Frame glue brushing module

CN224763434UActive Publication Date: 2026-09-18WUXI CHANGDING ELECTRONICS CO LTD
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Patent Information

Application Number
CN202521852389.2
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-08-28
Publication Date
2026-09-18
Estimated Expiration
2035-08-28

AI Technical Summary

Technical Problem

如公开号为CN212967613U的一种用于二极管引线框架的刷胶机构,此机构通过偏心凸轮控制刷胶结构在纵向直线导轨上任意升降,但上述通过偏心凸轮进行上下调节的方式存在控制精度差的缺陷,同时缺乏对框架的位置切换功能,不能实现四片框架进行刷胶,造成刷胶效率低下

Benefits of technology

[0016]This invention enables the vertical positioning of four chip frames via a linear motor stage module, facilitating adhesive application to the four chip frames supported on the stage and significantly improving application efficiency. Simultaneously, a linear screw module ensures precise control of the vertical adjustment distance, maintaining a suitable force exerted by the screen printing plate on the chip frames and preventing damage from excessive pressure. Furthermore, a designed adhesive application image detection module can detect adhesive application points on the chip frames. This is achieved by using a linear motor module and linear motor stage module to move the applied chip frames, thus assessing the adhesive application pass rate. Moreover, the lateral transfer motion of the designed linear motor module allows for rapid transfer and acceptance of the next chip dispensing process.

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Abstract

The utility model belongs to chip frame glueing technology field, especially relates to a frame glueing module. Including linear motor module, it is horizontally laid on the frame, linear platform module, it is vertically laid on the slide of linear motor module, glueing module, including: linear lead screw module, linear synchronous belt module and glueing mechanism, linear lead screw module is vertically laid on the frame, the drive end of linear lead screw module is horizontally installed linear synchronous belt module, the drive end of linear synchronous belt module is vertically installed glueing mechanism. The utility model can drive four pieces of chip frame to carry out position adjustment in longitudinal direction through linear motor platform module, to realize the glueing of four pieces of chip frame on the bearing platform, greatly improves the glueing efficiency, and simultaneously realizes the control precision of up and down adjustment distance through linear lead screw module.
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Description

Technical Field

[0001] This utility model belongs to the field of chip frame adhesive application technology, and specifically relates to a frame adhesive application module. Background Technology

[0002] During chip packaging, solder paste needs to be applied to the lead frame, and then the two lead frames are joined and soldered to fix the chip between the two lead frames. Because the chip is small and the contacts for applying solder paste to the lead frame are also small, the precision requirements for joining are high. For example, a glue-applying mechanism for diode lead frames, disclosed in CN212967613U, uses an eccentric cam to control the glue-applying structure to move arbitrarily up and down on a longitudinal linear guide. However, this method of adjusting up and down using an eccentric cam has the drawback of poor control precision and lacks the function of switching the position of the lead frames, making it impossible to apply glue to all four lead frames, resulting in low glue-applying efficiency.

[0003] Therefore, this utility model urgently needs to propose a frame adhesive application module to solve the above-mentioned technical problems. Utility Model Content

[0004] The purpose of this invention is to provide a frame gluing module. This invention can achieve the purpose of gluing four chip frames. At the same time, the linear screw module realizes the control accuracy of the vertical adjustment distance. Moreover, through the designed gluing image detection module, the gluing points on the chip frame can be image detected to screen the gluing qualification rate.

[0005] To solve the above technical problems, this utility model provides a frame adhesive application module, comprising:

[0006] The linear motor module is arranged horizontally on the frame;

[0007] The linear stage module is arranged longitudinally on the slide of the linear motor module;

[0008] The glue application module includes: a linear screw module, a linear synchronous belt module, and a glue application mechanism; the linear screw module is vertically arranged on the frame, the linear synchronous belt module is horizontally mounted on the drive end of the linear screw module, and the glue application mechanism is vertically mounted on the drive end of the linear synchronous belt module.

[0009] The glue application image detection module is installed on the frame and is used to perform image detection on the glue application points on the frame.

[0010] Preferably, the linear stage module includes a linear motor and a support platform; the support platform is provided on the slide of the linear motor, and the support platform is used to position and place the chip frame.

[0011] Preferably, the linear screw module includes: a drive motor, a driving pulley, a driven pulley, a synchronous belt, a screw, a nut seat, a guide rail, and a lifting plate; the drive motor is mounted on the frame, the output end of the drive motor is provided with the driving pulley, the synchronous belt is wound between the driving pulley and the driven pulley, the driven pulley is sleeved on one end of the screw, the screw is rotatably mounted on the frame, the nut seat is threaded onto the screw, the nut seat is connected to the lifting plate, the lifting plate is slidably connected to the guide rail, and the guide rail is disposed on the frame.

[0012] Preferably, the linear synchronous belt module includes: a second drive motor, a second drive pulley, a second driven pulley, a second synchronous belt, a second guide rail, and a moving plate; the second drive pulley and the second driven pulley are rotatably mounted on the lifting plate at a lateral interval, the second synchronous belt is wound between the second drive pulley and the second driven pulley, the shaft end of the second drive pulley is connected to the output end of the second drive motor mounted on the lifting plate, the upper edge of the second synchronous belt is locked to the moving plate, the locking plate is slidably connected to the second guide rail, and the second guide rail is laterally arranged on the lifting plate and located below the second synchronous belt.

[0013] Preferably, the glue application mechanism includes: a mesh frame, a locking fastener, a screen plate, a pressing cylinder, and a glue scraper; the mesh frame is arranged at the bottom of the lifting plate, and the screen plate is detachably locked to the bottom of the mesh frame by the locking fastener; two pressing cylinders are installed at intervals on the moving plate, and the glue scraper is provided at the driving end of the pressing cylinder.

[0014] Preferably, the adhesive-coated image detection module includes a CCD camera imaging module and a supplementary light source plate; the CCD camera imaging module is located above the supplementary light source plate, and the supplementary light source plate has a through hole in the center so that the CCD camera imaging module can pass through the through hole to take pictures and form images.

[0015] Compared with the prior art, this utility model has the following advantages:

[0016] This invention enables the vertical positioning of four chip frames via a linear motor stage module, facilitating adhesive application to the four chip frames supported on the stage and significantly improving application efficiency. Simultaneously, a linear screw module ensures precise control of the vertical adjustment distance, maintaining a suitable force exerted by the screen printing plate on the chip frames and preventing damage from excessive pressure. Furthermore, a designed adhesive application image detection module can detect adhesive application points on the chip frames. This is achieved by using a linear motor module and linear motor stage module to move the applied chip frames, thus assessing the adhesive application pass rate. Moreover, the lateral transfer motion of the designed linear motor module allows for rapid transfer and acceptance of the next chip dispensing process. Attached Figure Description

[0017] Figure 1 This is a front view of the structure of a frame glue application module provided by this utility model.

[0018] Figure 2 This is a rear view of the structure of a frame adhesive application module provided by this utility model.

[0019] Figure 3 This is a bottom view of the structure of a frame adhesive application module provided by this utility model.

[0020] Figure 4 This is a structural diagram of the glue-applying mechanism provided by this utility model.

[0021] In the diagram: 1-Linear motor module, 2-Linear platform module, 21-Linear motor, 22-Bearing platform, 3-Glue application module, 31-Linear lead screw module, 311-Drive motor one, 312-Drive pulley one, 313-Driven pulley one, 314-Synchronous belt one, 315-Lead screw, 316-Nut seat, 317-Guide rail one, 318-Lifting plate, 32-Linear synchronous belt module, 321-Drive motor two, 322-Drive pulley two, 323-Driven pulley two, 324-Synchronous belt two, 325-Guide rail two, 326-Moving plate, 33-Glue application mechanism, 331-Wire mesh frame, 332-Locking fastener, 333-Wire mesh plate, 334-Pressing cylinder, 335-Glue scraper, 4-Glue application image detection module, 41-CCD camera imaging module, 42-Supplementary light source plate. Detailed Implementation

[0022] The present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments. The advantages and features of the present invention will become clearer from the following description. It should be noted that the drawings are all in a very simplified form and use non-precise proportions, and are only used to facilitate and clarify the illustration of the embodiments of the present invention.

[0023] like Figures 1-4 As shown, this utility model embodiment specifically provides a frame adhesive application module, including:

[0024] The linear motor module 1 is arranged horizontally on the frame; it can adjust the horizontal position of the chip frame on the support platform 22.

[0025] The linear stage module 2 is arranged longitudinally on the slide of the linear motor module 1; it can adjust the longitudinal position of the chip frame on the stage 22.

[0026] The adhesive application module 3 includes: a linear screw module 31, a linear synchronous belt module 32, and an adhesive application mechanism 33. The linear screw module 31 is vertically mounted on the frame, and the linear synchronous belt module 32 is horizontally mounted on the drive end of the linear screw module 31. The adhesive application mechanism 33 is vertically mounted on the drive end of the linear synchronous belt module 32. By controlling the vertical lifting and lowering movement of the linear screw module 31, the adhesive application mechanism 33 is attached to the surface of the chip frame to perform the adhesive application action. By controlling the left and right sliding movement of the linear synchronous belt module 32, the scraper 335 in the adhesive application mechanism 33 is controlled to move left and right to scrape the adhesive, so as to evenly apply the adhesive in the frame 331 to the adhesive points on the surface of the chip frame.

[0027] The glue application image inspection module 4 is installed on the frame and is used to perform image inspection on the glue application points on the frame to distinguish between good and defective products that have undergone glue application.

[0028] The linear stage module 2 includes a linear motor 21 and a support platform 22. The linear motor 21 drives the support platform 22 on the slide to perform longitudinal position adjustment. The support platform 22 is provided on the slide of the linear motor 21, and the chip frame is positioned on the support platform 22.

[0029] The linear screw module 31 includes: a drive motor 311, a drive pulley 312, a driven pulley 313, a synchronous belt 314, a screw 315, a nut seat 316, a guide rail 317, and a lifting plate 318. The drive motor 311 is mounted on the frame. The output end of the drive motor 311 is provided with a drive pulley 312. A synchronous belt 314 is wound between the drive pulley 312 and the driven pulley 313. The driven pulley 313 is sleeved on one end of the screw 315. The screw 315 is rotatably mounted on the frame. A nut seat 316 is threaded onto the screw 315. The nut seat 316 is connected to the lifting plate 318. The lifting plate 318 is slidably connected to the guide rail 317. The guide rail 317 is set on the frame. When the above-mentioned linear screw module 31 is used, the drive motor 311 can be controlled to rotate, and the screw 315 can be rotated through the drive pulley 312, driven pulley 313 and synchronous belt 314. The screw 315 and the nut seat 316 can be used to drive the lifting plate 318 to adjust its vertical position under the guidance of the guide rail 317, thus achieving the advantage of high control accuracy.

[0030] The linear synchronous belt module 32 includes: a second drive motor 321, a second drive pulley 322, a second driven pulley 323, a second synchronous belt 324, a second guide rail 325, and a moving plate 326. The second drive pulley 322 and the second driven pulley 323 are rotatably mounted on the lifting plate 318 at a lateral interval. The second synchronous belt 324 is wound between the second drive pulley 322 and the second driven pulley 323. The shaft end of the second drive pulley 322 is connected to the output end of the second drive motor 321 mounted on the lifting plate 318. The upper edge of the second synchronous belt 324 is locked and connected to the moving plate 326. The locking plate is slidably connected to the second guide rail 325. The second guide rail 325 is arranged laterally on the lifting plate 318 and is located below the second synchronous belt 324. When the above-mentioned linear synchronous belt module 32 is used, the drive motor 321 can be controlled to move, and the synchronous belt 324 can be driven by the drive pulley 322 and the driven pulley 323. In turn, the glue-applying mechanism 33 on the moving plate 326 can be driven to slide and scrape glue left and right under the guidance of the guide rail 325.

[0031] The adhesive application mechanism 33 includes: a mesh frame 331, a locking fastener 332, a screen stencil 333, a pressing cylinder 334, and a scraper 335. The mesh frame 331 is located at the bottom of the lifting plate 318. The screen stencil 333 is detachably locked to the bottom of the mesh frame 331 by the locking fastener 332. Two pressing cylinders 334 are spaced apart on the moving plate 326, and the scraper 335 is provided at the driving end of the pressing cylinder 334. When the adhesive application mechanism 33 is in use, the pressing cylinder 334 can be controlled to drive the scraper 335 to press down close to the surface of the screen stencil 333, so as to evenly apply the adhesive in the mesh frame 331 to the adhesive points of the chip frame.

[0032] The adhesive application image inspection module 4 includes a CCD camera imaging module 41 and a supplementary light source plate 42. The CCD camera imaging module 41 is located above the supplementary light source plate 42, and the supplementary light source plate 42 has a through hole in its center, allowing the CCD camera imaging module 41 to pass through the through hole and take an image. The CCD camera imaging module 41 uses image information of the size and position of adhesive dots on the frame to perform image inspection, distinguishing between good and defective products, ensuring the product yield, and avoiding waste.

[0033] The above description is only a description of the preferred embodiment of the present utility model and is not intended to limit the scope of the present utility model in any way. Any changes or modifications made by those skilled in the art based on the above disclosure shall fall within the protection scope of the claims.

Claims

1. A frame glue brushing module, characterized in that, include: The linear motor module (1) is arranged horizontally on the frame; The linear stage module (2) is arranged longitudinally on the slide of the linear motor module (1); The glue application module (3) includes: a linear screw module (31), a linear synchronous belt module (32), and a glue application mechanism (33); the linear screw module (31) is vertically arranged on the frame, the linear synchronous belt module (32) is horizontally installed on the drive end of the linear screw module (31), and the glue application mechanism (33) is vertically installed on the drive end of the linear synchronous belt module (32). The glue application image detection module (4) is installed on the frame and is used to perform image detection on the glue application points on the frame.

2. The frame gluing module of claim 1, wherein, The linear stage module (2) includes a linear motor (21) and a support stage (22); the support stage (22) is provided on the slide of the linear motor (21), and the support stage (22) is used to position and place the chip frame.

3. The frame adhesive application module as described in claim 1, characterized in that, The linear screw module (31) includes: a drive motor (311), a drive pulley (312), a driven pulley (313), a synchronous belt (314), a screw (315), a nut seat (316), a guide rail (317), and a lifting plate (318); the drive motor (311) is mounted on the frame, and the output end of the drive motor (311) is provided with the drive pulley (312), and the drive pulley (312) and the driven pulley (313) are connected. The timing belt (314) is wound around the (313) and the driven pulley (313) is sleeved on one end of the lead screw (315). The lead screw (315) is rotatably mounted on the frame. The nut seat (316) is threaded on the lead screw (315). The nut seat (316) is connected to the lifting plate (318). The lifting plate (318) is slidably connected to the guide rail (317). The guide rail (317) is set on the frame.

4. The frame gluing module of claim 3, wherein, The linear synchronous belt module (32) includes: a second drive motor (321), a second drive pulley (322), a second driven pulley (323), a second synchronous belt (324), a second guide rail (325), and a moving plate (326); the second drive pulley (322) and the second driven pulley (323) are rotatably mounted on the lifting plate (318) at a lateral interval, and the second drive pulley (322) and the second driven pulley (323) are connected by a synchronous belt. The second synchronous belt (324) has its shaft end connected to the output end of the second drive motor (321) mounted on the lifting plate (318). The upper edge of the second synchronous belt (324) is locked to the moving plate (326). The locking plate is slidably connected to the second guide rail (325). The second guide rail (325) is horizontally arranged on the lifting plate (318) and located below the second synchronous belt (324).

5. The frame gluing module according to claim 4, characterized in that, The glue application mechanism (33) includes: a mesh frame (331), a locking fastener (332), a wire mesh plate (333), a pressing cylinder (334), and a glue scraper (335); the mesh frame (331) is arranged at the bottom of the lifting plate (318), and the bottom of the mesh frame (331) is detachably locked with the wire mesh plate (333) by the locking fastener (332); two pressing cylinders (334) are installed at intervals on the moving plate (326), and the driving end of the pressing cylinder (334) is provided with the glue scraper (335).

6. The frame gluing module according to any one of claims 1 to 5, characterized in that, The adhesive-coated image detection module (4) includes a CCD camera imaging module (41) and a supplementary light source plate (42). The CCD camera imaging module (41) is located above the supplementary light source plate (42), and the supplementary light source plate (42) has a through hole in the center so that the CCD camera imaging module (41) can pass through the through hole to take pictures and images.

Citation Information

Patent Citations

  • Glue brushing mechanism for diode lead frame

    CN212967613U