A plate straightening mechanism for a silicon wafer cutting backing plate

Abstract

This utility model provides a plate straightening mechanism for silicon wafer cutting substrates, relating to the field of cutting substrate straightening technology. It includes a support base, a straightening table mounted on the top of the support base, a cutting substrate placed on the upper side of the straightening table, and an adsorption straightening assembly installed inside the straightening table. The adsorption straightening assembly includes an installation groove inside the straightening table, and an adsorption cylinder installed inside the installation groove. The cutting substrate is positioned by a positioning corner plate and a limiting side plate, allowing the cutting substrate to be quickly and accurately placed in the designated position, improving the accuracy and efficiency of the straightening operation. An external controller briefly opens a solenoid valve, connecting the adsorption cylinder under the cutting substrate area to a negative pressure air pump, thereby adsorbing the cutting substrate onto the straightening table and fixing it. Simultaneously, the array of adsorption cylinders provides a uniform fixing effect, avoiding secondary deformation of the cutting substrate caused by mechanical clamping.

Description

Technical Field

[0001] This utility model relates to the field of cutting liner straightening technology, and in particular to a plate straightening mechanism for silicon wafer cutting liner. Background Technology

[0002] In the semiconductor industry, silicon wafer cutting is a critical process. To ensure cutting accuracy and quality, liner plates are usually used to support the silicon wafers. However, due to transportation, storage or pre-processing reasons, these liners may be bent or deformed. If the deformed liners are used directly for silicon wafer cutting, it will lead to problems such as uneven thickness and edge cracking of the cut silicon wafers, which will seriously affect the product yield.

[0003] However, traditional cutting liner plates mainly rely on mechanical clamping devices during the straightening process. The plates are fixed and straightened by physical force. However, the clamping stress is relatively concentrated in the mechanical clamping method, which can easily cause new deformations to the cutting liner plates, or even crush brittle liner plates, affecting the straightening effect. In addition, it is difficult to accurately straighten the small undulations or twists on the surface of the plate, resulting in the flatness of the straightened plate not meeting the ideal standard.

[0004] Therefore, we provide a plate straightening mechanism for silicon wafer cutting substrates to solve the above problems. Utility Model Content

[0005] To overcome the above deficiencies, this utility model provides a plate straightening mechanism for silicon wafer cutting substrates, aiming to solve the aforementioned problems.

[0006] To achieve the above objectives, this utility model is implemented through the following technical solution: it includes a support base, a straightening table is installed at the top of the support base, a cutting liner is placed on the upper side of the straightening table, an adsorption straightening component is installed inside the straightening table, the adsorption straightening component includes an installation groove opened inside the straightening table, and an adsorption cylinder is installed inside the installation groove.

[0007] Preferably, a support pad is adhered to the surface of the straightening table. The support pad is made of silicone and is bonded to the cutting liner.

[0008] Preferably, the mounting slots are arranged in a matrix of eighty-one groups on the straightening table, and there is a one-to-one correspondence between the adsorption cylinders and the mounting slots. Each group of adsorption cylinders is equipped with a corresponding solenoid valve at the bottom. The bottom of each solenoid valve is connected to an external negative pressure air pump through a pipe, and each solenoid valve can be controlled independently.

[0009] Preferably, a support frame is welded to the upper side of the adsorption cylinder, and a support plate is adhered to the top of the support frame. The height of the support plate is flush with the height of the support pad.

[0010] Preferably, a heating controller is installed inside the adsorption cylinder, and a heating wire is installed on the upper side of the heating controller, with the heating wire disposed on the upper surface of the adsorption cylinder.

[0011] Preferably, a fixing frame is welded to the rear end of the support base, and an mounting frame is installed on the front side of the top of the fixing frame. A detection probe is installed inside the mounting frame. The detection probe is an infrared rangefinder. The detection probe and the mounting groove are arranged in a corresponding array structure. The detection probe and the adsorption cylinder are in one-to-one correspondence. The solenoid valve and the detection probe are both connected to an external controller.

[0012] Preferably, a positioning corner plate is welded to one corner of the straightening table. The positioning corner plate has an "L" shape and limiting side plates are provided on both sides of the positioning corner plate. The limiting side plates are welded to the straightening table.

[0013] This invention provides a plate straightening mechanism for silicon wafer cutting substrates. Compared with the prior art, it has the following advantages:

[0014] 1. This is a plate straightening mechanism for silicon wafer cutting substrates. The positioning corner plate and the limiting side plate position the cutting substrate, enabling the cutting substrate to be placed quickly and accurately in the designated position, improving the accuracy and efficiency of the straightening operation. The solenoid valve is briefly opened by an external controller, connecting the adsorption cylinder under the cutting substrate area to the negative pressure air pump, thereby adsorbing the cutting substrate onto the straightening table and fixing it. At the same time, the array of adsorption cylinders can provide a uniform fixing effect, avoiding secondary deformation of the cutting substrate caused by mechanical clamping.

[0015] 2. This silicon wafer cutting substrate straightening mechanism, after fixing the cutting substrate, uses an infrared rangefinder to detect the distance to various areas on the surface of the cutting substrate. When deformation occurs at a certain point on the cutting substrate, the measured data at that point differs from other areas. When the measured data exceeds the error threshold, the controller controls the corresponding solenoid valve to open, causing the corresponding adsorption cylinder to continuously generate negative pressure suction. This targeted adsorption and straightening of the deformed area improves the accuracy of straightening. At the same time, a heating wire can heat the deformed area to soften the cutting substrate locally. Under the combined action of negative pressure adsorption, deformation is more effectively eliminated, and flatness is restored. Thus, the array of adsorption cylinders can accurately straighten different positions of the cutting substrate, improving the accuracy of straightening and ensuring the flatness of the straightened cutting substrate. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the overall appearance structure of this utility model;

[0017] Figure 2This is a schematic diagram of the cooperative structure of the straightening table, positioning angle plate and limiting side plate of this utility model;

[0018] Figure 3 This is a partially disassembled structural diagram of the adsorption straightening component of this utility model;

[0019] Figure 4 This is a bottom view of the mounting bracket of this utility model.

[0020] Figure 5 This is a cross-sectional structural diagram of the adsorption cylinder of this utility model.

[0021] The following are the labels in the diagram: 1. Support base; 2. Straightening table; 3. Support pad; 4. Cutting liner; 5. Adsorption straightening assembly; 501. Mounting slot; 502. Adsorption cylinder; 503. Solenoid valve; 504. Support frame; 505. Support plate; 506. Heating controller; 507. Heating wire; 508. Fixing frame; 509. Mounting frame; 510. Detection probe; 6. Positioning angle plate; 7. Limiting side plate. Detailed Implementation

[0022] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0023] Please see Figure 1-5 This utility model provides a technical solution: a plate straightening mechanism for silicon wafer cutting substrate, including a support base 1, a straightening table 2 installed on the top of the support base 1, a cutting substrate 4 placed on the upper side of the straightening table 2, and an adsorption straightening component 5 installed inside the straightening table 2. The adsorption straightening component 5 includes an installation groove 501 opened inside the straightening table 2, and an adsorption cylinder 502 installed inside the installation groove 501.

[0024] A support pad 3 is adhered to the surface of the straightening table 2. The support pad 3 is made of silicone and is bonded to the cutting liner 4.

[0025] When it is necessary to straighten the cutting liner 4, the cutting liner 4 is placed on the straightening table 2. The support pad 3 made of silicone material can effectively adapt to the slight unevenness at the bottom of the cutting liner 4, providing it with uniform support force and avoiding secondary deformation of the liner due to excessive local pressure during the straightening process.

[0026] There are eighty-one sets of mounting slots 501 arranged in a matrix on the straightening table 2. There is a one-to-one correspondence between the adsorption cylinders 502 and the mounting slots 501. Each set of adsorption cylinders 502 is equipped with a corresponding solenoid valve 503 at the bottom. The bottom of each solenoid valve 503 is connected to an external negative pressure air pump through a pipe. Each solenoid valve 503 can be controlled independently.

[0027] After the cutting liner 4 is placed on the straightening table 2, the solenoid valve 503 is briefly opened by the external controller, so that the adsorption cylinder 502 under the area of ​​the cutting liner 4 is connected to the negative pressure air pump, thereby adsorbing the cutting liner 4 onto the straightening table 2, thus adsorbing and fixing the cutting liner 4. At the same time, the array of adsorption cylinders 502 can provide a uniform fixing effect, avoiding secondary deformation of the cutting liner 4 caused by mechanical clamping.

[0028] A fixing frame 508 is welded to the rear end of the support base 1. A mounting frame 509 is installed on the front side of the top of the fixing frame 508. A detection probe 510 is installed inside the mounting frame 509. The detection probe 510 is an infrared rangefinder. The detection probe 510 and the mounting groove 501 are in a corresponding array structure. The detection probe 510 and the adsorption cylinder 502 are in one-to-one correspondence. The solenoid valve 503 and the detection probe 510 are both connected to an external controller.

[0029] After the cutting liner 4 is fixed, the external controller starts the detection probe 510 and uses an infrared rangefinder to detect the distance to each area on the surface of the cutting liner 4. The measured distance data is transmitted to the controller. When a certain part of the cutting liner 4 is deformed, the data measured at that part will differ from other areas. When the measured data exceeds the error threshold, the controller controls the corresponding solenoid valve 503 to open, so that the corresponding adsorption cylinder 502 continuously generates negative pressure suction to perform targeted adsorption and straightening of the deformed area, thereby improving the accuracy of straightening.

[0030] A support frame 504 is welded to the upper side of the adsorption cylinder 502, and a support plate 505 is attached to the top of the support frame 504. The height of the support plate 505 is flush with the height of the support pad 3.

[0031] The cutting liner 4 is supported by the support plate 505 to prevent excessive negative pressure adsorption, which would cause excessive deformation of the cutting liner 4 and ensure the straightening effect of the cutting liner 4.

[0032] A heating controller 506 is installed inside the adsorption cylinder 502. A heating wire 507 is installed on the upper side of the heating controller 506 and is located on the upper surface of the adsorption cylinder 502.

[0033] During use, when negative pressure adsorption cannot directly achieve the straightening effect, the heating controller 506 can be activated to heat the deformed area through the heating wire 507 to soften the cutting liner 4 locally. Under the combined action of negative pressure adsorption, the deformation is eliminated more effectively and the flatness is restored. If the straightening effect still cannot be achieved after softening, the corresponding area of ​​the cutting liner 4 can be pressed down by the external pressure plate to ensure the flatness of the cutting liner 4 after straightening.

[0034] A positioning angle plate 6 is welded to one corner of the straightening table 2. The positioning angle plate 6 has an "L" shaped structure. Limiting side plates 7 are provided on both sides of the positioning angle plate 6. The limiting side plates 7 are welded to the straightening table 2.

[0035] When the cutting liner 4 is placed on the straightening table 2, one corner of the cutting liner 4 is aligned with the "L"-shaped positioning corner plate 6. At the same time, the limiting side plates 7 on both sides can limit the other two sides of the cutting liner 4, so that the cutting liner 4 can be placed quickly and accurately in the designated position, avoiding displacement during the placement process, improving the accuracy and efficiency of the straightening operation, and ensuring that subsequent adsorption and straightening steps can be accurately applied to the corresponding area of ​​the cutting liner 4.

[0036] Working principle: When the cutting liner 4 needs to be straightened, one corner of the cutting liner 4 is attached to the "L"-shaped positioning corner plate 6, and the limiting side plates 7 on both sides can limit the other two sides of the cutting liner 4, so as to place the cutting liner 4 on the straightening table 2.

[0037] Subsequently, the external controller briefly opens the solenoid valve 503 corresponding to the area of ​​the cutting liner 4, connecting the adsorption cylinder 502 to the negative pressure air pump, adsorbing the cutting liner 4 onto the straightening table 2 to achieve initial fixation. Then, the external controller starts the detection probe 510 and uses an infrared rangefinder to detect the distance to each area on the surface of the cutting liner 4. When the data at a certain point exceeds the error threshold, that is, when the cutting liner 4 is deformed, the controller controls the solenoid valve 503 at the corresponding position to continue to open, so that the corresponding adsorption cylinder 502 generates a continuous negative pressure suction force to perform targeted adsorption and straightening of the deformed area.

[0038] If negative pressure adsorption cannot directly achieve the straightening effect, the heating controller 506 is activated, and the deformed area is heated by the heating wire 507, so that the cutting liner 4 is locally heated and softened, and the deformation is eliminated under the combined action of negative pressure adsorption force.

[0039] If the straightening effect cannot be achieved after softening, the corresponding area of ​​the cutting liner 4 can be pressed down by an external pressure plate to ensure the flatness after straightening. During the entire straightening process, the support plate 505 supports the cutting liner 4 to prevent excessive deformation caused by excessive negative pressure adsorption. The support pad 3 adapts to the slight unevenness at the bottom of the cutting liner 4 and provides uniform support force to ensure that the straightening process proceeds smoothly.

[0040] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A plate straightening mechanism of a silicon wafer cutting backing plate, comprising a support base (1), characterized in that: A straightening platform (2) is installed at the top of the support base (1). A cutting liner (4) is placed on the upper side of the straightening platform (2). An adsorption straightening assembly (5) is installed inside the straightening platform (2). The adsorption straightening assembly (5) includes an installation groove (501) opened inside the straightening platform (2). An adsorption cylinder (502) is installed on the inner side of the installation groove (501).

2. The sheet straightening mechanism of a silicon wafer dicing liner sheet according to claim 1, wherein The surface of the straightening table (2) is adhered with a support pad (3), which is made of silicone. The support pad (3) is attached to the cutting liner (4).

3. The sheet straightening mechanism of a silicon wafer dicing liner sheet according to claim 1, wherein The mounting slots (501) are arranged in a matrix of eighty-one groups on the straightening table (2). The adsorption cylinders (502) correspond one-to-one with the mounting slots (501), and each group of adsorption cylinders (502) is equipped with a corresponding solenoid valve (503) at the bottom. The bottom of each solenoid valve (503) is connected to an external negative pressure air pump through a pipe. Each solenoid valve (503) can be controlled independently.

4. The sheet straightening mechanism of a silicon wafer dicing liner sheet according to claim 1, wherein A support frame (504) is welded to the upper side of the adsorption cylinder (502), and a support plate (505) is attached to the top of the support frame (504). The height of the support plate (505) is flush with the height of the support pad (3).

5. The sheet straightening mechanism of a silicon wafer dicing liner sheet according to claim 1, wherein A heating controller (506) is installed inside the adsorption cylinder (502), and a heating wire (507) is installed on the upper side of the heating controller (506). The heating wire (507) is disposed on the upper surface of the adsorption cylinder (502).

6. The sheet straightening mechanism of a silicon wafer dicing liner sheet according to claim 3, wherein A fixing frame (508) is welded to the rear end of the support base (1). A mounting frame (509) is installed on the front side of the top of the fixing frame (508). A detection probe (510) is installed inside the mounting frame (509). The detection probe (510) is an infrared rangefinder. The detection probe (510) and the mounting groove (501) are in a corresponding array structure. The detection probe (510) and the adsorption cylinder (502) are in one-to-one correspondence. The solenoid valve (503) and the detection probe (510) are both connected to an external controller.

7. The sheet straightening mechanism of a silicon wafer dicing liner sheet according to claim 1, wherein A positioning angle plate (6) is welded to one corner of the straightening platform (2). The positioning angle plate (6) has an "L" shaped structure. Limiting side plates (7) are provided on both sides of the positioning angle plate (6). The limiting side plates (7) are welded to the straightening platform (2).

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