Laser processing device

Abstract

The application provides a laser processing device, which comprises a laser, a mirror assembly, a carrier assembly and a focusing assembly; the laser is used for emitting a light beam; the mirror assembly is arranged on the emission path of the light beam and is used for reflecting the light beam; the carrier assembly comprises a carrier part used for placing a plurality of workpieces to be processed; the focusing assembly comprises a plurality of focusing parts arranged on the carrier part, each focusing part is arranged corresponding to one workpiece to be processed, and is used for focusing the light beam on the corresponding workpiece to be processed; wherein the mirror assembly and / or the carrier part are movably arranged, so that the corresponding focusing part of the target workpiece to be processed is in the reflection light path of the mirror assembly; in this way, different regions and different specifications of workpieces to be processed can be processed by using one laser, so that the production cost is reduced; meanwhile, the focusing assembly does not need to be replaced, and the processing equipment does not need to be moved and adjusted for many times, so that the production efficiency is improved.

Description

Technical Field

[0001] This application belongs to the field of laser processing technology, and in particular relates to a laser processing device. Background Technology

[0002] Laser processing technology is a technique that uses high-energy laser beams to process materials and is widely used in various precision machining fields. Existing laser processing equipment typically employs a design where one laser head corresponds to one field lens and galvanometer, meaning one laser corresponds to one processing head. Different materials or workpieces of different shapes are processed by changing different field lenses. Furthermore, when processing workpieces in different areas, different laser heads need to be set up for different areas, or the laser processing equipment needs to be moved and adjusted multiple times. This not only affects production efficiency but also increases production costs. Utility Model Content

[0003] This application provides a laser processing apparatus to solve the problems of low production efficiency and high production cost of existing laser processing equipment.

[0004] In a first aspect, embodiments of this application provide a laser processing apparatus, comprising:

[0005] A laser used to emit a beam of light;

[0006] A reflector assembly is disposed in the exit path of the light beam for reflecting the light beam;

[0007] A loading assembly, including a loading section for holding multiple parts to be processed; and,

[0008] The focusing assembly includes a plurality of focusing parts disposed on the carrying part, each focusing part being disposed corresponding to a workpiece to be processed, for focusing the light beam onto the corresponding workpiece;

[0009] The mirror assembly and / or the loading part are movably configured so that the focusing part corresponding to the target workpiece is placed in the reflected light path of the mirror assembly.

[0010] In one embodiment, the reflector assembly includes at least one reflector having a reflective surface, and the reflector is rotatably configured to adjust the incident angle of the laser beam emitted from the laser on the reflective surface.

[0011] In one embodiment, the laser processing apparatus further includes:

[0012] An image acquisition component is mounted on the loading component to acquire images of multiple workpieces under the same field of view;

[0013] The identification component is electrically connected to the image acquisition component to receive the image and identify the actual position information of the target workpiece.

[0014] A lens driving assembly includes a movable lens driving unit, the lens driving unit being driven and connected to the reflector; and...

[0015] The circuit board assembly is electrically connected to the recognition component and the lens driving component.

[0016] In one embodiment, the lens driving assembly includes a dimming drive motor and a universal joint, wherein the output shaft of the dimming drive motor is drivenly connected to the drive shaft of the universal joint, and the driven shaft of the universal joint is drivenly connected to the reflector.

[0017] In one embodiment, the reflector assembly includes a plurality of reflectors, and the light beam emitted from the laser is reflected sequentially by the plurality of reflectors. The plurality of reflectors includes a first reflector closest to the laser, which is rotatably disposed, while the remaining reflectors are fixedly disposed.

[0018] In one embodiment, the loading assembly further includes a loading stage, on which a processing station is provided, the processing station being located on the reflected light path of the mirror assembly;

[0019] The loading unit is movably disposed on the loading stage to transfer the target workpiece and the corresponding focusing unit to the processing station.

[0020] In one embodiment, the laser processing apparatus further includes:

[0021] A position detection device is disposed on the worktable to detect the relative position information between the target workpiece and the processing station;

[0022] A transfer drive assembly includes a movably disposed transfer drive unit, the transfer drive unit being drively connected to the load unit; and...

[0023] The circuit board assembly is electrically connected to the position detection device and the transfer drive assembly.

[0024] In one embodiment, the loading assembly further includes a turntable and a plurality of loading protrusions. The plurality of loading protrusions are disposed on the turntable and are evenly distributed along the circumference of the turntable. Each loading protrusion is used to place a workpiece to be processed. The turntable is rotatably mounted on the loading platform along its central axis so that the plurality of loading protrusions can be rotated sequentially to the processing station.

[0025] The loading section includes the turntable and a plurality of loading bosses.

[0026] In one embodiment, the focusing unit includes a galvanometer and a field lens, the field lens being positioned between the galvanometer and the workpiece. The galvanometer is used to reflect a light beam reflected from the mirror assembly to the field lens, and the field lens is used to focus the received light beam onto the workpiece.

[0027] In one embodiment, the carrying part includes a plurality of placement bosses, which are used to place a plurality of workpieces to be processed with different specifications respectively;

[0028] Each of the focusing parts corresponds to one of the placement bosses. The specifications of the multiple field lenses of the multiple focusing parts are different, and each field lens is matched with the parameters of the workpiece to be processed on the corresponding placement boss.

[0029] This application provides a laser processing apparatus, including a laser, a mirror assembly, a carrier assembly, and a focusing assembly. The carrier assembly can hold multiple workpieces to be processed. Each workpiece is correspondingly provided with a focusing part. The mirror assembly and / or the carrier assembly are movably configured so that the focusing part corresponding to the target workpiece is located in the reflected light path of the mirror assembly, thereby enabling the focusing part to focus the light beam onto the target workpiece. By setting the mirror assembly and / or the carrier assembly to be movably configured, it is possible to use a single laser to process workpieces of different areas and specifications, thereby reducing production costs. At the same time, it is not necessary to replace the focusing assembly or move and adjust the processing equipment multiple times, thereby improving production efficiency. Attached Figure Description

[0030] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0031] To gain a more complete understanding of this application and its beneficial effects, the following description will be provided in conjunction with the accompanying drawings. In the following description, the same reference numerals denote the same parts.

[0032] Figure 1 This is a schematic diagram of a first structure of the laser processing apparatus provided in the embodiments of this application;

[0033] Figure 2 This is a schematic diagram of a second structure of the laser processing apparatus provided in the embodiments of this application;

[0034] Figure 3 This is a schematic diagram of a third structure of the laser processing apparatus provided in the embodiments of this application;

[0035] Figure 4 This is a schematic diagram of a fourth structure of the laser processing apparatus provided in the embodiments of this application;

[0036] Figure 5 This is a first flowchart of a laser processing method provided in an embodiment of this application;

[0037] Figure 6 This is a second flowchart of a laser processing method provided in an embodiment of this application. Detailed Implementation

[0038] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the scope of protection of this application.

[0039] This application provides a laser processing apparatus 100 to solve the problems of low production efficiency and high production cost of existing laser processing equipment.

[0040] See Figures 1 to 4 As shown in the figure, this application provides a laser processing apparatus 100. The laser processing apparatus 100 includes a laser 1, a mirror assembly 2, a carrier assembly 3, and a focusing assembly 4; the laser 1 is used to emit a laser beam; the mirror assembly 2 is disposed on the emission path of the laser beam and is used to reflect the laser beam; the carrier assembly 3 includes a carrier section 31 for placing a plurality of workpieces 200 to be processed; the focusing assembly 4 includes a plurality of focusing sections 41 disposed on the carrier section 31, each focusing section 41 corresponding to a workpiece 200 to be processed, for focusing the laser beam onto the corresponding workpiece 200; wherein, the mirror assembly 2 and / or the carrier section 31 are movably disposed so that the focusing section 41 corresponding to the target workpiece 201 is located in the reflected light path of the mirror assembly 2.

[0041] It is known that in the existing technology, laser processing equipment usually adopts a design where a single laser head corresponds to a single field lens 412 and galvanometer 411. That is, one laser 1 corresponds to one processing head, and different materials or workpieces of different shapes can be processed by changing different field lenses 412. Although this method can meet a variety of processing needs, each time the field lens 412 is changed, a lot of time and manpower are required, especially for large-scale mechanical equipment, which greatly affects production efficiency.

[0042] Furthermore, existing laser processing equipment can usually only process one area. If multiple areas need to be processed, multiple lasers 1 need to be set up accordingly, or the laser processing equipment needs to be moved and adjusted multiple times, which not only affects production efficiency but also increases production costs.

[0043] However, in this application, the reflector assembly 2 can be movably configured to adjust the reflected light path of the reflector assembly 2, so that the focusing part 41 corresponding to the target workpiece 201 is located on the reflected light path of the reflector assembly 2. The focusing part 41 can focus the light beam onto the target workpiece 201. In this way, by adjusting the reflector assembly 2, workpieces 200 at different positions can be processed. This not only improves the flexibility and adaptability of the laser processing device 100, but also eliminates the need to replace the focusing part 41 or move and adjust the entire laser processing device 100, thereby improving production efficiency. Furthermore, it can reduce the time and manpower wasted due to frequent replacement of the field lens 412 and reduce equipment maintenance costs.

[0044] Alternatively, the loading unit 31 can be movably configured. After the reflector assembly 2 reflects the beam emitted by the laser 1, the loading unit 31 can move the target workpiece 201 and the corresponding focusing unit 41 onto the reflected light path of the reflector assembly 2. The focusing unit 41 can focus the beam onto the target workpiece 201. In this way, by adjusting the loading unit 31, workpieces 200 at different positions can be processed. This not only improves the flexibility and adaptability of the laser processing device 100, but also eliminates the need to replace the focusing unit 41 or move and adjust the entire laser processing device 100, thereby improving production efficiency. Furthermore, it can reduce the time and manpower wasted due to frequent replacement of the field lens 412 and reduce equipment maintenance costs.

[0045] The two features mentioned above can also be set simultaneously, that is, both the reflector assembly 2 and the loading part 31 are movable; by adjusting the reflector assembly 2 and the loading part 31, the workpiece 200 at different positions can be processed, which not only improves the flexibility and adaptability of the laser processing device 100, but also eliminates the need to replace the focusing part 41 or move and adjust the entire laser processing device 100, thereby improving production efficiency; and can reduce the time and manpower wasted due to frequent replacement of the field lens 412, and reduce equipment maintenance costs.

[0046] Meanwhile, since the laser processing device 100 uses one laser 1 and can process different areas and different specifications of workpieces 200 by means of the reflector assembly 2 and / or the loading part 31, the manufacturing cost and maintenance cost of the laser processing device 100 can be reduced, and the cost-effectiveness of the laser processing device 100 can be improved.

[0047] In one embodiment, please refer to Figure 1 and Figure 2 The reflector assembly 2 includes at least one reflector 21, which has a reflective surface and is rotatably configured to adjust the incident angle and / or incident position of the beam emitted by the laser 1 on the reflective surface.

[0048] In this embodiment, by adjusting the rotation of the reflector 21, the incident angle and / or incident position of the laser beam emitted from the laser 1 on the reflective surface are adjusted, thereby adjusting the reflected light path of the reflector 21, so that the target workpiece 201 and its corresponding focusing part 41 are on the reflected light path of the reflector 21, realizing the processing of workpieces 200 with different positions and different specifications; thus, the adjustment operation of the reflector 21 is simple, and the laser processing device 100 has high flexibility and practicality.

[0049] Specifically, the laser processing apparatus 100 further includes an image acquisition component, an identification component, a lens driving component 5, and a controller; the image acquisition component is disposed on the carrier component 3 and is used to acquire images of multiple workpieces 200 under the same field of view; the identification component is electrically connected to the image acquisition component and is used to receive the images and identify the actual position information of the target workpiece 201; the lens driving component 5 includes a movable lens driving part, which is drivenly connected to the reflector 21; the controller is electrically connected to the identification component and the lens driving component 5 and is used to obtain the actual position information and control the lens driving part to drive the reflector 21 to the target position.

[0050] In this embodiment, the image acquisition component, the recognition component, and the lens driving component 5 can be used to precisely adjust the reflector 21. After determining the target workpiece 201, the image acquisition component acquires images of multiple workpieces 200 under the same field of view. The recognition component receives the images and identifies the actual position information of the target workpiece 201. The lens driving component then drives the reflector 21 to move to the target position.

[0051] For example, four workpieces 200, numbered one, two, three, and four, are spaced apart on the stage 32. Workpiece 200 number three is identified as the target workpiece 201. The image acquisition component acquires images of the four workpieces 200 within the same field of view. The recognition component receives the images and identifies the actual position information of the target workpiece 201, which is the actual position information of workpiece 200 number three. Since there is a preset correspondence between the tilt angle of the reflector 21 and the four workpieces 200 (e.g., workpiece 200 number one corresponds to a 30° tilt of the reflector 21, workpiece 200 number two corresponds to a 45° tilt of the reflector 21, and so on), after identifying workpiece 200 number three as the target workpiece 201, the lens driving unit drives the reflector 21 to rotate to the preset tilt angle.

[0052] This application does not impose specific limitations on the form of the lens driving assembly 5. In one embodiment, the lens driving assembly 5 includes a dimming drive motor and a universal joint 51. The output shaft of the dimming drive motor is drivenly connected to the drive shaft of the universal joint 51, and the driven shaft of the universal joint 51 is drivenly connected to the reflector 21.

[0053] It is understood that the universal joint 51, also known as a universal connector or universal coupling, is a mechanical component used to connect two shafts, allowing them to intersect and rotate relative to each other at a certain angle. The core of the universal joint 51 typically consists of two or more U-shaped joints (also called cross joints), which are connected to the shafts by pins, enabling the rotation of one shaft to be smoothly transmitted to the other shaft, even if there is a certain angle between the two shafts. By using the universal joint 51, the reflector 21 can be flexibly rotated at multiple angles.

[0054] In one embodiment, please refer to Figure 3 and Figure 4 The carrier assembly 3 further includes a stage 32, on which a processing station 33 is provided. The processing station 33 is located in the reflected light path of the mirror assembly 2. The carrier part 31 is movably disposed on the stage 32 to transfer the target workpiece 201 and the corresponding focusing part 41 to the processing station 33.

[0055] In this embodiment, the position of the reflector assembly 2 is fixed, and the reflected light path of the reflector assembly 2 is fixed. Based on the emitted light path of the reflector assembly 2, a fixed processing station 33 is determined on the stage 32. The carrier part 31 is movably disposed on the stage 32. The carrier part 31 can move the target workpiece 201 and its corresponding focusing part 41 to the processing station 33. The light beam reflected by the reflector assembly 2 can reach the focusing part 41, and the focusing part 41 focuses the light beam onto the target workpiece 201, thereby realizing the processing of workpieces 200 with different positions and specifications. In this way, the adjustment operation of the carrier part 31 is simple, and the laser processing device 100 has high flexibility and practicality.

[0056] Specifically, the laser processing apparatus 100 further includes a position detection device, a transfer drive assembly, and a controller; the position detection device is disposed on the stage 32 and is used to detect the relative position information between the target workpiece 201 and the processing station 33; the transfer drive assembly includes a movable transfer drive unit, which is drivenly connected to the stage 31; the controller is electrically connected to the position detection device and the transfer drive assembly to obtain the relative position information and control the transfer drive unit to transfer the target workpiece 201 to the processing station 33.

[0057] In this embodiment, the precise adjustment of the loading unit 31 can be achieved through the position detection device and the transfer drive assembly. After determining the target workpiece 201, the position detection device detects the relative position information between the target workpiece 201 and the processing station 33, and the transfer drive assembly moves the target workpiece 201 to the processing station 33 based on the relative position information.

[0058] For example, four workpieces 200, numbered one, two, three, and four, are spaced apart on the stage 32. Workpiece 200 number three is identified as the target workpiece 201. The position detection device detects the relative position information between the target workpiece 201 and the processing station 33. Since there is a preset correspondence between the four workpieces 200 and the processing station 33—for example, when workpiece 200 number one is located at processing station 33, the relative distance between workpiece 2 and processing station 33 is X, the relative distance between workpiece 3 and processing station 33 is 2X, and so on—after identifying workpiece 200 number three as the target workpiece 201, the transfer drive unit drives the stage 31 to move 2X, thus placing workpiece 200 number three at processing station 33.

[0059] This application does not impose specific limitations on the form of the carrying part 31. The carrying part 31 can move linearly, and the carrying part 31 can also rotate.

[0060] In one embodiment, the loading assembly 3 further includes a conveyor belt assembly, which includes two pulleys arranged opposite each other and a conveyor belt sleeved on the outside of the two pulleys; a plurality of workpieces 200 to be processed are placed sequentially on the conveyor belt; the transfer drive unit of the transfer drive assembly drives one of the pulleys to rotate, so that the conveyor belt transfers the target workpiece 201 to the processing station 33.

[0061] In one embodiment, please refer to Figure 3 and Figure 4 The loading assembly 3 further includes a turntable 311 and a plurality of loading protrusions. The plurality of loading protrusions are disposed on the turntable 311 and are evenly distributed along the circumference of the turntable 311. Each loading protrusion is used to place a workpiece 200 to be processed. The turntable 311 is rotatably mounted on the loading stage 32 along its central axis so that the plurality of loading protrusions can be rotated sequentially to the processing station 33. The loading part 31 includes the turntable 311 and the plurality of loading protrusions.

[0062] In one embodiment, the focusing unit 41 includes a galvanometer 411 and a field lens 412, the field lens 412 being located between the galvanometer 411 and the workpiece 200. The galvanometer 411 is used to reflect the light beam reflected from the mirror assembly 2 to the field lens 412, and the field lens 412 is used to focus the received light beam onto the workpiece 200.

[0063] Specifically, the loading section 31 includes a plurality of loading protrusions, which are used to place a plurality of workpieces 200 of different specifications respectively; each focusing section 41 is provided with a corresponding loading protrusion, and the plurality of field lenses 412 of the plurality of focusing sections 41 have different specifications, and each field lens 412 is matched with the parameters of the workpiece 200 on the corresponding loading protrusion.

[0064] In this embodiment, multiple workpieces 200 of different specifications can be placed on the multiple placement protrusions. Field mirrors 412 of different specifications are set on the different workpieces 200. Each field mirror 412 is matched with the parameters of the workpiece 200 on the corresponding placement protrusion. By movably setting the reflector assembly 2 and / or the carrying part 31, the workpieces 200 of different regions and specifications can be processed. Therefore, the manufacturing cost and maintenance cost of the laser processing device 100 can be reduced, and the cost-effectiveness of the laser processing device 100 can be improved.

[0065] Secondly, this application embodiment also provides a laser processing method based on the laser processing apparatus 100 described above. Figure 5 This is a first flowchart of a laser processing method provided in an embodiment of this application; Figure 6 This is a second flowchart of a laser processing method provided in an embodiment of this application.

[0066] The laser processing apparatus 100 further includes a lens driving assembly 5 and / or a transfer driving assembly. The lens driving assembly 5 drives the mirror assembly 2 connected to the laser processing apparatus 100, and the transfer driving assembly drives the loading part 31 connected to the laser processing apparatus 100. The laser processing method includes:

[0067] S10: Control the movement of the lens driving assembly 5 and / or the transfer driving assembly to drive the mirror assembly 2 and / or the loading part 31 to the target position;

[0068] S20: Control the laser 1 to turn on and emit a beam so that the beam passes sequentially through the reflector assembly 2 and the focusing assembly 4 of the laser processing device 100 and is focused on the target workpiece 201.

[0069] In this embodiment, the movement of the lens driving assembly 5 and / or the transfer driving assembly is controlled to drive the mirror assembly 2 and / or the carrier 31 to the target position; the laser 1 is controlled to turn on and emit a beam so that the beam passes sequentially through the mirror assembly 2 and the focusing assembly 4 of the laser processing device 100 and is focused on the target workpiece 201; by setting the movement of the mirror assembly 2 and / or the carrier 31, it is possible to use one laser 1 to process workpieces 200 of different areas and different specifications, thereby reducing production costs; at the same time, it is not necessary to replace the focusing assembly 4 or move and adjust the processing equipment multiple times, thereby improving production efficiency.

[0070] Please see Figure 5 In the first embodiment, the reflector assembly 2 includes a reflector 21, which is rotatably configured, and the target position is configured such that the reflector 21 is rotated to a preset tilt angle; the laser processing device 100 also includes an image acquisition component and a recognition component;

[0071] Step S10, which controls the activity of the lens drive assembly 5, includes:

[0072] S101: Acquire images of multiple workpieces 200 under the same field of view;

[0073] S102: Obtain the actual position information of the target workpiece 201 based on the image;

[0074] S103: Obtain the preset tilt angle of the reflector 21 based on the actual position information;

[0075] S104: Control the lens driving part of the lens driving assembly 5 to drive the reflector 21 to rotate to the preset tilt angle.

[0076] In this embodiment, after determining the target workpiece 201, the image acquisition component acquires images of multiple workpieces 200 under the same field of view. The recognition component receives the images and identifies the actual position information of the target workpiece 201. The mirror 21 is then driven to move to the target position by the lens driving unit.

[0077] For example, four workpieces 200, numbered one, two, three, and four, are spaced apart on the stage 32. Workpiece 200 number three is identified as the target workpiece 201. The image acquisition component acquires images of the four workpieces 200 within the same field of view. The recognition component receives the images and identifies the actual position information of the target workpiece 201, which is the actual position information of workpiece 200 number three. Since there is a preset correspondence between the tilt angle of the reflector 21 and the four workpieces 200 (e.g., workpiece 200 number one corresponds to a 30° tilt of the reflector 21, workpiece 200 number two corresponds to a 45° tilt of the reflector 21, and so on), after identifying workpiece 200 number three as the target workpiece 201, the lens driving unit drives the reflector 21 to rotate to the preset tilt angle.

[0078] Please see Figure 6 In the second embodiment, the loading component 3 of the laser processing apparatus 100 further includes a loading stage 32, on which a processing station 33 is provided, and the target position is set as the location of the processing station 33; the loading part 31 includes a turntable 311, which is rotatably mounted on the loading stage 32 along its central axis; the laser processing apparatus 100 further includes a position detection device and a transfer drive component;

[0079] Step S10, which controls the activity of the transfer drive component, includes:

[0080] S101': Obtain the relative position information between the target workpiece 201 and the processing station 33;

[0081] S102': Based on the relative position information, obtain the preset rotation angle of the target workpiece 201;

[0082] S103': Control the transfer drive unit of the transfer drive assembly to drive the turntable 311 to rotate by the preset rotation angle so that the target workpiece 201 on the turntable 311 is in the processing station 33.

[0083] In this embodiment, the position of the reflector assembly 2 is fixed, and the reflected light path of the reflector assembly 2 is fixed. Based on the emitted light path of the reflector assembly 2, a fixed processing station 33 is determined on the stage 32. The carrier part 31 is movably disposed on the stage 32. The carrier part 31 can move the target workpiece 201 and its corresponding focusing part 41 to the processing station 33. The light beam reflected by the reflector assembly 2 can reach the focusing part 41, and the focusing part 41 focuses the light beam onto the target workpiece 201, thereby realizing the processing of workpieces 200 with different positions and specifications. In this way, the adjustment operation of the carrier part 31 is simple, and the laser processing device 100 has high flexibility and practicality.

[0084] In the above embodiments, the descriptions of each embodiment have different focuses. For parts not described in detail in a certain embodiment, please refer to the relevant descriptions in other embodiments.

[0085] In the description of this application, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, features defined with "first" and "second" may explicitly or implicitly include one or more features.

[0086] The laser processing apparatus provided in the embodiments of this application has been described in detail above. Specific examples have been used to illustrate the principles and implementation methods of this application. The description of the above embodiments is only for the purpose of helping to understand the method and core ideas of this application. At the same time, for those skilled in the art, there will be changes in the specific implementation methods and application scope based on the ideas of this application. Therefore, the content of this specification should not be construed as a limitation of this application.

Claims

1. A laser processing apparatus, characterized in that, include: A laser used to emit a beam of light; A reflector assembly is disposed in the exit path of the light beam for reflecting the light beam; A loading assembly, including a loading section for holding multiple parts to be processed; as well as, The focusing assembly includes a plurality of focusing parts disposed on the carrying part, each focusing part being disposed corresponding to a workpiece to be processed, for focusing the light beam onto the corresponding workpiece; The mirror assembly and / or the loading part are movably configured so that the focusing part corresponding to the target workpiece is placed in the reflected light path of the mirror assembly.

2. The laser processing apparatus according to claim 1, characterized in that, The reflector assembly includes at least one reflector having a reflective surface and being rotatably configured to adjust the incident angle of the laser beam emitted from the laser on the reflective surface.

3. The laser processing apparatus according to claim 2, characterized in that, The laser processing device also includes: An image acquisition component is mounted on the loading component to acquire images of multiple workpieces under the same field of view; The identification component is electrically connected to the image acquisition component to receive the image and identify the actual position information of the target workpiece. A lens driving assembly includes a movable lens driving unit, the lens driving unit being driven and connected to the reflector; and... The circuit board assembly is electrically connected to the recognition component and the lens driving component.

4. The laser processing apparatus according to claim 3, characterized in that, The lens driving assembly includes a dimming drive motor and a universal joint. The output shaft of the dimming drive motor is drivenly connected to the drive shaft of the universal joint, and the driven shaft of the universal joint is drivenly connected to the reflector.

5. The laser processing apparatus according to claim 2, characterized in that, The reflector assembly includes multiple reflectors, and the laser beam emitted from the laser is reflected sequentially by the multiple reflectors. The multiple reflectors include a first reflector closest to the laser, which is rotatably arranged, while the other reflectors are fixedly arranged.

6. The laser processing apparatus according to claim 1, characterized in that, The loading assembly also includes a loading stage, on which a processing station is provided, and the processing station is located on the reflected light path of the mirror assembly; The loading unit is movably disposed on the loading stage to transfer the target workpiece and the corresponding focusing unit to the processing station.

7. The laser processing apparatus according to claim 6, characterized in that, The laser processing device also includes: A position detection device is disposed on the worktable to detect the relative position information between the target workpiece and the processing station; A transfer drive assembly includes a movably disposed transfer drive unit, the transfer drive unit being drively connected to the load unit; and... The circuit board assembly is electrically connected to the position detection device and the transfer drive assembly.

8. The laser processing apparatus according to claim 6, characterized in that, The loading assembly also includes a turntable and a plurality of loading protrusions. The plurality of loading protrusions are disposed on the turntable and are evenly distributed along the circumference of the turntable. Each loading protrusion is used to place a workpiece to be processed. The turntable is rotatably mounted on the loading platform along its central axis so that the plurality of loading protrusions can be rotated sequentially to the processing station. The loading section includes the turntable and a plurality of loading bosses.

9. The laser processing apparatus according to claim 1, characterized in that, The focusing unit includes a galvanometer and a field lens. The field lens is located between the galvanometer and the workpiece. The galvanometer is used to reflect the light beam reflected from the mirror assembly to the field lens, and the field lens is used to focus the received light beam onto the workpiece.

10. The laser processing apparatus according to claim 9, characterized in that, The carrying section includes multiple placement bosses, which are used to place multiple parts to be processed with different specifications. Each of the focusing parts corresponds to one of the placement bosses. The specifications of the multiple field lenses of the multiple focusing parts are different, and each field lens is matched with the parameters of the workpiece to be processed on the corresponding placement boss.

Images