuit components, and the height of the side wall of the mounting boss is greater than the maximum height of the driving circuit components.

[0012] Preferably, the mounting boss is made of metal and is fixedly connected to or integrally formed with the housing, constituting the main heat dissipation channel of the lamp.

[0013] Preferably, the lamp body further includes a secondary optical device, which is disposed on the side of the DOB substrate away from the DOB insulating layer and covers the light-emitting hole; the light-inlet of the secondary optical device is correspondingly disposed to the light-emitting hole.

[0014] This invention proposes an inverted COB-DOB module. By inverting the COB light source and mounting it on the circuit layer of the DOB substrate, the heat dissipation surface is directly exposed, improving heat conduction efficiency and reducing chip junction temperature. The design of corresponding positions between the light-emitting aperture and the light-emitting element improves the purity of the optical path and the light-emitting efficiency. By separating the driving circuit and the light-emitting element in different areas of the same surface of the substrate, the structural interference problem with secondary optical devices is completely solved. The structural design is compatible with conventional single- and double-sided substrate COB light sources, improving the module's versatility and reducing production costs.

[0015] Furthermore, this invention optimizes the heat dissipation path through a single-sided substrate structure, improving heat conduction efficiency and reducing manufacturing costs; enhances heat dissipation uniformity and circuit integration flexibility through the thermal pad design of a double-sided substrate structure; improves module adaptability and application scenario coverage through a light source structure compatible with both single and double-sided substrates; improves light energy utilization efficiency and eliminates edge light obstruction by ensuring that the projection of the light-emitting body is completely located within the light-emitting aperture area; improves assembly tolerance and reduces stray light generation by setting dimensional redundancy; improves light spot uniformity and light distribution consistency by adopting a symmetrical combination of a circular light-emitting aperture and a circular light-emitting area; ensures unobstructed light emission from all directions and reduces assembly precision requirements by designing the diameter of the light-emitting aperture to be larger than the outer diameter of the light-emitting area; improves heat conduction efficiency and reduces system thermal resistance by using a metal substrate to construct the heat conduction path; and improves interface heat conduction efficiency and simplifies the heat dissipation structure by having the metal heat dissipation surface directly contact the heat sink.

[0016] This utility model also proposes a lamp fixture that improves the protection of the driving circuit and eliminates spatial interference by forming an accommodating space through the mounting boss and the outer shell; improves the continuity of heat conduction and structural stability by integrating the heat dissipation path through the metal mounting boss; and solves the structural interference problem with the driving element and optimizes the light distribution effect by independently setting the secondary optical device on the light-emitting surface.

[0017] In summary, this utility model solves the technical problems in the prior art where COB-DOB modules and lamps are not compatible with conventional COB light sources due to the front-mounting method, have long heat dissipation paths and high thermal resistance, and where driving circuit components are prone to interference with secondary optical components. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0019] Figure 1 A schematic diagram of the structure of an inverted COB-DOB module for light sources provided by this utility model; Figure 2 A schematic diagram of the front and bottom surfaces of the DOB substrate provided by this utility model; Figure 3 A side view of the DOB substrate provided by this utility model; Figure 4 A schematic diagram of the front and bottom surfaces of the single-sided COB light source provided by this utility model; Figure 5 A side view of the single-sided COB light source provided by this utility model; Figure 6 A schematic diagram of the front and bottom surfaces of the double-sided COB light source provided by this utility model; Figure 7 A side view of the double-sided COB light source provided by this utility model; Figure 8 This is a structural schematic diagram of a lamp using an inverted COB-DOB module for light sources, provided by this utility model. Figure 9 This is a schematic diagram of the heat dissipation path of a lamp using an inverted COB-DOB module for light sources, as provided by this utility model.

[0020] In the attached diagram: 1-DOB substrate, 11-DOB base material, 12-DOB insulating layer, 13-DOB circuit layer, 14-light emission hole, 2-COB light source, 21-electrode emitting surface, 211-light emitter, 212-electrode pad, 212a-first electrode pad, 212b-second electrode pad, 22-heat dissipation surface, 23-COB base material, 24-COB insulating layer, 241-first COB insulating layer, 242-second COB insulating layer, 25-COB circuit layer, 251-first COB circuit layer, 252-second COB circuit layer, 26-thermal pad, 27-through hole, 3-driving circuit components, 4-lamp body, 41-mounting boss, 42-outer shell, 43-secondary optical components.

[0021] The realization of the purpose, functional features and advantages of this utility model will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0022] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of the present utility model.

[0023] It should be noted that if the embodiments of this utility model involve directional indicators, such as up, down, left, right, front, back, etc., the directional indicators are only used to explain the relative positional relationship and movement of the components in a specific posture. If the specific posture changes, the directional indicators will also change accordingly.

[0024] Furthermore, if the embodiments of this utility model involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this utility model.

[0025] The main purpose of this invention is to propose an inverted COB-DOB module, which aims to solve the technical problems of existing COB-DOB modules, such as incompatibility with conventional COB light sources due to the front-mounting method, long heat dissipation paths and high thermal resistance, and easy interference between driving circuit components and secondary optical devices.

[0026] like Figures 1 to 7 As shown, to achieve the above objectives, the first aspect of this utility model proposes an inverted COB-DOB module, including a DOB substrate 1, a COB light source 2, and driving circuit components 3; the DOB substrate 1 includes a DOB substrate 11, a DOB insulating layer 12, and a DOB circuit layer 13 stacked sequentially; the DOB substrate 1 has a light-emitting hole 14 penetrating the DOB substrate layer 11, the DOB insulating layer 12, and the DOB circuit layer 13; the COB light source 2 includes an electrode light-emitting surface 21 and a heat dissipation surface 22 facing each other; the electrode light-emitting surface 21 is provided with... The device includes a light-emitting element 211 and an electrode pad 212, with the light-emitting element 211 electrically connected to the electrode pad 212. The COB light source 2 is mounted upside down on the DOB circuit layer 13 of the DOB substrate 1 via the electrode light-emitting surface 21, so that the electrode pad 212 is electrically connected to the circuit on the DOB circuit layer 13. The position of the light-emitting element 211 corresponds to the position of the light-emitting hole 14. The heat dissipation surface 22 is used to conduct the heat generated by the COB light source 2 during operation to the outside. The driving circuit components 3 are disposed on the DOB circuit layer 13 of the DOB substrate 1 and are used to drive the COB light source 2.

[0027] Specifically, in one embodiment of the present invention, the inverted COB-DOB module uses a metal substrate as the DOB substrate 11, and its surface is covered with a high thermal conductivity epoxy resin insulating layer as the DOB insulating layer 12. The DOB circuit layer 13 is a circuit pattern formed by etching copper foil pressed onto the insulating layer. The COB light source 2 has a single-sided substrate structure with a back-facing electrode light-emitting surface 21 and a heat dissipation surface 22. The electrode light-emitting surface 21 is provided with a light-emitting body 211 and an electrode pad 212. The light-emitting body 211 is electrically connected to the electrode pad 212 through bonding wires. The light-emitting body 211 includes at least one LED chip, encapsulant, and a dam. The dam is disposed on the circuit layer and encloses a receiving area. The LED chip is fixed in the receiving area. On the surface of the inner circuit layer, encapsulant is filled in the accommodating area and covers the LED chip; the COB light source 2 is invertedly mounted on the DOB circuit layer 13 of the DOB substrate 1 through the electrode light-emitting surface 21, so that the electrode pad 212 is electrically connected to the circuit on the DOB circuit layer 13, and the light-emitting body 211 corresponds to the position of the light-emitting hole 14; the COB circuit layer 25 of the COB light source 2 is electrically connected to the corresponding circuit on the DOB circuit layer 13 by soldering with solder paste; multiple driving circuit components 3 are arranged around the light-emitting hole 14 and soldered on the DOB circuit layer 13, and connected to the electrode pad 212 of the COB light source 2 through wires; the heat dissipation surface 22 of the COB light source 2 is the exposed substrate surface, which can directly contact the external heat sink to conduct heat.

[0028] Understandably, this embodiment shortens the heat conduction path by inverting the COB light source and directly exposing the heat dissipation surface, thereby improving heat conduction efficiency and reducing the chip's operating junction temperature. By separating the driving circuit and the light emitter onto different planes and avoiding the light emission aperture area, space utilization is improved and structural interference with optical devices is completely eliminated. By inverting the COB light source, conventional single-sided substrate COB light sources can be used in this module, improving production compatibility and reducing module manufacturing costs.

[0029] Those skilled in the art can make corresponding equivalent improvements based on the application scenario. For example, the DOB substrate can be replaced with a ceramic substrate or a composite metal substrate to meet the requirements of higher power or higher insulation level; or thermal grease can be added between the heat dissipation surface and the heat sink of the lamp to optimize the thermal contact effect; or the shape of the light emission hole can be adapted to the COB light source with different light emission area shapes to optimize the light emission efficiency and light distribution requirements.

[0030] Preferred, see Figure 4 and Figure 5In a specific embodiment of the present invention, the COB light source 2 is a single-sided substrate structure, including a COB substrate 23, a COB insulating layer 24 and a COB circuit layer 25 stacked sequentially; the light emitter 211 and the electrode pad 212 are disposed on the COB circuit layer 25 to form an electrode light-emitting surface 21; the surface of the COB substrate 23 facing away from the COB insulating layer 24 forms a heat dissipation surface 22.

[0031] Specifically, in one embodiment of the present invention, the single-sided substrate COB light source 2 uses a metal substrate as the COB substrate 23, the surface of which is covered with a highly thermally conductive COB insulating layer 24. In one possible implementation, the insulating layer is composed of epoxy resin mixed with ceramic filler. The COB circuit layer 25 is formed by etching copper foil pressed onto the COB insulating layer 24, and its pattern includes mutually electrically isolated electrode pads 212. The light emitter 211 is bonded to the chip mounting area by a highly thermally conductive die bond adhesive and electrically connected to the electrode pads 212 by gold wire bonding. A heat dissipation surface 22 is formed on the surface of the COB substrate 23 facing away from the COB insulating layer 24. The heat dissipation surface 22 can be sandblasted or wire-drawn to increase the effective heat dissipation area, and then pressed and mounted on the surface of the lamp heat sink to achieve heat conduction without intermediaries.

[0032] Understandably, this embodiment constructs the shortest heat conduction path from the chip to the heat dissipation surface by directly stacking the substrate with the insulating layer and the circuit layer, thereby improving heat conduction efficiency and reducing thermal resistance; the chip is directly integrated into the circuit layer through mature die bonding and bonding processes, thereby improving production reliability and packaging integration; and the back side of the substrate is directly used as the exposed heat dissipation surface, thereby improving the contact efficiency with the external heat sink and simplifying the heat dissipation structure.

[0033] Preferred, see Figure 6 and Figure 7 In a specific embodiment of the present invention, the COB light source 2 has a double-sided substrate structure, including a COB substrate 23, a first COB insulating layer 241, a first COB circuit layer 251, a second COB insulating layer 242, and a second COB circuit layer 252. The first COB insulating layer 241 is disposed on a first surface of the COB substrate 23, and the first COB circuit layer 251 is disposed on the surface of the first COB insulating layer 241 facing away from the COB substrate 23. The second COB insulating layer 242 is disposed on a second surface of the COB substrate 23 facing away from the first surface, and the second COB circuit layer 252 is disposed on the surface of the second COB insulating layer 242 facing away from the COB substrate 23. A light emitter 211 and an electrode pad 212 are disposed on the first COB circuit layer 251 to form an electrode light-emitting surface 21. A thermal pad 26 is disposed on the second COB circuit layer 252, and the surface of the thermal pad 26 forms a heat dissipation surface 22.

[0034] Specifically, in one embodiment of the present invention, the first COB circuit layer 251 is formed by etching copper foil, and its pattern includes mutually electrically isolated first electrode pads 212a; the second COB circuit layer 252 is formed by etching copper foil, and its pattern includes mutually electrically isolated second electrode pads 212b and thermal pads 26; the first COB circuit layer 251 and the second COB circuit layer 252 are electrically interconnected through metallized vias 27 penetrating the substrate 23 to achieve the first electrode pads 212a and the second electrode pads 212b; the light emitter 211 is die-bonded on the first COB circuit layer 251 and electrically connected to the first electrode pads 212a through bonding wires; the surface of the thermal pads 26 facing away from the second COB insulating layer 242 forms a heat dissipation surface 22, which can directly contact the heat sink of the lamp for heat conduction.

[0035] Understandably, this embodiment improves the flexibility and applicability of module design by supporting a COB light source with a double-sided substrate structure, enabling the present invention to adapt to more diverse application scenarios and performance requirements. This embodiment improves the density of circuit wiring and the flexibility of drive circuit integration through the design of double-sided circuit layers and metallized vias; by placing the heat dissipation surface on the thermal pads on the back, the directness and efficiency of the heat dissipation path are maintained.

[0036] Those skilled in the art can make corresponding equivalent improvements based on the application scenario, such as: replacing the metallized vias with vias filled with thermally conductive medium to enhance the thermal conductivity in the thickness direction of the substrate; or replacing the substrate with a metal substrate to further improve the overall thermal conductivity; or designing the thermal pads of the second COB circuit layer as a raised fin structure to increase the heat dissipation surface area.

[0037] Preferred, see Figure 1 and Figure 3 In a specific embodiment of the present invention, the orthographic projection of the light emitter 211 on the DOB substrate 1 is completely located within the area of ​​the light emission aperture 14, and the minimum inner diameter of the light emission aperture 14 is greater than the maximum outer diameter of the light emitter 211.

[0038] Specifically, in one embodiment of this utility model, the orthographic projection contour of the light emitter 211 on the DOB substrate 1 is completely contained within the opening contour of the light emitting aperture 14, and the two are arranged concentrically or eccentrically; the minimum aperture size of the light emitting aperture 14 on all its radial sections is greater than the maximum circumscribed circle diameter of the light emitter 211 measured in all directions; the minimum inner diameter size of the light emitting aperture 14 maintains a certain safety margin compared to the maximum circumscribed circle diameter of the light emitter 211, forming a certain clearance area, providing design margin for thermal expansion and assembly tolerance.

[0039] Understandably, this embodiment improves light energy utilization efficiency and eliminates edge light occlusion by ensuring that the projection of the light source is completely within the light emission aperture area; and improves assembly tolerance and reduces production precision requirements by setting dimensional redundancy.

[0040] Preferred, see Figure 2 , Figure 4 and Figure 6 In a specific embodiment of the present invention, the light-emitting hole 14 is a circular hole, and the light-emitting area of ​​the light-emitting body 211 is circular.

[0041] Specifically, in one embodiment of the present invention, the light-emitting aperture 14 is a standard circular aperture, the center of which coincides with the geometric center of the light-emitting area of ​​the light-emitting body 211; the light-emitting body consists of multiple LED chips arranged in concentric circles in a circular die-bonding area and covered with phosphor to form a uniform circular light-emitting surface; the diameter of the light-emitting aperture 14 is larger than the maximum outer diameter of the light-emitting area 211 by a certain size. This size is determined comprehensively based on the outer diameter of the light-emitting area, the necessary thermal expansion margin, and the optical design requirements, always ensuring that the aperture is larger than the outer diameter of the light-emitting area, forming a uniform annular light-shielding area, avoiding physical blocking of edge light while controlling stray light.

[0042] Understandably, this embodiment achieves a centrally symmetrical optical fit by setting both the light-emitting aperture and the light-emitting area to be circular and ensuring that the aperture diameter is larger than the outer diameter of the light-emitting area. This facilitates processing and alignment, thereby improving the uniformity of the light spot and eliminating corner halos. The concentric circle design and precise dimensional matching ensure that the light spot forms a perfect Lambertian distribution. The precise control of the annular light-blocking area achieves efficient utilization of light energy and effective suppression of stray light. The standard circular symmetrical structure reduces the complexity of optical design and enhances visual aesthetics, improves light emission efficiency, and reduces light energy loss.

[0043] Those skilled in the art can make corresponding equivalent improvements based on the application scenario. For example, while keeping the aperture larger than the light-emitting area, the circular light-emitting area can be replaced with a rounded rectangular light-emitting area or other shapes to increase the effective light-emitting area; or a single circular hole can be replaced with an array of multiple small holes to form a special optical effect.

[0044] Preferably, in a specific embodiment of the present invention, the DOB substrate 11 is a metal substrate, and the heat dissipation surface 22 of the COB light source 2 is a metal surface.

[0045] Specifically, in one embodiment of the present invention, the DOB substrate 11 is made of aluminum alloy sheet through precision machining, and its surface is anodized to form a DOB insulating layer 12; the COB light source 2 is made of aluminum substrate, and its back side is sandblasted and directly used as an exposed metal heat dissipation surface. It can be understood that this embodiment achieves extremely low thermal resistance conduction from the chip to the lamp housing by constructing an all-metal heat conduction path; optimizes surface thermal conductivity while ensuring insulation performance through metal surface treatment processes; and maximizes interface thermal conductivity efficiency through direct metal-to-metal contact.

[0046] like Figures 8 to 9 As shown, the second aspect of this utility model provides a lamp, including the light source inverted COB-DOB module and lamp body 4 according to any one of the first aspects; the light source inverted COB-DOB module is installed on the lamp body 4, and the heat dissipation surface 22 of the COB light source 2 is in thermal contact with the lamp body 4.

[0047] Preferred, see Figure 8 In a specific embodiment of the present invention, the lamp body 4 is integrally die-cast and has a flat mounting surface; the inverted COB-DOB module of the light source is fixedly mounted on the mounting surface of the lamp body 4, wherein the heat dissipation surface 22 of the COB light source 2 is in close contact with the mounting surface to achieve direct thermal contact, and the heat conduction capability can be further improved by filling the micro-gaps of the interface with thermally conductive silicone grease; all the driving circuit components 3 are located in the substrate area outside the projection area of ​​the light exit hole 14. The working process is as follows: the driving circuit components 3 convert the AC power into DC driving current and supply it to the COB light source 2 through the electrode pad 212, the light emitter 211 is energized and emits light, and the light is emitted through the light exit hole 14; Reference Figure 9 The heat generated during the light emission process is directly conducted to the lamp body 4 through the heat dissipation surface 22, and then dissipated into the environment through the surface area of ​​the lamp body 4.

[0048] Understandably, this embodiment improves heat conduction efficiency and reduces thermal resistance by directly exposing the heat dissipation surface of the COB light source to the mounting plane of the lamp body.

[0049] Preferred, see Figure 8 In a specific embodiment of the present invention, the lamp body 4 includes a mounting boss 41 and a housing 42. The inverted COB-DOB light source module is mounted on the mounting boss 41, so that the heat dissipation surface 22 of the COB light source 2 is in thermal contact with the mounting boss 41. The side wall of the mounting boss 41 and the housing 42 form a cavity for accommodating the driving circuit components 3, and the height of the side wall of the mounting boss 41 is greater than the maximum height of the driving circuit components 3.

[0050] Understandably, this embodiment improves the physical protection and electromagnetic compatibility of the driving circuit by forming a dedicated accommodating space through the mounting boss and the outer shell; it eliminates the risk of vertical installation interference by designing the side wall height to exceed the component height; and it eliminates the risk of structural interference with secondary optical devices by setting the driving circuit components and the light emitter on different planes on both sides of the substrate.

[0051] Those skilled in the art can make corresponding equivalent improvements based on the application scenario, such as changing the connection between the mounting boss and the housing from fixed to detachable to facilitate later maintenance; or coating the inner wall of the accommodating space with a thermally conductive and insulating coating to assist in the conduction of heat from the drive circuit components to the lamp body.

[0052] Preferably, the mounting boss 41 is made of metal and is fixedly connected to the housing 42 or integrally formed to form the main heat dissipation channel of the lamp.

[0053] Understandably, this embodiment forms the main heat dissipation path with the metal mounting boss and the outer shell, thereby improving the overall heat conduction efficiency from the light source to the environment; the mechanical strength and reliability of the heat dissipation structure are improved through integral molding or a firm connection method; and the longitudinal heat conduction speed and lateral diffusion effect are improved by utilizing the rapid thermal conductivity of metal materials.

[0054] Those skilled in the art can make corresponding equivalent improvements based on the application scenario, such as replacing the material with pure copper or magnesium alloy to improve thermal conductivity; or adding heat dissipation fins or heat-conducting bumps to the surface of the metal mounting boss to further increase the effective heat dissipation area.

[0055] Preferred, see Figure 8 In a specific embodiment of the present invention, the lamp body 4 further includes a secondary optical device 43, which is disposed on the side of the DOB substrate 11 away from the DOB insulating layer 12 and covers the light outlet 14; the light inlet of the secondary optical device 43 is correspondingly disposed to the light outlet 14.

[0056] Specifically, in one embodiment of this utility model, the secondary optical device 43 is a reflector cup. The reflector cup is fixed to the light-emitting surface 11 of the DOB substrate 1 by the mounting feet provided at its bottom and is located in the preset mounting holes. The light inlet of the reflector cup is set directly opposite to the light-emitting hole 14 and completely covers the area of ​​the light-emitting hole 14. The light emitted by the COB light source 2 enters the interior of the reflector cup after exiting the light-emitting hole 14, and is reflected to form a beam of light at a preset angle that is emitted outward. It should be noted that the secondary optical device 43 is not limited to the reflector cup structure, and can also use optical elements such as lenses, diffusers, and prisms to achieve different light distribution requirements. Since all the driving circuit components 3 are set on the back light surface 12 of the DOB substrate 1, while the secondary optical device 43 is set on one side of the light-emitting surface 11, the two are located on two opposing surfaces of the substrate, avoiding the problem of interference between the driving circuit components and the secondary optical device in spatial position.

[0057] Understandably, this embodiment completely avoids spatial interference through faceted layout, improving the freedom and reliability of optical design; and improves the environmental adaptability and application flexibility of the module through the selection of various secondary optical devices.

[0058] Compared with the prior art, the beneficial effects of this utility model include at least the following: This invention proposes an inverted COB-DOB module. By inverting the COB light source and mounting it on the circuit layer of the DOB substrate, the heat dissipation surface is directly exposed, improving heat conduction efficiency and reducing chip junction temperature. The design of corresponding positions between the light-emitting aperture and the light-emitting element improves the purity of the optical path and the light-emitting efficiency. By separating the driving circuit and the light-emitting element in different areas of the same surface of the substrate, the structural interference problem with secondary optical devices is completely solved. The structural design is compatible with conventional single- and double-sided substrate COB light sources, improving the module's versatility and reducing production costs.

[0059] Furthermore, this invention optimizes the heat dissipation path through a single-sided substrate structure, improving heat conduction efficiency and reducing manufacturing costs; enhances heat dissipation uniformity and circuit integration flexibility through the thermal pad design of a double-sided substrate structure; improves module adaptability and application scenario coverage through a light source structure compatible with both single and double-sided substrates; improves light energy utilization efficiency and eliminates edge light obstruction by ensuring that the projection of the light-emitting body is completely located within the light-emitting aperture area; improves assembly tolerance and reduces stray light generation by setting dimensional redundancy; improves light spot uniformity and light distribution consistency by adopting a symmetrical combination of a circular light-emitting aperture and a circular light-emitting area; ensures unobstructed light emission from all directions and reduces assembly precision requirements by designing the diameter of the light-emitting aperture to be larger than the outer diameter of the light-emitting area; improves heat conduction efficiency and reduces system thermal resistance by using a metal substrate to construct the heat conduction path; and improves interface heat conduction efficiency and simplifies the heat dissipation structure by having the metal heat dissipation surface directly contact the heat sink.

[0060] This utility model also proposes a lamp fixture that improves the protection of the driving circuit and eliminates spatial interference by forming an accommodating space through the mounting boss and the outer shell; improves the continuity of heat conduction and structural stability by integrating the heat dissipation path through the metal mounting boss; and solves the structural interference problem with the driving element and optimizes the light distribution effect by independently setting the secondary optical device on the light-emitting surface.

[0061] In summary, this utility model solves the technical problems in the prior art where COB-DOB modules and lamps are not compatible with conventional COB light sources due to the front-mounting method, have long heat dissipation paths and high thermal resistance, and where driving circuit components are prone to interference with secondary optical components.

[0062] The above description is only a preferred embodiment of the present utility model and does not limit the patent scope of the present utility model. All equivalent structural transformations made under the inventive concept of the present utility model using the contents of the present utility model specification and drawings, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present utility model.

Claims

1. A light source inverted COB-DOB module, characterized in that, include: DOB substrate (1) includes DOB substrate (11), DOB insulating layer (12) and DOB circuit layer (13) stacked sequentially; the DOB substrate (1) has light-emitting holes (14) that penetrate the DOB substrate layer (11), the DOB insulating layer (12) and the DOB circuit layer (13). The COB light source (2) includes an electrode light-emitting surface (21) and a heat dissipation surface (22) facing each other. A light-emitting body (211) and an electrode pad (212) are disposed on the electrode light-emitting surface (21). The light-emitting body (211) is electrically connected to the electrode pad (212). The COB light source (2) is mounted on the DOB circuit layer (13) of the DOB substrate (1) by inverting the electrode light-emitting surface (21), so that the electrode pad (212) is electrically connected to the circuit on the DOB circuit layer (13). The position of the light-emitting body (211) corresponds to the position of the light-emitting hole (14). The heat dissipation surface (22) is used to conduct the heat generated by the COB light source (2) during operation to the outside. The driving circuit component (3) is disposed on the DOB circuit layer (13) of the DOB substrate (1) and is used to drive the COB light source (2).

2. The light source inverted COB-DOB module as described in claim 1, characterized in that, The COB light source (2) has a single-sided substrate structure, including a COB substrate (23), a COB insulating layer (24) and a COB circuit layer (25) stacked in sequence; the light emitter (211) and the electrode pad (212) are disposed on the COB circuit layer (25) to form the electrode light-emitting surface (21); the surface of the COB substrate (23) facing away from the COB insulating layer (24) forms the heat dissipation surface (22).

3. The light source inverted COB-DOB module as described in claim 1, characterized in that, The COB light source (2) has a double-sided substrate structure, including a COB substrate (23), a first COB insulating layer (241), a first COB circuit layer (251), a second COB insulating layer (242), and a second COB circuit layer (252); the first COB insulating layer (241) is disposed on the first surface of the COB substrate (23), and the first COB circuit layer (251) is disposed on the surface of the first COB insulating layer (241) facing away from the COB substrate (23); the second COB insulating layer (241) is disposed on the surface of the first COB insulating layer (241) facing away from the COB substrate (23); 2) The second COB circuit layer (252) is disposed on the second surface of the COB substrate (23) opposite to the first surface, and the second COB insulating layer (242) is disposed on the surface of the second COB substrate (23) opposite to the COB substrate (23); the light emitter (211) and the electrode pad (212) are disposed on the first COB circuit layer (251) to form the electrode light-emitting surface (21); the second COB circuit layer (252) is provided with a thermal pad (26), and the surface of the thermal pad (26) forms the heat dissipation surface (22).

4. The light source inverted COB-DOB module as described in any one of claims 1 to 3, characterized in that, The orthographic projection of the light emitter (211) on the DOB substrate (1) is completely located within the area of ​​the light-emitting aperture (14), and the minimum inner diameter of the light-emitting aperture (14) is greater than the maximum outer diameter of the light emitter (211).

5. The light source inverted COB-DOB module as described in claim 4, characterized in that, The light-emitting hole (14) is a circular hole, and the light-emitting area of ​​the light-emitting body (211) is circular.

6. The light source inverted COB-DOB module as described in any one of claims 1 to 3, characterized in that, The DOB substrate (11) is a metal substrate, and the heat dissipation surface (22) of the COB light source (2) is a metal surface.

7. A lamp, characterized in that, Includes the inverted COB-DOB module and lamp body (4) as described in any one of claims 1 to 6; the inverted COB-DOB module is mounted on the lamp body (4), and the heat dissipation surface (22) of the COB light source (2) is in thermal contact with the lamp body (4).

8. The lamp as described in claim 7, characterized in that, The lamp body (4) includes a mounting boss (41) and a housing (42). The inverted COB-DOB module of the light source is mounted on the mounting boss (41), so that the heat dissipation surface (22) of the COB light source (2) is in thermal contact with the mounting boss (41). The side wall of the mounting boss (41) and the housing (42) form a cavity for accommodating the driving circuit components (3), and the height of the side wall of the mounting boss (41) is greater than the maximum height of the driving circuit components (3).

9. The lamp as described in claim 8, characterized in that, The mounting boss (41) is made of metal and is fixedly connected to or integrally formed with the outer shell (42), forming the main heat dissipation channel of the lamp.

10. The luminaire as described in any one of claims 7 to 9, characterized in that, The lamp body (4) also includes a secondary optical device (43), which is disposed on the side of the DOB substrate (11) away from the DOB insulating layer (12) and covers the light outlet (14); the light inlet of the secondary optical device (43) is correspondingly disposed to the light outlet (14).

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