Soldering fixture for printed circuit boards

Abstract

The utility model relates to the field of printed circuit board's welding, concretely is printed circuit board's welding fixture, it aims at solving the problem of printed circuit board warping deformation, element easy to be damaged and low positioning accuracy when welding, technical scheme includes insulating pedestal, insulating cover and adjusting lever, and the upper surface of insulating pedestal is positioned groove and positions printed circuit board, and the bottom of groove is equipped with accommodating groove and is equipped with welding window corresponding welding point, and the inner cavity of insulating pedestal is communicated through adjusting hole, and adjusting lever pushes element fine adjustment position, and the surface of positioning groove and the lower surface of insulating cover are equipped with anti -static soft pad and are pressed from the two sides of up and down softness printed circuit board, realize the beneficial effect of restraining printed circuit board warping, improve the welding accuracy and protect element.

Description

Technical Field

[0001] This application relates to the field of soldering printed circuit boards, and more specifically to soldering fixtures for printed circuit boards. Background Technology

[0002] In the manufacturing process of electronic products, the printed circuit board (PCB) serves as the basic structure that carries electrical components and realizes electrical connections. The soldering quality of the PCB has a direct impact on the electrical performance and reliability of the product.

[0003] When soldering components onto printed circuit boards, localized high temperatures can cause thermal deformation of the printed circuit boards, especially warping along the length. In the prior art, when soldering ordinary metal or non-metal materials, in order to reduce warping deformation and maintain the flatness of the solder joint, several rigid pressure plates are usually used to clamp the components to be soldered, so as to provide support and constraint during the soldering process.

[0004] However, printed circuit boards are typically made of brittle materials such as glass fiber reinforced resin or epoxy resin, which have limited compressive strength and cannot withstand the concentrated pressure applied by rigid clamping plates. In addition, the surface of printed circuit boards has a large number of electrical components, pins and solder joints, which are easily damaged under pressure, making it difficult to use rigid clamping plates for clamping operations directly. This is especially true for highly integrated devices such as SSDs, where electrical components are densely packed and there is a lack of component-free areas that can directly contact the rigid clamping plate, further limiting the application of rigid clamping plate clamping methods. Finally, due to the small size of printed circuit boards and electrical components, the positioning accuracy of the solder joints is required when soldering them, and it is currently not easy to fine-tune their positions. Utility Model Content

[0005] The purpose of this invention is to provide a soldering fixture for printed circuit boards. Utilizing a structure including an insulating base, an insulating cover plate, and an adjusting rod, the printed circuit board is positioned by a positioning groove on the insulating base, the receiving groove accommodates the components to be soldered, the soldering window corresponds to the solder joint area, the adjusting rod finely adjusts the position of the components through the cavity, and the anti-static pads softly press the printed circuit board from the top and bottom sides, thereby effectively suppressing warping of the printed circuit board, improving soldering positioning accuracy, and enhancing operational convenience.

[0006] To achieve the aforementioned objectives, the technical solution adopted by this utility model is as follows: A soldering fixture for printed circuit boards, comprising an insulating base, an insulating cover, and several adjusting rods; The upper surface of the insulating base is provided with several positioning grooves for positioning printed circuit boards. The bottom of the positioning groove is provided with several receiving grooves, which are used to receive the main body of the component to be soldered. A soldering window is opened on the side of the receiving groove, and the pins of the component to be soldered are located at the soldering window. The soldering window corresponds to the position of the area to be soldered on the printed circuit board. The insulating base has a cavity inside, and the cavity communicates with the receiving groove through an opening on the side wall or bottom surface of the receiving groove. The outer periphery of the insulating base has a number of adjustment holes that communicate with the cavity. The adjusting rod is used to extend into the cavity from the adjusting hole and push the body of the component to be welded to move within the receiving groove; The positioning groove surface and the lower surface of the insulating cover plate are respectively provided with anti-static pads. When the insulating base and the insulating cover plate are closed together, the anti-static pads press the printed circuit board from the upper and lower sides.

[0007] Preferably, the insulating base includes an upper plate and a lower plate spaced apart, the upper plate and the lower plate being connected by side walls and together enclosing the cavity; The positioning groove and the receiving groove are provided on the upper surface of the upper plate, and the welding windows are respectively opened at corresponding positions on the upper plate and the lower plate.

[0008] Preferably, it also includes a dustproof plate, which is detachably installed at the welding window opened in the lower plate.

[0009] Preferably, the outer periphery of the dustproof plate is provided with a plurality of latches, and the welding window wall of the lower plate is provided with a slot that matches the latches; The latch can engage or disengage from the slot, thereby enabling the dustproof plate to be detachably installed.

[0010] Preferably, a handle is provided on the lower surface of the dustproof plate.

[0011] Preferably, one end of the adjusting rod is provided with a component holding part, which is used to hold the body of the component to be soldered.

[0012] Preferably, the receiving groove communicates with the cavity through openings in its bottom and / or wall.

[0013] Preferably, the insulating base and the insulating cover are hinged together by a hinge.

[0014] Preferably, the antistatic pad is made of antistatic EVA foam.

[0015] Preferably, the component holding part has a clearance groove for avoiding the pins of the component to be soldered.

[0016] The beneficial effects of this utility model are: Effectively suppresses warping deformation of printed circuit boards: The antistatic pads on the insulating base and insulating cover gently press the printed circuit board from the top and bottom sides, avoiding the stress concentration problem caused by rigid pressure plates; the antistatic pads can be made of antistatic EVA foam, which has elastic deformation capability and can evenly distribute the clamping force. In the local high temperature environment of welding, it provides flexible constraint, thereby directly eliminating the warping tendency and improving the flatness and stability of welding.

[0017] Improved welding positioning accuracy and adjustability: The positioning groove on the insulating base can accurately position the printed circuit board, the receiving groove is used to hold the main body of the component to be welded, and the welding window corresponds to the solder joint area; the adjustment rod pushes the component to be welded through the cavity to finely adjust its position in the receiving groove, realizing the precise alignment of the component and the solder joint, which is especially suitable for highly integrated printed circuit boards, directly improving welding accuracy and reliability.

[0018] Protect printed circuit boards and components from damage: The insulating base and cover made of engineering plastic, combined with the soft pressing method of the anti-static pad, avoid hard impacts on the brittle printed circuit board materials and surface components; The removable dustproof plate is designed to open before soldering and be installed immediately after soldering to close the soldering window, effectively preventing dust and impurities from falling into the cavity and adhering to the solder joints, thereby avoiding the problem of contaminating the printed circuit board. Attached Figure Description

[0019] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0020] Figure 1 This is a schematic diagram of the structure of the insulating base and insulating cover plate in this application; Figure 2 for Figure 1 A magnified view of a portion of region A in the middle; Figure 3 This is a schematic diagram of one side of the insulating base in this application; Figure 4 for Figure 3 A sectional view along the AA direction; Figure 5 This is a schematic diagram of the other side of the insulating base in this application; Figure 6 This is a schematic diagram of one structure of the adjusting rod in this application; Figure 7 This is a schematic diagram of the dustproof plate in this application; Figure 8This is a schematic diagram of a printed circuit board with components to be soldered.

[0021] Among them, 1-insulating base, 2-insulating cover plate, 3-adjusting rod, 4-positioning groove, 5-accommodating groove, 6-welding window, 7-cavity, 8-adjusting hole, 9-antistatic pad, 10-upper plate, 11-lower plate, 12-side wall, 13-dustproof plate, 14-clamp tongue, 15-clamp slot, 16-handle, 17-component holding part, 18-hinge, 19-leaving groove, 20-printed circuit board, 21-component to be soldered. Detailed Implementation

[0022] In the description of this utility model, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.

[0023] The following disclosure provides many different embodiments or examples for implementing various structures of this invention. To simplify the disclosure, specific examples of components and arrangements are described below. Of course, these are merely examples and are not intended to limit the scope of this invention.

[0024] The embodiments of the utility model will now be described in detail with reference to the accompanying drawings.

[0025] Example 1

[0026] See Figures 1 to 6 This embodiment describes the basic structure that enables the present invention to achieve its objectives.

[0027] This embodiment provides a soldering fixture for a printed circuit board 20, including an insulating base 1, an insulating cover plate 2, and several adjusting rods 3.

[0028] The upper surface of the insulating base 1 is provided with several positioning grooves 4, each positioning groove 4 being used to position a printed circuit board 20; the shape of the positioning groove 4 should match the shape of the printed circuit board 20, so as to position the printed circuit board 20 as a whole; the positioning groove 4 may also be provided with several clearances, which are used to accommodate electrical components pre-installed on the printed circuit board 20, thereby avoiding interference and positioning the printed circuit board 20 in these details; the soldering surface of the printed circuit board 20 faces the bottom surface of the positioning groove 4, so that the printed circuit board 20 is stably positioned in the positioning groove 4.

[0029] The bottom surface of the positioning groove 4 is provided with several receiving grooves 5, which are used to receive the main body of the component 21 to be soldered. The space of the receiving groove 5 is larger than the volume of the main body of the component 21 to be soldered, so that the main body of the component 21 to be soldered can move within the receiving groove 5 without being fixed. A soldering window 6 is provided on the side of the receiving groove 5. The soldering window 6 is set close to the receiving groove 5 and connected to the receiving groove 5. Alternatively, a channel is provided between the receiving groove 5 and the soldering window 6 for the pins of the component 21 to be soldered to pass through and move, so that the pins of the component 21 to be soldered can extend to the soldering window 6. The position of the soldering window 6 should correspond to the position of the area to be soldered on the printed circuit board 20. The area of ​​the area to be soldered is much larger than the area of ​​the specific soldering point. Therefore, the opening area of ​​the soldering window 6 is also much larger than the area of ​​the specific soldering point.

[0030] To achieve precise welding by adjusting the pin position of the component 21 to a certain extent, a cavity 7 is provided in the insulating base 1. This cavity is connected to the receiving groove 5. Specifically, it can be connected to the receiving groove 5 through an opening on the side wall or bottom surface of the receiving groove 5. Preferably, it is connected through an opening on the side wall of the receiving groove 5. Several adjustment holes 8 communicating with the cavity 7 should be provided on the outer periphery of the insulating base 1. These adjustment holes 8 are preferably strip-shaped holes arranged around the outer periphery of the cavity 7, so as to facilitate the subsequent movement of the adjustment rod 3 and the operation of personnel.

[0031] The adjusting rod 3 can extend into the cavity 7 through the adjusting hole 8 and pass through the opening on the wall or bottom of the receiving groove 5 to push the body of the component to be soldered 21 to move within the receiving groove 5, thereby changing the pin position of the component to be soldered 21.

[0032] To prevent the insulating base 1 and the insulating cover 2 from directly contacting the printed circuit board 20, thereby squeezing and damaging the printed circuit board 20 or generating static electricity, anti-static pads 9 are respectively provided on the surface of the positioning groove 4 of the insulating base 1 and the lower surface of the insulating cover 2. When the insulating base 1 and the insulating cover 2 are closed together, the anti-static pads 9 press and clamp the printed circuit board 20 from the upper and lower sides.

[0033] The following supplementary explanations are provided regarding the scope of application and usage of this application: The component 21 to be soldered in this application should have a certain volume, rather than being an extremely small chip, so that the operator can move the position of the component 21 to be soldered by adjusting the lever 3. The pins of the component 21 to be soldered should extend to the side of its body so that the pins can be located within the soldering window 6. For example, see Figure 8 Several capacitors need to be soldered on the printed circuit board 20 of the SSD solid-state drive. These capacitors have been pre-interconnected to form a row of capacitor groups. Pins are led out on both sides of this row of capacitor groups. This row of capacitor groups is the component to be soldered 21 in this application.

[0034] When using the device, the main body of the component to be soldered 21 should be placed in the receiving groove 5, and the pins of the component to be soldered 21 should be basically placed at the soldering window 6. The soldering surface of the printed circuit board 20 should face the bottom surface of the positioning groove 4 and be positioned in the positioning groove 4. The insulating cover plate 2 should be covered so that the printed circuit board 20 is clamped between the insulating base 1 and the insulating cover plate 2. The insulating base 1 and the insulating cover plate 2 that have been fastened together should be flipped so that the soldering window 6 of the insulating base 1 faces upward, which facilitates subsequent soldering operations. The operator can also adjust the position of the main body of the component to be soldered 21 by adjusting the adjusting rod 3, thereby changing the position of the pins of the component to be soldered 21 to achieve precise positioning.

[0035] Example 2 See Figure 7 Based on the above embodiment 1, this embodiment describes a specific structure of the insulating base 1.

[0036] The insulating base 1 includes an upper plate 10 and a lower plate 11 spaced apart. The upper plate 10 and the lower plate 11 are connected by a side wall 12 and together enclose a cavity 7. Preferably, the outer peripheries of the upper plate 10 and the lower plate 11 are connected by the side wall 12 to form the cavity 7.

[0037] The positioning groove 4 and the receiving groove 5 are located on the upper surface of the upper plate 10. The upper surface of the cavity 7 may not be flat and may have a protrusion occupying the receiving groove 5. The welding window 6 is respectively opened on the upper plate 10 and the lower plate 11, and the positions should correspond.

[0038] To prevent dust and impurities from falling into the cavity and adhering to the solder joints or printed circuit board 20, this embodiment adds a dustproof plate 13 based on the above technical solution. The shape of the dustproof plate 13 matches the opening shape of the welding window 6 and is detachably installed at the welding window 6 opened in the lower plate 11. Specifically, the detachable method can be to directly clip the dustproof plate 13 onto the welding window 6 and fix it by the friction between the two, or to set a snap-fit ​​device or other device on the dustproof plate 13 and the welding window 6 for detachable connection. The following is a method of setting a snap-fit ​​device for detachable connection: a number of latches 14 are provided on the outer periphery of the dustproof plate 13. Here, the latches 14 are preferably set in pairs on the two pairs of side walls of the dustproof plate 13. The welding window 6 hole wall of the lower plate 11 is provided with a slot 15 that matches the number and shape of the latches 14. The dustproof plate 13 can deform itself so that the latches 14 can be inserted into or removed from the slot 15, thereby realizing the detachable installation of the dustproof plate 13. To facilitate the detachable installation of the dustproof plate 13 at the welding window 6, and especially to facilitate the removal of the dustproof plate 13 from the welding window 6, a handle 16 is provided on the lower surface of the dustproof plate 13 to facilitate operation by the operator.

[0039] Example 3 Based on the above embodiment 1, this embodiment makes further improvements to the adjusting rod 3.

[0040] One end of the adjusting rod 3 is provided with a component holding part 17. The component holding part 17 can be specifically configured as a ring or have a curved claw shape, so as to hold the main body of the component 21 to be soldered. The component holding part 17 is provided with a relief groove 19 for avoiding the pins of the component 21 to be soldered. The method of using this adjusting rod 3 is as follows: The adjusting rod 3 is pre-inserted into the cavity 7 of the insulating base 1, and the component holding part 17 of the adjusting rod 3 is inserted into the corresponding receiving groove 5. The main body of the component 21 to be soldered is held, and then the printed circuit board 20 is placed into the positioning groove 4. After the insulating cover plate 2 is covered, the position of the component to be soldered is finely adjusted by adjusting the adjusting rod 3.

[0041] In order to better achieve the purpose of this application, the following common descriptions and improvements are made based on the above embodiments: The insulating base 1 and the insulating cover 2 are hinged to each other by a hinge 18. The hinge 18 can be a hinge. Hinging the insulating base 1 and the insulating cover 2 together facilitates precise fitting of the two and reduces the number of parts, making it easier for operators to use.

[0042] The antistatic soft pad 9 can be made of antistatic EVA foam, which is a foam material made of ethylene-vinyl acetate copolymer (EVA). Of course, it can also be made of materials with similar properties.

[0043] The insulating base 1 and the insulating cover 2 can be made of engineering plastics, or of course, materials with similar properties can be selected.

[0044] The above specific embodiments further illustrate the purpose, technical solution, and beneficial effects of the present invention. It should be understood that the above are merely specific embodiments of the present invention and are not intended to limit the scope of protection of the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the scope of protection of the present invention.

Claims

1. A soldering fixture for printed circuit boards, characterized in that: It includes an insulating base (1), an insulating cover plate (2), and several adjusting rods (3); The upper surface of the insulating base (1) is provided with a plurality of positioning grooves (4) for positioning the printed circuit board (20). The bottom of the positioning groove (4) is provided with several receiving grooves (5). The receiving grooves (5) are used to receive the main body of the component (21) to be soldered. The side of the receiving groove (5) is provided with a welding window (6). The pins of the component (21) to be soldered are located at the welding window (6). The welding window (6) corresponds to the position of the area to be soldered on the printed circuit board (20). The insulating base (1) has a cavity (7) inside. The cavity (7) is connected to the receiving groove (5) through an opening on the side wall or bottom surface of the receiving groove (5). The outer periphery of the insulating base (1) has several adjustment holes (8) that are connected to the cavity (7). The adjusting rod (3) is used to extend from the adjusting hole (8) into the cavity (7) to push the body of the component to be welded (21) to move within the receiving groove (5); The positioning groove (4) and the lower surface of the insulating cover plate (2) are respectively provided with antistatic pads (9). When the insulating base (1) and the insulating cover plate (2) are closed together, the antistatic pads (9) press the printed circuit board (20) from the upper and lower sides.

2. The soldering fixture for printed circuit boards as claimed in claim 1, wherein: The insulating base (1) includes an upper plate (10) and a lower plate (11) spaced apart. The upper plate (10) and the lower plate (11) are connected by a side wall (12) and together enclose the cavity (7). The positioning groove (4) and the receiving groove (5) are located on the upper surface of the upper plate (10), and the welding window (6) is respectively opened at the corresponding positions of the upper plate (10) and the lower plate (11).

3. The soldering fixture for printed circuit boards as claimed in claim 2, wherein: It also includes a dustproof plate (13), which is detachably installed at the welding window (6) opened in the lower plate (11).

4. The soldering fixture for printed circuit boards as claimed in claim 3, wherein: The outer periphery of the dustproof plate (13) is provided with several tabs (14), and the welding window (6) hole wall of the lower plate (11) is provided with a slot (15) that matches the tabs (14). The latch (14) can be engaged or disengaged from the slot (15), thereby enabling the dustproof plate (13) to be detachably installed.

5. The soldering fixture for printed circuit boards as claimed in claim 3 or 4, characterized in that: A handle (16) is provided on the lower surface of the dustproof plate (13).

6. The soldering fixture for printed circuit boards of claim 1, wherein: One end of the adjusting rod (3) is provided with a component holding part (17), which is used to hold the body of the component (21) to be soldered.

7. The soldering fixture for printed circuit boards of claim 1, wherein: The receiving groove (5) is connected to the cavity (7) through an opening in its bottom and / or wall.

8. The soldering fixture for printed circuit boards of claim 1, wherein: The insulating base (1) and the insulating cover plate (2) are hinged to each other by a hinge (18).

9. The soldering fixture for printed circuit boards of claim 1, wherein: The antistatic pad (9) is made of antistatic EVA foam.

10. The soldering fixture for printed circuit boards as claimed in claim 6, wherein: The component holding part (17) is provided with a relief groove (19) for avoiding the pins of the component (21) to be soldered.

Images