A hot expanding disk module and a sheet expanding device

Abstract

The application discloses a heat-expanding disk module and a wafer expanding device. The heat-expanding disk module comprises a heat-expanding disk and a heating unit. The heat-expanding disk is used for bearing an expanding film on a workpiece to be processed. The heating unit is used for heating the heat-expanding disk, so that the heat-expanding disk heats the expanding film and forms a plurality of temperature zones in the direction from the center to the edge of the heat-expanding disk. The temperature of the temperature zone close to the center of the heat-expanding disk is greater than the temperature of the temperature zone far from the center of the heat-expanding disk. The application is beneficial to keeping the spacing between each crystal grain on the wafer consistent, thereby being beneficial to avoiding collision between the crystal grains and loss.

Description

Technical Field

[0001] This application relates to the field of wafer processing technology, and in particular to a thermal expansion disk module and wafer expansion equipment. Background Technology

[0002] In semiconductor manufacturing processes, during wafer expansion, the expansion film on the back of the wafer can be heated. When heated, the expansion film softens and becomes easier to expand and stretch. As the expansion film is expanded and stretched, it exerts a tensile force on the wafer that is tightly attached to it. This can separate the wafer into individual grains, or increase the spacing between grains that have already been separated by "cold expansion".

[0003] However, in related technologies, it is difficult to ensure the uniformity of the spacing between grains after stretching. In this case, the spacing between grains in the central region cannot be fully expanded, making it easier for grains in the central region to collide, and thus making the grains more prone to damage. Utility Model Content

[0004] In view of the above-mentioned deficiencies in the related technologies, this application provides a thermal expansion disk module and a wafer expansion device to solve the problem that it is difficult to ensure the uniformity of the spacing between grains after stretching in the related technologies.

[0005] To address the aforementioned technical problems, in a first aspect, this application provides a thermal expansion pad module, which includes:

[0006] A thermal expansion plate, used to hold an expanded film on a workpiece;

[0007] A heating unit is used to heat the heat expansion plate so that the heat expansion plate heats the expansion film and forms multiple temperature zones in the direction from the center to the edge of the heat expansion plate;

[0008] Among these, the temperature of the temperature region closer to the center of the heat expansion plate is greater than the temperature of the temperature region farther from the center of the heat expansion plate.

[0009] In a possible implementation of the first aspect, the plurality of temperature regions includes a central temperature region;

[0010] The plurality of temperature zones further include an annular temperature zone, wherein at least one annular temperature zone is provided surrounding the outer side of the central temperature zone in the direction from the center to the edge of the heat expansion plate; or,

[0011] The multiple temperature zones also include multiple arc-shaped strip temperature zones, which are arranged in at least one ring around the central temperature zone in the direction from the center to the edge of the heat expansion plate.

[0012] In one possible implementation of the first aspect, the central temperature region is a circular region;

[0013] The diameter D1 of the central temperature region and the radial dimension D2 of the workpiece satisfy the following condition: 1 / 4 ≤ D1 / D2 ≤ 2 / 3.

[0014] In a possible implementation of the first aspect, the thermal expansion plate includes:

[0015] Base;

[0016] A support plate, wherein the support plate is disposed on the base, and the support surface is disposed on the support plate;

[0017] The support plate and the base form an inner cavity located at the center of the thermal expansion plate, and the support surface has a plurality of adsorption holes communicating with the inner cavity;

[0018] The heating unit is not installed at the location corresponding to the inner cavity.

[0019] In a possible implementation of the first aspect, the heating unit is used to heat each of the temperature zones; or,

[0020] In the direction from the center to the edge of the heat expansion plate, the outermost temperature region among the multiple temperature regions is the edge temperature region, and the heating unit is used to heat all regions except the edge temperature region.

[0021] In a possible implementation of the first aspect, the heating unit includes an electric heating element that heats the heat expansion plate; or,

[0022] The heating unit includes a liquid output component for supplying heating liquid to the heat expansion plate to heat the heat expansion plate.

[0023] In one possible implementation of the first aspect, the heating unit includes an airflow output element;

[0024] The heat expansion plate is provided with a hot air cavity, and the airflow output component is used to blow the heated airflow into the hot air cavity to heat the heat expansion plate; or...

[0025] The airflow output component is used to blow heated airflow onto the bearing surface to heat the thermal expansion plate.

[0026] In one possible implementation of the first aspect, the thermal expansion disk module further includes:

[0027] A temperature sensing element, which is a contact-type temperature sensing element, is disposed on the heat expansion plate. The temperature sensing element is used to detect the temperature of the heat expansion plate. Multiple temperature zones are each provided with multiple temperature sensing elements evenly arranged; or...

[0028] The temperature sensing element is a non-contact temperature sensing element and is disposed above the thermal expansion plate. The temperature sensing element is used to detect the temperature of the expansion film.

[0029] In one possible implementation of the first aspect, the thermal expansion disk module further includes:

[0030] The control unit is electrically connected to the temperature detection element and the heating unit. The control unit is used to control the working state of the heating unit based on the temperature data detected by the temperature detection element.

[0031] Secondly, this application also provides a hot-expansion disk module, including:

[0032] A thermal expansion plate having a bearing surface for bearing an expansion film on a workpiece;

[0033] A heating unit is provided for heating the central region of the heat expansion plate, such that the temperature of the region near the center of the heat expansion plate is greater than the temperature of the region far from the center of the heat expansion plate.

[0034] The central region includes the center of the thermal expansion plate, and the maximum size of the central region is smaller than the diameter of the thermal expansion plate.

[0035] In a possible implementation of the second aspect, the size of the central region is adjustable.

[0036] Thirdly, this application also provides a film enlargement device, which includes:

[0037] The thermal expansion plate module includes:

[0038] A thermal expansion plate having a bearing surface for bearing an expansion film on a workpiece;

[0039] A heating unit is used to heat the heat expansion plate so that the heat expansion plate heats the expansion film and forms multiple temperature zones in the direction from the center to the edge of the heat expansion plate;

[0040] The display panel shows temperature data for multiple temperature zones.

[0041] Compared with related technologies, this application has at least the following beneficial effects:

[0042] In this application, multiple temperature zones are formed from the center to the edge of the thermal expansion pad. Since the temperature zone closer to the center of the thermal expansion pad has a higher temperature than the zone farther from the center, when the workpiece is a wafer, and after the expansion film on the wafer is placed on the thermal expansion pad, the multiple temperature zones can be arranged from the center of the wafer and the expansion film towards the edge. This ensures that the temperature zone corresponding to the center of both the wafer and the expansion film has the highest temperature, and the temperature zone decreases closer to the edge of both the wafer and the expansion film. Thus, when the thermal expansion pad heats the expansion film, the degree of heating of the expansion film gradually increases from the edge to the center, and the center region, due to its higher temperature, is relatively easier to stretch than the edge.

[0043] In this way, the stretching force of the expanded film is stronger in the central region and weaker closer to the edge. This helps to balance the stretching difficulty from the edge to the center, facilitates the uniform expansion of the expanded film, and ensures the uniformity of the spacing between the grains after stretching. This helps to avoid the problem that the spacing between the grains gradually narrows from the outside to the inside along the radial direction of the wafer due to the increasing stretching difficulty of the expanded film from the edge to the center. It also helps to keep the spacing between the grains on the wafer consistent, thereby avoiding collisions between grains and resulting losses. Attached Figure Description

[0044] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0045] Figure 1 A cross-sectional view of the first type of thermal expansion plate module provided in the embodiments of this application;

[0046] Figure 2 for Figure 1 Enlarged view of point A in the middle;

[0047] Figure 3 One of the schematic diagrams of a thermal expansion plate provided in an embodiment of this application;

[0048] Figure 4 A second schematic diagram of a thermal expansion plate provided in an embodiment of this application;

[0049] Figure 5 An assembly diagram of the expanded film, wafer, and wafer frame provided in an embodiment of this application;

[0050] Figure 6 A cross-sectional view of the thermal expansion disc provided in an embodiment of this application;

[0051] Figure 7 A cross-sectional view of the second type of thermal expansion plate module provided in the embodiments of this application;

[0052] Figure 8 A perspective view of the third type of thermal expansion plate module provided in the embodiments of this application;

[0053] Figure 9 for Figure 7 Enlarged view of point B in the middle;

[0054] Figure 10 A schematic diagram showing the distribution of temperature sensing elements on a thermal expansion plate according to an embodiment of this application;

[0055] Figure 11 This is a schematic diagram illustrating the temperature detection of a non-contact temperature sensing device provided in an embodiment of this application.

[0056] Figure 12 This is a cross-sectional view of the expander provided in an embodiment of this application.

[0057] Explanation of reference numerals in the attached figures:

[0058] 1-Heat expansion plate; 11-Bearing surface; 12-Temperature zone; 121-Edge temperature zone; 122-Center temperature zone; 123-Annular temperature zone; 124-Arc-shaped strip temperature zone; 13-Installation cavity; 14-Hot air cavity; 15-Base; 16-Inner cavity; 17-Bearing plate;

[0059] 2-Heating unit; 21-Electric heating element; 211-Annular heating wire; 22-Controller; 23-Airflow output element;

[0060] 3-Expanded membrane;

[0061] 4-Wafer; 41-Grain; 42-Spacing;

[0062] 5-Temperature detection component; 6-Control unit; 7-First clamping plate; 8-Second clamping plate; 9-Wafer frame; 10-Clamping drive component; 20-First lifting drive component; 30-Second lifting drive component; 40-Guide wheel; 100-Thermal expansion plate module; 200-Clamping module. Detailed Implementation

[0063] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0064] In this application, the terms "upper," "lower," "left," "right," "front," "rear," "top," "bottom," "inner," "outer," "vertical," "horizontal," "lateral," and "longitudinal" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. These terms are primarily for the purpose of better describing this application and its embodiments, and are not intended to limit the indicated device, element, or component to having a specific orientation, or to be constructed and operated in a specific orientation.

[0065] Furthermore, in addition to indicating location or positional relationship, some of the aforementioned terms may also have other meanings. For example, the term "above" may also be used in some cases to indicate a certain dependency or connection relationship. Those skilled in the art can understand the specific meaning of these terms in this application based on the specific circumstances.

[0066] Furthermore, the terms "installation," "setup," "equipped with," "connection," and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral structure; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium, or an internal connection between two devices, components, or parts. Those skilled in the art can understand the specific meaning of these terms in this application based on the specific circumstances.

[0067] Furthermore, the terms "first," "second," etc., are primarily used to distinguish different devices, elements, or components (which may be the same or different in specific type and construction), and are not intended to indicate or imply the relative importance or quantity of the indicated devices, elements, or components. Unless otherwise stated, "a plurality of" means two or more.

[0068] As described in the background section of this application, in semiconductor manufacturing processes, during wafer expansion, the expansion film on the back of the wafer can be heated. Heated, the expansion film softens and becomes easier to expand and stretch. This expansion and stretching of the film exerts a tensile force on the wafer tightly adhered to it, thereby separating the wafer into individual grains or increasing the spacing between the grains separated by "cold expansion." "Cold expansion" is a standard process in wafer expansion and will not be further explained here.

[0069] However, in related technologies, during wafer expansion, the spacing between the grains gradually narrows from the outside to the inside along the radial direction of the wafer. This means that the spacing between the grains in the central region cannot be fully expanded, making it easier for the grains in the central region to collide, and thus making the grains more prone to wear.

[0070] In view of the above-mentioned problems, this application provides a thermal expansion disk module to solve the problem that the spacing between the dies gradually narrows from the outside to the inside along the radial direction of the wafer in the related technology.

[0071] The technical solution of this application will be further described below with reference to specific embodiments and accompanying drawings:

[0072] like Figure 1 , Figure 3 and Figure 4 As shown, the thermal expansion plate module 100 includes a thermal expansion plate 1 and a heating unit 2. The thermal expansion plate 1 has a bearing surface 11, which is used to support the expansion film 3 on the workpiece to be processed.

[0073] Heating unit 2 is used to heat the heat expansion plate 1, so that the heat expansion plate 1 heats the expansion film 3, and in the direction from the center to the edge of the heat expansion plate 1 (e.g. Figure 1 Multiple temperature regions are formed in the X direction (12). Figure 3 and Figure 4 (As shown).

[0074] Among the multiple temperature zones 12, the temperature of the temperature zone 12 closer to the center of the heat expansion plate 1 is greater than the temperature of the temperature zone 12 farther from the center of the heat expansion plate 1.

[0075] With this configuration, multiple temperature zones 12 are formed from the center to the edge of the heat expansion plate 1. Furthermore, the temperature of the temperature zone 12 closest to the center of the heat expansion plate 1 is greater than the temperature of the temperature zone 12 furthest from the center of the heat expansion plate 1. Therefore... Figure 1 and Figure 5 As shown, when the workpiece to be processed is wafer 4, and after the expansion film 3 on wafer 4 is placed on the thermal expansion pad 1, multiple temperature zones 12 can be arranged from the center of wafer 4 and expansion film 3 towards the edge. This ensures that the temperature zone 12 corresponding to the center region of both wafer 4 and expansion film 3 has the highest temperature, and the temperature zone 12 decreases as it approaches the edge of both wafer 4 and expansion film 3. In this way, when the thermal expansion pad 1 heats the expansion film 3, the degree of heating of the expansion film 3 gradually increases from the edge to the center region, and the center region is more easily stretched than the edge due to its higher temperature.

[0076] In this way, the stretching force of the expanded film 3 is stronger in the central region and weaker closer to the edge. This helps to balance the stretching difficulty from the edge to the center, facilitates the uniform expansion of the expanded film 3, and helps to ensure the grain size 41 after stretching. Figure 1 and Figure 5 The spacing between (as shown) is 41 ( Figure 1 and Figure 5The uniformity of the wafer 41 (as shown) helps to avoid the problem in related technologies where the stretching difficulty of the expanded film 3 gradually increases from the edge to the center, causing the spacing 42 between the grains 41 to gradually narrow from the outside to the inside along the radial direction of the wafer 4. This helps to keep the spacing 42 between each grain 41 on the wafer 4 consistent, thereby helping to avoid collisions between the grains 41 that cause losses.

[0077] In some alternative embodiments, such as Figure 3 As shown, the plurality of temperature zones 12 include a central temperature zone 122 and an annular temperature zone 123. In the direction from the center to the edge of the heat expansion plate 1, at least one annular temperature zone 123 is arranged around the outside of the central temperature zone 122.

[0078] This arrangement allows the central temperature region 122 and the annular temperature region 123 to be concentrically arranged, ensuring that the temperature at any radius is uniform in the circumferential direction. This, in turn, ensures that the softening degree of the expanded membrane 3 is the same in the circumferential direction at any radius, thereby generating a symmetrical and balanced tensile force during stretching, which is beneficial to further ensure the uniform expansion of the expanded membrane 3.

[0079] In some other alternative embodiments, such as Figure 4 As shown, the plurality of temperature regions 12 include a central temperature region 122 and a plurality of arc-shaped strip temperature regions 124. In the direction from the center to the edge of the heat expansion plate 1, the plurality of arc-shaped strip temperature regions 124 are arranged around the central temperature region 122 in at least one ring.

[0080] This configuration not only creates a hierarchical, surrounding temperature control structure from the center to the edge of the heat expansion plate 1, but also allows for the individual adjustment of the temperature of each arc-shaped strip temperature region 124 to meet the heat expansion requirements of different circumferential positions, thereby enhancing practicality.

[0081] In this embodiment, the temperatures of the multiple arc-shaped temperature regions 124 can be the same or different. The temperature relationship between the arc-shaped temperature regions 124 can be set flexibly. Specifically, it can be set according to actual needs. This embodiment does not impose any specific limitations on this.

[0082] Furthermore, in some optional embodiments, the central temperature region 122 is a circular region, and the diameter D1 of the central temperature region 122 and the radial dimension D2 of the workpiece satisfy: 1 / 4≤D1 / D2≤2 / 3.

[0083] This configuration ensures that the central temperature region 122 can cover the central region of the wafer 4, while also preventing the central temperature region 122 from heating too much, thereby preventing the edge region of the expansion film 3 from overheating. This helps to ensure the uniform expansion of the expansion film 3.

[0084] In this embodiment, the value of D1 / D2 can be any value within the range of 1 / 4, 2 / 3, or 1 / 4-2 / 3. The specific value of D1 / D2 is set flexibly and can be set according to actual needs. This embodiment does not impose any specific limitations on this.

[0085] For the radial dimension D2, when the workpiece to be processed is wafer 4, since wafer 4 is usually circular, the radial dimension D2 is the diameter of wafer 4. However, when the workpiece to be processed is another non-circular part, the radial dimension D2 can be the maximum size of the workpiece to be processed.

[0086] In some alternative embodiments, such as Figure 1 As shown, the thermal expansion plate 1 includes a base 15 and a support plate 17, wherein the support plate 17 is disposed on the base 15 and the support surface 11 is disposed on the support plate 17.

[0087] like Figure 1 and Figure 6 As shown, the support plate 17 and the base 15 form an inner cavity 16 located at the center of the heat expansion plate 1. The support surface 11 has multiple adsorption holes (not shown in the figure) communicating with the inner cavity 16. The heating unit 2 is not provided at the position corresponding to the inner cavity 16.

[0088] The vacuum pump (not shown) is connected to the inner cavity 16 and is used to evacuate the inner cavity 16 so that the multiple adsorption holes adsorb and fix the expansion membrane 3.

[0089] This setup ensures that the expansion membrane 3 in the central area can be heated, while also providing adsorption force to the carrier plate 17 through vacuuming in subsequent processes.

[0090] Regarding the adsorption pores of the support plate 17, in this embodiment, the support plate 17 can be made of a porous material, such as porous ceramic material. In this case, the pores in the porous material constitute the adsorption pores. Alternatively, the adsorption pores can also be manufactured by machining. The configuration of the adsorption pores is quite flexible and can be selected according to actual needs. This embodiment does not impose specific limitations on this.

[0091] In this embodiment, the vacuum pump can be a vacuum pump or a vacuum generator, etc. The type of vacuum pump can be selected flexibly. Specifically, it can be selected according to actual needs. This embodiment does not limit this in any specific way.

[0092] Regarding the heating of each temperature zone 12 by the heating unit 2, in some optional embodiments, the heating unit 2 is used to heat each temperature zone 12.

[0093] This configuration allows for precise temperature control of each temperature zone 12, ensuring that each zone maintains its set temperature value and preventing heat interference. This allows the expansion film 3, mounted on the thermal expansion plate 1, to exhibit the expected softening degree in different temperature zones 12. This ensures that during wafer expansion, different parts of the expansion film 3 exert the required tensile force on the wafer 4, resulting in a more uniform spacing 42 between the separated grains 41. This improves the accuracy and reliability of the wafer expansion process and effectively reduces the problem of uneven spacing 42 between the grains 41 after wafer expansion caused by inaccurate temperature control.

[0094] In some other alternative embodiments, such as Figure 3 and Figure 4 As shown, the outermost temperature region 12 among the multiple temperature regions 12 is the edge temperature region 121, and the heating unit 2 is used to heat the other temperature regions 12 except for the edge temperature region 121.

[0095] This setup not only enables precise temperature control of the inner temperature zone 12, ensuring that the inner temperature zone 12 maintains the set temperature value, but also allows the edge temperature zone 121 to maintain room temperature by utilizing natural heat dissipation characteristics. This still ensures that the spacing 42 between the grains 41 after the thermal expansion film 3 is stretched is uniform, and it also reduces energy loss caused by heating, which helps to reduce costs.

[0096] This setup ensures the stretching effect while reducing the adverse effects of excessively high or low temperatures on the expanded film 3 and grains 41, further improving the stability and reliability of the expansion process.

[0097] For heating unit 2, further, in some optional embodiments, such as Figure 1 and Figure 2 As shown, the heating unit 2 includes an electric heating element 21, which heats the heat expansion plate 1. The electric heating element 21 is disposed on the heat expansion plate 1 and is thermally connected to the heat expansion plate 1. The thermal connection can be, for example, by using thermally conductive adhesive to thermally connect the electric heating element 21 to the heat expansion plate 1 or by contacting it for thermal conduction. Alternatively, the electric heating element 21 can be arranged to directly contact the non-bearing surface of the heat expansion plate 1 for thermal conduction.

[0098] With this configuration, the heating power can be precisely controlled by controlling the current or voltage of the electric heating element 21, which is beneficial for precisely controlling the temperature of each temperature zone 12, that is, for precisely controlling the heating temperature of each temperature zone 12 on the expansion film 3, and further ensuring the uniform expansion of the expansion film 3.

[0099] In this embodiment, the portion where the electric heating element 21 is located can be a mounting surface, a mounting groove, or a mounting cavity 13. Figure 2As shown in the figure, the mounting cavity 13 can be formed by the support plate 17 and the base 15. The structure for mounting the electric heating element 21 is flexible and can be configured according to actual needs. This application embodiment does not impose specific limitations on this.

[0100] Furthermore, in some alternative embodiments, such as Figure 1 and Figure 2 As shown, at least one electric heating element 21 is provided within the temperature region 12 heated by the heating unit 2.

[0101] With this configuration, the electric heating element 21 can heat the corresponding temperature zone 12, enabling independent temperature control of the corresponding temperature zone 12. This facilitates more precise temperature control of the temperature zone 12 heated by the heating unit 2.

[0102] Furthermore, in some optional embodiments, the electric heating element 21 is a PI (Polyimide) film heating element.

[0103] With this configuration, the heating circuitry within the PI film heating element is evenly distributed, resulting in a more uniform heating effect. This facilitates uniform heating of the expanded film 3 across all temperature zones 12. Furthermore, the relatively thin overall thickness of the PI film heating element reduces the space occupied by the heat expansion plate 1, enabling a miniaturized design of the heat expansion plate 1.

[0104] In some alternative embodiments, when the electric heating element 21 is circular or annular and concentrically arranged with the wafer 4, an 8-inch wafer with a smaller diameter can have 2-3 electric heating elements 21 arranged concentrically, while a 12-inch wafer with a larger diameter can have 2, 3, 4, or more electric heating elements 21 arranged concentrically. This allows for convenient independent heating temperature control of the extended film 3 at different locations on the back of the wafer 4, ensuring simultaneous heating of the extended film 3 across the entire circumference.

[0105] In some alternative embodiments, the electric heating element 21 may also be a PTC (Positive Temperature Coefficient) heating element, an MCH (Metal Ceramic Heater) heating element, or an AIN (Aluminum Nitride) heating element, etc. The type of electric heating element 21 is flexible and can be selected according to actual needs. This application embodiment does not make specific limitations in this regard.

[0106] Furthermore, in some alternative embodiments, such as Figure 6As shown, the electric heating element 21 includes annular heating wires 211, and multiple annular heating wires 211 are arranged concentrically along the first direction.

[0107] like Figure 1 As shown, the heating unit 2 also includes a controller 22, which is electrically connected to a plurality of annular heating wires 211. The controller 22 is used to control the power supply to independently supply power to each annular heating wire 211 so that each annular heating wire 211 has an independent working state.

[0108] This design eliminates the risk of overall failure caused by the failure of a single heating wire in traditional series heating methods. When a certain ring heating wire 211 malfunctions, the other ring heating wires 211 can still work normally, which helps to ensure the normal heating of the electric heating element 21.

[0109] On the other hand, the working state of each ring heating wire 211 can be dynamically adjusted in real time according to processing requirements. For example, when processing wafers 4 of different sizes, by turning on or off specific ring heating wires 211, the range of the corresponding temperature zone 12 can be adjusted to adapt to wafers 4 of different sizes, thereby significantly enhancing the adaptability of the thermal expansion plate 1.

[0110] For the heating unit 2, in some alternative embodiments, the heating unit 2 includes a liquid output component for supplying heating liquid to the heat expansion plate 1 to heat the heat expansion plate 1.

[0111] With this configuration, the temperature of each temperature zone 12 on the heat expansion plate 1 can be more stable due to the good thermal stability and heat transfer uniformity of the heating liquid, which helps to avoid local temperature fluctuations.

[0112] Furthermore, in some optional embodiments, at least one liquid cavity is provided within the temperature region 12 heated by the heating unit 2, and a liquid output component is provided for each liquid cavity, which is used to deliver heated liquid into the corresponding liquid cavity. The liquid cavity may be formed by the support plate 17 and the base 15.

[0113] With this configuration, the temperature, flow rate, and velocity of the heated liquid delivered to the corresponding liquid cavity can be adjusted individually for each liquid output component, so that each temperature zone 12 can stably maintain the preset temperature parameters and effectively avoid temperature interference between different zones.

[0114] In this embodiment, the liquid output component can be a gear pump or a centrifugal pump, etc. The type of liquid output component is flexible and can be selected according to actual needs. This embodiment does not impose any specific limitations on this.

[0115] For heating unit 2, further, in some alternative embodiments, such as Figure 7 and Figure 8 As shown, the heating unit 2 includes an airflow output component 23, such as... Figure 9 As shown, a hot air cavity 14 is provided inside the heat expansion plate 1, and an airflow output component 23 is used to blow heated airflow into the hot air cavity 14 to heat the heat expansion plate 1. The hot air cavity 14 can be formed by a support plate 17 and a base 15.

[0116] With this configuration, the hot air cavity 14, as a closed space inside the heat expansion plate 1, can confine the heating airflow within a preset range, which can prevent heat from being lost to the outside and thus enhance the heating efficiency of the heat expansion plate 1.

[0117] In this embodiment, the airflow output component 23 can be a hot air gun or an infrared hot air composite heating head, etc. This embodiment uses a hot air gun as an example for explanation. The type of airflow output component 23 is flexible and can be selected according to actual needs. This embodiment does not impose specific limitations on this.

[0118] Furthermore, in some alternative embodiments, such as Figure 9 As shown, at least one hot air cavity 14 is provided within the temperature region 12 heated by the heating unit 2, and each hot air cavity 14 is provided with an airflow output component 23, which is used to blow heating airflow into the corresponding hot air cavity 14.

[0119] With this configuration, heating airflow is blown into the corresponding hot air cavity 14 through the corresponding airflow output component 23, which can achieve independent temperature control of the corresponding temperature zone 12, thereby facilitating precise temperature control of the corresponding temperature zone 12.

[0120] In some other alternative embodiments, such as Figure 8 As shown, the airflow output component 23 is used to blow heated airflow onto the bearing surface 11.

[0121] This setup not only enables effective heating of the thermal expansion plate 1, but also removes dust particles from the bearing surface 11, keeping the bearing surface 11 clean and thus helping to avoid damage to the expansion membrane 3.

[0122] Furthermore, in some optional embodiments, a corresponding airflow output component 23 is provided for the temperature region 12 heated by the heating unit 2. The airflow output component 23 is used to blow heating airflow onto a portion of the bearing surface 11 within the corresponding temperature region 12.

[0123] With this configuration, by blowing heated airflow onto a portion of the bearing surface 11 within the corresponding temperature zone 12 through the airflow output component 23, independent temperature control of the corresponding temperature zone 12 can be achieved, which is beneficial for achieving precise temperature control of the corresponding temperature zone 12.

[0124] Furthermore, in some optional embodiments, the airflow output element 23 is movably disposed parallel to the bearing surface 11 to blow heated airflow onto the bearing surface 11.

[0125] This configuration, with its movement parallel to the bearing surface 11, ensures that the airflow output component 23 always acts on the bearing surface 11 at a stable distance, thus avoiding uneven heat flow caused by changes in distance.

[0126] In some alternative embodiments, such as Figure 1 As shown, the thermal expansion plate module 100 also includes a temperature detection element 5. The temperature detection element 5 is a contact-type temperature detection element and is disposed on the thermal expansion plate 1. The temperature detection element 5 is used to detect the temperature of the thermal expansion plate 1, such as... Figure 10 As shown, multiple temperature zones 12 are each equipped with multiple uniformly arranged temperature detection elements 5.

[0127] With this setup, multiple temperature sensors 5 are evenly arranged in each temperature zone 12. This allows for full circumferential coverage detection of each temperature zone 12. Furthermore, by averaging the temperatures detected by the multiple temperature sensors 5, the average temperature of the corresponding temperature zone 12 can be obtained. This average temperature enables more accurate temperature detection.

[0128] In addition, the contact-type temperature sensing element can directly contact the thermal expansion plate 1, which helps to improve the accuracy of temperature detection and achieve more accurate temperature detection.

[0129] In this embodiment, the contact temperature sensing element can be a resistance temperature detector (RTD) sensor or a thermocouple sensor, etc. The type of contact temperature sensing element is flexible and can be selected according to actual needs. This embodiment does not impose any specific limitations on this.

[0130] In some other alternative embodiments, such as Figure 11 As shown, the temperature detection element 5 is a non-contact temperature detection element and is located above the thermal expansion plate 1. The temperature detection element 5 is used to detect the temperature of the expansion film 3.

[0131] With this setup, the detection area of ​​the non-contact detection can be flexibly adjusted, enhancing the flexibility of temperature detection. It can also directly detect the temperature of the expanded membrane 3, and the detected temperature can more accurately reflect the state of the expanded membrane 3.

[0132] In this embodiment, the non-contact temperature detection device can be an infrared thermometer or a fiber optic temperature sensor, etc. The type of non-contact temperature detection device is flexible and can be selected according to actual needs. This embodiment does not impose any specific limitations on this.

[0133] Furthermore, in some alternative embodiments, such as Figure 1 and Figure 11 As shown, the heat expansion plate module 100 also includes a control unit 6, which is electrically connected to the temperature detection element 5 and the heating unit 2. The control unit 6 is used to control the working state of the heating unit 2 according to the temperature data detected by the temperature detection element 5.

[0134] Controlling the operating state of heating unit 2 refers to controlling whether heating unit 2 needs to heat up, cool down, or maintain the temperature, as well as whether heating unit 2 needs to be started or stopped. Specifically, when the expansion process begins, the control unit 6 can control heating unit 2 to start and heat the expansion plate 1; when the temperature sensor 5 detects that the temperature has not reached the corresponding set temperature, the control unit 6 can control heating unit 2 to heat; when the temperature sensor 5 detects that the temperature has reached the corresponding set temperature, the control unit 6 can control heating unit 2 to stop heating and instead maintain the corresponding set temperature, i.e., maintain the temperature; when the expansion process is completed, the control unit 6 can control heating unit 2 to be turned off.

[0135] As can be seen from the above description, the control unit 6 can conveniently control the working state of the heating unit 2 based on the temperature data detected by the temperature sensor 5, which is beneficial to improving the level of automation.

[0136] This application also provides a thermal expansion disk module 100, such as Figure 1 As shown, the thermal expansion plate module 100 includes a thermal expansion plate 1 and a heating unit 2. The thermal expansion plate 1 has a bearing surface 11, which is used to bear the expansion film 3 on the workpiece to be processed.

[0137] Heating unit 2 is used to heat the central region of heat expansion plate 1, such that the temperature of the region near the center of heat expansion plate 1 is greater than the temperature of the region far from the center of heat expansion plate 1. The central region includes the center of heat expansion plate 1, and the maximum size of the central region is smaller than the diameter of heat expansion plate 1.

[0138] With this configuration, the heating unit 2 can raise the temperature of the central area to be higher than the temperature of the area further away from the center of the heat expansion plate. Figure 1 and Figure 5As shown, when the workpiece to be processed is wafer 4, and when the expansion film 3 on wafer 4 is placed on the thermal expansion pad 1, the central region of both wafer 4 and expansion film 3 corresponds to the central region of thermal expansion pad 1 with the highest temperature. Furthermore, the temperature of thermal expansion pad 1 decreases as it approaches the edges of both wafer 4 and expansion film 3. Thus, when thermal expansion pad 1 heats expansion film 3, the degree of heating of expansion film 3 gradually increases from the edge to the center region, and the central region, due to its higher temperature, is relatively easier to stretch compared to the edges.

[0139] In this way, the stretching force of the expanded film 3 is stronger in the central region and weaker closer to the edge. This helps to balance the stretching difficulty from the edge to the center, facilitates the uniform expansion of the expanded film 3, and helps to ensure the grain size 41 after stretching. Figure 1 and Figure 5 The spacing between (as shown) is 41 ( Figure 1 and Figure 5 The uniformity of the wafer 41 (as shown) helps to avoid the problem that the spacing 42 between the grains 41 gradually narrows from the outside to the inside along the radial direction of the wafer 4 due to the increasing difficulty of stretching the expanded film 3 from the edge to the center. This helps to keep the spacing 42 between the grains 41 on the wafer 4 consistent, thereby helping to avoid collisions between the grains 41 that cause losses.

[0140] It should be explained that the difference between this heat expansion plate module 100 and any of the heat expansion plate modules 100 in the above embodiments is that the heating unit 2 is only used to heat the central temperature region 122, so that the central temperature region 122 heats the expansion film 3. Of course, this heat expansion plate module 100 may also be different from any of the heat expansion plate modules 100 in the above embodiments, and this application does not specifically limit it.

[0141] Furthermore, in some alternative embodiments, the size of the aforementioned central region is adjustable.

[0142] This configuration allows for the reasonable setting of the size of the central region based on factors such as the type of the expansion film 3 and the size of the grains 41 on the wafer 4.

[0143] Specifically, when the heat expansion plate 1 is heated by the electric heating element 21, the size of the central area can be adjusted by turning on or off the annular heating wire 211 of a specific layer in the central area. This facilitates the adjustment of the size of the central area.

[0144] When heating the thermal expansion plate 1 using a liquid output component, an annular retractable baffle can be installed at the edge of the liquid cavity to adjust the size of the central region. Thus, when the annular retractable baffle expands radially outward, the liquid cavity increases, thereby increasing the size of the central region; when the annular retractable baffle retracts radially inward, the liquid cavity decreases, thereby decreasing the size of the central region. Therefore, the annular retractable baffle facilitates the adjustment of the size of the central region.

[0145] When heating the heat spreader 1 by blowing heating air into the hot air cavity 14 using the airflow output component 23, to adjust the size of the central region, similar to the case where the heat spreader 1 is heated using the liquid output component, an annular retractable baffle can be provided at the edge of the hot air cavity 14. Thus, when the annular retractable baffle expands radially outward, the hot air cavity 14 can be enlarged, thereby increasing the size of the central region; when the annular retractable baffle retracts radially inward, the hot air cavity 14 can be reduced, thereby reducing the size of the central region. Therefore, the annular retractable baffle facilitates the adjustment of the size of the central region.

[0146] When the heat expansion plate 1 is heated by blowing heating air onto the bearing surface 11 using the airflow output component 23, the size of the central area can be adjusted by adjusting the blowing range of the airflow output component 23, thus facilitating the adjustment of the size of the central area.

[0147] This application also provides a film enlargement device, such as... Figure 12 As shown, the expansion device includes a thermal expansion plate module 100 and a display panel. Among them, as... Figure 1 and Figure 3 As shown, the thermal expansion plate module 100 includes a thermal expansion plate 1 and a heating unit 2. The thermal expansion plate 1 has a bearing surface 11 for bearing the expansion film 3 on the workpiece to be processed. The heating unit 2 is used to heat the thermal expansion plate 1 so that the thermal expansion plate 1 heats the expansion film 3 and forms multiple temperature zones 12 in the direction from the center to the edge of the thermal expansion plate 1. Figure 3 and Figure 4 (As shown).

[0148] The display panel shows temperature data for multiple temperature zones 12. It is understood that the thermal expansion plate 1 can have the same configuration as in the above embodiments, and will not be described again here. Correspondingly, the highest temperature value among the multiple temperature data displayed on the display panel represents the temperature of the central region of the thermal expansion plate 1 or the central region of the expansion film 3.

[0149] This setup facilitates the construction of an intelligent temperature control system that combines "data visualization and real-time interaction." Because the display can intuitively present temperature data from multiple temperature zones (12), it allows operators to quickly view real-time temperature data and identify anomalies, thereby improving work efficiency.

[0150] It should be noted that the thermal expansion plate module 100 in the expansion equipment has the same structure as any of the thermal expansion plate modules 100 in the above embodiments, and can bring the same or similar beneficial effects. For details, please refer to the description in the above embodiments. This embodiment will not repeat the description here.

[0151] In this embodiment, the display panel can be a touch screen display or a digital tube display, etc. The type of display panel can be selected flexibly. Specifically, it can be selected according to actual needs. This embodiment does not make specific limitations in this regard.

[0152] Furthermore, in some alternative embodiments, such as Figure 12 As shown, the film expansion device also includes a clamping module 200, which is used to clamp and fix the expansion film 3. The thermal expansion plate 1 and the clamping module 200 are configured to be relatively far apart for stretching and expanding the expansion film 3.

[0153] Specifically, the clamping module 200 includes a first clamping plate 7 and a second clamping plate 8 disposed opposite to each other, such as Figure 5 As shown, since the edge of the expanded film 3 is attached to the wafer frame 9, therefore... Figure 12 As shown, the first clamping plate 7 and the second clamping plate 8 can clamp the expanded film 3 by clamping the wafer frame 9.

[0154] like Figure 12 As shown, the clamping module 200 also includes a clamping drive 10 connected to the first clamping plate 7. The clamping drive 10 is used to drive the first clamping plate 7 to move closer to or away from the second clamping plate 8 to clamp the wafer frame 9 and fix the edge of the expansion film 3. In this way, not only can the stretching effect of the expansion film 3 be guaranteed, but the expansion film 3 can also be prevented from detaching from the clamping module 200.

[0155] In some optional embodiments, the expanding device can stretch the expanding film 3 by circumferential stretching. Specifically, circumferential stretching here refers to the expanding film 3 being subjected to a tensile force that radiates outward in a circular pattern from its center. In this case, the first clamping plate 7 and the second clamping plate 8 can be constructed as annular rings surrounding the thermal expansion plate 1. Thus, when the thermal expansion plate 1 and the clamping module 200 move relative to each other in the vertical direction, the force on the expanding film 3 will radiate outward in a circular pattern from its center. At this time, the clamping module 200 can stretch the expanding film 3 by circumferential stretching.

[0156] In some alternative embodiments, the expanding device can stretch the expanding film 3 by vertical stretching. Specifically, vertical stretching here means that the expanding film 3 is subjected to tensile forces in two directions within the horizontal plane, wherein the two tensile forces are perpendicular to each other. That is, when the thermal expansion plate 1 and the clamping module 200 move relative to each other in the horizontal direction, the expanding film 3 is subjected to tensile forces in two mutually perpendicular directions within the horizontal plane, thereby achieving the stretching of the expanding film 3 by vertical stretching.

[0157] The process of expanding wafer 4 using the wafer expansion equipment described in this application will be introduced below.

[0158] When the wafer expansion equipment expands wafer 4, taking the stretching and expansion film 3 by circumferential stretching as an example, at this time, as... Figure 12 As shown, the heat expansion plate module 100 may further include a first lifting drive 20, which is connected to the heat expansion plate 1 and is used to drive the heat expansion plate 1 to move in the vertical direction, so that the heat expansion plate 1 and the clamping module 200 can move relative to each other in the vertical direction.

[0159] When performing wafer expansion on wafer 4, the second clamping plate 8 can be moved away from the thermal expansion pad 1 first. Then, wafer 4, expansion film 3, and wafer frame 9 are placed on the surface of the first clamping plate 7 and above the thermal expansion pad 1. To facilitate clamping the expansion film 3, the position of the thermal expansion pad 1 should be lower than the first clamping plate 7. Then, the second clamping plate 8 is moved above the first clamping plate 7, and the clamping drive 10 drives the first clamping plate 7 to approach the second clamping plate 8, thereby clamping and fixing the wafer frame 9 to fix the edge of the expansion film 3.

[0160] Generally speaking, such as Figure 12 As shown, a second lifting drive 30 is also required in the expansion equipment. The second lifting drive 30 can be used to drive the guide wheel 40 so that the guide wheel 40 can move in the same direction as the hot expansion plate 1. This ensures that after the hot expansion plate 1 moves to the designated position, the guide wheel 40 can maintain a certain relative distance from the hot expansion plate 1, so as to ensure the protective effect of the guide wheel 40 on the expansion film 3.

[0161] During the process of fixing the expansion film 3, the heating unit 2 can be started first to preheat, shortening the time of the entire expansion process. When the temperature detection element 5 detects that the temperature of multiple temperature zones 12 on the heat expansion plate 1 has reached the preset temperature, the control unit 6 sends a command to the heating unit 2 to stop heating and maintain the current temperature.

[0162] When the temperature detection element 5 detects that the temperatures of multiple temperature zones 12 on the thermal expansion disk 1 have all reached the preset temperature, the first lifting drive element 20 and the second lifting drive element 30 can drive the thermal expansion disk 1 and the guide wheel 40 to rise at a first speed. After the bearing surface 11 contacts the expansion film 3, the first lifting drive element 20 and the second lifting drive element 30 can drive the thermal expansion disk 1 and the guide wheel 40 to rise at a second speed, and the second speed is less than the first speed. After the bearing surface 11 contacts the expansion film 3, since the expansion film 3 is clamped by the clamping module 200 and cannot move, while the thermal expansion disk 1 supports the expansion film 3 and the wafer 4 and moves away from the clamping module 200 in the vertical direction, the expansion film 3 is stretched in the radial direction of the wafer 4. The guide wheel 40 is responsible for ensuring that the part of the expansion film 3 close to the edge of the wafer 4 can transition smoothly when stretched, so as not to be damaged by the edge of the thermal expansion disk 1. After the first lifting drive unit 20 and the second lifting drive unit 30 drive the thermal expansion disk 1 and the guide wheel 40 to rise to the set height, they slowly descend, and the wafer expansion process of the wafer 4 is completed.

[0163] In this embodiment, the clamping drive 10, the first lifting drive 20, and the second lifting drive 30 can be electric cylinders, hydraulic cylinders, or pneumatic cylinders. The selection of the types of clamping drive 10, the first lifting drive 20, and the second lifting drive 30 is flexible and can be chosen according to actual needs. This embodiment does not impose specific limitations on this. It is easy to understand that in the above embodiments, during the process of the thermal expansion plate 1 heating the expansion film 3 and the stretching process after heating the expansion film 3, the vacuuming component does not work, that is, the thermal expansion plate 1 does not adsorb the workpiece to be processed. After the expansion film 3 is stretched, the vacuuming component works, causing the support plate 17 of the thermal expansion plate 1 to generate an adsorption force to adsorb the workpiece to be processed, so that the expansion film 3 remains in the stretched state, which is convenient for subsequent processing.

[0164] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. A thermal expansion disk module, characterized in that, include: A heat expansion plate (1) has a bearing surface (11) for bearing an expansion film (3) on a workpiece to be processed. Heating unit (2) is used to heat the heat expansion plate (1) so that the heat expansion plate (1) heats the expansion film (3) and forms a plurality of temperature zones (12) in the direction from the center to the edge of the heat expansion plate (1); Among the multiple temperature zones (12), the temperature of the temperature zone (12) closer to the center of the heat expansion plate (1) is greater than the temperature of the temperature zone (12) farther from the center of the heat expansion plate (1).

2. The thermal expansion plate module according to claim 1, characterized in that, The plurality of temperature regions (12) include a central temperature region (122); The plurality of temperature zones (12) further include annular temperature zones (123), and at least one of the annular temperature zones (123) is arranged around the outer side of the central temperature zone (122) in the direction from the center to the edge of the heat expansion plate (1); or, The plurality of temperature zones (12) further include a plurality of arc-shaped strip temperature zones (124), which are arranged in at least one ring around the central temperature zone (122) in the direction from the center to the edge of the heat expansion plate (1).

3. The thermal expansion plate module according to claim 2, characterized in that, The central temperature region (122) is a circular region; The diameter D1 of the central temperature region (122) and the radial dimension D2 of the workpiece satisfy the following condition: 1 / 4 ≤ D1 / D2 ≤ 2 / 3.

4. The thermal expansion plate module according to any one of claims 1-3, characterized in that, The heat expansion plate (1) includes: Base (15); A support plate (17) is disposed on the base (15), and a bearing surface (11) is disposed on the support plate (17); The support plate (17) and the base (15) form an inner cavity (16) located at the center of the heat expansion plate (1), and the support surface (11) has a plurality of adsorption holes communicating with the inner cavity (16); The heating unit (2) is not installed at the position corresponding to the inner cavity (16).

5. The thermal expansion disc module according to any one of claims 1-3, characterized in that, The heating unit (2) is used to heat each of the temperature zones (12); or, In the direction from the center to the edge of the heat expansion plate (1), the outermost temperature region (12) among the plurality of temperature regions (12) is the edge temperature region (121), and the heating unit (2) is used to heat the other temperature regions (12) except for the edge temperature region (121).

6. The thermal expansion disk module according to any one of claims 1-3, characterized in that, The heating unit (2) includes an electric heating element (21), which heats the heat expansion plate (1); or, The heating unit (2) includes a liquid output component for supplying heating liquid to the heat expansion plate (1) to heat the heat expansion plate (1).

7. The thermal expansion disc module according to any one of claims 1-3, characterized in that, The heating unit (2) includes an airflow output component (23); The heat expansion plate (1) is provided with a hot air cavity (14), and the airflow output component (23) is used to blow heated airflow into the hot air cavity (14) to heat the heat expansion plate (1); or, The airflow output component (23) is used to blow heating airflow onto the bearing surface (11) to heat the heat expansion plate (1).

8. The thermal expansion plate module according to any one of claims 1-3, characterized in that, The thermal expansion plate module (100) also includes: Temperature detection element (5), the temperature detection element (5) is a contact temperature detection element and is disposed on the heat expansion plate (1), the temperature detection element (5) is used to detect the temperature of the heat expansion plate (1), and multiple temperature zones (12) are each provided with multiple uniformly arranged temperature detection elements (5); or, The temperature detection element (5) is a non-contact temperature detection element and is located above the thermal expansion plate (1). The temperature detection element (5) is used to detect the temperature of the expansion film (3).

9. The thermal expansion plate module according to claim 8, characterized in that, The thermal expansion plate module (100) also includes: Control unit (6), which is electrically connected to the temperature detection element (5) and the heating unit (2), is used to control the working state of the heating unit (2) according to the temperature data detected by the temperature detection element (5).

10. A thermal expansion disk module, characterized in that, include: A heat expansion plate (1) has a bearing surface (11) for bearing an expansion film (3) on a workpiece to be processed. Heating unit (2) is used to heat the central region of the heat expansion plate (1) so that the temperature of the region near the center of the heat expansion plate (1) is greater than the temperature of the region far from the center of the heat expansion plate (1); The central region includes the center of the heat expansion plate (1), and the maximum size of the central region is smaller than the diameter of the heat expansion plate (1).

11. The thermal expansion disk module according to claim 10, characterized in that, The size of the central region is adjustable.

12. A film enlargement device, characterized in that, include: A thermal expansion plate module (100), the thermal expansion plate module (100) comprising: A heat expansion plate (1) has a bearing surface (11) for bearing an expansion film (3) on a workpiece to be processed. Heating unit (2) is used to heat the heat expansion plate (1) so that the heat expansion plate (1) heats the expansion film (3) and forms a plurality of temperature zones (12) in the direction from the center to the edge of the heat expansion plate (1); The display panel displays temperature data for multiple temperature zones (12).

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