Nitrogen blowing device for chip thermal compression bonding machine and chip thermal compression bonding machine

Abstract

This utility model relates to the field of thermocompression welding, specifically to a nitrogen purging device for a chip thermocompression welding machine and the chip thermocompression welding machine itself. The nitrogen purging device for the chip thermocompression welding machine includes a support frame, a hollow shaft mounted on the support frame, and a nozzle assembly mounted at the end of the hollow shaft. The nitrogen purging device includes a chamber section and a enclosure section. The chamber section is mounted on the support frame and has a nitrogen chamber and a nitrogen inlet connected to the nitrogen chamber. At least one nitrogen outlet connected to the nitrogen chamber is located facing the nozzle assembly end. The enclosure section connects to the chamber section, surrounds the connection point between the hollow shaft and the nozzle assembly with a gap, and extends beyond the nitrogen outlet towards the nozzle assembly side. The nitrogen outlet is located within the space enclosed by the enclosure section. This utility model can purge nitrogen into the welding area while cooling the nozzle assembly, thereby improving the overall operating accuracy of the chip thermocompression welding machine and enhancing the welding quality.

Description

Technical Field

[0001] This utility model relates to the field of hot press welding, specifically to a nitrogen purging device for a chip hot press welding machine and the chip hot press welding machine. Background Technology

[0002] Chip hot press welding machines are key equipment in advanced packaging and micro-assembly processes. Their basic principle is to use a precision lifting mechanism (such as an electric cylinder or servo motor) to drive the nozzle assembly, pick up the chip, and precisely press it onto the corresponding pad on the circuit board that has been coated with solder paste. The heating plate on the nozzle assembly locally heats the chip and pad area, causing the solder paste to melt, reflow, and finally cool and solidify, thereby achieving a stable electrical and mechanical connection between the chip and the circuit board.

[0003] In existing thermoforming welding equipment, the nozzle assembly typically employs a multi-layered structure, mainly comprising an adsorption mechanism for adsorbing the chip, a heating plate for heating, and a heat insulation plate located above the heating plate. The core function of the heat insulation plate is to prevent the high temperature generated by the heating plate from being conducted to the moving parts above the equipment, thus protecting these delicate components.

[0004] However, in practical applications, it has been found that despite the installation of heat insulation panels, heat inevitably rises due to various heat transfer pathways such as heat conduction and radiation. This "heat transfer" affects the equipment's motion accuracy and lifespan: During prolonged operation in high-temperature environments, heat gradually accumulates and is conducted to the hollow shaft, electric cylinder, and precision pneumatic components (such as vacuum generators and solenoid valves) connected to the nozzle assembly. Under continuous thermal load, these core moving and gas components may experience thermal expansion, material degradation, or lubrication failure, leading to decreased motion accuracy, sluggish response, and even shortened lifespan, directly impacting production yield and equipment stability.

[0005] Furthermore, in traditional hot press soldering machines, to prevent oxidation and improve soldering quality, a protective gas (such as nitrogen) is typically purged into the soldering area during the heating process. This protective gas needs to be delivered to the nozzle through a channel inside the hollow shaft. However, due to the aforementioned "heat transfer" problem, the channel through which the gas flows is preheated, causing the temperature of the protective gas to rise significantly before reaching the solder joint. The high-temperature protective gas reduces its protective effectiveness, not only failing to effectively isolate oxygen but also potentially exacerbating the oxidation reaction of the solder paste at high temperatures. This results in a rough solder joint surface, the appearance of slag, and the formation of cold or incomplete solder joints, severely degrading the reliability and consistency of the soldering process.

[0006] Therefore, it is urgent to solve the above-mentioned technical problems. Summary of the Invention

[0007] The technical problem to be solved by this utility model is to overcome the defects of the prior art and provide a nitrogen purging device for a chip hot press welding machine. It can purge nitrogen into the welding area while cooling the nozzle assembly, thereby improving the operating accuracy of the entire chip hot press welding machine and improving the welding quality.

[0008] To solve the above-mentioned technical problems, the technical solution of this utility model is as follows: a chip hot-press welding machine includes a bracket, a hollow shaft mounted on the bracket, and a suction nozzle assembly mounted on the end of the hollow shaft; the nitrogen purging device for the chip hot-press welding machine includes: The chamber section is mounted on the bracket and is provided with a nitrogen chamber and a nitrogen inlet communicating with the nitrogen chamber, and is provided with at least one nitrogen outlet communicating with the nitrogen chamber facing the nozzle assembly end; The enclosure portion connects to the chamber portion, surrounds the hollow shaft and the nozzle assembly at the connection position with a gap, and extends beyond the nitrogen outlet toward the nozzle assembly side. The nitrogen outlet is located within the space enclosed by the enclosure portion.

[0009] Furthermore, the nitrogen chamber is arranged in a circle around the hollow shaft, and at least two nitrogen outlets are provided along the circumference of the nitrogen chamber.

[0010] Furthermore, the chamber includes two fastening members. The end faces of the two fastening members that fasten each other are respectively provided with annular grooves, or the end face of one fastening member facing the other fastening member is provided with annular grooves. After the two fastening members fasten each other, the annular grooves form the nitrogen chamber.

[0011] Furthermore, the enclosure portion is integrally formed with the fastening component located nearby.

[0012] Furthermore, in order to allow nitrogen gas to reach the substrate without obstruction, the nozzle assembly provides unobstructed access to the nitrogen outlet along the axial direction of the hollow shaft.

[0013] Furthermore, to enable nitrogen gas to better assist in heat dissipation, the nozzle assembly includes: An adsorption mechanism, connected to the end of the hollow shaft, is used for vacuum adsorption of chips; A heating plate is attached to the end face of the adsorption mechanism away from the adsorption surface, and is used to heat the adsorption mechanism. A connecting sleeve is fitted onto the side of the heating plate away from the adsorption mechanism; A heat insulation plate is installed inside the connecting sleeve, with a gap between it and the heating plate; wherein, The connecting sleeve has multiple heat dissipation holes positioned opposite the heat insulation plate and opposite the interval, respectively.

[0014] Furthermore, the enclosure portion extends beyond the heat insulation plate and away from the heating plate on the side facing the suction nozzle assembly.

[0015] Furthermore, to prevent nitrogen from affecting the heating of the adsorption mechanism by the heating plate, the enclosure portion does not extend beyond the end of the heat insulation plate closest to the heating plate.

[0016] Furthermore, some of the heat dissipation holes are directly opposite the enclosure.

[0017] This utility model also relates to a chip hot press welding machine, including a nitrogen purging device for the chip hot press welding machine. By adopting the above technical solution, this utility model has the following beneficial effects: 1. Low-temperature nitrogen enters the nitrogen chamber through the nitrogen inlet and exits through the nitrogen outlet. It gathers under the enclosure of the baffle, thereby cooling the part where the hollow shaft connects to the nozzle assembly. This prevents the heat from the nozzle assembly from being transferred to the hollow shaft, electric cylinder, and precision pneumatic components (such as vacuum generators and solenoid valves). This avoids problems such as thermal expansion, material degradation, or lubrication failure in these core components under continuous heat load, which could lead to decreased motion accuracy and slow response. This ensures that the hollow shaft, electric cylinder, etc., maintain their motion accuracy and extend the life of the chip hot press welding machine.

[0018] 2. A portion of the low-temperature nitrogen gas exiting the nitrogen outlet directly reaches the soldering area, effectively isolating oxygen and providing gas protection for the soldering area. This prevents the solder paste from oxidizing at high temperatures and also eliminates the increased equipment complexity caused by the purging of protective gas in traditional hot press soldering machines. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the nitrogen purging device of the present invention applied to a chip hot press welding machine. Figure 2 for Figure 1 A sectional view; Figure 3 This is a schematic diagram of the nitrogen purging device for a chip hot press welding machine according to the present invention; Figure 4 for Figure 3 Exploded view; In the picture: 10. Hollow shaft; 20. Suction nozzle assembly; 201. Adsorption mechanism; 202. Heating plate; 203. Connecting sleeve; 2031. Heat dissipation hole; 204. Heat insulation plate; 1. Chamber section; 11. Nitrogen chamber; 12. Nitrogen inlet; 13. Nitrogen outlet; 1a. Fastening element; 11a. Annular groove; 2. Enclosure section. Detailed Implementation

[0020] To make the contents of this utility model easier to understand, the present utility model will be further described in detail below with reference to specific embodiments and accompanying drawings.

[0021] like Figures 1 to 4 As shown, a nitrogen purging device for a chip thermoforming machine is disclosed. The chip thermoforming machine includes a support, a hollow shaft 10 mounted on the support, and a suction nozzle assembly 20 mounted on the end of the hollow shaft 10. The nitrogen purging device includes: The chamber 1 is mounted on a bracket and is provided with a nitrogen chamber 11 and a nitrogen inlet 12 communicating with the nitrogen chamber 11, and is provided with at least one nitrogen outlet 13 communicating with the nitrogen chamber 11 facing the nozzle assembly 20 end. The enclosure 2 connects to the chamber 1, surrounds the hollow shaft 10 and the nozzle assembly 20 at the connection point with each other through a gap, and extends beyond the nitrogen outlet 13 toward the nozzle assembly 20. The nitrogen outlet 13 is located within the space enclosed by the enclosure 2.

[0022] Specifically, low-temperature nitrogen enters the nitrogen chamber 11 from the nitrogen inlet 12 and exits from the nitrogen outlet 13. It gathers under the enclosure of the enclosure 2, thereby cooling the part where the hollow shaft 12 is connected to the nozzle assembly 20. This prevents the heat from the nozzle assembly 20 from being transferred to the hollow shaft 10, electric cylinder, and precision pneumatic components (such as vacuum generators, solenoid valves, etc.). This prevents these core components from experiencing problems such as thermal expansion, material performance degradation, or lubrication failure under continuous heat load, which would lead to a decrease in their motion accuracy and slow response. As a result, the hollow shaft, electric cylinder, etc., can maintain their motion accuracy and extend the life of the chip hot press welding machine.

[0023] Furthermore, a portion of the low-temperature nitrogen gas exiting from nitrogen outlet 13 directly reaches the soldering area, effectively isolating oxygen and providing gas protection for the soldering area. This prevents the solder paste from undergoing oxidation at high temperatures and also eliminates the increased equipment complexity caused by purging protective gas in traditional hot press soldering machines.

[0024] In some examples, such as Figures 1 to 4 As shown, the nitrogen chamber 11 is arranged in a circle around the hollow shaft 10, and at least two nitrogen outlets 13 are provided along the circumference of the nitrogen chamber 11. The nitrogen outlet 13 can also be a closed-loop groove facing the nozzle assembly 20 end of the chamber portion 1.

[0025] In some examples, such as Figures 1 to 4 As shown, the chamber 1 includes two fastening members 1a. The end faces of the two fastening members 1a that fasten each other are respectively provided with annular grooves 11a, or the end face of one of the fastening members 1a facing the other fastening member 1a is provided with annular grooves 11a. After the two fastening members 1a fasten each other, the annular grooves 11a form a nitrogen chamber 11.

[0026] Preferably, the enclosure part 2 is integrally formed with the fastening part 1a located nearby.

[0027] In some examples, such as Figure 2 As shown, along the axial direction of the hollow shaft 10, the nozzle assembly 20 does not obstruct the nitrogen outlet 13.

[0028] In this way, the low-temperature nitrogen gas coming out of nitrogen outlet 13 can reach the substrate more quickly, providing better nitrogen protection for the chip hot-press welding process and preventing oxidation.

[0029] In some examples, such as Figure 1 and Figure 2 As shown, the nozzle assembly 20 includes: The adsorption mechanism 201 is connected to the end of the hollow shaft 10 and is used for vacuum adsorption of the chip; Heating plate 202 is attached to the end face of adsorption mechanism 201 away from the adsorption surface, and is used to heat adsorption mechanism 201; The connecting sleeve 203 is assembled on the side of the heating plate 202 away from the adsorption mechanism 201; The heat insulation plate 204 is installed inside the connecting sleeve 203, with a gap between it and the heating plate 202; wherein, Multiple heat dissipation holes 2031 are provided on the connecting sleeve 203 facing the heat insulation plate 204 and on the spaced-out position respectively.

[0030] This nozzle assembly 20 can be insulated by the heat insulation plate 204 and dissipated through the heat dissipation holes 2031, thereby preventing heat from being transmitted and avoiding the heat of the vacuum nozzle 20 from affecting other components of the chip hot press welding machine.

[0031] Preferably, the end of the enclosure portion 2 that extends away from the heating plate 202 beyond the heat insulation plate 204 on the side facing the suction nozzle assembly 20.

[0032] In this way, at least a portion of the heat insulation plate 204 is located within the space enclosed by the enclosure portion 2, thereby enabling the flowing nitrogen gas to cool the heat insulation plate 204 and further preventing heat from being transmitted.

[0033] More preferably, the enclosure portion 2 does not extend beyond the end of the heat insulation plate 204 near the heating plate 202.

[0034] Considering that the heating plate 202 needs to heat the adsorption mechanism 201 and maintain a high temperature, this setting can minimize the cooling of the heating plate 202 by nitrogen, thereby ensuring that the adsorption mechanism 201 reaches the required temperature accurately and also avoids heat waste.

[0035] More preferably, some of the heat dissipation holes 2031 are directly opposite the enclosure part 2. In this way, some nitrogen gas can enter the connecting sleeve 203 from the heat dissipation holes 2031 and directly contact the heat insulation plate 204, thereby better cooling the heat insulation plate 204 and better preventing heat from being transmitted.

[0036] A chip hot press welding machine includes the nitrogen purging device for chip hot press welding machines described in the above embodiments.

[0037] Based on the above-described preferred embodiments of this utility model, and through the foregoing description, those skilled in the art can make various changes and modifications without departing from the technical concept of this utility model. The technical scope of this utility model is not limited to the contents of the specification, but must be determined according to the scope of the claims.

Claims

1. A nitrogen purging device for a chip hot press welding machine, the chip hot press welding machine comprising a support, a hollow shaft (10) mounted on the support, and a suction nozzle assembly (20) mounted on the end of the hollow shaft (10), characterized in that, The nitrogen purging system includes: The chamber (1) is mounted on the bracket and is provided with a nitrogen chamber (11) and a nitrogen inlet (12) communicating with the nitrogen chamber (11), and is provided with at least one nitrogen outlet (13) communicating with the nitrogen chamber (11) facing the nozzle assembly (20). The enclosure (2) connects to the chamber (1), surrounds the hollow shaft (10) and the nozzle assembly (20) at the connection position of the two parts with a gap, and extends beyond the nitrogen outlet (13) toward the nozzle assembly (20). The nitrogen outlet (13) is located in the space enclosed by the enclosure (2).

2. The nitrogen purging device for a chip hot press welding machine according to claim 1, characterized in that, The nitrogen chamber (11) is arranged in a circle around the hollow shaft (10), and at least two nitrogen outlets (13) are provided along the circumference of the nitrogen chamber (11).

3. The nitrogen purging device for a chip hot press welding machine according to claim 2, characterized in that, The chamber (1) includes two fastening members (1a). The end faces of the two fastening members (1a) that fasten each other are respectively provided with annular grooves (11a) or the end face of one of the fastening members (1a) facing the other fastening member (1a) is provided with annular grooves (11a). After the two fastening members (1a) fasten each other, the annular grooves (11a) form the nitrogen chamber (11).

4. The nitrogen purging device for a chip hot press welding machine according to claim 3, characterized in that, The enclosure (2) is integrally formed with the fastener (1a) located nearby.

5. The nitrogen purging device for a chip hot press welding machine according to claim 1, characterized in that, Along the axial direction of the hollow shaft (10), the nozzle assembly (20) does not obstruct the nitrogen outlet (13).

6. The nitrogen purging device for a chip hot press welding machine according to claim 1, characterized in that, The suction nozzle assembly (20) includes: The adsorption mechanism (201) is connected to the end of the hollow shaft (10) and is used for vacuum adsorption of the chip; A heating plate (202) is attached to the end face of the adsorption mechanism (201) away from the adsorption surface, and is used to heat the adsorption mechanism (201). A connecting sleeve (203) is fitted onto the side of the heating plate (202) away from the adsorption mechanism (201); A heat insulation plate (204) is installed inside the connecting sleeve (203), with a gap between it and the heating plate (202); wherein, The connecting sleeve (203) has multiple heat dissipation holes (2031) respectively located opposite the heat insulation plate (204) and opposite the interval.

7. The nitrogen purging device for a chip hot press welding machine according to claim 6, characterized in that, The enclosure (2) extends beyond the heat insulation plate (204) and away from the heating plate (202) on the side facing the suction nozzle assembly (20).

8. The nitrogen purging device for a chip hot press welding machine according to claim 7, characterized in that, The enclosure (2) does not extend beyond the end of the heat insulation plate (204) near the heating plate (202).

9. The nitrogen purging device for a chip hot press welding machine according to claim 7 or 8, characterized in that, Some of the heat dissipation holes (2031) are directly opposite the enclosure part (2).

10. A chip hot-press welding machine, characterized in that, Includes the nitrogen purging device for a chip hot press welding machine as described in any one of claims 1-9.

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