High-precision chip encapsulation point glue machine

Abstract

The utility model provides a kind of high-precision chip packaging point gum machine, it is related to point gum machine technical field, including cleaning component, cleaning component includes second support frame, second support frame is divided into two groups, and one group of support table is fixedly installed in two ends of two groups of second support frame respectively.The utility model is through additional cleaning component, make it pass through the synchronous belt rotation of two groups of transmission shafts driven by motor on support frame, drive the movement of upper and lower two groups of brush, when operation platform moves to the below of support frame, brush can clean residual glue from different direction, adapt the rhythm of point gum machine, complete cleaning in the interval between feeding and discharging and not additional time consumption, can remove gap residual comprehensively, avoid the problem that chip positioning deviation, short circuit etc. are caused by glue solidification into impurity, improve qualified rate, reduce artificial cleaning frequency and intensity simultaneously, reduce manpower cost and time consumption, make equipment more sustainable and efficient operation, guarantee point gum stability and packaging quality.

Description

Technical Field

[0001] This utility model relates to the field of dispensing machine technology, and in particular to a high-precision chip packaging dispensing machine. Background Technology

[0002] High-precision chip packaging dispensing machines are automated devices used for precise dispensing of adhesive during chip packaging. Through a high-precision drive system, vision positioning technology, and precision dispensing valves, they achieve nanometer- to micrometer-level adhesive dispensing, ensuring uniform adhesive quantity and accurate positioning. They can be adapted to different chip sizes and packaging processes and are widely used in semiconductor packaging, improving the reliability and production efficiency of chip packaging. They are key equipment for ensuring packaging quality in microelectronics manufacturing.

[0003] Existing high-precision chip packaging dispensing machines lack the function of cleaning adhesive residue from the worktable, which is a significant shortcoming. Residual adhesive on the worktable gradually hardens into hard impurities, causing positioning deviations during subsequent chip placement, compromising dispensing accuracy, and easily leading to problems such as chip short circuits and poor contact, thus reducing product yield. At the same time, frequent manual cleaning is required, which not only increases labor costs and cleaning time but also interrupts the production rhythm, affecting the continuous and efficient operation of the equipment. Furthermore, manual cleaning is difficult to completely remove residual adhesive from crevices, and long-term accumulation will contaminate equipment components, increasing maintenance frequency and costs, and restricting chip packaging quality and production economy. Utility Model Content

[0004] The purpose of this invention is to provide a high-precision chip packaging dispensing machine to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, the present invention adopts the following technical solution: It includes a cleaning component, which comprises a second support frame divided into two groups. Each end of one of the two groups of second support frames is fixedly mounted with a support platform. One end of a support column is fixedly mounted on the top of each of the two support platforms. A first drive shaft is movably mounted on the other end of one of the support columns, and a second drive shaft is movably mounted on the other end of the other support column. Both ends of a synchronous belt are movably mounted on the inner walls of the first and second drive shafts. A motor is fixedly connected to one outer wall of the first drive shaft. The motor is fixedly mounted on the top of one of the support platforms. A set of fixing plates is fixedly mounted on the upper and lower belt joints at the center of the synchronous belt. Two sets of third guide rails are slidably connected to the bottom ends of the two sets of fixing plates. The two sets of third guide rails are fixedly mounted on the top of the two groups of second support frames. Two sets of brushes are fixedly mounted at the center of the bottom of the two sets of fixing plates. A first and second recycling trough of a recycling component are attached to the inner walls of both ends of the two groups of second support frames.

[0006] Preferably, the recycling assembly includes a glue tank, a water pump is fixedly installed on the top of the glue tank, one end of the water pump is fixedly connected to a first water pump pipe, the other end of the water pump is fixedly connected to a second water pump pipe, the other ends of the first and second water pump pipes are fixedly connected to the bottom of one side of the first and second recycling tanks, and the first and second recycling tanks are mounted against the inner walls of two sets of second support frames.

[0007] Preferably, the recycling component is fixedly installed on one side of the top of the base plate of the slide body. A first moving component is fixedly installed at the top center of the base plate. The first moving component includes a motor, a lead screw, and a nut. The motor is fixedly installed on one side of the base plate. An operating table is fixedly installed on the top of the nut. A cylinder is fixedly installed inside the operating table. A groove is formed at the top center of the operating table. Two first guide rails are slidably connected to the bottom of the operating table. The two sets of first guide rails are fixedly installed on the top of the base plate. The dispensing machine body is fixedly installed on the other side of the base plate.

[0008] Preferably, the dispensing machine body includes a first support frame, which comprises four sets. The four sets of first support frames include two sets of left and right vertical first support frames and two sets of upper and lower horizontal first support frames. The upper and lower horizontal first support frames are respectively fixedly connected to the two sets of vertical first support frames. A second moving component is fixedly installed on the top of the lower horizontal first support frame. The second moving component includes a motor, a first drive shaft, a second drive shaft, a lead screw, and a nut. The motor and the first drive shaft are installed on the top outer side of the lower horizontal first support frame. The second drive shaft, the lead screw, and the nut are installed at the top center of the lower horizontal first support frame. A connecting plate is fixedly installed on one side of the outer wall of the nut. A cylinder is fixedly installed inside the upper half of the connecting plate. A needle tube is movably installed inside the lower half of the connecting plate. The upper and lower ends of one side of the outer wall of the connecting plate are respectively slidably connected to the outer wall of a set of second guide rails. The two sets of second guide rails are fixedly installed on one side of the outer wall of the upper and lower horizontal first support frames.

[0009] Preferably, the dispensing machine body is fixedly installed at one end of the top of the base plate, a cleaning component is fixedly installed at the other end of the base plate, a first moving component is installed at the top center of the base plate, and a glue tank of the recycling component is fixedly installed on one side of the top of the base plate. The two sets of first recycling tanks and second recycling tanks of the recycling component are mounted and attached to the inner walls of the two sets of second support frames.

[0010] Preferably, the two sets of first and second pumping pipes of the recycling component are respectively mounted around the top of the base plate.

[0011] Compared with the prior art, the advantages and positive effects of this utility model are as follows:

[0012] 1. In this utility model, by adding a cleaning component, the synchronous belts of two sets of transmission shafts are driven by a motor on the support frame to rotate, which in turn drives the upper and lower sets of brushes to move. When the operating table moves to the bottom of the support frame, the brushes can clean the residual glue from different directions, adapting to the rhythm of the dispensing machine. The cleaning is completed during the loading and unloading interval without additional time consumption. It can thoroughly remove the residue in the gaps, avoid the glue solidifying into impurities that may cause chip positioning deviation, short circuits and other problems, improve the pass rate, and at the same time reduce the frequency and intensity of manual cleaning, reduce labor costs and time consumption, and allow the equipment to operate more continuously and efficiently, ensuring the stability of dispensing and the quality of packaging.

[0013] 2. In this utility model, by adding a recycling component, two sets of recycling tanks are set below the support frame of the cleaning component. When the brush cleans the residual glue on the operating table, it is swept into the recycling tank and then pumped to the glue tank through the water pipe to achieve recycling. This avoids glue waste, reduces the procurement cost of special encapsulation glue, and can save considerable expenses in large-scale production. It works in conjunction with the cleaning component to make cleaning more thorough, prevents glue curing from affecting dispensing accuracy or contaminating the equipment, reduces maintenance costs, and is fully automated, requiring no manpower. It is seamlessly connected with the dispensing and cleaning processes, does not affect the production rhythm, ensures encapsulation quality, and improves equipment operating efficiency and economy. Attached Figure Description

[0014] Figure 1 This utility model provides an overall perspective view of a high-precision chip packaging dispensing machine;

[0015] Figure 2 A perspective view of a slide assembly in a high-precision chip packaging dispensing machine is provided for this utility model.

[0016] Figure 3 This utility model provides a perspective view of the main body of a high-precision chip packaging dispensing machine.

[0017] Figure 4 A perspective view of a cleaning component in a high-precision chip packaging dispensing machine is provided for this utility model;

[0018] Figure 5 This invention provides a perspective view of a recycling component in a high-precision chip packaging dispensing machine.

[0019] Legend: 1. Main body of the slide table; 101. Base plate; 102. First moving component; 103. First guide rail; 104. Operating table; 105. Groove; 2. Main body of the dispensing machine; 201. First support frame; 202. Second moving component; 203. Cylinder; 204. Connecting plate; 205. Needle; 206. Second guide rail; 3. Cleaning component; 301. Second support frame; 302. Support platform; 303. Support column; 304. First drive shaft; 305. Second drive shaft; 306. Synchronous belt; 307. Motor; 308. Fixing plate; 309. Brush; 310. Third guide rail; 4. Recycling component; 401. Glue tank; 402. Water pump; 403. First water suction pipe; 404. Second water suction pipe; 405. First recycling tank; 406. Second recycling tank. Detailed Implementation

[0020] To better understand the above-mentioned objectives, features, and advantages of this utility model, the present utility model will be further described below with reference to the accompanying drawings and embodiments. It should be noted that, unless otherwise specified, the embodiments and features described in these embodiments can be combined with each other.

[0021] Many specific details are set forth in the following description in order to provide a full understanding of the present invention. However, the present invention may also be implemented in other ways different from those described herein. Therefore, the present invention is not limited to the specific embodiments disclosed in the following specification.

[0022] Example 1: Refer to Figure 4 As shown: This embodiment includes a high-precision chip packaging dispensing machine, comprising a cleaning component 3. The cleaning component 3 includes a second support frame 301, which is divided into two groups. A support platform 302 is fixedly installed at each end of the two groups of second support frames 301. One end of a support column 303 is fixedly installed on the top of the two groups of support platforms 302. A first drive shaft 304 is movably installed at the other end of one group of support columns 303, and a second drive shaft 305 is movably installed at the other end of the other group of support columns 303. Both ends of a synchronous belt 306 are movably installed on the inner walls of the first drive shaft 304 and the second drive shaft 305. A motor 307 is fixedly connected to one side of the outer wall of the first drive shaft 304. The motor 307 is fixedly installed on the top of one set of support platforms 302. A set of fixing plates 308 are fixedly installed at the upper and lower belt joints of the center of the synchronous belt 306. Two sets of third guide rails 310 are slidably connected at the bottom ends of the two sets of fixing plates 308. The two sets of third guide rails 310 are fixedly installed on the top of the two sets of second support frames 301. Two sets of brushes 309 are fixedly installed at the bottom center of the two sets of fixing plates 308. The first recycling tank 405 and the second recycling tank 406 of the recycling component 4 are attached to each other on the inner walls of the two sets of second support frames 301.

[0023] The overall effect of this embodiment is as follows: By adding a cleaning component 3 to the high-precision chip packaging dispensing machine, the cleaning component 3 can promptly remove residual adhesive from the operating table 104, preventing it from curing and forming hard impurities. This prevents positioning deviations during subsequent chip placement, ensures dispensing position accuracy, reduces problems such as chip short circuits and poor contact caused by adhesive residue, and improves product qualification rate. At the same time, it reduces the frequency and intensity of manual cleaning, lowers labor costs and cleaning time, and allows the equipment to operate more continuously and efficiently, improving overall production efficiency. The cleaning component 3 drives the synchronous belts of the two sets of first transmission shafts 304 and second transmission shafts 305 through the motor 307 on the second support frame 301. The rotation of 306 drives two sets of brushes 309 fixed on the upper and lower sides of the synchronous belt 306 to move in opposite directions. When the operating table 104 of the slide body 1 moves below the second support frame 301, the upper cleaning component 3 can clean the residual glue, realizing automated cleaning. This design can adapt to the working rhythm of the dispensing machine, complete the cleaning between loading and unloading, and does not occupy additional production time. Moreover, the two sets of brushes 309 work from different directions, which can thoroughly remove the residual glue in the gaps and corners of the operating table 104, ensuring the cleaning effect. This matches the high precision characteristics of the dispensing machine, further ensuring the stability and reliability of the dispensing process, and providing a stronger guarantee for the quality of chip packaging.

[0024] Example 2: According to Figure 1 - Figure 5As shown: The recycling component 4 includes a glue tank 401, a water pump 402 fixedly installed on the top of the glue tank 401, a first water pump pipe 403 fixedly connected to one end of the water pump 402, and a second water pump pipe 404 fixedly connected to the other end of the water pump 402. The other ends of the first water pump pipe 403 and the second water pump pipe 404 are fixedly connected to the bottom of one side of the first recycling tank 405 and the second recycling tank 406. The first recycling tank 405 and the second recycling tank 406 are mounted against the inner walls of two sets of second support frames 301. The recycling component 4 is fixedly installed on one side of the top of the base plate 101 of the slide body 1. A first moving component 102 is fixedly installed at the center of the top of the base plate 101. The first moving component 102 includes a motor 307. The screw and nut, motor 307 are fixedly installed on one side of the base plate 101. An operating table 104 is fixedly installed on the top of the nut. A cylinder 203 is fixedly installed inside the operating table 104. A groove 105 is formed at the center of the top of the operating table 104. Two first guide rails 103 are slidably connected to the bottom of the operating table 104. The two sets of first guide rails 103 are fixedly installed on the top of the base plate 101. The dispensing machine body 2 is fixedly installed on the other side of the base plate 101. The dispensing machine body 2 includes a first support frame 201, which includes four sets: two sets of left and right vertical first support frames 201 and two sets of upper and lower horizontal first support frames 201. The upper and lower sets of horizontal first support frames 201... 1. Two sets of vertical first support frames 201 are fixedly connected. A second moving component 202 is fixedly installed on the top of the lower horizontal first support frame 201. The second moving component 202 includes a motor 307, a first drive shaft 304, a second drive shaft 305, a lead screw, and a nut. The motor 307 and the first drive shaft 304 are installed on the top outer side of the lower horizontal first support frame 201. The second drive shaft 305, the lead screw, and the nut are installed at the top center of the lower horizontal first support frame 201. A connecting plate 204 is fixedly installed on the outer wall of one side of the nut. A cylinder 203 is fixedly installed inside the upper half of the connecting plate 204. A needle tube 205 is movably installed inside the lower half of the connecting plate 204. The upper and lower ends of the outer wall are slidably connected to the outer wall of a set of second guide rails 206. The two sets of second guide rails 206 are fixedly installed on the outer wall of one side of the upper and lower sets of horizontal first support frames 201. The dispensing machine body 2 is fixedly installed at one end of the top of the base plate 101. The cleaning component 3 is fixedly installed at the other end of the base plate 101. The first moving component 102 is installed at the center of the top of the base plate 101. The glue tank 401 of the recycling component 4 is fixedly installed on one side of the top of the base plate 101. The two sets of first recycling tanks 405 and second recycling tanks 406 of the recycling component 4 are installed and attached to the inner wall of the two sets of second support frames 301. The two sets of first water suction pipes 403 and second water suction pipes 404 of the recycling component 4 are respectively installed around the top of the base plate 101.

[0025] The overall effect of Embodiment 2 is as follows: A recycling component 4 is added to the high-precision chip packaging dispensing machine. By adding two sets of first recycling tanks 405 and second recycling tanks 406 below the two sets of second support frames 301 of the cleaning component 3, when the two sets of brushes 309 of the cleaning component 3 clean the residual adhesive on the operating table 104, the adhesive can be swept towards the first recycling tanks 405 and second recycling tanks 406 below. Subsequently, through the two sets of first water suction pipes 403 and second water suction pipes 404 connected to the first recycling tanks 405 and second recycling tanks 406, the water pump 402 extracts the adhesive from the first recycling tanks 405 and second recycling tanks 406 and transports it to the adhesive tank 401 below the water pump 402, thus achieving the goal of removing residual adhesive. The design of recycling adhesive effectively avoids adhesive waste, significantly reducing procurement costs, especially for high-cost specialized encapsulation adhesives. In large-scale production, this can lead to substantial material savings over time. Secondly, the synergistic effect of the recycling component 4 and the cleaning component 3 not only ensures more thorough cleaning and prevents residual adhesive from curing on the equipment and affecting subsequent dispensing accuracy, but also prevents adhesive from flowing and contaminating equipment components, reducing equipment maintenance frequency and costs. Furthermore, the entire recycling process is automated, requiring no manual intervention, saving labor costs and seamlessly integrating with the dispensing and cleaning processes without disrupting production. This ensures chip packaging quality while further improving the overall operating efficiency and economy of the equipment.

[0026] Working principle: When the cleaning component 3 and the recycling component 4 work in conjunction, after the dispensing machine body 2 completes the dispensing of a batch of chips, the operating table 104 moves to below the second support frame 301 of the cleaning component 3 via the first moving component 102. The motor 307 on the second support frame 301 then drives two sets of first transmission shafts 304 and second transmission shafts 305 to rotate the synchronous belt 306, causing the two sets of brushes 309 fixed on the upper and lower sides of the synchronous belt 306 to move in opposite directions, thoroughly cleaning the residual glue on the surface and in the gaps of the operating table 104 from different directions. At the same time, the cleaned glue is swept into the two sets of first recycling tanks 405 and second recycling tanks 406 below the second support frame 301. Immediately afterwards, the two sets of first water suction pipes 403 and second water suction pipes 404 connected to the first recycling tanks 405 and second recycling tanks 406 are started by the water pump 402 to pump out the residual glue collected in the tanks. The adhesive is collected and transported to the glue tank 401 below the water pump 402, achieving the recycling and retention of the adhesive. This linkage design has significant advantages. It can promptly remove residual adhesive through the brush 309, preventing it from solidifying and forming hard impurities, thus preventing positioning deviations in subsequent chip placement and reducing problems such as chip short circuits and poor contact caused by adhesive residue, thereby improving the product qualification rate. It can also achieve the recycling of adhesive through the recycling component 4, which can significantly reduce procurement costs, especially for high-cost special packaging adhesives, saving considerable expenses in long-term large-scale production. At the same time, the entire process is automated, requiring no manual intervention, reducing the frequency and intensity of manual cleaning, lowering labor costs and cleaning time, and seamlessly connecting with the dispensing process without affecting the production rhythm. It can also prevent adhesive from flowing and contaminating the equipment, reducing maintenance frequency and costs. While ensuring chip packaging quality, it greatly improves the overall operating efficiency and economy of the equipment.

[0027] By following the steps outlined above, you can successfully use the high-precision chip packaging dispensing machine.

[0028] The above description is merely a preferred embodiment of the present utility model and is not intended to limit the present utility model in any other way. Any person skilled in the art may make changes or modifications to the above-disclosed technical content to create equivalent embodiments for application in other fields. However, any simple modifications, equivalent changes, and modifications made to the above embodiments based on the technical essence of the present utility model without departing from the technical solution of the present utility model shall still fall within the protection scope of the technical solution of the present utility model.

Claims

1. A high-precision chip packaging dispensing machine, characterized in that: Includes cleaning components (3); The cleaning component (3) includes a second support frame (301), which is divided into two groups. Each of the two groups of second support frames (301) has a support platform (302) fixedly installed at both ends. One end of a support column (303) is fixedly installed on the top of each of the two groups of support platforms (302). A first drive shaft (304) is movably installed at the other end of one group of support columns (303), and a second drive shaft (305) is movably installed at the other end of the other group of support columns (303). Both ends of a synchronous belt (306) are movably installed on the inner walls of the first drive shaft (304) and the outer wall of one side of the first drive shaft (304) is fixedly installed. A motor (307) is fixedly connected to the top of one of the support platforms (302). A set of fixing plates (308) are fixedly installed at the upper and lower belt joints at the center of the synchronous belt (306). Two sets of third guide rails (310) are slidably connected at the bottom ends of the two sets of fixing plates (308). The two sets of third guide rails (310) are fixedly installed at the top of the two sets of second support frames (301). Two sets of brushes (309) are fixedly installed at the bottom center of the two sets of fixing plates (308). The first recycling trough (405) and the second recycling trough (406) of the recycling component (4) are attached to the inner walls at both ends of the two sets of second support frames (301).

2. The high-precision chip encapsulation point glue machine according to claim 1, characterized in that: The recycling component (4) includes a glue tank (401), a water pump (402) is fixedly installed on the top of the glue tank (401), a first water pump pipe (403) is fixedly connected to one end of the water pump (402), a second water pump pipe (404) is fixedly connected to the other end of the water pump (402), and the other ends of the first water pump pipe (403) and the second water pump pipe (404) are fixedly connected to the bottom of one side of the first recycling tank (405) and the second recycling tank (406). The first recycling tank (405) and the second recycling tank (406) are installed in contact with the inner walls of two sets of second support frames (301).

3. The high-precision chip encapsulation point glue machine according to claim 2, characterized in that: The recycling component (4) is fixedly installed on one side of the top of the base plate (101) of the slide body (1). A first moving component (102) is fixedly installed at the top center of the base plate (101). The first moving component (102) includes a motor (307), a lead screw and a nut. The motor (307) is fixedly installed on one side of the base plate (101). An operating table (104) is fixedly installed on the top of the nut. A cylinder (203) is fixedly installed inside the operating table (104). A groove (105) is formed at the top center of the operating table (104). Two first guide rails (103) are slidably connected to the bottom of the operating table (104). The two sets of first guide rails (103) are fixedly installed on the top of the base plate (101). The dispensing machine body (2) is fixedly installed on the other side of the base plate (101).

4. The high-precision chip encapsulation point glue machine according to claim 3, characterized in that: The dispensing machine body (2) includes a first support frame (201), which includes four sets of first support frames (201). The four sets of first support frames (201) include two sets of left and right vertical first support frames (201) and two sets of upper and lower horizontal first support frames (201). The upper and lower sets of horizontal first support frames (201) are respectively fixedly connected to the two sets of vertical first support frames (201). A second moving component (202) is fixedly installed on the top of the lower horizontal first support frame (201). The second moving component (202) includes a motor (307), a first transmission shaft (304), a second transmission shaft (305), and a lead screw and a nut. The motor (307) and the first transmission shaft (304) are fixedly connected to the two sets of vertical first support frames (201). The moving shaft (304) is installed on the top outer side of the lower transverse first support frame (201). The second transmission shaft (305), the lead screw and the nut are installed at the top center of the lower transverse first support frame (201). A connecting plate (204) is fixedly installed on one side of the outer wall of the nut. A cylinder (203) is fixedly installed inside the upper half of the connecting plate (204). A needle tube (205) is movably installed inside the lower half of the connecting plate (204). The upper and lower ends of one side of the outer wall of the connecting plate (204) are slidably connected to the outer wall of a set of second guide rails (206). The two sets of second guide rails (206) are fixedly installed on one side of the upper and lower sets of transverse first support frames (201).

5. The high-precision chip encapsulation point glue machine according to claim 3, characterized in that: The dispensing machine body (2) is fixedly installed at one end of the top of the base plate (101), and a cleaning component (3) is fixedly installed at the other end of the base plate (101). A first moving component (102) is installed at the top center of the base plate (101), and a glue tank (401) of a recycling component (4) is fixedly installed on one side of the top of the base plate (101). The two sets of first recycling tanks (405) and second recycling tanks (406) of the recycling component (4) are installed and attached to the inner walls of two sets of second support frames (301).

6. The high-precision chip encapsulation point glue machine according to claim 5, characterized in that: The two sets of first pumping pipes (403) and second pumping pipes (404) of the recycling component (4) are respectively mounted around the top of the base plate (101).

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