An LED optical template

Abstract

The utility model discloses a LED optical template, including copper base plate and set up on copper base plate LED light source, copper base plate includes base plate, copper bottom plate and insulating layer, insulating layer with base plate sets up respectively on the upper, lower end surface of copper bottom plate, set up a plurality of pits for exposing copper bottom plate on insulating layer, a plurality of pits all are provided with ceramic plate, LED light source includes a plurality of LED chips, a plurality of LED chips all one -one through ceramic plate set up on pit. It can increase the contact area of LED chip and base plate, improve the heat conduction efficiency, and reduce the probability of heat damage.

Description

Technical Field

[0001] This utility model relates to the field of circuit boards, and more particularly to an LED optical template. Background Technology

[0002] LED lights are becoming increasingly common in daily life and work. A typical LED light usually contains multiple LED chips. An LED chip generally includes the chip body and the LED bead (LED diode). Multiple LED beads can easily lead to excessive heat generation on the circuit board. Furthermore, the LED chips on a typical LED circuit board have point (pin) contact with the substrate, resulting in a small contact area and low heat conduction efficiency, which can easily lead to overheating and damage. Utility Model Content

[0003] In order to overcome the shortcomings of the prior art, the purpose of this utility model is to provide an LED optical template that can increase the contact area between the LED chip and the substrate, improve the heat conduction efficiency, and reduce the probability of heat damage.

[0004] The objective of this utility model is achieved through the following technical solution:

[0005] An LED optical template includes a copper substrate and an LED light source disposed on the copper substrate. The copper substrate includes a base plate, a copper bottom plate, and an insulating layer. The insulating layer and the base plate are respectively disposed on the upper and lower end faces of the copper bottom plate. The insulating layer has multiple recesses for exposing the copper bottom plate. Each of the multiple recesses contains a ceramic plate. The LED light source includes multiple LED chips, each of which is disposed on the recess through the ceramic plate.

[0006] Preferably, multiple sinkholes are arranged in a matrix in the middle of the insulating layer, the ceramic plate forms a boss, and the LED chip is attached to the boss.

[0007] Preferably, the LED chip includes a lamp bead and pins electrically connected to the lamp bead, the recess further includes a side hole, the lamp bead is disposed on the ceramic plate, and the pins are disposed in the side hole.

[0008] Preferably, the copper substrate further includes a plurality of perforations for positioning, the plurality of perforations being evenly distributed around the plurality of sinkholes.

[0009] Preferably, the LED light source further includes a circuit and multiple electrical contacts. The circuit is disposed on the insulating layer, and the multiple electrical contacts are respectively disposed on both sides of multiple recesses. The electrical contacts are electrically connected to the LED chip through the circuit.

[0010] Preferably, the LED light source further includes components that are electrically connected to the LED chip and are disposed on the insulating layer via solder joints.

[0011] Preferably, the component includes a logic controller, which is electrically connected to the LED chip.

[0012] Preferably, the insulating layer includes a solder resist layer and a surface coating, wherein the solder resist layer is disposed on the upper surface of the copper base plate, and the surface coating is disposed on the upper surface of the solder resist layer.

[0013] Preferably, the insulating layer further includes a screen printing layer for identification, the screen printing layer being disposed on the upper surface of the surface coating.

[0014] Preferably, the ceramic plate is an aluminum nitride ceramic plate, and the copper substrate is a tin-plated copper substrate.

[0015] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0016] The LED optical template disclosed in this application includes a substrate, a copper base plate, and an insulating layer. The insulating layer has multiple recesses communicating with the copper base plate. A ceramic plate, which facilitates heat conduction, is placed within each recess. The LED chip can achieve surface contact with the ceramic plate, indirectly achieving surface contact between the LED chip and the copper base plate and the substrate, thereby improving heat conduction efficiency and reducing the probability of the LED chip overheating and being damaged. Additionally, the ceramic plate also prevents short circuits. Attached Figure Description

[0017] Figure 1 This is a three-dimensional structural diagram of the LED optical template of this utility model;

[0018] Figure 2 This is a schematic diagram of the planar structure of the LED optical template of this utility model;

[0019] Figure 3 This is a schematic diagram of the planar structure of a portion of the copper substrate of this utility model;

[0020] Figure 4 This is a schematic diagram of the planar structure of a portion of the copper substrate of this utility model;

[0021] Figure 5 This is a schematic diagram of the planar structure of the LED optical template of this utility model after the surface paint has been removed.

[0022] In the diagram: 10, copper substrate; 11, LED light source; 111, LED chip; 112, electrical contact; 113, circuit; 12, through hole; 13, solder joint; 20, insulating layer; 21, surface coating; 22, recess; 221, ceramic plate; 222, boss; 23, solder resist layer; 30, copper base plate; 40, substrate. Detailed Implementation

[0023] The present invention will now be further described in conjunction with the accompanying drawings and specific embodiments:

[0024] In the description of this utility model, it should be noted that the terms "upper," "lower," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product is in use. They are used only for the convenience of describing this utility model and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. Furthermore, the terms "first," "second," and "third," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0025] Implementation Method 1

[0026] like Figure 1 - Figure 3 As shown, this application discloses an LED optical template, including a copper substrate 10 and an LED light source 11 disposed on the copper substrate 10. The copper substrate 10 includes a substrate 40, a copper base plate 30, and an insulating layer 20. The insulating layer 20 and the substrate 40 are respectively disposed on the upper and lower end surfaces of the copper base plate 30. The insulating layer 20 is provided with a plurality of recesses 22 for exposing the copper base plate 30. Each of the plurality of recesses 22 is provided with a ceramic plate 221. The LED light source 11 includes a plurality of LED chips 111, and each of the plurality of LED chips 111 is disposed on the recesses 22 through the ceramic plate 221.

[0027] In the above embodiments, the LED optical template disclosed in this application includes a substrate 40, a copper base plate 30, and an insulating layer 20. The insulating layer 20 is provided with a plurality of recesses 22 communicating with the copper base plate 30. A ceramic plate 221 that facilitates heat conduction is provided in the recesses 22. The LED chip 111 can make surface contact with the ceramic plate 221, thereby indirectly making surface contact between the LED chip 111 and the copper base plate 30 and the substrate 40. The copper base plate 30 and the substrate 40 have high thermal conductivity, thereby improving the thermal conductivity efficiency and reducing the probability of the LED chip 111 overheating and being damaged.

[0028] In addition, the ceramic plate 221 and the substrate 40 can also prevent short circuits between multiple LED chips 111. (Note that the proportions of the components in the accompanying drawings have been adjusted for ease of understanding.)

[0029] In the process of processing the LED optical template, the copper substrate 10 can be installed at the LED chip 111 and recessed to expose the copper base plate 30 as a heat conduction path. Other circuits are designed on the outside of the LED chip 111. The (gold wire) welding positions are designed, and then the ceramic plate 221 is welded to the recess 22 using a high thermal conductivity material. After the welding is reliable, the LED chip 111 is placed on the ceramic plate 221. Further subsequent processes such as wire bonding, powder coating, and testing are then performed to complete the processing of the LED optical template.

[0030] This LED optical template enables fully automated processing, resulting in high production efficiency, high precision, and good consistency. The heat from the LED chip is directly and extensively conducted to the copper substrate 30, significantly improving heat transfer efficiency. Furthermore, no solder paste is used, eliminating the volatilization of rosin residue that could contaminate the optical components.

[0031] Implementation Method 2

[0032] like Figure 1 - Figure 3 As shown, in a preferred embodiment, a plurality of recesses 22 are arranged in a matrix in the middle of the insulating layer 20, and the ceramic plate 221 forms a boss 222, on which the LED chip 111 is attached. Preferably, the LED chip 111 includes a lamp bead (LED diode) and pins electrically connected to the lamp bead. The recesses 22 also include side holes, the lamp bead is disposed on the ceramic plate 221, and the pins are disposed in the side holes. Preferably, the copper substrate 10 also includes a plurality of through holes 12 for positioning, the plurality of through holes 12 being evenly distributed around the plurality of recesses 22.

[0033] In the above embodiment, multiple recesses 22 are arranged in a matrix in the middle of the insulating layer 20, which helps the LED chip 111 emit light more beautifully and brightly. The protrusions 222 facilitate the adhesion of the LED chip 111, and facilitate the conduction of heat emitted by the LED chip to the copper base plate 30 through the ceramic plate 221. The side holes of the recesses 22 facilitate the installation of the pins, and can also increase the contact area accordingly, thereby improving the heat conduction efficiency. Multiple through holes 12 facilitate the installation and positioning of the copper substrate 10.

[0034] Implementation Method 3

[0035] like Figure 2 - Figure 5As shown, in a preferred embodiment, the LED light source further includes a circuit 113, components, and multiple electrical contacts 112. The circuit 113 is disposed on the insulating layer 20, and the multiple electrical contacts 112 are respectively disposed on both sides of multiple recesses 22. The electrical contacts 112 are electrically connected to the LED chip 111 through the circuit 113. The components are electrically connected to the LED chip 111 and are disposed on the insulating layer 20 through solder points 13. Preferably, the components include a logic controller, which is electrically connected to the LED chip 111.

[0036] In the above embodiment, multiple electrical contacts 112 are used for electrical connection to an external circuit power supply, and the multiple electrical contacts 112 are divided into positive contacts and negative contacts. The line 113 facilitates circuit connection, and the line 113 and the electrical contacts 112 can also be connected to the copper base plate 30 through the ceramic plate 221. The soldering points facilitate the soldering of components, and the logic controller can be a microcontroller or a selection logic chip, which can control multiple LED chips to make the LED light source 11 emit various desired lights. Understandably, the LED light source may also include other materials, such as phosphors to change the color of the LED beads and some decorative accessories.

[0037] Implementation Method 4

[0038] like Figure 3 - Figure 5 As shown, in a preferred embodiment, the insulating layer 20 includes a solder resist layer 23, a surface coating 21, and a screen printing layer (not shown) for identification. The solder resist layer 23 is disposed on the upper surface of the copper substrate 30, and the surface coating 21 is disposed on the upper surface of the solder resist layer 23. The screen printing layer is disposed on the upper surface of the surface coating 21. Preferably, the ceramic plate 221 is an aluminum nitride ceramic plate, and the copper substrate 10 is a tin-plated copper substrate.

[0039] In the above embodiments, the solder resist layer 23 prevents soldering errors, and the surface coating 21 enhances aesthetics and prevents short circuits. The silkscreen layer can display text, facilitating component installation and maintenance. The aluminum nitride ceramic plate and the tin-plated copper substrate save costs, improve heat dissipation, and enhance the toughness of the copper substrate 10.

[0040] In summary, the LED optical template disclosed in this application has a countersunk hole 22 in the insulating layer 20 and a ceramic plate 221 is placed in the countersunk hole 22. This allows the LED chip on the ceramic plate 221 to conduct heat to the copper base plate 30 and the substrate 40, thereby greatly improving heat dissipation performance, reducing the probability of the LED chip 111 overheating and being damaged, and enabling fully automated production of this product.

[0041] For those skilled in the art, various other corresponding changes and modifications can be made based on the technical solutions and concepts described above, and all such changes and modifications should fall within the protection scope of the claims of this utility model.

Claims

1. An LED optical template, comprising a copper substrate and an LED light source disposed on the copper substrate, wherein the copper substrate comprises a base plate, a copper bottom plate, and an insulating layer, the insulating layer and the base plate being respectively disposed on the upper and lower end faces of the copper bottom plate, characterized in that: The insulating layer is provided with multiple recesses for exposing the copper base plate. Each recess contains a ceramic plate. The LED light source includes multiple LED chips, which are all disposed on the recesses through the ceramic plates.

2. The LED optical template according to claim 1, characterized in that: Multiple sinkholes are arranged in a matrix in the middle of the insulating layer, the ceramic plate forms a boss, and the LED chip is attached to the boss.

3. The LED optical template according to claim 2, characterized in that: The LED chip includes a lamp bead and pins electrically connected to the lamp bead. The recess also includes a side hole. The lamp bead is disposed on the ceramic plate, and the pins are disposed in the side hole.

4. The LED optical template according to claim 3, characterized in that: The copper substrate also includes multiple perforations for positioning, which are evenly distributed around the multiple sinkholes.

5. The LED optical template according to claim 1, characterized in that: The LED light source also includes circuits and multiple electrical contacts. The circuits are disposed on the insulating layer, and the multiple electrical contacts are respectively disposed on both sides of multiple recesses. The electrical contacts are electrically connected to the LED chip through the circuits.

6. The LED optical template according to claim 5, characterized in that: The LED light source also includes components that are electrically connected to the LED chip and are mounted on the insulating layer via solder joints.

7. The LED optical template according to claim 6, characterized in that: The component includes a logic controller, which is electrically connected to the LED chip.

8. The LED optical template according to claim 1, characterized in that: The insulating layer includes a solder resist layer and a surface coating. The solder resist layer is disposed on the upper surface of the copper base plate, and the surface coating is disposed on the upper surface of the solder resist layer.

9. The LED optical template according to claim 8, characterized in that: The insulating layer also includes a screen printing layer for identification, which is disposed on the upper surface of the surface coating.

10. The LED optical template according to claim 1, characterized in that: The ceramic plate is an aluminum nitride ceramic plate, and the copper substrate is a tin-plated copper substrate.

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