Cooling mechanism for vacuum reflow soldering

Abstract

The utility model discloses a cooling mechanism for vacuum reflow soldering relates to vacuum reflow soldering technical field, including apron, apron in top side surface equal interval is provided with the outlet gas upper flat mouth, apron downside is provided with the base, the inboard of base is provided with the lift box, the lift box upside surface equal interval is provided with the outlet gas lower flat mouth, the lift box downside is provided with the semiconductor refrigeration plate, the utility model discloses the lift box and electric push rod of setting make electric push rod can promote the lift box up and down movement, and then adjust the lift box and the interval of PCB board material downside, make the cooling effect obtain the guarantee.

Description

Technical Field

[0001] This utility model relates to the field of vacuum reflow soldering technology, specifically to a cooling mechanism for vacuum reflow soldering. Background Technology

[0002] Vacuum reflow soldering, also known as a vacuum / controlled atmosphere eutectic furnace, boasts a large heat capacity and minimal temperature difference on the PCB surface, making it widely used in European and American aerospace, military electronics, and other fields. Utilizing infrared radiation heating, it features uniform temperature, safe ultra-low temperature soldering, no temperature difference, no overheating, reliable and stable process parameters, no need for complex process testing, and environmentally friendly, low-cost operation, meeting the diverse, small-batch, and highly reliable soldering needs of military products.

[0003] The existing vacuum reflow soldering cooling mechanism cannot adjust the distance between the bottom of the PCB board and the cooling device, which makes it impossible to guarantee the cooling effect of the bottom side of the PCB board. At the same time, the existing cooling mechanism blows the air from the top and bottom sides of the PCB board through the circular air outlet, which does not effectively cover the air-cooled area on the PCB surface, thus affecting the air-cooling effect. Utility Model Content

[0004] The technical problem to be solved by this utility model is to overcome the existing defects and provide a cooling mechanism for vacuum reflow soldering. By setting up a lifting box and an electric push rod, the electric push rod can push the lifting box to move up and down, thereby adjusting the distance between the lifting box and the lower side of the PCB board, so as to ensure the cooling effect and effectively solve the problems in the background art.

[0005] To achieve the above objectives, the present invention provides the following technical solution: a cooling mechanism for vacuum reflow soldering, comprising a cover plate, wherein upper flat nozzles for air outlet are equally spaced on the inner top side of the cover plate, a base is provided on the lower side of the cover plate, a lifting box is provided on the inner side of the base, lower flat nozzles for air outlet are equally spaced on the upper side of the lifting box, a semiconductor cooling plate is provided on the lower side of the lifting box, and electric push rods are provided at the four corners of the lower side of the lifting box.

[0006] Furthermore, an air guide box is provided on the upper side of the cover plate, and an axial flow fan is installed on the side of the air guide box.

[0007] Furthermore, a centrifugal fan is provided on the side of the air guide box away from the axial flow fan, and an exhaust pipe is installed on the outside of the centrifugal fan.

[0008] Furthermore, the side of the lifting box is connected to an air inlet pipe via a corrugated flexible hose, and an air intake nozzle is provided on the side of the air outlet flat nozzle.

[0009] Furthermore, the upper air outlet nozzle is connected to the inner side of the air guide box, and the lower air inlet nozzle is connected to the air intake pipe of the centrifugal fan.

[0010] Furthermore, the cover plate is hinged to the base, and the axial flow fan is fixedly connected to the air guide box.

[0011] Compared with the prior art, the beneficial effects of this utility model are: 1. This utility model, through the setting of a lifting box and an electric push rod, enables the electric push rod to push the lifting box up and down, thereby adjusting the distance between the lifting box and the lower side of the PCB board, so as to ensure the cooling effect.

[0012] 2. This utility model, through the design of the upper and lower flat air outlets, allows the air to be squeezed out from the upper and lower flat air outlets during air cooling, so that the upper and lower surfaces of the PCB board are evenly covered and blown by the air cooling air, ensuring the air cooling effect. Attached Figure Description

[0013] Fig. 1 This is a schematic diagram of the main structure of this utility model; Fig. 2 This is a side view of the lifting box in this utility model. Fig. 3 This is a schematic diagram of the main structure of the lifting box in this utility model.

[0014] In the diagram: 1. Base; 2. Cover plate; 3. Axial flow fan; 4. Air guide box; 5. Centrifugal fan; 6. Exhaust pipe; 7. Intake nozzle; 8. Upper exhaust nozzle; 9. Lower exhaust nozzle; 10. Lifting box; 11. Inlet pipe; 12. Electric push rod; 13. Semiconductor cooling plate. Detailed Implementation

[0015] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0016] Please see Figs. 1-3 This embodiment provides a technical solution: a cooling mechanism for vacuum reflow soldering, including a cover plate 2, with upper flat nozzles 8 evenly spaced on the inner top side of the cover plate 2, a base 1 on the lower side of the cover plate 2, a lifting box 10 on the inner side of the base 1, lower flat nozzles 9 evenly spaced on the upper side of the lifting box 10, a semiconductor cooling plate 13 on the lower side of the lifting box 10, and electric push rods 12 at the four corners of the lower side of the lifting box 10.

[0017] like Figs. 1-3As shown, after the PCB board is heated and soldered, it is moved to the upper side of the base 1 via the conveyor rail. The electric push rod 12 can adjust the height of the lifting box 10, so that the distance between the lifting box 10 and the PCB board can be adjusted, and the distance between the lower air outlet nozzle 9 on the lifting box 10 and the PCB board can meet the requirements, thereby ensuring the air cooling effect on the lower side of the PCB board. The upper air outlet nozzle 8 and the lower air outlet nozzle 9 can blow the air-cooled air evenly on the upper and lower sides of the PCB board to ensure the air cooling effect. The air inlet pipe 11 is connected to the air pump, and the pressurized air is blown into the upper side of the semiconductor cooling plate 13 through the air inlet pipe 11. After being cooled, it is blown upward through the lower air outlet nozzle 9. The axial flow fan 3 can blow the air into the air guide box 4 and blow it downward through the upper air outlet nozzle 9, blowing it onto the upper side of the PCB board, so that both the upper and lower sides of the PCB board are air-cooled. The centrifugal fan 5 can draw out the air-cooled hot air through the suction nozzle 7 and discharge it through the exhaust pipe 6.

[0018] An air guide box 4 is provided on the upper side of the cover plate 2, and an axial flow fan 3 is installed on the side of the air guide box 4.

[0019] A centrifugal fan 5 is installed on the side of the air guide box 4 away from the axial fan 3, and an exhaust pipe 6 is installed on the outside of the centrifugal fan 5.

[0020] The side of the lifting box 10 is connected to the air inlet pipe 11 via a corrugated hose, and the side of the air outlet flat nozzle 8 is provided with an air intake flat nozzle 7.

[0021] The upper flat nozzle 8 for air outlet is connected to the inside of the air guide box 4, and the flat nozzle 7 for air intake is connected to the air intake pipe of the centrifugal fan 5.

[0022] The cover plate 2 is hinged to the base 1, and the axial flow fan 3 is fixedly connected to the air guide box 4.

[0023] The working principle of the cooling mechanism for vacuum reflow soldering provided by this utility model is as follows: Figs. 1-3 As shown, after the PCB board is heated and soldered, it is moved to the upper side of the base 1 via the conveyor rail. The electric push rod 12 can adjust the height of the lifting box 10, so that the distance between the lifting box 10 and the PCB board can be adjusted, and the distance between the lower air outlet nozzle 9 on the lifting box 10 and the PCB board can meet the requirements, thereby ensuring the air cooling effect on the lower side of the PCB board. The upper air outlet nozzle 8 and the lower air outlet nozzle 9 can blow the air-cooled air evenly on the upper and lower sides of the PCB board to ensure the air cooling effect. The air inlet pipe 11 is connected to the air pump, and the pressurized air is blown into the upper side of the semiconductor cooling plate 13 through the air inlet pipe 11. After being cooled, it is blown upward through the lower air outlet nozzle 9. The axial flow fan 3 can blow the air into the air guide box 4 and blow it downward through the upper air outlet nozzle 9, blowing it onto the upper side of the PCB board, so that both the upper and lower sides of the PCB board are air-cooled. The centrifugal fan 5 can draw out the air-cooled hot air through the suction nozzle 7 and discharge it through the exhaust pipe 6.

[0024] The above description is merely an embodiment of this utility model and does not limit the patent scope of this utility model. Any equivalent structural or procedural transformations made based on the content of this utility model specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this utility model.

Claims

1. A cooling mechanism for vacuum reflow soldering, comprising a cover plate (2), characterized in that: The cover plate (2) has an upper flat nozzle (8) with equal spacing on the inner top side. The cover plate (2) has a base (1) on the lower side. The base (1) has a lifting box (10) on the inner side. The lifting box (10) has a lower flat nozzle (9) with equal spacing on the upper side. The lifting box (10) has a semiconductor cooling plate (13) on the lower side. The lifting box (10) has electric push rods (12) at the four corners of the lower side.

2. The cooling mechanism for vacuum reflow soldering according to claim 1, characterized in that: An air guide box (4) is provided on the upper side of the cover plate (2), and an axial flow fan (3) is installed on the side of the air guide box (4).

3. The cooling mechanism for vacuum reflow soldering according to claim 2, characterized in that: A centrifugal fan (5) is provided on the side of the air guide box (4) away from the axial flow fan (3), and an exhaust pipe (6) is installed on the outside of the centrifugal fan (5).

4. The cooling mechanism for vacuum reflow soldering according to claim 1, characterized in that: The side of the lifting box (10) is connected to the air inlet pipe (11) via a corrugated hose, and the side of the air outlet flat nozzle (8) is provided with an air inlet nozzle (7).

5. The cooling mechanism for vacuum reflow soldering according to claim 3, characterized in that: The upper flat nozzle (8) for air outlet is connected to the inner side of the air guide box (4), and the flat nozzle for air intake (7) is connected to the air intake pipe of the centrifugal fan (5).

6. The cooling mechanism for vacuum reflow soldering according to claim 2, characterized in that: The cover plate (2) is hinged to the base (1), and the axial flow fan (3) is fixedly connected to the air guide box (4).

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