High speed folding mechanism for a film label

Abstract

The utility model discloses a kind of high-speed palm mechanism of film label, it is related to palm machine technical field, including by the setting of semiconductor refrigeration sheet and copper plate, when being palm processed to film label, the film label being initially palm extruded is moved to above copper plate, by the low temperature of copper plate, promote the cooling of glue, to speed up solidification speed, in this way, the number of turnover roller can be reduced, to facilitate the feeding operation of film label, and the way mechanism is simple, it is more convenient to use, the utility model is by the setting of semiconductor refrigeration sheet and copper plate, when being palm processed to film label, the film label being initially palm extruded is moved to above copper plate, by the low temperature of copper plate, promote the cooling of glue, to speed up solidification speed, in this way, the number of turnover roller can be reduced, to facilitate the feeding operation of film label, and the way mechanism is simple, it is more convenient to use.

Description

Technical Field

[0001] This utility model relates to the field of palm-clasping machine technology, and in particular to a high-speed palm-clasping mechanism for a thin film label. Background Technology

[0002] High-speed folding machines are specifically designed to fold film materials into roll-shaped packaging materials, and are widely used in packaging production lines in the food, beverage, and daily chemical industries.

[0003] For example, Chinese patent CN208856007U discloses a device for preventing adhesive spillage in a hand-clapping machine, which includes a hand-clapping machine frame, an adhesive suction roller, and an air blowing pipe. The hand-clapping machine frame is equipped with a fixed bracket, a first fixed rod, a winding device, and several film guide rollers. An air blowing pipe is sleeved on the outer surface of the first fixed rod. The two ends of the second fixed rod are fixedly installed on the fixed bracket. An adhesive suction layer is provided on the outer sleeve of the adhesive suction roller. The two ends of the adhesive suction roller are fixedly connected to the upper end of the U-shaped fixed bracket, and the lower end of the U-shaped fixed bracket is rotatably connected to the fixed bracket.

[0004] In existing technologies, the clasping mechanism in high-speed clasping machines consists of two rollers pressing against each other to adhere the two ends of the film label. Once the adhesive has solidified, the two ends of the film label are firmly bonded, completing the clasping. The clasping of film labels often involves applying hot melt adhesive to both ends of the film label. However, the hot melt adhesive requires cooling to solidify. Therefore, although the two ends of the film label are adhered together after clasping, they are not yet firmly bonded. A turnover roller is needed to move the film label in an S-shape within the clasping machine to increase the cooling time. Since the clasping speed is relatively fast, a large number of turnover rollers are required. This method makes the entry of the film surface cumbersome and inconvenient to use. Utility Model Content

[0005] The purpose of this invention is to solve the problem that in the existing technology of film label closure, hot melt adhesive is mostly applied to both ends of the film label. However, the solidification of hot melt adhesive requires cooling. Therefore, although the two ends of the film label are adhered together after closure, they are not yet firmly established. It is necessary to use turnover rollers to move the film label in an S-shape within the closure machine to increase the cooling time. However, the closure speed is relatively fast, so more turnover rollers are needed. This method makes the entry of the film surface cumbersome and inconvenient to use. Therefore, a high-speed closure mechanism for film labels is proposed.

[0006] To achieve the above objectives, the present invention adopts the following technical solution: a high-speed closing mechanism for a film label, comprising a frame mechanism, the frame mechanism including a middle mounting frame, an auxiliary condensation mechanism disposed inside the middle mounting frame, the auxiliary condensation mechanism including a bottom extension frame, a bottom closing cover fixedly connected to the lower end of the middle mounting frame, the bottom extension frame fixedly connected to the lower middle part of the bottom closing cover, a fan fixedly connected inside the bottom extension frame, air inlets provided on both sides of the middle mounting frame, an end groove provided at the upper end of the middle mounting frame, a copper plate fixedly connected inside the end groove, an assembly slot provided inside the middle mounting frame, and a semiconductor cooling chip installed inside the assembly slot.

[0007] Preferably, a limiting plate is fixedly connected to the upper end of the inner frame and at the edge of the assembly slot.

[0008] Preferably, the upper end of the middle frame is provided with an end cap, and one side of the end cap is rotatably connected to one side of the middle frame.

[0009] Preferably, a buckle groove is provided on one side of the end cap, and a bottom groove is provided on one side of the lower end of the end cap.

[0010] Preferably, a soft magnetic strip is fixedly connected inside the bottom groove.

[0011] Preferably, side frames are fixedly connected to both sides of the central frame, an inner roller is rotatably connected inside the side frame, and a silicone pressure sleeve is fixedly connected to the outer surface of the inner roller.

[0012] Preferably, the lower end of the end cap is provided with side through grooves on both sides.

[0013] Compared with the prior art, the advantages and positive effects of this utility model are as follows: 1. In this utility model, by setting up a semiconductor cooling chip and a copper plate, the film label that has been initially squeezed by the cupping process can be moved to the top of the copper plate. The low temperature of the copper plate promotes the cooling of the adhesive, thereby accelerating the solidification speed. In this way, the number of turnover rollers can be reduced to facilitate the feeding operation of the film label. Moreover, this method has a simple mechanism and is relatively convenient to use.

[0014] 2. In this utility model, the end cap is used to seal the upper area of ​​the copper plate to reduce the rate of cold air dissipation, thereby ensuring the curing effect of the adhesive inside the film label and ensuring the stability of use. The fan and air inlet are used to remove the heat from the heating end of the semiconductor cooling chip, ensuring the working stability of the semiconductor cooling chip. The soft magnetic strip is designed to prevent the end cap from shaking during use and ensure the connection stability between the end cap and the central mounting frame. The slot is designed to facilitate the opening of the end cap and make it convenient to use. Attached Figure Description

[0015] Figure 1 A three-dimensional structural diagram of a high-speed clasping mechanism for a thin film label is provided for this utility model. Figure 2 This utility model provides a schematic diagram of the internal structure of a high-speed clasping mechanism for a film label. Figure 3 An exploded view of a high-speed clasping mechanism for a thin film label is provided for this utility model. Figure 4 This invention presents a three-dimensional structural diagram of the mounting frame in a high-speed closing mechanism for film labels.

[0016] Legend: 1. Frame structure; 11. Middle frame; 12. Bottom cover; 13. Side frame; 14. Inner roller; 15. Silicone sleeve; 16. Fastening groove; 17. Soft magnetic strip; 18. Bottom groove; 2. Auxiliary condenser mechanism; 21. Bottom extension frame; 22. Fan; 23. Air inlet; 24. End cap; 25. Side passage groove; 26. Copper plate; 27. Limiting plate; 28. Semiconductor cooling chip; 29. ​​End groove; 210. Assembly slot. Detailed Implementation

[0017] To better understand the above-mentioned objectives, features, and advantages of this utility model, the present utility model will be further described below with reference to the accompanying drawings and embodiments. It should be noted that, unless otherwise specified, the embodiments and features described in these embodiments can be combined with each other.

[0018] Many specific details are set forth in the following description in order to provide a full understanding of the present invention. However, the present invention may also be implemented in other ways than those described herein, and therefore the present invention is not limited to the specific embodiments disclosed in the following specification.

[0019] Example 1: As Figure 1 - Figure 4 As shown, this utility model provides a high-speed closing mechanism for film labels, including a frame mechanism 1. The frame mechanism 1 includes a middle mounting frame 11, and an auxiliary condensation mechanism 2 is provided inside the middle mounting frame 11. The auxiliary condensation mechanism 2 includes a bottom extension frame 21. A bottom closing cover 12 is fixedly connected to the lower end of the middle mounting frame 11. The bottom extension frame 21 is fixedly connected to the lower middle part of the bottom closing cover 12. A fan 22 is fixedly connected inside the bottom extension frame 21. Air inlets 23 are provided on both sides of the middle mounting frame 11. An end groove 29 is provided at the upper end of the middle mounting frame 11. A copper plate 26 is fixedly connected inside the end groove 29. An assembly slot 210 is provided inside the middle mounting frame 11. A semiconductor cooling chip 28 is installed inside the assembly slot 210.

[0020] The specific settings and functions of this embodiment will be described in detail below. By setting up the semiconductor cooling chip 28 and the copper plate 26, the film label that has been initially squeezed during the folding process can be moved above the copper plate 26. The low temperature of the copper plate 26 promotes the cooling of the adhesive, thereby accelerating the solidification speed. In this way, the number of turnover rollers can be reduced to facilitate the feeding operation of the film label. Moreover, this method has a simple mechanism and is relatively convenient to use.

[0021] Example 2: Figure 1 - Figure 4 As shown, a limiting plate 27 is fixedly connected to the upper end of the middle frame 11 and at the edge of the assembly slot 210. An end cover 24 is provided at the upper end of the middle frame 11. One side of the end cover 24 is rotatably connected to one side of the middle frame 11. A buckle groove 16 is provided on one side of the end cover 24. A bottom groove 18 is provided on one side of the lower end of the end cover 24. A soft magnetic strip 17 is fixedly connected inside the bottom groove 18. Side frames 13 are fixedly connected to both sides of the middle frame 11. An inner roller 14 is rotatably connected inside the side frame 13. A silicone pressure sleeve 15 is fixedly connected to the outer surface of the inner roller 14. Side through grooves 25 are provided on both sides of the lower end of the end cover 24.

[0022] The overall effect of this embodiment is as follows: the end cap 24 is used to seal the upper area of ​​the copper plate 26 to reduce the rate of cold air dissipation, thereby ensuring the curing effect of the adhesive inside the film label and ensuring the stability of use; the fan 22 and the air inlet 23 are used to remove the heat from the heating end of the semiconductor cooling chip 28, ensuring the working stability of the semiconductor cooling chip 28; the soft magnetic strip 17 adopts a magnetic attraction design to prevent the end cap 24 from shaking during use, ensuring the connection stability between the end cap 24 and the central mounting bracket 11; and the buckle 16 makes it easy to open the end cap 24 for convenient use.

[0023] The usage method and working principle of this device are as follows: When in use, the film label is installed in the clasping machine, the clasping machine is turned on, the inner roller 14 is driven to rotate, and the semiconductor cooling chip 28 and the fan 22 are turned on at the same time. After the film label is coated with glue, the inner roller 14 and the silicone pressure sleeve 15 on one side squeeze the film label to perform pre-clasping. Then the film label enters the area between the copper plate 26 and the end cap 24 to cool the glue and accelerate the solidification speed. Then the inner roller 14 and the silicone pressure sleeve 15 on the other side squeeze the film label to clasp it again, thus completing the clasping operation. The clasped film label passes through the turnover roller and is wound up by the winding mechanism.

[0024] The above are merely preferred embodiments of this utility model and are not intended to limit the utility model in any other way. Any person skilled in the art may make changes or modifications to the above-disclosed technical content to create equivalent embodiments for application in other fields. However, any simple modifications, equivalent changes, and modifications made to the above embodiments based on the technical essence of this utility model without departing from the technical solution of this utility model shall still fall within the protection scope of this utility model.

Claims

1. A high-speed clasping mechanism for a film label, comprising a frame mechanism (1), characterized in that: The frame structure (1) includes a middle frame (11), and an auxiliary condensation mechanism (2) is provided inside the middle frame (11). The auxiliary condensation mechanism (2) includes a bottom extension frame (21). A bottom cover (12) is fixedly connected to the lower end of the middle frame (11). The bottom extension frame (21) is fixedly connected to the middle of the lower end of the bottom cover (12). A fan (22) is fixedly connected inside the bottom extension frame (21). An air inlet (23) is provided on both sides of the middle frame (11). An end groove (29) is provided at the upper end of the middle frame (11). A copper plate (26) is fixedly connected inside the end groove (29). An assembly slot (210) is provided inside the middle frame (11). A semiconductor cooling chip (28) is installed inside the assembly slot (210).

2. The high-speed clasping mechanism for a film label according to claim 1, characterized in that: A limiting plate (27) is fixedly connected to the upper end of the inner frame (11) and at the edge of the assembly slot (210).

3. The high-speed clasping mechanism for a film label according to claim 1, characterized in that: The upper end of the middle frame (11) is provided with an end cap (24), and one side of the end cap (24) is rotatably connected to one side of the middle frame (11).

4. The high-speed clasping mechanism for a film label according to claim 3, characterized in that: A buckle groove (16) is provided on one side of the end cap (24), and a bottom groove (18) is provided on one side of the lower end of the end cap (24).

5. The high-speed clasping mechanism for a film label according to claim 4, characterized in that: A soft magnetic strip (17) is fixedly connected inside the bottom groove (18).

6. The high-speed clasping mechanism for a film label according to claim 1, characterized in that: Both sides of the central frame (11) are fixedly connected to side frames (13), and the inside of the side frame (13) is rotatably connected to an inner roller (14). The outer surface of the inner roller (14) is fixedly connected to a silicone pressure sleeve (15).

7. The high-speed clasping mechanism for a film label according to claim 3, characterized in that: Side through grooves (25) are provided on both sides of the lower end of the end cap (24).

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