A circuit board repair welding device
Patent Information
- Application Number
- CN202522389315.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-11-11
- Publication Date
- 2026-09-18
- Estimated Expiration
- 2035-11-11
AI Technical Summary
如此在焊接一个元器件的引脚时,其他已插好但未焊接的元器件容易因重力或意外碰触而松动、歪斜甚至脱落
[0006]Therefore, this device allows operators to first insert all electronic components onto the circuit board, then clamp and secure them all at once using a pressure plate, and finally flip it over for soldering. This process simplifies complex "cooperative operations" into sequential "batch operations," greatly improving assembly and soldering efficiency, especially suitable for circuit boards with multiple pins and components. Furthermore, the sliding adjustable support plate allows the device to support circuit boards of different sizes.
Smart Images

Figure CN224764478U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of circuit board auxiliary processing, and more specifically, to a circuit board repair and welding device. Background Technology
[0002] In the research, development, production, and repair of electronic products, soldering components onto printed circuit boards (PCBs) is a fundamental and crucial task. For through-hole components, the traditional soldering method typically involves the operator first threading the component's leads through the PCB's pad holes, then roughly securing it by hand or with simple tools. Next, the PCB is flipped so the leads are facing upwards before soldering. This process is problematic because while soldering one component's lead, other inserted but unsoldered components are prone to loosening, tilting, or even falling off due to gravity or accidental contact. Furthermore, during soldering, one hand must hold the soldering iron, and the other must feed the solder wire, making it difficult to free up a hand to stabilize the PCB, resulting in inconvenient soldering. Utility Model Content
[0003] In view of this, the present invention provides a circuit board repair and soldering device.
[0004] The objective of this utility model is achieved through the following technical solution: A circuit board repair and soldering device, comprising: A base, on which two support blocks are spaced apart; A flip-up support plate is rotatably disposed between the two support blocks; the flip-up support plate has an operating hole, and the inner periphery of the operating hole has an annular protrusion for supporting the circuit board; The adjustable support plate is slidably locked onto the flip support plate, and the two opposite sides of the adjustable support plate are provided with protruding strips that are flush with the annular protruding edge; A pressure plate is rotatably connected to the tilting support plate, and a floating plate is movably connected to the pressure plate. The floating plate is located on the side of the pressure plate facing the adjusting support plate, and the distance between the floating plate and the pressure plate is adjustable. A limiting post is provided on the base and is used to abut against the side of the flip support plate away from the floating plate when the flip support plate is rotated to a predetermined position.
[0005] In the above technical solution, when the device is in use, the circuit board can be supported by the annular protrusion on the inner periphery of the operating hole and the protrusions on the opposite sides of the adjusting support plate. Then, the electronic components are inserted into the circuit board, the pressure plate is flipped and the floating plate is pressed onto the circuit board or electronic components. Then, the support plate can be rotated so that the side with the electronic component pins faces upward, which makes it convenient for the operator to solder the electronic components.
[0006] Therefore, this device allows operators to first insert all electronic components onto the circuit board, then clamp and secure them all at once using a pressure plate, and finally flip it over for soldering. This process simplifies complex "cooperative operations" into sequential "batch operations," greatly improving assembly and soldering efficiency, especially suitable for circuit boards with multiple pins and components. Furthermore, the sliding adjustable support plate allows the device to support circuit boards of different sizes.
[0007] Before soldering, the circuit board and all components are firmly locked together as a whole by the pressure plate and floating plate, which completely eliminates problems such as poor soldering and misalignment caused by loose, detached or displaced components during the soldering process. The soldering quality is significantly improved and the rework rate is greatly reduced.
[0008] Optionally, in one possible implementation, the flip support plate has two sliding grooves, which are located on opposite sides of the operating hole. The two ends of the adjusting support plate are respectively connected to first sliding columns, and the two first sliding columns are slidably engaged in the two sliding grooves.
[0009] In the above technical solution, the cooperation between the sliding groove and the first sliding column provides a precise guide trajectory for the movement of the adjusting support plate. This design ensures that the adjusting support plate always moves in a straight line during the adjustment process without deviation or jamming, thus enabling it to accurately and reliably adapt to circuit boards of different sizes.
[0010] Optionally, in one possible implementation, both ends of the adjusting support plate are provided with a first support portion that abuts against the flip support plate and a second support portion that abuts against the annular protrusion, and the first sliding column is disposed on the first support portion.
[0011] In the above technical solution, the first support part abuts against the body of the flip-up support plate, and the second support part abuts against the annular protrusion, thus providing the adjusting support plate with dual support in the height direction from the flip-up support plate and the annular protrusion. This forms a stable two-stage support structure, effectively reducing bending, deformation, or resonance of the adjusting support plate when under load or compression, and improving the flatness of the entire support plane.
[0012] Optionally, in one possible implementation, a support rod is further provided parallel to the adjusting support plate. The two ends of the support rod are respectively movably engaged with the rotating support plate via a slider. The slider is connected to a second sliding column, and the two second sliding columns are respectively slidably engaged in the two sliding grooves.
[0013] In the above technical solutions, for circuit boards that are large or thin, when supported only by the edges (annular flanges and ridges), the central area may experience slight downward bending due to its own weight or pressure under compression or operation. The support rod provides a crucial central support point, transforming the suspended area into an effective support zone and ensuring the circuit board remains flat throughout the process.
[0014] Optionally, in one possible implementation, the floating plate is provided with a plurality of threaded guide posts on the side near the pressure plate, the plurality of threaded guide posts being movably inserted through the pressure plate, and a locking collar is threadedly connected to the threaded guide posts, the locking collar being located on the side of the pressure plate away from the floating plate.
[0015] In the above technical solution, by rotating the locking collar, the operator can precisely control the distance between the floating plate and the pressure plate, thereby "presetting" for components with different height ranges. Once adjusted, the locking collar can firmly lock the distance through the self-locking effect of the threads, preventing loosening due to vibration during clamping or use, and ensuring stable and consistent clamping force.
[0016] Alternatively, in one possible implementation, a flexible protective layer is provided on the side of the floating plate away from the pressure plate.
[0017] In the above technical solution, the flexible protective layer forms a soft buffer interface between the rigid floating plate and the fragile electronic components. It effectively prevents scratches on the surface of the components or damage to the printed screen printing on the circuit board during the clamping process.
[0018] Optionally, in one possible implementation, a fixing block is provided on the flip support plate, the fixing block being close to the edge of the flip support plate, and the pressure plate being rotatably connected to the fixing block via multiple hinges.
[0019] In the above technical solution, multiple hinges can withstand the stress caused by repeated opening and closing, effectively preventing the pressure plate from shaking due to loosening or deformation of the pivot after long-term use, ensuring that the pressure plate can accurately cover the predetermined position each time, and guaranteeing the repeatability of clamping accuracy.
[0020] Optionally, in one possible implementation, the support block is provided with a stepped surface, and the flip-up support plate is provided with an extension that can abut against the stepped surface.
[0021] In the above technical solution, the stepped surface and the extension together constitute a rigid mechanical limit. When the flip support plate is rotated to a horizontal position or other predetermined working angle, the extension will abut tightly against the stepped surface, thereby accurately determining and locking the position of the flip support plate, thus facilitating the operator's assembly of electronic components.
[0022] Optionally, in one possible implementation, two connecting blocks are spaced apart on the flip support plate, and the two connecting blocks are rotatably connected to the two support blocks via rotating shafts.
[0023] In the above technical solution, two connecting blocks cooperate with the rotating shaft to establish symmetrical and concentric rotation centers at both ends of the tilting support plate. This structure ensures that the tilting support plate rotates smoothly and steadily without jamming or shaking, providing a reliable mechanical basis for the frequent tilting operation of the device. Attached Figure Description
[0024] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.
[0025] Figure 1 This is a schematic diagram of the overall structure of one embodiment.
[0026] Figure 2 This is a partial structural schematic diagram of an embodiment of the adjusting support plate.
[0027] Figure 3 This is a schematic diagram showing the connection between the pressure plate and the floating plate in one embodiment.
[0028] Figure 4 This is a partial structural schematic diagram of one embodiment.
[0029] Reference numerals: 1-base; 11-limiting post; 2-support block; 21-step surface; 22-rotating shaft; 3-flipping support plate; 31-operating hole; 32-annular protrusion; 33-slide groove; 4-adjusting support plate; 41-protrusion; 42-first slide column; 43-first support part; 44-second support part; 5-pressure plate; 6-floating plate; 61-threaded guide post; 62-locking collar; 63-flexible protective layer; 7-support rod; 71-slider; 72-second slide column; 8-fixing block; 81-hinge. Detailed Implementation
[0030] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. The components of the embodiments of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.
[0031] Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely to illustrate selected embodiments of the application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.
[0032] Please refer to Figure 1 and Figure 4 This embodiment provides a circuit board repair and soldering device, including: a base 1, a flipping support plate 3, an adjusting support plate 4, a pressure plate 5, and a limiting post 11; two support blocks 2 are spaced apart on the base 1; the flipping support plate 3 is rotatably disposed between the two support blocks 2; the flipping support plate 3 has an operating hole 31, and the inner periphery of the operating hole 31 has an annular protrusion 32 for supporting the circuit board; the adjusting support plate 4 is slidably engaged with the flipping support plate 3, and the opposite sides of the adjusting support plate 4 have protrusions 41 flush with the annular protrusion 32; the pressure plate 5 is rotatably connected to the flipping support plate 3, and the pressure plate 5 is movably connected to a floating plate 6, the floating plate 6 is located on the side of the pressure plate 5 facing the adjusting support plate 4, and the distance between the floating plate 6 and the pressure plate 5 is adjustable; the limiting post 11 is disposed on the base 1, and is used to abut against the side of the flipping support plate 3 away from the floating plate 6 when the flipping support plate 3 is rotated to a predetermined position. The limiting post 11 is a telescopic structure, so that the angle of the flipping support plate 3 after flipping can be adaptively adjusted according to the operator's habits.
[0033] In use, the device of this embodiment can support the circuit board through the annular protrusion 32 on the inner periphery of the operating hole 31 and the protrusions 41 on opposite sides of the adjusting support plate 4. Then, the electronic components are inserted into the circuit board, the pressure plate 5 is flipped and the floating plate 6 is pressed onto the circuit board or electronic components. After the position of the floating plate 6 relative to the circuit board is fixed, the relative position between the floating plate 6 and the pressure plate 5 is locked. Then, the support plate 3 can be rotated so that the side with the electronic component pins faces upward, which makes it convenient for the operator to solder the electronic components.
[0034] Therefore, this device allows operators to first insert all electronic components onto the circuit board, then clamp and secure them all at once using the pressure plate 5, and finally flip them over for soldering. This process simplifies complex "cooperative operations" into sequential "batch operations," greatly improving assembly and soldering efficiency, especially suitable for circuit boards with multiple pins and components. Furthermore, the sliding adjustable support plate 4 allows the device to support circuit boards of different sizes. The floating plate 6 is designed to adapt to the height differences of components on the circuit board surface, achieving uniform and flexible clamping. While providing sufficient fixing force, it effectively avoids the risk of damaging or crushing precision or tall components (such as electrolytic capacitors and plastic interfaces).
[0035] Before soldering, the circuit board and all components are firmly locked together as a whole by the pressure plate 5 and the floating plate 6, which completely eliminates problems such as poor soldering and misalignment caused by loose, detached or displaced components during the soldering process. The soldering quality is significantly improved and the rework rate is greatly reduced.
[0036] After flipping, the solder joints (component pin faces) are facing upwards, allowing operators to perform soldering from the most natural and comfortable overhead angle. With an unobstructed view and stable hand support, operators can clearly observe the fusion of the pads and pins, easily completing solder feeding and soldering operations.
[0037] In this embodiment, the tilting support plate 3 has two annular grooves 33, which are located on opposite sides of the operating hole 31. The two ends of the adjusting support plate 4 are connected to first sliding posts 42, which are slidably engaged within the two annular grooves 33. The first sliding posts 42 are fixed to the tilting support plate 3 and penetrate through it, ensuring that the tilting support plate 3 and the first sliding posts 42 move synchronously.
[0038] By setting the annular groove 33 to cooperate with the first sliding column 42, a precise guide trajectory is provided for the movement of the adjusting support plate 4. This design ensures that the adjusting support plate 4 always moves in a straight line during the adjustment process without deviation or jamming, thus enabling it to accurately and reliably adapt to circuit boards of different sizes.
[0039] Two annular grooves 33 are located on opposite sides of the operating hole 31. This symmetrical layout ensures that the adjusting support plate 4 receives uniform support at both ends when supporting the circuit board. When the circuit board is pressed or the device is flipped, this structure can effectively resist torque and prevent the adjusting support plate 4 from deforming or loosening due to uneven force, thus ensuring the rigidity and stability of the entire clamping system.
[0040] Please refer to Figure 2 In this embodiment, both ends of the adjusting support plate 4 are provided with a first support portion 43 that abuts against the flip support plate 3 and a second support portion 44 that abuts against the annular protrusion 32, and the first sliding column 42 is disposed on the first support portion 43. Specifically, the first support portion 43 and the second support portion 44 have a stepped structure.
[0041] With the first support part 43 abutting against the body of the flip-up support plate 3, and the second support part 44 abutting against the annular protrusion 32, the adjusting support plate 4 receives dual support in the height direction from the flip-up support plate 3 and the annular protrusion 32. This forms a stable secondary support structure, effectively reducing the bending, deformation, or resonance of the adjusting support plate 4 when under load or compression, and improving the flatness of the entire support plane.
[0042] This embodiment also includes a support rod 7 arranged parallel to the adjusting support plate 4. Both ends of the support rod 7 are movably engaged with the rotating support plate via a slider 71. The slider 71 is connected to a second sliding post 72, and the two second sliding posts 72 are slidably engaged within two annular grooves 33. The slider 71 is provided with a C-shaped groove, which directly engages with the tilting support plate 3, such that the two top surfaces inside the C-shaped groove contact the upper and lower surfaces of the tilting support plate 3, respectively.
[0043] Understandably, for larger or thinner circuit boards, when supported only by the perimeter edges (annular flanges 32 and ridges 41), the central region may experience slight downward bending due to its own weight or pressure under compression or operation. The support rod 7 provides a crucial central support point, transforming the suspended area into an effective support zone and ensuring the circuit board remains flat throughout the process.
[0044] Furthermore, the support rod 7 slides independently of the adjusting support plate 4 via the slider 71 and the second sliding column 72, meaning its position can be flexibly adjusted according to the specific component layout on the circuit board. The operator can precisely slide it under an open area without tall components, thus providing support while perfectly avoiding existing components or solder joints on the bottom of the board, achieving a balance between support and avoidance.
[0045] Please refer to Figure 3 In this embodiment, multiple threaded guide posts 61 are provided on the side of the floating plate 6 near the pressure plate 5. The multiple threaded guide posts 61 are movably inserted through the pressure plate 5. A locking collar 62 is threadedly connected to the threaded guide post 61. The locking collar 62 is located on the side of the pressure plate 5 away from the floating plate 6.
[0046] By rotating the locking collar 62, the operator can precisely control the distance between the floating plate 6 and the pressure plate 5, thereby "presetting" for components with different height ranges. Once adjusted, the locking collar 62 can firmly lock the distance through the self-locking effect of the thread, preventing loosening due to vibration during clamping or use, and ensuring stable and consistent clamping force.
[0047] It should be noted that the floating plate 6 and the pressure plate 5 are connected by the threaded guide post 61. In the initial state, the floating plate 6 can be moved relative to the pressure plate 5 by adjusting the position of the locking collar 62. In this state, when the pressure plate 5 is flipped, the floating plate 6 first contacts the electronic components on the circuit board. Since the electronic components protrude from the surface of the circuit board, they will squeeze the floating plate 6 to make it rise. When the floating plate 6 is fully covered, it will automatically move to a position that adapts to the height of the electronic components. At this time, the locking collar 62 can be adjusted to fit the floating plate 6 to fix the circuit board.
[0048] In this embodiment, a flexible protective layer 63 is provided on the side of the floating plate 6 away from the pressure plate 5. The flexible protective layer 63 (such as silicone, rubber, or soft foam) forms a soft buffer interface between the rigid floating plate 6 and the fragile electronic components. It effectively prevents scratches on the surface of components (such as chip packaging, plastic shells) or damage to the printed screen printing on the circuit board during the pressing process.
[0049] Secondly, flexible materials have the ability to deform slightly, allowing them to better conform to the top contours of irregularly shaped components. Whether it's a cylindrical capacitor or a sloping heat sink, the protective layer can adaptively adjust the contact surface to distribute the clamping force more evenly, avoiding point stress or line stress concentration, thus more effectively protecting components of various shapes.
[0050] In this embodiment, a fixing block 8 is provided on the flip support plate 3. The fixing block 8 is close to the edge of the flip support plate 3, and the pressure plate 5 is rotatably connected to the fixing block 8 through multiple hinges 81.
[0051] Multiple hinges 81 can withstand the stress caused by repeated opening and closing, effectively preventing the pressure plate 5 from shaking due to loosening or deformation of the pivot 22 after long-term use. This ensures that the pressure plate 5 can accurately cover the predetermined position each time, guaranteeing the repeatability of clamping. In addition, the fixing block 8 can increase the thickness of the flip support plate 3, giving the floating plate 6 and the pressure plate 5 sufficient rotation space. On the other hand, as an independent reinforcing structure, the fixing block 8 firmly transfers the force points of the hinges 81 to the main body of the flip support plate 3, avoiding the direct installation of the hinges 81 on the relatively weak edge of the flip support plate 3, thus enhancing the overall rigidity and fatigue resistance of the rotating connection.
[0052] Please refer to Figure 4 In this embodiment, the support block 2 is provided with a stepped surface 21, and the flip support plate 3 is provided with an extension, which can abut against the stepped surface 21.
[0053] The stepped surface 21 and the extension together form a rigid mechanical limit. When the flip support plate 3 is rotated to a horizontal position or other predetermined working angle, the extension will abut tightly against the stepped surface 21, thereby accurately determining and locking the position of the flip support plate 3, thus facilitating the operator's assembly of electronic components.
[0054] It should be noted that two connecting blocks (not shown in the figure) are spaced apart on the flip support plate 3. The two connecting blocks are rotatably connected to the two support blocks 2 through the rotating shaft 22.
[0055] By using two connecting blocks in conjunction with the rotating shaft 22, symmetrical and concentric centers of rotation are established at both ends of the tilting support plate 3. This structure ensures that the tilting support plate 3 rotates smoothly and steadily without jamming or wobbling, providing a reliable mechanical basis for the frequent tilting operation of the device.
[0056] In the description of this utility model, it should be understood that terms such as "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", and "outer" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.
[0057] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this utility model, "a plurality of" means two or more, unless otherwise explicitly specified.
[0058] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.
Claims
1. A circuit board repair welding apparatus characterized by comprising: include: A base, on which two support blocks are spaced apart; A flip-up support plate is rotatably disposed between the two support blocks; the flip-up support plate has an operating hole, and the inner periphery of the operating hole has an annular protrusion for supporting the circuit board; The adjustable support plate is slidably locked onto the flip support plate, and the two opposite sides of the adjustable support plate are provided with protruding strips that are flush with the annular protruding edge; A pressure plate is rotatably connected to the tilting support plate, and a floating plate is movably connected to the pressure plate. The floating plate is located on the side of the pressure plate facing the adjusting support plate, and the distance between the floating plate and the pressure plate is adjustable. A limiting post is provided on the base and is used to abut against the side of the flip support plate away from the floating plate when the flip support plate is rotated to a predetermined position.
2. The circuit board repair welding apparatus of claim 1, wherein The flip support plate has two sliding grooves, which are located on opposite sides of the operating hole. The two ends of the adjustment support plate are connected to first sliding columns, and the two first sliding columns are slidably locked in the two sliding grooves.
3. The circuit board repair welding apparatus of claim 2, wherein Both ends of the adjusting support plate are provided with a first support portion that abuts against the flip support plate and a second support portion that abuts against the annular protrusion. The first sliding column is disposed on the first support portion.
4. The circuit board repair welding apparatus of claim 1, wherein It also includes a support rod arranged parallel to the adjusting support plate. The two ends of the support rod are respectively movably locked to the rotating support plate by a slider. The slider is connected to a second sliding column, and the two second sliding columns are respectively slidably locked in the two sliding grooves.
5. The circuit board repair welding apparatus of claim 1, wherein The floating plate is provided with multiple threaded guide posts on the side near the pressure plate. The multiple threaded guide posts are movably inserted through the pressure plate. Locking collars are threadedly connected to the threaded guide posts. The locking collars are located on the side of the pressure plate away from the floating plate.
6. The circuit board repair welding apparatus of claim 1, wherein A flexible protective layer is provided on the side of the floating plate away from the pressure plate.
7. The circuit board repair welding apparatus of claim 1, wherein A fixing block is provided on the flip support plate, the fixing block is close to the edge of the flip support plate, and the pressure plate is rotatably connected to the fixing block through multiple hinges.
8. The circuit board repair welding apparatus of claim 1, wherein, The support block is provided with a stepped surface, and the flip support plate is provided with an extension, which can abut against the stepped surface.
9. The circuit board repair welding apparatus of claim 1, wherein, Two connecting blocks are spaced apart on the flip support plate, and the two connecting blocks are rotatably connected to the two support blocks through rotating shafts.