A double-sided heat dissipation module based on pre-bond power device

Abstract

The utility model relates to a kind of double-sided heat dissipation module based on pre-taped power device, including tube shell, at least one pre-taped power device, lower insulating heat sink, upper insulating heat sink, upper radiator, at least one electrically conductive component and protective glue;Tube shell has openwork area on it;Pre-taped power device, lower insulating heat sink, upper insulating heat sink and electrically conductive component are all located in openwork area;The upper surface of lower insulating heat sink and the lower surface of upper insulating heat sink are each equipped with circuit layer;The upper and lower surfaces of pre-taped power device are respectively attached in the corresponding position between two circuit layers, realize electrical connection;Tube shell is equipped with several signal pins;Protective glue is filled in the openwork area.The utility model also relates to a kind of preparation process of double-sided heat dissipation module based on pre-taped power device.

Description

Technical Field

[0001] This utility model relates to the field of integrated circuit manufacturing technology, and in particular to a double-sided heat dissipation module based on pre-attached power devices and its fabrication process. Background Technology

[0002] Traditional modular packaging has two main characteristics. First, the chip is directly mounted on an insulating heat sink, with internal electrical conduction and current transfer achieved via bonding wires. This method significantly increases the total inductance of the circuit loop, leading to greater electrical interference and poor performance. Second, it uses a single-sided heat dissipation design, where the chip's heat is dissipated downwards through the bottom insulating heat sink, while the top of the chip is sealed by a casing or molding compound, leaving no heat dissipation channel. During operation, this often results in ineffective heat transfer, leading to heat accumulation and causing electrical failure or even chip explosion.

[0003] Therefore, it is desirable to provide a double-sided heat dissipation module based on pre-attached power devices and its fabrication process, in order to solve the above-mentioned technical problems. Utility Model Content

[0004] The first objective of this utility model is to provide a double-sided heat dissipation module based on pre-attached power devices, including a housing, at least one pre-attached power device, a lower insulating heat sink, an upper insulating heat sink, an upper heat sink, at least one conductive component, and a protective adhesive.

[0005] The tube shell has a hollow area;

[0006] The pre-attached power device, the lower insulating heat sink, the upper insulating heat sink, and the conductive components are all located within the hollow area.

[0007] The upper surface of the lower insulating heat sink and the lower surface of the upper insulating heat sink are both provided with a circuit layer;

[0008] The upper and lower surfaces of the pre-mounted power device are respectively mounted at corresponding positions between the two circuit layers to achieve electrical connection;

[0009] The upper and lower surfaces of the conductive component are mounted on corresponding positions between the two circuit layers;

[0010] The casing is provided with a number of signal pins, which are electrically connected to the corresponding positions of the circuit layer of the lower insulating heat sink.

[0011] The protective adhesive is filled in the hollow area, and the lower surface of the lower insulating heat sink and the upper part of the upper heat sink are exposed outside the protective adhesive.

[0012] Preferably, the protective adhesive is an epoxy resin protective adhesive.

[0013] Preferably, components are electrically connected between the two circuit layers.

[0014] Preferably, the upper surface of the upper insulating heat sink and the lower surface of the lower insulating heat sink are both covered with a protective layer.

[0015] Specifically, the upper insulating heat sink and the lower insulating heat sink are ceramic substrates.

[0016] Furthermore, the protective layer is a copper-clad layer.

[0017] Optionally, the upper radiator is an air-cooled radiator or a water-cooled radiator.

[0018] Optionally, the casing is provided with a plurality of connection holes.

[0019] Compared with the prior art, the double-sided heat dissipation module based on pre-attached power devices and its fabrication process of this utility model have the following advantages:

[0020] (1) Good heat dissipation performance: The double-sided heat dissipation module design allows the chip heat to be dissipated from the top and bottom insulating heat dissipation plates together. The heat dissipation effect is 20% higher than that of the conventional single-sided heat dissipation module, resulting in good thermal performance and stable electrical output of the product.

[0021] (2) Good electrical performance: The chip is pre-mounted in the power device, eliminating the need for bonding wires. This efficiently introduces the chip's electrical properties into the power device without weakening its performance. At the same time, the pre-mounted power device is mounted on the lower insulating heat sink, achieving efficient interconnection between the source and gate terminals. The top is interconnected with the upper insulating heat sink, achieving interconnection between the drain terminals. Again, no bonding wires are required, resulting in low total loop inductance, high electrical transmission performance, and excellent performance.

[0022] (3) High power density: This double-sided heat dissipation pre-attached design introduces the drain end to the top interconnect and has no bonding wires, which effectively utilizes the layout space, saves more than 50% of the space, and significantly improves the power density.

[0023] (4) High reliability: Based on good thermal conductivity (double-sided heat dissipation design), small overall size (high power density), no bonding wire process (avoiding the reliability failure risk of bonding wire), and high mechanical strength (potting protective glue process), the reliability of the product is significantly enhanced.

[0024] (5) High flexibility: This design has high power density, which allows for more room for internal product design, and can integrate more designs and functions. It can be expanded into a drive and power integrated module, which is highly flexible.

[0025] (6) Cost savings: From the perspective of packaging cost, this design eliminates the cost of bonding wires and has a high power density, resulting in a small structural size and reduced overall packaging cost. From the perspective of client assembly, the small package size allows for a smaller client chassis assembly size, saving on client chassis costs. Attached Figure Description

[0026] Figure 1 This is a schematic diagram of the structure of a double-sided heat dissipation module based on a pre-attached power device and its fabrication process, as described in Example 1.

[0027] Figure 2 This is a schematic diagram of the internal structure of a double-sided heat dissipation module based on a pre-attached power device and its fabrication process, as shown in Example 1.

[0028] Figure 3 This is a schematic diagram of the shell structure in Example 1;

[0029] Figure 4 This is a schematic diagram of the product after step S1 in Example 2;

[0030] Figure 5 This is a schematic diagram of the product after step S2 in Example 2;

[0031] Figure 6 This is a schematic diagram of the product after step S3 in Example 2;

[0032] Figure 7 This is a schematic diagram of the product after step S5 in Example 2;

[0033] Figure 8 This is a schematic diagram of the product after step S6 in Example 2;

[0034] Figure 9 This is a schematic diagram of the product after step S7 in Example 2. Detailed Implementation

[0035] The specific embodiments of this utility model patent will be further described in detail below with reference to the accompanying drawings.

[0036] Example 1

[0037] In this embodiment, as Figure 1 and Figure 2 As shown, a double-sided heat dissipation module based on pre-attached power devices includes a housing 1, at least one pre-attached power device 2, a lower insulating heat sink 3, an upper insulating heat sink 4, an upper heat sink 5, at least one conductive component 6, and protective adhesive 7.

[0038] Pre-mounted power devices refer to devices in which the chip is pre-mounted on the circuit frame and encapsulated into a single unit, achieving double-sided heat dissipation or an embedded structure.

[0039] like Figure 3 As shown, the shell 1 has a hollow area 8;

[0040] The pre-attached power device 2, the lower insulating heat sink 3, the upper insulating heat sink 4, and the conductive component 6 are all located within the hollow area 8.

[0041] The upper surface of the lower insulating heat sink 3 and the lower surface of the upper insulating heat sink 4 are both provided with circuit layers (9, 10).

[0042] The upper and lower surfaces of the pre-mounted power device 2 are respectively mounted on corresponding positions between the two circuit layers (9, 10) to achieve electrical connection;

[0043] The upper and lower surfaces of the conductive component 6 are attached to corresponding positions between the two circuit layers (9, 10);

[0044] The casing 1 is provided with a plurality of signal pins 11, and the signal pins 11 are electrically connected to the corresponding positions of the circuit layer 9 of the lower insulating heat sink 3.

[0045] The protective adhesive 7 is filled in the hollow area 8, and the lower surface of the lower insulating heat sink 3 and the upper part of the upper heat sink 5 are exposed outside the protective adhesive 7.

[0046] In this embodiment, the protective adhesive 7 is an epoxy resin protective adhesive, which has good high-voltage insulation and high reliability.

[0047] In this embodiment, depending on actual needs, components 12 can be electrically connected between the two circuit layers (9, 10).

[0048] In this embodiment, the upper surface of the upper insulating heat sink 3 and the lower surface of the lower insulating heat sink 4 are both covered with protective layers (13, 14).

[0049] Specifically, the upper insulating heat sink 3 and the lower insulating heat sink 4 are ceramic substrates.

[0050] In this embodiment, the protective layers (13, 14) are copper-clad layers.

[0051] In this embodiment, the upper heat sink 5 is either an air-cooled heat sink or a water-cooled heat sink, which can be selected according to actual needs.

[0052] In this embodiment, the housing 1 is provided with several connection holes 15 to facilitate installation with external devices.

[0053] Working principle: The chip is pre-encapsulated in a pre-mounted power device. The source and gate of the pre-mounted power device are mounted on the lower insulating heat sink, with the drain terminal facing upwards. The circuit is connected through the upper insulating heat sink, and the entire circuit does not require bonding wires. During operation, heat is dissipated through both the lower and upper insulating heat sinks. The lower insulating heat sink is aided by water cooling or air cooling, while the upper insulating heat sink transfers heat to the top heat sink, which is aided by external air cooling.

[0054] Example 2

[0055] The method for fabricating a double-sided heat dissipation module based on pre-attached power devices, as described in Example 1, includes the following steps:

[0056] S1. Prepare the lower insulating heat sink 3 and the upper insulating heat sink 4, which are printed with circuit layers (9, 10). Print adhesive material 16 at the corresponding positions of the circuit layers on the lower insulating heat sink 3, such as... Figure 4 As shown;

[0057] S2. The pre-mounted power device 2, conductive component 6, and component 12 are mounted on the corresponding positions of the circuit layer of the lower insulating heat sink to achieve electrical connection, such as... Figure 5 As shown;

[0058] S3. Print adhesive material 17 on the upper surface of the pre-mounted power device 2, conductive component 6, and component 12, and attach an insulating heat sink 4 to achieve electrical connection between the circuit layer 10 of the upper insulating heat sink 4 and the pre-mounted power device 2, component 12, and conductive component 6, such as... Figure 6 As shown;

[0059] S4. Curing treatment of adhesive materials;

[0060] S5. Install the component processed in S4 into the hollow area 8 of the casing 1, and solder the signal pin 11 on the casing 1 to the corresponding position on the circuit layer 9 on the lower insulating heat sink 3 to achieve electrical connection. Figure 7 As shown;

[0061] S6. Attach the upper radiator 5 to the upper surface of the upper insulating heat sink 4, as follows: Figure 8 As shown;

[0062] S7. Pour protective adhesive 7 into the hollow area 8 inside the tube shell 1 and heat it to solidify, such as Figure 9 As shown.

[0063] In this embodiment, in step S5, ultrasonic welding is used to achieve electrical connection between the signal pin 11 on the casing 1 and the corresponding position on the circuit layer 9 on the lower insulating heat sink 3.

[0064] In this embodiment, in step S6, thermally conductive double-sided adhesive material 18 is pre-attached to the lower surface of the upper heat sink 5, and then the upper heat sink 5 is attached to the upper surface of the upper insulating heat sink 4.

[0065] The advantages of the above-mentioned manufacturing process are: 1. All materials used in the manufacturing process are mature and easy to implement; 2. All processes involved in the manufacturing process are mature and easy to implement; 3. The entire process loop mainly relies on the interconnection of the mounting surfaces for conductivity, without involving bonding wire interconnection, making the manufacturing process simple and fast; 4. This process achieves internal circuit sealing protection and enhances the mechanical strength of the product through the potting of protective adhesive, eliminating the need for shell assembly protection. This reduces costs and significantly improves reliability.

[0066] The preferred embodiments of this utility model have been described in detail above, but this utility model is not limited to the embodiments described. Those skilled in the art can make various equivalent modifications or substitutions without departing from the spirit of this utility model, and these equivalent modifications or substitutions are all included within the scope defined by the claims of this application.

Claims

1. A double-sided heat dissipation module based on pre-attached power devices, characterized in that, It includes a housing, at least one pre-mounted power device, a lower insulating heat sink, an upper insulating heat sink, an upper heat sink, at least one conductive component, and protective adhesive. The tube shell has a hollow area; The pre-attached power device, the lower insulating heat sink, the upper insulating heat sink, and the conductive components are all located within the hollow area. The upper surface of the lower insulating heat sink and the lower surface of the upper insulating heat sink are both provided with a circuit layer; The upper and lower surfaces of the pre-mounted power device are respectively mounted at corresponding positions between the two circuit layers to achieve electrical connection; The upper and lower surfaces of the conductive component are mounted on corresponding positions between the two circuit layers; The casing is provided with a number of signal pins, which are electrically connected to the corresponding positions of the circuit layer of the lower insulating heat sink. The protective adhesive is filled in the hollow area, and the lower surface of the lower insulating heat sink and the upper part of the upper heat sink are exposed outside the protective adhesive.

2. The double-sided heat dissipation module based on pre-attached power devices according to claim 1, characterized in that, The protective adhesive is an epoxy resin protective adhesive.

3. A double-sided heat dissipation module based on pre-attached power devices according to claim 1, characterized in that, There are components electrically connected between the two circuit layers.

4. A double-sided heat dissipation module based on pre-attached power devices according to claim 1, characterized in that, The upper surface of the upper insulating heat sink and the lower surface of the lower insulating heat sink are both covered with a protective layer.

5. A double-sided heat dissipation module based on pre-attached power devices according to claim 4, characterized in that, The upper and lower insulating heat sinks are ceramic substrates.

6. A double-sided heat dissipation module based on pre-attached power devices according to claim 5, characterized in that, The protective layer is a copper-clad layer.

7. A double-sided heat dissipation module based on pre-attached power devices according to claim 1, characterized in that, The upper radiator is either an air-cooled radiator or a water-cooled radiator.

8. A double-sided heat dissipation module based on pre-attached power devices according to claim 1, characterized in that, The tube shell is provided with several connection holes.

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