An ultrafast laser micro-nano processing device

Abstract

The utility model discloses a kind of ultrafast laser micro-nano machining equipment, including three-dimensional moving workbench being installed in installation machine tool, ultrafast laser, optical shaping module, three-dimensional galvanometer machining head module, CCD camera and industrial computer;Three-dimensional moving workbench is used to install workpiece, and drive workpiece to move;Gaussian beam emitted by ultrafast laser is shaped as Bessel beam after optical shaping module, and Bessel beam is focused on workpiece by three-dimensional galvanometer machining head module;Industrial computer is electrically connected with three-dimensional moving workbench, ultrafast laser, three-dimensional galvanometer machining head module and CCD camera respectively, and the cooperation control between component is realized.By ultrafast laser combining Bessel beam shaping technology, cold machining mechanism is realized, cooperates with three-dimensional moving workbench and dynamic focusing system cooperative control, effectively suppresses heat affected zone and improves machining precision, with the advantages of inhibiting thermal effect, improving machining precision and consistency, adapting complex curved surface machining demand.

Description

Technical Field

[0001] This utility model relates to the field of laser processing technology, and in particular to an ultrafast laser micro-nano processing device. Background Technology

[0002] In the field of precision relief carving, existing technologies face significant bottlenecks. Traditional mechanical engraving relies on the physical contact between the tool and the workpiece to remove material. While this can adapt to the processing needs of materials with varying hardness, its accuracy is limited by the tool diameter and wear characteristics. When machining submicron-level fine structures, the mechanical vibrations and wear particles generated by the physical contact between the tool and the workpiece lead to deterioration of the surface morphology. Furthermore, frequent tool changes and the need for rigid clamping directly restrict mass production efficiency. While thermal processing technologies, such as CO2 lasers and nanosecond pulsed lasers, can achieve rapid material removal, the thermal diffusion effect caused by their long pulse widths creates a significant heat-affected zone on the processed surface. This thermal effect results in thermal cracks, slag accumulation, and surface roughness degradation at the relief edges. Moreover, the spot diameter of several micrometers limits the resolution of complex micro / nano structures, especially when machining structures with steep sidewalls or dense array features.

[0003] In recent years, ultrafast laser micromachining technology has achieved a "cold processing" mechanism through the characteristics of ultrashort pulses, effectively suppressing the impact of thermal effects on processing quality. However, existing equipment still faces key technical bottlenecks: the depth of field of its Gaussian beam focusing system is typically limited to the order of hundreds of micrometers. When processing three-dimensional curved surfaces or deep cavity structures, axial displacement of the focal point can lead to uneven energy density distribution, directly causing fluctuations in engraving depth and differences in surface roughness. For hard and brittle materials such as glass and sapphire, the laser-matter interaction process is highly sensitive to the energy threshold, and energy fluctuations can easily induce uncontrollable microcrack propagation. The dynamic distortion generated by the existing galvanometer scanning system during high-speed movement further exacerbates processing errors, especially when processing large-sized reliefs, where beam distortion at the edge of the mirror field of view and focal point displacement lead to geometric distortion of lines. These technical defects collectively restrict the engineering application of ultrafast laser processing technology in the manufacturing of complex curved surfaces, high aspect ratios, and highly consistent reliefs. Utility Model Content

[0004] In response to the problems raised in the background technology, the purpose of this utility model is to propose an ultrafast laser micro-nano processing device, which has the advantages of suppressing thermal effects, improving processing accuracy and consistency, and adapting to the processing needs of complex curved surfaces.

[0005] To achieve this objective, the present invention adopts the following technical solution:

[0006] An ultrafast laser micro / nano processing device includes a mounting machine tool, a three-dimensional moving worktable, an ultrafast laser, an optical shaping module, a three-dimensional galvanometer processing head module, a CCD camera, and an industrial control computer;

[0007] The three-dimensional moving worktable, ultrafast laser, optical shaping module, three-dimensional galvanometer processing head module and CCD camera are respectively mounted on the mounting machine tool, and the ultrafast laser, optical shaping module, three-dimensional galvanometer processing head module and CCD camera are located above the three-dimensional moving worktable;

[0008] The three-dimensional moving worktable is used to mount the workpiece and drive the workpiece to reciprocate along the X, Y and Z axes;

[0009] The Gaussian beam emitted by the ultrafast laser is shaped into a Bessel beam after passing through the optical shaping module. The Bessel beam is then focused onto the workpiece by the three-dimensional galvanometer processing head module. The CCD camera is used to identify the surface of the workpiece in real time.

[0010] The industrial control computer is electrically connected to the three-dimensional moving worktable, the ultrafast laser, the three-dimensional galvanometer processing head module, and the CCD camera, respectively, to achieve coordinated control between the components.

[0011] Preferably, the optical shaping module includes a collimating objective lens one, a collimating objective lens two, a prism lens, an aspherical lens and a focusing lens arranged in sequence.

[0012] Preferably, the optical shaping module further includes several reflectors, which are used to change the propagation direction of the laser beam.

[0013] Preferably, the three-dimensional galvanometer processing head module includes a two-dimensional galvanometer module, a dynamic focusing module, and a planar focusing lens. The dynamic focusing module is located in front of the beam incident end of the two-dimensional galvanometer module, and the planar focusing lens is located behind the beam exit end of the two-dimensional galvanometer module.

[0014] The two-dimensional galvanometer module includes an X-mirror and a Y-mirror. The X-mirror is used to control the deflection of the laser beam along the X-axis, and the Y-mirror is used to control the deflection of the laser beam along the Y-axis.

[0015] The dynamic focusing module is used to adjust the depth of the focal point focused on the workpiece.

[0016] Preferably, the dynamic focusing module includes a beam expander and an objective lens;

[0017] The beam expander is positioned in front of the beam incident end of the objective lens, the objective lens is fixedly mounted, and the distance between the beam expander and the objective lens is adjustable.

[0018] Preferably, the three-dimensional moving worktable includes an X-axis moving component, a Y-axis moving component, a Z-axis moving component, and a worktable;

[0019] The drive end of the X-axis moving component is equipped with the Y-axis moving component, and the X-axis moving component is used to drive the Y-axis moving component to reciprocate along the X-axis.

[0020] The Z-axis moving component is mounted on the drive end of the Y-axis moving component, and the Y-axis moving component is used to drive the Z-axis moving component to reciprocate along the Y-axis.

[0021] The worktable is mounted on the drive end of the Z-axis moving assembly, and the Z-axis moving assembly is used to drive the worktable to reciprocate along the Z-axis.

[0022] The workpiece is mounted on the worktable.

[0023] Preferably, the CCD camera is mounted on the side of the three-dimensional galvanometer processing head module.

[0024] Preferably, the optical axis of the CCD camera forms an angle of 5°-30° with the laser transmission axis of the three-dimensional galvanometer processing head module.

[0025] Compared with the prior art, one of the above technical solutions has the following beneficial effects:

[0026] The cold processing mechanism is achieved by combining ultraviolet picosecond or ultraviolet femtosecond lasers with Bessel beam shaping technology. With the coordinated control of a three-dimensional moving stage and dynamic focusing system, the heat-affected zone is effectively suppressed and the processing accuracy is improved. It has the advantages of suppressing thermal effects, improving processing accuracy and consistency, and adapting to the processing needs of complex curved surfaces. Attached Figure Description

[0027] Figure 1 This is a schematic diagram of the overall structure of one embodiment of the present utility model;

[0028] Figure 2 This is a schematic diagram of the electrical control and optical path of one embodiment of the present invention;

[0029] Figure 3 This is a schematic diagram of the structure of an ultrafast laser, an optical shaping module, and a three-dimensional galvanometer processing head module according to an embodiment of the present invention;

[0030] Figure 4 This is a schematic diagram of an ultrafast laser and an optical shaping module according to an embodiment of the present invention;

[0031] Figure 5 This is a schematic diagram of a three-dimensional galvanometer processing head module according to an embodiment of the present invention;

[0032] Figure 6 This is a schematic diagram of one embodiment of the present invention.

[0033] The system includes: a machine tool 100, a three-dimensional moving worktable 200, an X-axis moving assembly 210, a Y-axis moving assembly 220, a Z-axis moving assembly 230, a worktable 240, an ultrafast laser 300, an optical shaping module 400, a collimating objective lens 1 410, a collimating objective lens 2 420, a pyramidal mirror 430, an aspherical lens 440, a focusing mirror 450, a reflecting mirror 460, a three-dimensional galvanometer processing head module 500, a two-dimensional galvanometer module 510, an X-ray galvanometer 511, a Y-ray galvanometer 512, a dynamic focusing module 520, a beam expander 521, an objective lens 522, a planar focusing lens 530, a CCD camera 600, an industrial computer 700, and a workpiece 0. Detailed Implementation

[0034] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this utility model, and should not be construed as limiting this utility model.

[0035] In the description of this utility model, it should be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0036] Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first," "second," and "third" may explicitly or implicitly include one or more of that feature.

[0037] It should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to fixed connections, detachable connections, or integral connections; they can refer to mechanical connections or electrical connections; they can refer to direct connections or indirect connections through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0038] The following is in conjunction with the appendix Figures 1 to 6The technical solution of this utility model will be further illustrated through specific implementation methods.

[0039] An ultrafast laser micro-nano processing device includes a mounting machine tool 100, a three-dimensional moving worktable 200, an ultrafast laser 300, an optical shaping module 400, a three-dimensional galvanometer processing head module 500, a CCD camera 600, and an industrial control computer 700.

[0040] The three-dimensional moving worktable 200, ultrafast laser 300, optical shaping module 400, three-dimensional galvanometer processing head module 500 and CCD camera 600 are respectively mounted on the mounting machine tool 100, and the ultrafast laser 300, optical shaping module 400, three-dimensional galvanometer processing head module 500 and CCD camera 600 are located above the three-dimensional moving worktable 200;

[0041] The three-dimensional moving worktable 200 is used to mount the workpiece 0 and drive the workpiece 0 to reciprocate along the X, Y and Z axes;

[0042] The Gaussian beam emitted by the ultrafast laser 300 is shaped into a Bessel beam after passing through the optical shaping module 400. The Bessel beam is then focused onto the workpiece 0 by the three-dimensional galvanometer processing head module 500. The CCD camera is used to identify the surface of the workpiece 0 in real time.

[0043] The industrial control computer 700 is electrically connected to the three-dimensional moving worktable 200, the ultrafast laser 300, the three-dimensional galvanometer processing head module 500, and the CCD camera 600, respectively, to realize the coordinated control between the components.

[0044] The machine tool 100 is installed as a basic support platform to ensure the spatial positioning accuracy of each component. The workpiece 0 is processed by the three-axis linkage drive of the three-dimensional moving worktable 200, forming a spatial complementary positioning with the laser processing system above, breaking through the limitations of traditional single-axis movement.

[0045] The ultrafast laser 300 uses a 355nm ultraviolet picosecond or femtosecond laser source. Its extremely short pulses, narrow spectral bandwidth, high power, and high repetition rate maximize the utilization of the optical absorption and nonlinear effects of the processed material. Especially when processing acrylic or glass surfaces, this "cold processing" mode virtually eliminates the heat-affected zone, ensuring smooth, crack-free relief edges and significantly improving pattern clarity and surface integrity. Preferably, the laser power is 50W, the wavelength is 355nm, the pulse width is 10ps to 300fs, and the laser exhibits excellent beam directivity.

[0046] The introduction of the optical shaping module 400 and the 3D galvanometer processing head module 500 breaks through the depth-of-field limitations of traditional Gaussian focusing. The optical shaping module 400 converts the Gaussian beam into a diffraction-free Bessel beam, which, combined with high-speed galvanometer scanning, forms a stable focusing area tens of millimeters long, maintaining a sub-micron spot size within this area. This ensures uniform energy distribution, whether processing planar surfaces or complex 3D curved surfaces, effectively preventing over-etching or uneven depth, resulting in more refined engraving details.

[0047] In terms of motion control, a multi-axis CNC linkage strategy between the 3D galvanometer machining head module 500 and the 3D moving worktable 200 enables synchronous movement of the laser beam and the workpiece. Through dual optimization of dynamic focusing of the 3D galvanometer machining head module 500 and dynamic planning of the 3D moving worktable 200, different positions and depths can be seamlessly switched during processing, significantly improving the efficiency of curved surface engraving. Simultaneously, the depth control error can be stably maintained within ±0.02mm, reducing both mechanical adjustment time and the need for manual secondary compensation.

[0048] Ultrafast laser technology itself possesses extremely high peak power density. Combined with a CCD camera 600, the equipment can monitor the surface morphology in real time during processing and automatically adjust the focus, laser power, or the position of the 3D moving stage 200 accordingly. This closed-loop feedback further compresses the overall error of the relief contour of the processed part 0, significantly improving the consistency and pass rate of each finished product in mass production.

[0049] Through the above technical solutions, this invention achieves high-precision machining of complex three-dimensional micro / nano structures. The long focal depth of the Bessel beam ensures consistent energy density during curved surface machining, avoiding the defocusing attenuation problem of traditional Gaussian beams. The three-dimensional galvanometer machining head module 500 and the three-dimensional moving worktable 200, through the coordinated control of the industrial control computer 700, solve the problems of low efficiency and uneven carving depth in relief machining of complex three-dimensional curved surfaces. The visual feedback from the ultrafast laser 300 and the CCD camera 600 enables closed-loop control, effectively suppressing thermal effects and crack propagation, ensuring the surface quality of hard and brittle materials. The coordinated control between the sub-modules significantly reduces dynamic scanning distortion and improves the geometric accuracy of large-size relief machining.

[0050] Furthermore, the optical shaping module 400 includes a collimating objective lens 410, a collimating objective lens 420, a prism lens 430, an aspherical lens 440, and a focusing lens 450 arranged sequentially.

[0051] The optical shaping module 400, through a collimating objective lens 410, a collimating objective lens 420, a prism lens 430, an aspherical lens 440 and a focusing lens 450 arranged in sequence, forms a composite telescope structure and a focusing and shaping optical channel, which is used to convert the Gaussian beam output by the ultrafast laser 300 into a Bessel focused spot with long focal depth, uniform distribution and high resolution.

[0052] Collimating objective 410 is positioned at the front end of the ultrafast laser 300's output, used to initially collimate the initially diverging laser beam into parallel light, eliminating wavefront curvature and improving the efficiency of subsequent beam expansion and shaping. Collimating objective 420, paired with collimating objective 410, forms a "telescope system," its main function being to increase the beam diameter (beam expansion) and further optimize the spatial coherence and wavefront quality of the laser beam, improving the concentration of the main peak after shaping by the subsequent prism and aspherical lens. This combination of two collimating lenses constitutes a high-magnification, low-aberration beam expansion system, a prerequisite for subsequent Bessel conversion and focusing control. Pyramidal lens 430 is used to convert the collimated beam into a zero-order Bessel beam. Its unique geometry causes the incident light to be refracted into a ring-shaped wavefront, ultimately converging axially to form a slender, self-healing main peak with significant long depth of focus. Aspherical lens 440 is used for wavefront correction and shaping of the Bessel beam generated by prism lens 430. Its aspherical design effectively eliminates spherical aberration and higher-order aberrations, maintaining axial consistency in the intensity distribution of the focused area. This lens extends the focal length while preserving the diffraction-free characteristics of the Bessel main peak, improving processing consistency and making it suitable for machining complex three-dimensional relief structures. The focusing lens 450, located at the end of the optical path, precisely focuses the shaped Bessel beam onto the workpiece surface, forming a sub-micron-sized, uniformly intense, and deep-focus spot, achieving high-resolution precision machining.

[0053] To further explain, the dual-stage configuration of collimating objective 410 and collimating objective 420 to construct a "telescope-like system" offers several significant advantages. Firstly, it effectively expands the beam diameter while achieving laser collimation, optimizing the efficiency and conversion quality of subsequent optical shaping devices. Secondly, the two-stage collimation eliminates residual wavefront distortion and edge intensity unevenness after the first collimation, ensuring the stability of the Bessel peak formation. Furthermore, the two-stage collimation provides suitable incident beam size and angle for the prism lens 430 and the aspherical lens 440, achieving full-range wavefront control for long-depth-of-focus Bessel focusing. Finally, different beam expansion ratios can be achieved by adjusting the distance between the two collimating objectives, adapting to different focal diameter and light intensity density requirements in various processes.

[0054] To further explain, the Bessel beam energy is strongly concentrated in a small, elongated region over long distances, allowing the focused spot to maintain a sub-micron size. When used in conjunction with a high numerical aperture (NA) focusing assembly, it can simultaneously achieve sub-micron lateral resolution and deep longitudinal focusing, thus maintaining clear focus throughout the machining of complex curved surfaces or deep grooves. Specifically, a high NA focusing assembly refers to a focusing lens and collimating objective system with a numerical aperture (NA) greater than 0.5, preferably using an aspherical focusing lens or a compound objective structure with an NA ≥ 0.65. The core function of this high NA focusing assembly is to improve the resolution and energy density of the focused laser, especially in high aspect ratio structures and sub-micron scale structures, where it has significant advantages.

[0055] Furthermore, the optical shaping module 400 also includes several reflectors 460, which are used to change the propagation direction of the laser beam.

[0056] By utilizing the 460-degree multi-angle turning function of the reflector, a compact optical path can be constructed within a limited equipment space, significantly improving processing accuracy and system stability.

[0057] Furthermore, the introduction of the reflector 460 enables the Bessel beam to be transmitted to the three-dimensional galvanometer processing head module 500 with a shorter path, ensuring that the incident beam received by the dynamic focusing module has a stable energy distribution and spatial directivity, thereby suppressing focus shift and line distortion in the edge area during large-size processing.

[0058] Furthermore, the three-dimensional galvanometer processing head module 500 includes a two-dimensional galvanometer module 510, a dynamic focusing module 520, and a planar focusing lens 530. The dynamic focusing module 520 is located in front of the beam incident end of the two-dimensional galvanometer module 510, and the planar focusing lens 530 is located behind the beam exit end of the two-dimensional galvanometer module 510.

[0059] The two-dimensional galvanometer module 510 includes an X-mirror 511 and a Y-mirror 512. The X-mirror 511 is used to control the deflection of the laser beam along the X-axis, and the Y-mirror 512 is used to control the deflection of the laser beam along the Y-axis.

[0060] The dynamic focusing module 520 is used to adjust the depth of the focal point focused on the workpiece 0.

[0061] The two-dimensional galvanometer module 510 refers to a deflection device independently controlled by the X and Y axes, which can be implemented by using a high-speed galvanometer motor to drive the reflecting mirror. The X-galvanometer 511 and the Y-galvanometer 512 independently control the beam deflection trajectory in the planar dimension, and the dynamic distortion caused by high-speed motion is eliminated through the linkage of the two axes.

[0062] The dynamic focusing module 520 refers to the axial focus position adjustment module, which is located at the incident end of the two-dimensional galvanometer module 510. This allows the focus depth adjustment to be synchronized with the planar scanning, avoiding the cumulative error of optical path difference caused by traditional rear-mounted dynamic focusing.

[0063] The planar focusing lens 530 fixes the beam transmission path at the output end of the two-dimensional galvanometer module 510. By compressing the divergence angle, it maintains a uniform energy density distribution at the focal point, playing a core role in correcting optical path difference and achieving planar focusing. Specifically, when the mirror of the two-dimensional galvanometer module 510 deflects the laser beam, the optical path (beam transmission distance) changes at different scanning positions, causing the focal plane of a traditional lens to be spherical (in a front focusing system), making it impossible to focus in the peripheral area. However, the planar focusing lens 530, through a special optical design, corrects the spherical focal plane to a planar plane, ensuring uniform spot size and energy distribution throughout the scanning area.

[0064] Traditional galvanometer systems suffer from accumulated optical path difference due to the rear-mounted dynamic focusing module, leading to dynamic distortion and focus shift during high-speed scanning. This solution addresses this by placing the 520 dynamic focusing module at the front, enabling coordinated control of focus adjustment and planar scanning to eliminate geometric distortion caused by optical path difference. Existing Gaussian beams suffer from insufficient depth of field, resulting in uneven energy distribution in deep cavity processing. This solution utilizes the Z-axis adjustment function of the dynamic focusing module, combined with the characteristics of Bessel beams, to achieve a wide range of depth of field coverage.

[0065] Furthermore, the dynamic focusing module 520 includes a beam expander 521 and an objective lens 522;

[0066] The beam expander 521 is located in front of the beam incident end of the objective lens 522. The objective lens 522 is fixedly installed, and the distance between the beam expander 521 and the objective lens 522 is adjustable.

[0067] like Figure 5 As shown, dynamic focus adjustment is achieved by moving the beam expander 521. Specifically, in front of the incident end of the objective lens 522, the divergence angle of the output beam is adjusted by changing the distance between the beam expander 521 and the objective lens 522, thereby changing the depth of focus on the workpiece 0. The focal point can move up and down in real time according to the processing surface or workpiece shape, while the objective lens 522 always maintains high-quality focusing characteristics. The beam expander 521 can be driven by a motor to achieve micro-displacement, thereby adjusting the laser beam exit angle and divergence characteristics to achieve dynamic focusing. This focusing method based on beam parameter control does not require moving the objective lens 522 or the entire optical assembly; only a micrometer-level displacement of the beam expander 521 is needed to achieve millimeter-level effective depth of focus adjustment.

[0068] Specifically, this invention establishes a multi-axis linkage model of an ultrafast laser 300, a three-dimensional galvanometer processing head module 500, and a three-dimensional moving worktable 200 using an industrial control computer 700. Based on the processing scheme obtained by the industrial control computer 700, the three-dimensional relief processing path is precisely planned. During the processing, the three-dimensional galvanometer processing head module 500 and the three-dimensional moving worktable 200 work synchronously to achieve dynamic focusing and high-speed scanning of the laser beam on any three-dimensional curved surface of the workpiece 0. The industrial control computer 700 intelligently adjusts the laser energy density, focal position, and scanning speed according to the curvature of the current processing area, the carving depth, and the complexity of the pattern, effectively solving the core problems in traditional relief processing, such as focal drift leading to blurred carving, uneven energy distribution causing thermal damage, and distortion of complex curved surface patterns.

[0069] Furthermore, the three-dimensional moving worktable 200 includes an X-axis moving component 210, a Y-axis moving component 220, a Z-axis moving component 230, and a worktable 240;

[0070] The X-axis moving component 210 is equipped with the Y-axis moving component 220 at its driving end, and the X-axis moving component 210 is used to drive the Y-axis moving component 220 to reciprocate along the X-axis.

[0071] The Z-axis moving component 230 is mounted on the drive end of the Y-axis moving component 220, and the Y-axis moving component 220 is used to drive the Z-axis moving component 230 to reciprocate along the Y-axis.

[0072] The Z-axis moving assembly 230 is equipped with the worktable 240 at its driving end, and the Z-axis moving assembly 230 is used to drive the worktable 240 to reciprocate along the Z-axis.

[0073] The workpiece 0 is mounted on the worktable 240.

[0074] The X-axis moving assembly 210 is a linear motion mechanism arranged laterally along the X-axis direction. It can be implemented using a linear motor and a high-precision grating ruler in closed-loop control, and its function is to support the Y-axis moving assembly 220 and achieve basic axial displacement. The Y-axis moving assembly 220 is a secondary motion mechanism arranged longitudinally along the Y-axis direction, and can be implemented using a combination of crossed roller guides and a servo motor drive. Its function is to eliminate motion interference in traditional parallel structures. The Z-axis moving assembly 230 is a mechanism that moves along the Z-axis direction, and can be implemented using an air-bearing guide and a piezoelectric ceramic actuator. Its function is to compensate for axial offset of the machining focus. The worktable 240 is a rigid platform that supports the workpiece 0, and can be made of microcrystalline ceramic material. Its function is to suppress the transmission of high-frequency vibrations.

[0075] Specifically, the X-axis motion component 210, as the basic motion unit, directly supports the Y-axis motion component 220, avoiding mass superposition effects through a layered structure. The Y-axis motion component 220 is independently mounted on the drive end of the X-axis motion component 210, forming an orthogonal superposition motion mode and eliminating mechanical coupling errors. The Z-axis motion component 230 is rigidly connected and vertically mounted on the drive end of the Y-axis motion component 220, shortening the kinematic chain length to improve axial positioning accuracy. The worktable 240 is fixed to the drive end of the Z-axis motion component 230 to form a closed-loop control, achieving three-dimensional spatial positioning through the superposition of three-axis displacement vectors. Each motion component adopts an independent drive and layered support topology, reducing motion inertia while ensuring system rigidity.

[0076] Furthermore, the CCD camera 600 is mounted on the side of the three-dimensional galvanometer processing head module 500.

[0077] Side mounting refers to the physical separation and non-coaxial arrangement of the CCD camera 600 from the 3D galvanometer processing head module 500. Specifically, a mechanical bracket can be used to fix the CCD camera 600 to the side of the 3D galvanometer processing head module 500. This arrangement avoids cross-interference between the laser processing optical path and the visual monitoring optical path, while maintaining a tilted observation angle that covers the processing area. The non-coaxial arrangement means that the optical axis of the CCD camera 600 forms an angle of 5°-30° with the laser transmission axis of the 3D galvanometer processing head module 500, which can be achieved by adjusting the mounting tilt angle of the CCD camera 600. This angle range ensures that the image acquisition field of view completely covers the processing focal area and avoids laser reflection interfering with image quality.

[0078] Specifically, the CCD camera 600 captures image data of the processing area in real time through a side-mounted position. After processing by the industrial control computer 700, the image data is analyzed to determine the coordinate deviation between the actual processing focus and the preset trajectory. The industrial control computer 700 synchronously controls the dynamic focusing module 520 to adjust the laser focus depth based on the deviation, while simultaneously driving the three-dimensional moving stage 200 for position compensation. During the high-speed scanning process of the galvanometer, the CCD camera 600 continuously monitors the focus shift at a millisecond-level sampling frequency, suppressing line distortion caused by dynamic distortion through a closed-loop feedback mechanism.

[0079] To further explain, such as Figure 6As shown, this invention uses diffuse reflection light from a line laser to a CCD camera 600 to achieve three-dimensional recognition of the surface of the workpiece 0. Specifically, precision machining compensation is achieved by constructing a closed-loop control system of "model import - machining monitoring - dynamic compensation". In the initial stage of machining, after importing the digital model into the industrial control computer 700 to establish a reference three-dimensional coordinate system, the line laser module integrated into the three-dimensional galvanometer machining head module 500 synchronously performs online three-dimensional reconstruction. A 355nm line laser is projected through the high-speed galvanometer system, and the CCD camera 600 collects the diffuse reflection data of the surface of the workpiece 0 in real time, completing the point cloud stitching and shape reconstruction of the current machining surface. The real-time reconstructed model and the reference model are spatially registered to calculate the deviation matrix. When a local deviation ≥0.03mm is detected, a multi-parameter linkage compensation mechanism is triggered. For path offset, the dynamic focusing module 520 adjusts the laser focus position; for abnormal material removal, the ultrafast laser 300 adjusts the femtosecond laser power to implement energy density compensation; for depth deviation, the Z-axis moving component 230 is driven to perform micron-level displacement compensation.

[0080] Furthermore, the optical axis of the CCD camera forms an angle of 5°-30° with the laser transmission axis of the three-dimensional galvanometer processing head module. This can be achieved by adjusting the mounting angle of the CCD camera 600.

[0081] The technical principles of this utility model have been described above with reference to specific embodiments. These descriptions are merely for explaining the principles of this utility model and should not be construed as limiting the scope of protection of this utility model in any way. Based on this explanation, those skilled in the art can readily conceive of other specific embodiments of this utility model without any inventive effort, and these embodiments will all fall within the scope of protection of this utility model.

Claims

1. An ultrafast laser micro / nano processing device, characterized in that: This includes machine tools, 3D moving worktables, ultrafast lasers, optical shaping modules, 3D galvanometer processing head modules, CCD cameras, and industrial control computers; The three-dimensional moving worktable, ultrafast laser, optical shaping module, three-dimensional galvanometer processing head module and CCD camera are respectively mounted on the mounting machine tool, and the ultrafast laser, optical shaping module, three-dimensional galvanometer processing head module and CCD camera are located above the three-dimensional moving worktable; The three-dimensional moving worktable is used to mount the workpiece and drive the workpiece to reciprocate along the X, Y and Z axes; The Gaussian beam emitted by the ultrafast laser is shaped into a Bessel beam after passing through the optical shaping module. The Bessel beam is then focused onto the workpiece by the three-dimensional galvanometer processing head module. The CCD camera is used to identify the surface of the workpiece in real time. The industrial control computer is electrically connected to the three-dimensional moving worktable, the ultrafast laser, the three-dimensional galvanometer processing head module, and the CCD camera, respectively, to achieve coordinated control between the components; The three-dimensional galvanometer processing head module includes a two-dimensional galvanometer module, a dynamic focusing module, and a planar focusing lens. The dynamic focusing module is located in front of the beam incident end of the two-dimensional galvanometer module, and the planar focusing lens is located behind the beam exit end of the two-dimensional galvanometer module. The two-dimensional galvanometer module includes an X-mirror and a Y-mirror. The X-mirror is used to control the deflection of the laser beam along the X-axis, and the Y-mirror is used to control the deflection of the laser beam along the Y-axis. The dynamic focusing module is used to adjust the depth of the focal point focused on the workpiece.

2. The ultrafast laser micro / nano processing equipment according to claim 1, characterized in that: The optical shaping module includes collimating objective lens one, collimating objective lens two, prism lens, aspherical lens and focusing lens arranged in sequence.

3. The ultrafast laser micro / nano processing equipment according to claim 2, characterized in that: The optical shaping module also includes several reflectors, which are used to change the propagation direction of the laser beam.

4. The ultrafast laser micro / nano processing equipment according to claim 1, characterized in that: The dynamic focusing module includes a beam expander and an objective lens; The beam expander is positioned in front of the beam incident end of the objective lens, the objective lens is fixedly mounted, and the distance between the beam expander and the objective lens is adjustable.

5. The ultrafast laser micro / nano processing equipment according to claim 1, characterized in that: The three-dimensional moving worktable includes an X-axis moving component, a Y-axis moving component, a Z-axis moving component, and a worktable; The drive end of the X-axis moving component is equipped with the Y-axis moving component, and the X-axis moving component is used to drive the Y-axis moving component to reciprocate along the X-axis. The Z-axis moving component is mounted on the drive end of the Y-axis moving component, and the Y-axis moving component is used to drive the Z-axis moving component to reciprocate along the Y-axis. The worktable is mounted on the drive end of the Z-axis moving assembly, and the Z-axis moving assembly is used to drive the worktable to reciprocate along the Z-axis. The workpiece is mounted on the worktable.

6. The ultrafast laser micro / nano processing equipment according to claim 1, characterized in that: The CCD camera is mounted on the side of the three-dimensional galvanometer processing head module.

7. The ultrafast laser micro / nano processing equipment according to claim 6, characterized in that: The optical axis of the CCD camera forms an angle of 5°-30° with the laser transmission axis of the three-dimensional galvanometer processing head module.

Images