A jig for adjusting the parallelism between a stage and a chuck of a wafer flatness machine

Abstract

The utility model discloses a kind of for adjusting wafer flatness machine table's platform and chuck parallel jig, including support plate, the opposite sides of support plate are respectively provided with horizontal observation surface, the bottom of two sides horizontal observation surface is parallel with support plate, and the bottom height of the horizontal observation surface is consistent;The center of support plate is equipped with rotating shaft connecting hole and rotating shaft connecting shaft located in the bottom of rotating shaft connecting hole;When rotating shaft connecting hole, rotating shaft connecting shaft and the rotating shaft after dismounting chuck cooperate, whether the two sides horizontal observation surface can be adhered with platform is observed, or whether the distance between the two sides the horizontal observation surface and platform is equal is observed to judge whether chuck is parallel with platform.The jig provided in the application can improve the efficiency of platform adjustment chuck level, make the relative horizontal precision of platform and chuck higher, and the machine table measurement data is more accurate.

Description

Technical Field

[0001] This utility model belongs to the field of semiconductor manufacturing technology, specifically relating to a fixture for adjusting the stage and chuck of a wafer flatness machine. Background Technology

[0002] In the semiconductor industry, wafer flatness inspection equipment is used to check the flatness of wafers. During inspection, it is essential to ensure that the measurement stage and chuck of the equipment are level. If the measurement stage and chuck are not level, it often leads to problems such as abnormal measurement data and wafer scratches. Current technology requires manual adjustment of the measurement stage and chuck to a level position. Manual adjustment relies solely on visual observation of the wafer gaps, which is not only time-consuming but also cannot guarantee a level position. Utility Model Content

[0003] The purpose of this invention is to provide a fixture for adjusting the parallelism of the stage and chuck of a wafer flatness machine, in order to overcome the shortcomings of the prior art. This fixture can adjust the parallelism of the stage and chuck more efficiently, improve the leveling accuracy, and reduce the adjustment time.

[0004] The objective of this utility model is achieved through the following technical solution:

[0005] A fixture for adjusting wafer flatness, wherein the stage is parallel to the chuck, the stage is provided with a liftable rotating shaft, the chuck is detachably mounted on the top of the rotating shaft, the fixture includes a support plate, and horizontal observation surfaces are provided on opposite sides of the support plate, the bottom of the horizontal observation surfaces on both sides is parallel to the support plate, and the bottom height of the horizontal observation surfaces on both sides is the same.

[0006] The support plate has a rotating shaft connection hole at its center and a rotating shaft connection shaft located at the bottom of the rotating shaft connection hole. The rotating shaft connection shaft has an axial through hole for the rotating shaft to pass through.

[0007] When the rotating shaft connecting hole and the rotating shaft are engaged with the rotating shaft after the suction cup is removed, the suction cup is parallel to the platform by observing whether the horizontal observation surfaces on both sides can fit against the platform, or by observing whether the distance between the horizontal observation surfaces on both sides and the platform is equal. If they are not parallel, the angle of the rotating shaft is adjusted until the suction cup is parallel to the platform.

[0008] Preferably, the horizontal observation surfaces on both sides are located on the left and right sides of the support plate, respectively.

[0009] Preferably, the support plate is also provided with a level.

[0010] Preferably, there are multiple levels.

[0011] Preferably, there are four levels arranged around the connecting hole of the rotating shaft.

[0012] Preferably, a clearance groove is provided between the horizontal observation surfaces on both sides and the support plate.

[0013] Preferably, the bottom height of the horizontal observation surfaces on both sides is the same as the bottom height of the support plate.

[0014] Preferably, the rotating shaft is connected to the suction cup by a thread, and the connecting hole of the rotating shaft is a threaded hole adapted to the thread of the rotating shaft.

[0015] The fixture provided in this application can improve the efficiency of adjusting the suction cup level of the machine tool, make the relative horizontal accuracy between the stage and the suction cup higher, and make the machine tool measurement data more accurate. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the structure of the fixture provided in this application;

[0017] Explanation of reference numerals in the attached figures:

[0018] 1-Rotating shaft connecting hole; 2-Level; 3-Allowing groove; 4-Left side horizontal observation surface; 5-Rotating shaft connecting shaft; 6-Right side horizontal observation surface; 7-Support plate. Detailed Implementation

[0019] A typical wafer flatness inspection machine has a liftable rotating shaft on its platform, and a detachable suction cup is mounted on top of the rotating shaft. The rotating shaft and the suction cup are generally connected by threads.

[0020] The chuck is used to pick up wafers. Accurate wafer flatness measurement data is only obtained when the chuck is parallel to the stage. However, because the rotation axis can move up and down, if the chuck and stage are not parallel, the silicon wafer on the chuck may collide with the stage during the descent of the rotation axis, causing scratches or damage. The problem of the chuck and stage not being parallel generally occurs because the rotation axis is not installed horizontally, resulting in tilting of the chuck and the wafer on it. Current technology relies solely on visually inspecting the gaps between the wafer and the stage to determine if the chuck and stage are level when adjusting the rotation axis installation angle. This is not only time-consuming but also lacks precision.

[0021] To address the aforementioned technical problems, this application provides a fixture for adjusting the parallelism between the stage and the chuck of a wafer flatness adjustment machine, such as... Figure 1As shown, the support plate 7 is provided with horizontal observation surfaces on opposite sides. Preferably, a left horizontal observation surface 4 is provided on the left side of the support plate and a right horizontal observation surface 6 is provided on the right side. The bottom of the two horizontal observation surfaces is parallel to the support plate and the bottom height of the two horizontal observation surfaces is the same.

[0022] The support plate 7 has a rotating shaft connecting hole 1 at its center and a rotating shaft connecting shaft 5 located at the bottom of the rotating shaft connecting hole. The rotating shaft connecting shaft has an axial through hole at its center for the rotating shaft to pass through. In use, the rotating shaft is first adjusted to an upward-push-up position, and the suction cup is removed from the rotating shaft. Then, the rotating shaft connecting shaft and the rotating shaft connecting hole of the fixture are inserted into the rotating shaft. The rotating shaft connecting hole is preferably a threaded hole that matches the thread of the rotating shaft, thus installing the entire fixture onto the rotating shaft. At this time, the support plate acts as a suction cup. The rotating shaft is then slowly lowered, and the horizontal observation surfaces on both sides of the support plate also slowly lower. When it reaches a certain height, if the rotating shaft is horizontally installed, the support plate and the platform will also remain horizontal, and the horizontal observation surfaces on both sides will be able to fully contact the platform. If the rotating shaft is not horizontally installed, the support plate will be tilted, and the horizontal observation surfaces parallel to the support plate will also tilt, thus failing to fully contact the platform. Therefore, by observing whether the horizontal observation surfaces on both sides can fully contact the platform, it can be determined whether the support plate and the suction cup it replaces are parallel to the platform. For the same reason, you can also determine whether the suction cup is parallel to the stage by observing whether the distance between the horizontal observation surfaces on both sides and the stage is equal. When determining whether the distance is equal, you can quickly check by using a feeler gauge between the horizontal observation surfaces on both sides and the stage. If the horizontal observation surfaces on both sides cannot fully fit with the stage, or if the distance between the horizontal observation surfaces on both sides and the stage is not equal, adjust the angle of the rotation axis (specifically by adjusting the four set screws of the fixing frame that holds the rotation axis below the stage) until the horizontal observation surfaces on both sides can fully fit with the stage, or the distance between the horizontal observation surfaces on both sides and the stage is equal.

[0023] After the above leveling, the fixture is removed from the rotating shaft, and then the chuck is reinstalled on the rotating shaft. Generally, after the above adjustments, the chuck and the stage are level. To confirm, the chuck can pick up a wafer for testing. Even if the wafer is found to be not perfectly parallel to the stage after picking it up, only a minor adjustment of the rotating shaft is needed, which significantly reduces the adjustment time compared to existing technologies.

[0024] In summary, the fixture provided in this application can improve the efficiency of the machine tool in adjusting the level of the suction cup, make the relative level accuracy between the stage and the suction cup higher, and make the machine tool measurement data more accurate.

[0025] Preferably, the support plate 7 is also equipped with a level 2, which is used to initially observe the level of the machine platform with the ground and to adjust the machine platform feet, which is a preliminary rough adjustment.

[0026] Preferably, there are multiple levels 2. More preferably, there are four levels arranged around the connecting hole of the rotating shaft, which allows for convenient observation of the machine's levelness from multiple angles.

[0027] Preferably, clearance grooves are provided between the left horizontal observation surface and the support plate, and between the right horizontal observation surface and the support plate.

[0028] A support bar is also provided near the rotating shaft on the platform. To allow the fixture to avoid the support bar, a relief groove 3 is provided. When the rotating shaft descends, the support bar can be placed in the relief groove, thus not obstructing the descent of the rotating shaft and the observation surface. The shape of the relief groove matches the support bar. Since the support bar is strip-shaped, the relief groove is also set as a strip-shaped groove.

[0029] Preferably, the bottom height of the horizontal observation surfaces on both sides is the same as the height of the support plate; or the bottom height of the horizontal observation surfaces on both sides is lower than the bottom height of the support plate, so that the horizontal observation surfaces can be attached to the platform before the support plate.

[0030] Although preferred embodiments of the present invention have been described, those skilled in the art, upon learning the basic inventive concept, can make other changes and modifications to these embodiments. Therefore, the appended claims are intended to be interpreted as including both the preferred embodiments and all changes and modifications falling within the scope of the present invention. Clearly, those skilled in the art can make various alterations and modifications to the present invention without departing from its spirit and scope. Thus, if such modifications and modifications fall within the scope of the claims of the present invention and their equivalents, the present invention also intends to include such modifications and modifications.

Claims

1. A fixture for adjusting the flatness of a wafer, wherein a stage and a chuck are parallel, the stage being provided with a height-adjustable rotating shaft, and the chuck is detachably mounted on top of the rotating shaft, characterized in that... The fixture includes a support plate, and horizontal observation surfaces are provided on opposite sides of the support plate. The bottom of the horizontal observation surfaces on both sides is parallel to the support plate, and the bottom height of the horizontal observation surfaces on both sides is the same. The support plate has a rotating shaft connection hole at its center and a rotating shaft connection shaft located at the bottom of the rotating shaft connection hole. The rotating shaft connection shaft has an axial through hole for the rotating shaft to pass through. When the rotating shaft connecting hole and the rotating shaft are engaged with the rotating shaft after the suction cup is removed, the suction cup is parallel to the platform by observing whether the horizontal observation surfaces on both sides can fit against the platform, or by observing whether the distance between the horizontal observation surfaces on both sides and the platform is equal. If they are not parallel, the angle of the rotating shaft is adjusted until the suction cup is parallel to the platform.

2. The fixture for adjusting the parallelism between the stage and the chuck of a wafer flatness adjustment machine as described in claim 1, characterized in that, The horizontal observation surfaces on both sides are located on the left and right sides of the support plate, respectively.

3. The fixture for adjusting the parallelism between the stage and the chuck of a wafer flatness adjustment machine as described in claim 1, characterized in that... The support plate is also equipped with a level.

4. The fixture for adjusting the parallelism between the stage and the chuck of a wafer flatness adjustment machine as described in claim 3, characterized in that... There are multiple levels.

5. The fixture for adjusting the parallelism between the stage and the chuck of a wafer flatness adjustment machine as described in claim 4, characterized in that... There are four levels, arranged around the connecting hole of the rotating shaft.

6. The fixture for adjusting the parallelism between the stage and the chuck of a wafer flatness adjustment machine as described in claim 1, characterized in that, Both sides of the horizontal observation surface are provided with clearance grooves between themselves and the support plate.

7. The fixture for adjusting the parallelism between the stage and the chuck of a wafer flatness adjustment machine as described in claim 1, characterized in that... The bottom height of the horizontal observation surfaces on both sides is the same as the bottom height of the support plate.

8. The fixture for adjusting the parallelism between the stage and the chuck of a wafer flatness adjustment machine as described in claim 1, characterized in that, The rotating shaft is connected to the suction cup by a thread, and the connecting hole of the rotating shaft is a threaded hole that is adapted to the thread of the rotating shaft.

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