A packaged triode

Abstract

The utility model provides a kind of encapsulation triode, it is related to the technical field of semiconductor device, including encapsulation shell and pin body, the inside of encapsulation shell is equipped with triode body, the side surface of triode body is fixedly connected with conducting sheet, encapsulation shell side surface is fixedly installed with connecting sleeve, the surface of pin body is fixedly installed with connecting block, the surface of connecting block is fixedly connected with positioning block.The utility model in, by setting connecting sleeve in encapsulation shell side surface, installing connecting block with positioning block and limit block on pin body, positioning block and the positioning groove on connecting sleeve slide fit realize preliminary alignment, when connecting block is completely inserted into connecting sleeve, limit block is automatically clamped into limit hole under the action of tension spring, form reliable mechanical connection, while pin body and conducting sheet are closely attached to realize electrical conduction, the structure is convenient for the quick installation and replacement of pin, improve the convenience of encapsulation and maintenance.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor device technology, and in particular to a packaged transistor. Background Technology

[0002] With the continuous development of the electronics industry, transistors, as key components in electronic circuits, are widely used in various electronic devices. Their packaging quality directly affects the performance stability and service life of the devices.

[0003] In existing technologies, traditional transistor packaging often uses a fixed soldering method to connect the pins to the die. When the pins are damaged and need to be replaced, this method requires complex desoldering and resoldering operations, which is not only time-consuming and labor-intensive, but may also damage the die and increase maintenance costs, thus requiring improvement. Utility Model Content

[0004] This utility model mainly provides a packaged transistor for semiconductor devices.

[0005] To achieve the above objectives, the present invention adopts the following technical solution: a packaged transistor, comprising a package housing, a lead body, a transistor body, a conductive sheet, a connecting sleeve, a connecting block, a positioning block, a positioning groove, a tension spring, a limiting block, and a limiting hole. The transistor body is installed inside the package housing. The conductive sheet is fixedly connected to the side of the transistor body. The connecting sleeve is fixedly installed to the side of the package housing. The connecting block is fixedly installed to the surface of the lead body. The positioning block is fixedly connected to the surface of the connecting block. The positioning groove is formed on the side of the connecting sleeve. The tension spring is fixedly connected to the inside of the connecting block. The limiting block is slidably connected to the inside of the connecting block. The limiting hole is formed through the side of the connecting sleeve.

[0006] Compared with the prior art, the advantages and positive effects of this utility model are as follows:

[0007] 1. In this utility model, a connecting sleeve is provided on the side of the packaging shell, and a connecting block with a positioning block and a limiting block is installed on the pin body. The positioning block slides with the positioning groove on the connecting sleeve to achieve initial alignment. When the connecting block is fully inserted into the connecting sleeve, the limiting block automatically engages in the limiting hole under the action of the tension spring to form a reliable mechanical connection. At the same time, the pin body and the conductive sheet are tightly attached to achieve electrical conduction. This structure facilitates the quick installation and replacement of the pin and improves the convenience of packaging and maintenance.

[0008] 2. In this utility model, by using a high-temperature resistant ceramic material for the packaging shell and fixing a heat sink made of high thermal conductivity aluminum alloy to its outer surface, the heat sink is provided with multiple heat dissipation fins to increase the heat dissipation area. Combined with the structure in which the transistor body is fixedly connected to the inner wall of the packaging shell by thermally conductive adhesive, the heat generated by the internal chip can be effectively and quickly conducted to the external environment, which significantly improves the heat dissipation performance and working stability of the transistor and extends the service life of the device. Attached Figure Description

[0009] Figure 1 A perspective view of a packaged transistor is provided for this utility model;

[0010] Figure 2 A cross-sectional view of a packaged transistor is provided for this utility model;

[0011] Figure 3 This utility model provides an exploded view of the lead body, connecting block, tension spring, and limiting block of a packaged transistor;

[0012] Figure 4 A side view of a packaged transistor is provided for this utility model.

[0013] Legend: 1. Package housing; 2. Pin body; 3. Transistor body; 4. Conductive sheet; 5. Connecting sleeve; 6. Connecting block; 7. Positioning block; 8. Positioning groove; 9. Tension spring; 10. Limiting block; 11. Limiting hole; 12. Heat sink. Detailed Implementation

[0014] To better understand the above-mentioned objectives, features, and advantages of this utility model, the present utility model will be further described below with reference to the accompanying drawings and embodiments. It should be noted that, unless otherwise specified, the embodiments and features described in these embodiments can be combined with each other.

[0015] Please see Figures 1-4 This utility model provides a technical solution: a packaged transistor, including a package housing 1, a lead body 2, a transistor body 3, a conductive sheet 4, a connecting sleeve 5, a connecting block 6, a positioning block 7, a positioning groove 8, a tension spring 9, a limiting block 10, and a limiting hole 11. The transistor body 3 is installed inside the package housing 1. The conductive sheet 4 is fixedly connected to the side of the transistor body 3. The connecting sleeve 5 is fixedly installed on the side of the package housing 1. The connecting block 6 is fixedly installed on the surface of the lead body 2. The positioning block 7 is fixedly connected to the surface of the connecting block 6. The positioning groove 8 is opened on the side of the connecting sleeve 5. The tension spring 9 is fixedly connected to the inside of the connecting block 6. The limiting block 10 is slidably connected to the inside of the connecting block 6. The limiting hole 11 is opened through the side of the connecting sleeve 5.

[0016] like Figure 2As shown, the connecting block 6 is slidably connected to the connecting sleeve 5, and the positioning block 7 is slidably connected to the positioning groove 8. Here, the pin body 2 and the package housing 1 are quickly docked by the sliding of the connecting block 6 in the connecting sleeve 5, and the sliding cooperation between the positioning block 7 and the positioning groove 8 plays a guiding role to ensure that the pin body 2 can be accurately attached to the conductive sheet 4.

[0017] like Figure 3 As shown, one end of the tension spring 9 is fixedly connected to the surface of the limiting block 10, and the other end of the tension spring 9 is fixedly connected to the inner side of the connecting block 6. Here, the elastic force of the tension spring 9 pushes the limiting block 10 to move towards the limiting hole 11, so that the limiting block 10 is inserted into the limiting hole 11, thereby achieving a stable fixation between the connecting block 6 and the connecting sleeve 5.

[0018] like Figure 2 As shown, the conductive sheet 4 is made of copper material, and one end of the pin body 2 is attached to the inner side of the conductive sheet 4. Here, the good conductivity of the copper conductive sheet 4 reduces the contact resistance between the pin body 2 and the transistor body 3, and the tight attachment between the pin body 2 and the conductive sheet 4 ensures the stability of current transmission.

[0019] like Figure 2 As shown, the encapsulation housing 1 is made of high-temperature resistant ceramic material, and the transistor body 3 is fixedly connected to the inner wall of the encapsulation housing 1 by thermally conductive adhesive. Here, the high-temperature resistant ceramic material of the encapsulation housing 1 withstands the high temperature when the transistor is working, preventing the housing from being damaged due to overheating. The thermally conductive adhesive quickly conducts the heat generated by the transistor body 3 to the encapsulation housing 1, preparing for heat dissipation.

[0020] like Figure 3 As shown, a heat sink 12 is fixedly connected to the outer surface of the encapsulation housing 1. Here, the heat sink 12 increases the heat dissipation area of ​​the encapsulation housing 1, so that the heat on the encapsulation housing 1 can be dissipated to the external environment more quickly, thereby reducing the operating temperature of the transistor body 3.

[0021] like Figure 3 As shown, the heat sink 12 is made of high thermal conductivity aluminum alloy. Several heat dissipation fins are evenly distributed on the surface of the heat sink 12. Here, the heat sink 12 made of high thermal conductivity aluminum alloy efficiently conducts heat, and the evenly distributed heat dissipation fins further increase the heat dissipation area, accelerate the exchange of heat with air, and improve the overall heat dissipation effect.

[0022] The usage and working principle of this device are as follows: First, align the connecting block 6 on the pin body 2 with the connecting sleeve 5 on the side of the package housing 1. Then, push the pin body 2 to slide the connecting block 6 along the inner wall of the connecting sleeve 5. Simultaneously, the positioning block 7 on the surface of the connecting block 6 enters the positioning groove 8 on the side of the connecting sleeve 5, achieving guidance and alignment. As the connecting block 6 continues to be inserted, its internal limiting block 10 is compressed by the inner wall of the connecting sleeve 5 during the sliding process and retracts into the connecting block 6, compressing the tension spring 9. When the connecting block 6 is fully inserted, the limiting block 10 moves to a position aligned with the limiting hole 11 on the side of the connecting sleeve 5. Under the elastic restoring force of the tension spring 9, the limiting block 10 automatically pops out and locks into the limiting hole 11. A mechanical lock is formed, completing the stable connection between the pin body 2 and the package housing 1. At this time, one end of the pin body 2 is tightly attached to the copper conductive sheet 4 on the side of the transistor body 3 inside the package housing 1, realizing electrical conduction. The heat generated when the transistor is working is conducted from the transistor body 3 to the high-temperature ceramic package housing 1 through the thermal conductive adhesive, and then transferred to the high thermal conductivity aluminum alloy heat sink 12 fixedly connected to the outer surface. The heat is efficiently exchanged with the surrounding air through multiple heat dissipation fins evenly distributed on the heat sink 12, realizing continuous heat dissipation. When it is necessary to replace the pin body 2, the limiting block 10 is manually pressed out from the limiting hole 11 to release the locking state, and then the connecting block 6 is slid out along the connecting sleeve 5 in the opposite direction to complete the pin disassembly.

[0023] The above description is merely a preferred embodiment of the present utility model and is not intended to limit the present utility model in any other way. Any person skilled in the art may make changes or modifications to the above-disclosed technical content to create equivalent embodiments for application in other fields. However, any simple modifications, equivalent changes, and modifications made to the above embodiments based on the technical essence of the present utility model without departing from the technical solution of the present utility model shall still fall within the protection scope of the technical solution of the present utility model.

Claims

1. A packaged transistor, characterized in that, include: The package includes a housing (1) and a pin body (2). Inside the housing (1) is a transistor body (3). A conductive sheet (4) is fixedly connected to the side of the transistor body (3). A connecting sleeve (5) is fixedly installed on the side of the housing (1). A connecting block (6) is fixedly installed on the surface of the pin body (2). A positioning block (7) is fixedly connected to the surface of the connecting block (6). A positioning groove (8) is opened on the side of the connecting sleeve (5). A tension spring (9) is fixedly connected to the inside of the connecting block (6). A limiting block (10) is slidably connected inside the connecting block (6). A limiting hole (11) is opened through the side of the connecting sleeve (5).

2. The packaged transistor according to claim 1, characterized in that: The connecting block (6) is slidably connected to the connecting sleeve (5), and the positioning block (7) is slidably connected to the positioning groove (8).

3. The packaged transistor according to claim 1, characterized in that: One end of the tension spring (9) is fixedly connected to the surface of the limiting block (10), and the other end of the tension spring (9) is fixedly connected to the inner side of the connecting block (6).

4. The packaged transistor according to claim 1, characterized in that: The conductive sheet (4) is made of copper material, and one end of the pin body (2) is attached to the inner side of the conductive sheet (4).

5. The packaged transistor according to claim 1, characterized in that: The encapsulation housing (1) is made of high-temperature resistant ceramic material, and the transistor body (3) is fixedly connected to the inner wall of the encapsulation housing (1) by thermally conductive adhesive.

6. The packaged transistor according to claim 1, characterized in that: The outer surface of the encapsulation housing (1) is fixedly connected to a heat sink (12).

7. The packaged transistor according to claim 6, characterized in that: The heat sink (12) is made of high thermal conductivity aluminum alloy, and several heat dissipation fins are evenly distributed on the surface of the heat sink (12).

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