A polishing apparatus for sapphire processing

Abstract

The utility model provides a kind of polishing device of sapphire processing, it is related to sapphire production and processing device field, solve the problem that sapphire polishing needs multiple equipment in prior art, transfer process is complicated and prone to cause workpiece damage Polishing disc, including polishing pedestal and the overturning polishing table being set on it, the overturning polishing table has oppositely arranged first work surface and second work surface, two work surfaces are all installed with polishing disc Polishing disc;The polishing pedestal is provided with the polishing groove corresponding with polishing disc, workpiece disc Polishing disc for fixing sapphire workpiece is equipped in groove, overturning polishing table is connected with polishing pedestal by lifting mechanism and overturning mechanism, lifting mechanism drives polishing table to move up and down to make polishing disc contact or separate from workpiece, overturning mechanism drives polishing table overturning to switch different work surface and process Polishing disc, the utility model integrates coarse polishing and fine polishing procedure, significantly improves production efficiency and product yield.

Description

Technical Field

[0001] This utility model relates to the field of sapphire production and processing equipment, specifically to a polishing device for sapphire processing. Background Technology

[0002] Sapphire is widely used in high-end manufacturing due to its high hardness and excellent optical properties, and its processing requires extremely high surface quality. Typically, the processing of a single side of a sapphire wafer requires two core steps: rough polishing and fine polishing. Rough polishing is used to quickly remove the damaged layer left after surface cutting and grinding, achieving better flatness; fine polishing, on the other hand, further improves the surface finish based on rough polishing, achieving a mirror-like effect.

[0003] In the existing production process, rough polishing and fine polishing are usually completed by two independent special equipment. The operation process is as follows: First, the operator fixes the sapphire workpiece to be processed on a rough polishing machine for rough polishing; after the rough polishing is completed, the entire workpiece disc with the workpiece fixed on it needs to be removed from the rough polishing machine, transferred to a fine polishing machine, re-aligned and installed, and then fine polishing is performed.

[0004] This separate processing flow has the following technical problems: 1. The transfer, unloading and reinstallation of workpieces between two machines takes a lot of time, resulting in a discontinuous production process and low overall efficiency. 2. During the transfer from the rough polishing machine to the fine polishing machine, the surface of the workpiece that has undergone preliminary treatment is completely exposed and is highly susceptible to secondary contamination from dust and particles in the environment, or to accidental scratches and bumps during handling, which directly affects the final fine polishing quality and product yield. 3. It is difficult to ensure that the two independent clamping and positioning processes are completely consistent, which may introduce positioning errors and affect the uniformity and accuracy of subsequent fine polishing. Utility Model Content

[0005] In order to overcome the problems in the prior art, this utility model provides a polishing device for sapphire processing, which solves the problems of the prior art that sapphire polishing requires two devices, the intermediate transfer process is cumbersome, it is easy to cause secondary pollution and damage, and the production efficiency is low. It provides an automated polishing device that integrates rough polishing and fine polishing functions.

[0006] A polishing apparatus for sapphire processing includes a polishing base and a flip-type polishing table disposed on the polishing base. The flip-type polishing table has a first working surface and a second working surface disposed opposite to each other. At least one polishing disc is mounted on each of the first and second working surfaces. The polishing base is provided with polishing grooves corresponding to the first and second working surfaces, and a workpiece disc for fixing the sapphire to be polished is disposed in the polishing groove. The flip-type polishing table is connected to the polishing base through a lifting mechanism and a flipping mechanism. The lifting mechanism drives the flip-type polishing table to move vertically so that the polishing disc contacts or separates from the sapphire workpiece on the workpiece disc. The flipping mechanism drives the flip-type polishing table to flip and switch the first working surface or the second working surface to face the workpiece disc.

[0007] Furthermore, the polishing disc on the first working surface is a coarse polishing disc, and the polishing disc on the second working surface is a fine polishing disc.

[0008] Furthermore, each polishing disc on the first and second working surfaces is driven to rotate by an independent polishing motor.

[0009] Furthermore, the lifting mechanism includes a lifting motor mounted on the polishing base, a lead screw connected to the lifting motor, and a guide rail slider assembly connected to the flip-type polishing table; the flipping mechanism includes a flipping motor and a flipping shaft mounted on the flip-type polishing table, the flipping shaft being fixed to the flip-type polishing table and rotatably mounted at both ends to the guide rail slider assembly, and the power input end of the flipping shaft being connected to the power output end of the flipping motor.

[0010] Furthermore, the workpiece disk is a vacuum adsorption type workpiece disk, and the polishing base is provided with a workpiece disk motor that drives the workpiece disk to rotate.

[0011] Furthermore, the polishing tank is equipped with an interface for connecting to an external liquid supply system for supplying polishing liquid and an external liquid discharge system for discharging waste liquid.

[0012] Furthermore, the sapphire polishing apparatus also includes a central control system, which is electrically connected to the lifting mechanism, the tilting mechanism, and the drive motors of the polishing disc and the workpiece disc.

[0013] Compared with the prior art, the beneficial effects of this utility model are: 1. This application integrates rough polishing and fine polishing functions into the same machine. After the sapphire workpiece is clamped once, the entire process from rough polishing to fine polishing can be completed without moving the workpiece, through the automatic rotation of the polishing table. This eliminates the transfer and waiting time between machines, realizes continuous production, and greatly improves production efficiency.

[0014] 2. In this application, the workpiece is always fixed and protected in the polishing tank during the transition between rough polishing and fine polishing processes, which completely avoids contact with the external environment and manual handling, fundamentally eliminating the risk of secondary pollution and scratches, ensuring the surface quality before fine polishing, and thus significantly improving the yield of the final product.

[0015] 3. The entire rough and fine polishing conversion process of this application is automatically controlled by the program, which reduces manual intervention, ensures the consistency and stability of process parameters, and improves the accuracy and reliability of processing. Attached Figure Description

[0016] To clearly illustrate the technical solutions in the embodiments of this utility model, the accompanying drawings used in the description of the embodiments are explained.

[0017] Figure 1 This is a schematic diagram of the overall structure of this utility model; Figure 2 This is a schematic diagram of the rear structure of this utility model; Figure 3 This is a schematic diagram of the bottom structure of this utility model; Figure 4 This is a schematic diagram of the structure of the flip-type polishing table of this utility model; Figure 5 This is a schematic diagram of the second working surface of the flip-type polishing table of this utility model. Figure 6 This is a schematic diagram of the polishing base structure of this utility model; Figure 7 This is a schematic diagram of the side structure of the polishing base of this utility model.

[0018] Reference numerals in the attached drawings: A-polishing base, B-flipping polishing table, B1-first working surface, B2-second working surface, B3-polishing tank, B4-workpiece tray, B5-workpiece tray motor, C-lifting mechanism, C1-lifting motor, C2-lead screw, C3-guide rail slider assembly, D-flipping mechanism, D1-flipping motor, D2-flipping shaft, E-polishing disc, E1-rough polishing disc, E2-fine polishing disc, E3-polishing motor, G-central control system. Detailed Implementation

[0019] To make the objectives, technical solutions, and beneficial effects of this utility model clearer, the preferred embodiments of this utility model will be described in detail below with reference to the accompanying drawings, so as to facilitate the understanding of those skilled in the art.

[0020] See Figure 1 , Figure 2 , Figure 3This utility model proposes a polishing device for sapphire processing, including a polishing base A as the equipment base, and a flip-type polishing table B that can be raised, lowered and flipped. The polishing base A is a box structure that provides stable support for the entire device. At the top of the polishing base A, there is a polishing tank B3 to fix the sapphire semi-finished product to be polished and to hold the polishing liquid. Inside the center of the polishing tank B3, there is a workpiece disk B4 for fixing the sapphire to be polished. In this preferred embodiment, the workpiece disk B4 is a vacuum adsorption type workpiece disk with a flat upper surface and vacuum adsorption holes. It is connected to an external vacuum generator through internal pipelines, which can firmly and evenly adsorb the sapphire workpiece onto the working surface. At the same time, the workpiece disk B4 is connected to the workpiece disk motor B5 installed inside the polishing base A through a rotating shaft to drive the workpiece to rotate during the polishing process to ensure polishing uniformity. The polishing tank B3 is also provided with a liquid supply port and a liquid drain port for connecting to an external liquid supply system and a liquid drain system.

[0021] See Figure 4 , Figure 5 The rotating polishing table B is a disc-shaped box with a first working surface B1 and a second working surface B2 facing each other. At least one circular polishing disc E is mounted on each working surface, four in this embodiment. To achieve integrated roughing and finishing, the first working surface B1 is equipped with a rough polishing disc E1, while the second working surface B2 is equipped with a fine polishing disc E2. Inside the polishing table B, each polishing disc E is driven by an independent polishing motor E3, allowing for independent control of the rotation speed of each disc to adapt to different process requirements.

[0022] See Figure 6 , Figure 7 The lifting and tilting motion of the tilting polishing table B is achieved by the lifting mechanism C and the tilting mechanism D. The lifting mechanism C is symmetrically arranged on both sides of the polishing base A. Each lifting mechanism C includes a lifting motor C1 mounted on the base A, a vertical lead screw C2 connected to it, and a set of guide rail slider assembly C3. The lifting motor C1 drives the lead screw C2 to rotate, and the lead screw C2 drives the slider on the guide rail slider assembly C3, which is supported and rotated at the top, to make a smooth up and down linear motion along the guide rail. See Figure 4-7 A horizontal rotating shaft D2 is fixed at the center of the rotating polishing table B. The two ends of the rotating shaft D2 are rotatably connected to the bearings of the slider part of the guide rail slider assembly C3 on both sides. The entire polishing table B is suspended between two lifting mechanisms C through the rotating shaft D2 and rises and falls together with them. One end of the rotating shaft D2 is connected to the rotating motor D1 through the transmission mechanism. When the rotating motor D1 is started, it can drive the rotating shaft D2, thereby driving the entire rotating polishing table B to rotate 180°.

[0023] See Figure 1 The entire device is operated by a central control system G, which is electrically connected to the lifting motor C1, the tilting motor D1, the polishing motor E3, the workpiece tray motor B5, and all auxiliary systems such as liquid supply, liquid drainage, and vacuum, to achieve fully automated operation.

[0024] Work process: The operator places a sapphire workpiece to be processed on workpiece tray B4 and starts the vacuum system to adsorb and fix it. The central control system G issues a command, and the flipping mechanism D first ensures that the first working surface B1 (rough polishing disc E1) faces the workpiece disc B4; then, the lifting mechanism C drives the entire polishing table B to descend until the rough polishing disc E1 gently contacts the surface of the sapphire workpiece and applies the set polishing pressure; at the same time, the liquid supply system starts to supply the rough polishing liquid, and the workpiece disc motor B5 and the polishing motors E3 of all the rough polishing discs E1 start to begin the first rough polishing of the workpiece. After the rough polishing reaches the predetermined time or effect, all motors stop and the liquid supply stops; the lifting mechanism C drives the polishing table B to rise, so that it is separated from the workpiece; then, the flipping motor D1 of the flipping mechanism D starts, flipping the polishing table B 180°, so that the second working surface B2 (fine polishing disk E2) is turned downwards, facing the workpiece disk B4. The lifting mechanism C drives the polishing table B to descend again, so that the fine polishing disc E2 comes into contact with the surface of the workpiece that has just been rough polished, and applies fine polishing pressure. The liquid supply system switches to supply fine polishing liquid, the relevant motors start, and the workpiece begins to undergo the second fine polishing. After fine polishing is completed, polishing table B rises and resets, the vacuum system is released, and the operator can then remove the finished workpiece that has completed both rough and fine polishing processes on one side. Throughout the process, the workpiece does not require any manual handling or secondary positioning.

[0025] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and the inventive concept of the present utility model, should be included within the protection scope of the present utility model.

Claims

1. A polishing apparatus for sapphire processing, characterized in that, The device includes a polishing base (A) and a flip-type polishing table (B) disposed on the polishing base (A). The flip-type polishing table (B) has a first working surface (B1) and a second working surface (B2) disposed opposite to each other. At least one polishing disc (E) is mounted on both the first working surface (B1) and the second working surface (B2). The polishing base (A) is provided with a polishing groove (B3) corresponding to the first working surface (B1) and the second working surface (B2). A workpiece disc (B4) for fixing sapphire to be polished is disposed in the polishing groove (B3). The flip-type polishing table (B) is connected to the polishing base (A) through a lifting mechanism (C) and a flipping mechanism (D). The lifting mechanism (C) drives the flip-type polishing table (B) to move vertically so that the polishing disc (E) contacts or separates from the sapphire workpiece on the workpiece disc (B4). The flipping mechanism (D) drives the flip-type polishing table (B) to flip and switch the first working surface (B1) or the second working surface (B2) to face the workpiece disc (B4).

2. The polishing apparatus for sapphire processing according to claim 1, characterized in that: The polishing disc (E) on the first working surface (B1) is a coarse polishing disc (E1), and the polishing disc (E) on the second working surface (B2) is a fine polishing disc (E2).

3. A polishing apparatus for sapphire processing according to claim 1 or 2, characterized in that: Each polishing disc (E) on the first working surface (B1) and the second working surface (B2) is driven to rotate by an independent polishing motor (E3).

4. The polishing apparatus for sapphire processing according to claim 1, characterized in that: The lifting mechanism (C) includes a lifting motor (C1) mounted on the polishing base (A), a lead screw (C2) connected to the lifting motor (C1), and a guide rail slider assembly (C3) connected to the flip-type polishing table (B); the flipping mechanism (D) includes a flipping motor (D1) and a flipping shaft (D2) mounted on the flip-type polishing table (B). The flipping shaft (D2) is fixed to the flip-type polishing table (B) and its two ends are rotatably mounted to the guide rail slider assembly (C3). The power input end of the flipping shaft (D2) is connected to the power output end of the flipping motor (D1).

5. The polishing apparatus for sapphire processing according to claim 1, characterized in that: The workpiece disk (B4) is a vacuum adsorption type workpiece disk, and the polishing base (A) is provided with a workpiece disk motor (B5) that drives the workpiece disk (B4) to rotate.

6. The polishing apparatus for sapphire processing according to claim 1, characterized in that: The polishing tank (B3) is equipped with an interface for connecting to an external liquid supply system for supplying polishing liquid and an external liquid discharge system for discharging waste liquid.

7. The polishing apparatus for sapphire processing according to claim 1, characterized in that: The sapphire polishing apparatus further includes a central control system (G), which is electrically connected to the lifting mechanism (C), the tilting mechanism (D), and the drive motors of the polishing disc (E) and the workpiece disc (B4).

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