PCB pad avoidance positioning resistance soldering coater
Patent Information
- Application Number
- CN202522096855.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-09-29
- Publication Date
- 2026-09-18
- Estimated Expiration
- 2035-09-29
AI Technical Summary
但是,在输送过程中,由于没有定位导向机构,导致PCB板在输送过程中位置容易偏移,输送效果差,并且由于PCB板表面容易产生静电,在静电作用下,容易导致阻焊油墨聚集,进而会对后续涂布质量造成影响,使用效果差
1、通过驱动电机可带动双向丝杆转动,通过双向丝杆可在第一固定块的作用下带动两对条形连接板相对移动,进而可对限位辊之间的距离进行调节,限位辊可对PCB板输送过程中进行限位和导向,避免PCB板位置偏移,提高输送效果。
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Figure CN224763503U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of coating machine technology, and in particular to a PCB pad avoidance and positioning solder resist coating machine. Background Technology
[0002] The PCB pad avoidance positioning solder resist coating machine is an automated device that uses high-precision machine vision and precision motion control technology to automatically and accurately coat solder resist ink onto the PCB board, precisely avoiding the pads and open areas that need to be soldered.
[0003] Existing PCB pad avoidance and positioning solder resist coating machines typically use a conveyor mechanism to transport the PCB board into the coating chamber for coating. However, due to the lack of a positioning and guiding mechanism during transport, the PCB board is prone to displacement, resulting in poor transport efficiency. Furthermore, the PCB board surface is susceptible to static electricity, which can cause solder resist ink to accumulate, negatively impacting subsequent coating quality and leading to poor overall performance. Therefore, we propose a PCB pad avoidance and positioning solder resist coating machine. Utility Model Content The purpose of this invention is to address the aforementioned shortcomings in the existing technology by proposing a PCB pad avoidance and positioning solder resist coating machine.
[0004] To achieve the above objectives, the present invention adopts the following technical solution: a PCB pad avoidance positioning solder resist coating machine is designed, including a base, two strip mounting plates are symmetrically installed on the top of the base, a roller conveyor is installed between the two strip mounting plates, a housing is installed on the top of the base, and a nozzle is connected inside the housing through an adjustment mechanism; Two pairs of strip connecting plates are symmetrically arranged between the two strip mounting plates. Each pair of strip connecting plates is located at the upper and lower ends of the roller conveyor, and the two ends of each pair of strip connecting plates are connected by a connecting frame. Several limiting rollers are rotatably connected between each pair of strip connecting plates. The limiting rollers are located between two adjacent rollers. A first fixing block is installed at the bottom of the two lower strip connecting plates. A bidirectional screw is rotatably connected between the two strip mounting plates. Both ends of the bidirectional screw are threaded through the corresponding first fixing block. A drive motor is connected to one end of the bidirectional screw. The drive motor is fixed to the top of the base. A U-shaped frame is installed on the top of the base, and an air supply pipe is installed on the top of the U-shaped frame. The other end of the air supply pipe is fixed to the air outlet of the air pump. A shelf is connected to the bottom of the base by a connecting rod, and the air pump is fixed to the top of the shelf. Several jet nozzles are installed at the bottom of the U-shaped frame. The top of each jet nozzle is connected to the bottom of the gas delivery pipe, and an ion rod is connected inside the jet nozzle.
[0005] Preferably, the adjustment mechanism includes a first strip-shaped fixing plate fixed to the top of the housing via a connecting rod, a first linear drive module connected to the bottom of the first strip-shaped fixing plate via a guide rail, a second strip-shaped fixing plate mounted on the bottom of the first linear drive module, a second linear drive module connected to the bottom of the second strip-shaped fixing plate via a guide rail, the top of the nozzle fixed to the bottom of the second linear drive module, and the nozzle's feed inlet connected to a feeding device via a pipe.
[0006] Preferably, a camera is also installed on the top side of the second linear drive module.
[0007] Preferably, several second fixing blocks are installed at the bottom of the two strip connecting plates located below, and several guide rods are installed between the two strip mounting plates, with each guide rod sliding through a corresponding pair of second fixing blocks.
[0008] Preferably, the bottom of the jet nozzle is flush with the top of the strip connecting plate.
[0009] Preferably, a control cabinet is installed at the bottom of the base, and the controller inside the control cabinet is connected to the roller conveyor, air pump, first linear drive module, second linear drive module, nozzle, drive motor, camera and ion bar via wires.
[0010] Preferably, a vacuum suction cup is installed on the top of the base, the vacuum suction cup is located below the nozzle, and the air outlet of the vacuum suction cup is connected to the negative pressure device through a pipe.
[0011] Preferably, several support legs are installed on the bottom edge of the base.
[0012] The design scheme proposed in this utility model has the following beneficial effects in application: 1. The drive motor can drive the bidirectional lead screw to rotate. The bidirectional lead screw can drive the two pairs of strip connecting plates to move relative to each other under the action of the first fixed block. This allows for adjustment of the distance between the limit rollers. The limit rollers can limit and guide the PCB board during the conveying process, preventing the PCB board from shifting position and improving the conveying effect.
[0013] 2. An air pump delivers external air through an air pipe to the nozzle, where it is then ionized by an ion bar. The ionized air is then blown onto the PCB surface to remove static electricity, preventing it from affecting the subsequent coating quality and improving the overall performance. Attached Figure Description
[0014] Figure 1 This is a schematic diagram of the structure of the present invention. Figure 1 ; Figure 2 This is a schematic diagram of the structure of the present invention. Figure 2 ; Figure 3 This is a side sectional view of the present invention; Figure 4 This is a schematic diagram of the strip connecting plate and bidirectional lead screw structure of this utility model; Figure 5 This is a schematic diagram of the gas pump and gas pipeline structure of this utility model.
[0015] In the diagram: 1. Base; 2. Housing; 3. Gas supply pipe; 4. Limiting roller; 5. Strip connecting plate; 6. Roller conveyor; 7. Strip mounting plate; 8. Storage plate; 9. Gas pump; 10. Support leg; 11. U-shaped frame; 12. Guide rod; 13. Air nozzle; 14. First strip fixing plate; 15. First linear drive module; 16. Second strip fixing plate; 17. Second linear drive module; 18. Nozzle; 19. Vacuum suction cup; 20. First fixing block; 21. Bidirectional lead screw; 22. Ion rod; 23. Second fixing block; 24. Connecting frame; 25. Drive motor; 26. Control cabinet; 27. Camera. Detailed Implementation
[0016] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.
[0017] Reference Figures 1-5 A PCB pad avoidance positioning solder resist coating machine includes a base 1, several support legs 10 are installed on the bottom edge of the base 1, and a control cabinet 26 is installed at the bottom of the base 1. The control cabinet 26 is equipped with a controller, which can be a Siemens S7-1200 or other brand controllers.
[0018] like Figure 1 and Figure 3 As shown, two strip mounting plates 7 are symmetrically installed on the top of the base 1, and a roller conveyor 6 is installed between the two strip mounting plates 7. The roller conveyor 6 is connected to the controller through wires. In actual use, the operator places the PCB board on the roller of the roller conveyor 6, and the controller can control the roller conveyor 6 to work and transport the PCB board.
[0019] like Figure 1 and Figure 3As shown, a housing 2 is installed on the top of the base 1. Inside the housing 2, a nozzle 18 is connected via an adjustment mechanism. The adjustment mechanism includes a first strip-shaped fixing plate 14 fixed to the top of the housing 2 via a connecting rod. The bottom of the first strip-shaped fixing plate 14 is connected to a first linear drive module 15 via a guide rail. A second strip-shaped fixing plate 16 is installed at the bottom of the first linear drive module 15. The bottom of the second strip-shaped fixing plate 16 is connected to a second linear drive module 17 via a guide rail. The top of the nozzle 18 is fixed to the bottom of the second linear drive module 17, and the inlet of the nozzle 18 is connected to a feeding device via a pipe. The first linear drive module 15, the second linear drive module 17, and the nozzle 18 are all connected to a controller via wires. In actual use, the horizontal position of the nozzle 18 can be adjusted by the first linear drive module 15 and the second linear drive module 17. Then, the coating can be sprayed onto the surface of the PCB board through the nozzle 18 to complete the coating process.
[0020] like Figure 3 As shown, a camera 27 is also installed on the top side of the second linear drive module 17. The camera 27 is a high-resolution industrial CCD camera, and the camera 27 is connected to the controller through a wire. In actual use, the captured data can be transmitted to the controller through the camera 27. The controller then controls the first linear drive module 15 and the second linear drive module 17 to drive the nozzle 18 to move, and then controls the nozzle 18 to spray onto the surface of the PCB board, so as to accurately avoid the solder pads.
[0021] It should be noted that, as Figure 3 As shown, a vacuum suction cup 19 is installed on the top of the base 1. The vacuum suction cup 19 is located below the nozzle 18, and the air outlet of the vacuum suction cup 19 is connected to the negative pressure device through a pipe. The negative pressure device (not shown in the figure) is also connected to the controller through a wire. In this way, during use, when the PCB board is transported to the preset position by the roller conveyor 6, the camera 27 can transmit the shooting data to the controller, which controls the roller conveyor 6 to be turned off and the negative pressure device to work, so that the vacuum suction cup 19 generates suction force to adsorb and fix the PCB board, thus completing the positioning.
[0022] like Figure 2 and Figure 4As shown, two pairs of strip connecting plates 5 are symmetrically arranged between two strip mounting plates 7. Each pair of strip connecting plates 5 is located at the upper and lower ends of the roller conveyor 6, and the two ends of each pair of strip connecting plates 5 are connected by a connecting frame 24. Several limiting rollers 4 are rotatably connected between each pair of strip connecting plates 5. The limiting rollers 4 are located between two adjacent rollers, and the bottom of the two lower strip connecting plates 5 are each equipped with a first fixing block 20. A bidirectional screw 21 is rotatably connected between the two strip mounting plates 7, and both ends of the bidirectional screw 21 are... The thread passes through the corresponding first fixing block 20, and one end of the bidirectional lead screw 21 is connected to the drive motor 25. The drive motor 25 is fixed on the top of the base 1 and is connected to the controller through wires. In actual use, the drive motor 25 can drive the bidirectional lead screw 21 to rotate. The bidirectional lead screw 21 will synchronously drive the two pairs of strip connecting plates 5 to move relative to each other. When the strip connecting plates 5 move, they will drive the limiting roller 4 to move, so that the side of the limiting roller 4 abuts against the side of the PCB board, thereby limiting and guiding the PCB board.
[0023] It should be noted that, as Figure 4 As shown, several second fixing blocks 23 are installed at the bottom of the two strip connecting plates 5 located below, and several guide rods 12 are also installed between the two strip mounting plates 7. Each guide rod 12 slides through a corresponding pair of second fixing blocks 23. Through the cooperation of the guide rods 12 and the second fixing blocks 23, the strip connecting plates 5 can be limited, thereby keeping the limiting roller 4 stable.
[0024] like Figure 2 and Figure 5 As shown, a U-shaped frame 11 is installed on the top of the base 1, and an air supply pipe 3 is installed on the top of the U-shaped frame 11. The other end of the air supply pipe 3 is fixed to the air outlet of the air supply pump 9. A shelf 8 is connected to the bottom of the base 1 by a connecting rod. The air supply pump 9 is fixed on the top of the shelf 8. The air supply pump 9 is connected to the controller by a wire. External air can be delivered into the air supply pipe 3 through the air supply pump 9.
[0025] like Figure 3 and Figure 5 As shown, several air nozzles 13 are installed at the bottom of the U-shaped frame 11. The top of each air nozzle 13 is connected to the bottom of the air supply pipe 3, and an ion rod 22 is connected inside the air nozzle 13. The ion rod 22 is connected to the controller through a wire. When the air supply pump 9 delivers air through the air supply pipe 3 to the air nozzle 13, the ion rod 22 can ionize the air. The ionized air passes through the air nozzle 13 and blows onto the PCB board surface to remove static electricity from the PCB board surface, so as not to hinder the subsequent coating.
[0026] Specifically, when using this utility model, the operator places the PCB board on the roller conveyor 6, and the controller controls the roller conveyor 6 to work and transport the PCB board. Before transporting, the controller first controls the drive motor 25 to work. The drive motor 25 drives the bidirectional lead screw 21 to rotate. The bidirectional lead screw 21 drives the two first fixed blocks 20 to move synchronously relative to each other. The first fixed blocks 20 drive the two pairs of strip connecting plates 5 to move relative to each other. Each pair of strip connecting plates 5 will drive the corresponding limit rollers 4 to move relative to each other. Thus, the distance between the limit rollers 4 can be adjusted according to the size of the PCB board. Then the roller conveyor 6 transports the PCB board. When the PCB board moves between the two pairs of strip connecting plates 5, the two sides of the PCB board will contact the sides of the corresponding limiting rollers 4. The sides of the limiting rollers 4 can limit and guide the PCB board to avoid the PCB board from shifting position. Furthermore, when the PCB board moves under the U-shaped frame 11, the controller controls the air pump 9 and the ion bar 22 to work. The air pump 9 delivers external air through the air pipe 3 to the nozzle 13. When the air passes through the nozzle 13, it is ionized by the ion bar 22. Finally, the ionized air blows onto the PCB board on the roller conveyor 6 to remove the static electricity from the surface of the PCB board. The static-free PCB board moves into the housing 2. Camera 27 captures the position information of the PCB board and transmits it to the controller. When the PCB board moves to the preset position, the controller shuts down the roller conveyor 6 and simultaneously controls the negative pressure device to work, so that the vacuum suction cup 19 generates suction to adsorb and fix the PCB board. Then the controller controls the first linear drive module 15 and the second linear drive module 17 to work. The first linear drive module 15 and the second linear drive module 17 drive the nozzle 18 to move. The controller then controls the nozzle 18 to spray the PCB board surface, avoiding the solder pads. After the PCB board has completed the spraying process, it passes through the housing 2 and is transported to the subsequent equipment for further processing.
[0027] Furthermore, such as Figure 3 As shown, the bottom of the jet nozzle 13 is flush with the top of the strip connecting plate 5. During use, the strip connecting plate 5 will not collide with the jet nozzle 13 during movement.
[0028] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and the inventive concept of the present utility model, should be included within the protection scope of the present utility model.
Claims
1. A PCB pad avoidance and positioning solder resist coating machine, comprising a base (1), characterized in that: Two strip mounting plates (7) are symmetrically installed on the top of the base (1), and a roller conveyor (6) is installed between the two strip mounting plates (7). A housing (2) is installed on the top of the base (1), and a nozzle (18) is connected inside the housing (2) through an adjustment mechanism. Two pairs of strip connecting plates (5) are symmetrically arranged between the two strip mounting plates (7). Each pair of strip connecting plates (5) is located at the upper and lower ends of the roller conveyor (6), and the two ends of each pair of strip connecting plates (5) are connected by a connecting frame (24). Several limiting rollers (4) are rotatably connected between each pair of strip connecting plates (5). The limiting rollers (4) are located between two adjacent rollers. The bottom of the two strip connecting plates (5) located below are each equipped with a first fixing block (20). A bidirectional screw (21) is rotatably connected between the two strip mounting plates (7). Both ends of the bidirectional screw (21) are threaded through the corresponding first fixing block (20). One end of the bidirectional screw (21) is connected to a drive motor (25). The drive motor (25) is fixed on the top of the base (1). A U-shaped frame (11) is installed on the top of the base (1), and an air supply pipe (3) is installed on the top of the U-shaped frame (11). The other end of the air supply pipe (3) is fixed to the air outlet of the air pump (9), and a shelf (8) is connected to the bottom of the base (1) by a connecting rod. The air pump (9) is fixed on the top of the shelf (8). Several jet nozzles (13) are installed at the bottom of the U-shaped frame (11). The top of each jet nozzle (13) is connected to the bottom of the gas delivery pipe (3), and an ion rod (22) is connected inside the jet nozzle (13).
2. The PCB pad-avoiding positioning soldering resist coater according to claim 1, characterized in that: The adjustment mechanism includes a first strip-shaped fixing plate (14) fixed to the top of the housing (2) by a connecting rod. The bottom of the first strip-shaped fixing plate (14) is connected to a first linear drive module (15) by a guide rail. The bottom of the first linear drive module (15) is equipped with a second strip-shaped fixing plate (16). The bottom of the second strip-shaped fixing plate (16) is connected to a second linear drive module (17) by a guide rail. The top of the nozzle (18) is fixed to the bottom of the second linear drive module (17), and the inlet of the nozzle (18) is connected to the feeding device through a pipe.
3. The PCB pad-avoiding positioning solder resist coater according to claim 2, characterized in that: A camera (27) is also installed on the top side of the second linear drive module (17).
4. The PCB pad-avoiding positioning resistance coating machine according to claim 1, characterized in that: Several second fixing blocks (23) are installed at the bottom of the two strip connecting plates (5) located below, and several guide rods (12) are installed between the two strip mounting plates (7). Each guide rod (12) slides through the corresponding pair of second fixing blocks (23).
5. The PCB pad-avoiding positioning resistance coating machine according to claim 1, characterized in that: The bottom of the jet nozzle (13) is flush with the top of the strip connecting plate (5).
6. The PCB pad-avoiding positioning solder resist coater according to claim 3, characterized in that: The bottom of the base (1) is equipped with a control cabinet (26). The controller inside the control cabinet (26) is connected to the roller conveyor (6), the air pump (9), the first linear drive module (15), the second linear drive module (17), the nozzle (18), the drive motor (25), the camera (27), and the ion bar (22) respectively via wires.
7. The PCB pad-avoiding positioning resistance coating machine according to claim 1, characterized in that: A vacuum suction cup (19) is installed on the top of the base (1). The vacuum suction cup (19) is located below the nozzle (18), and the air outlet of the vacuum suction cup (19) is connected to the negative pressure device through a pipe.
8. The PCB pad-avoiding positioning resistance coating machine according to claim 1, characterized in that: Several legs (10) are installed on the bottom edge of the base (1).