A new chip tin pad for mobile phone maintenance

Abstract

The utility model provides a novel chip tin -planting pad for mobile phone maintenance, including tin -planting pad body still includes the placement area, the placement area includes first placement area, second placement area and third placement area, and the placement area is the recess structure, the jack is set up in the side of tin -planting pad body, and the plugboard is placed in the jack, the adjusting mechanism, the adjusting mechanism includes the fixed frame on tin -planting pad body, be provided with adjusting bolt on the fixed frame, the adjusting bolt is connected with the screw sleeve, the screw sleeve is connected with second magnetic sheet, second magnetic sheet is connected with third placement area, and the advantage is not only can realize the effect of wide range of application, and simple structure, convenient operation.

Description

Technical Field

[0001] This utility model relates to the technical field of soldering for mobile phone chips, and specifically to a novel chip soldering pad for mobile phone repair. Background Technology

[0002] When repairing faulty motherboards and chips in mobile phones, it is necessary to apply solder to the motherboards and chips before soldering to repair the fault. During the soldering process, a soldering station is needed for auxiliary positioning. The soldering station fixes and limits the motherboard and solder mesh, so that the solder paste passes through the through-holes and is accurately placed on the contact points to be soldered, thereby improving the success rate of soldering.

[0003] Existing solder pads have a narrow range of applications, only suitable for soldering chips of a few different thicknesses.

[0004] A patent publication number CN219666567U, entitled "A Soldering Platform for Mobile Phone Repair," was found. The patent discloses a soldering platform for mobile phone repair, comprising a base. A soldering mesh is snapped onto the top surface of the base, and a limiting plate is snapped onto the bottom surface. A positioning groove is centrally located on the top surface of the base, and two clamping plates are slidably connected inside the positioning groove. Two protective sleeves are provided on the opposite surfaces of the base and the limiting plate, and magnetic blocks are snapped onto the inside of each protective sleeve. An adjustment mechanism is straddling the lower opposite surfaces of the two protective sleeves. The adjustment mechanism includes a sliding bar, with rotating rods movably connected to both ends inside the sliding bar. A threaded ring is fixedly connected to the inner end of each rotating rod, and two fixing blocks are fixedly connected to the middle of the rotating rod. A movable ring is movably sleeved on the outer side of each fixing block.

[0005] Analysis of the publicly available materials shows that it can adapt to chips of different sizes and specifications, but the structure is too complex and inconvenient to adjust. Utility Model Content

[0006] In view of this, the present invention provides a novel chip solder pad for mobile phone repair, which not only achieves a wide range of applications, but also has a simple structure and is easy to operate.

[0007] To solve the above-mentioned technical problems, this utility model provides a novel chip solder pad for mobile phone repair, including a solder pad body and further comprising... The placement area includes a first placement area, a second placement area, and a third placement area, wherein the placement area has a groove structure; A socket is provided on the side of the solder pad body, and a plug plate is placed in the socket; The adjustment mechanism includes a fixing frame mounted on the solder pad body, an adjustment bolt mounted on the fixing frame, a screw sleeve connected to the adjustment bolt, a second magnetic sheet connected to the screw sleeve, and a third placement area connected to the second magnetic sheet.

[0008] Furthermore, the groove depths of the first, second, and third placement areas are different, which are used to place chips of different thicknesses.

[0009] Furthermore, each of the first and second placement areas has a socket below it. The insert plate is inserted into the socket, and a first magnetic sheet is provided on the insert plate. A plug is provided at the end of the insert plate. When the plug is flush with the outer side of the solder pad body, the first magnetic sheet moves to the bottom of the first and second placement areas.

[0010] Furthermore, the fixing frame and the solder pad body are fixedly connected. The fixing frame is placed horizontally, and a hole is provided in the middle of the fixing frame. This hole is a through hole, and an adjusting bolt is connected to the through hole.

[0011] Furthermore, the third placement area has a block structure, and the third placement area and the solder pad body are slidably connected. The lower end of the third placement area is fixedly connected to the second magnetic sheet.

[0012] Furthermore, a screw sleeve is fixedly provided on the lower end face of the second magnetic sheet. The screw sleeve is vertically arranged and connected to an adjusting bolt.

[0013] Furthermore, a guide rod is provided at the lower end of the second magnetic sheet, the guide rod passing through the fixing frame and being slidably connected to the fixing frame.

[0014] The beneficial effects of the above-mentioned technical solution of this utility model are as follows: 1. By setting an adjustable third placement area, it can achieve a wide range of applications.

[0015] 2. The structure is simple and easy to operate. The first magnetic sheet can be placed using a plug-in mechanism with insert plates and holes. The height of the third placement area can be adjusted by tightening the threaded connection of adjusting bolts and sleeves. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the structure of this utility model; Figure 2 for Figure 1 A structural diagram from another perspective; Figure 3 for Figure 2 Enlarged view of section A in the middle; In the diagram: 1. Plating pad body; 2. First placement area; 3. Second placement area; 4. Third placement area; 5. Insertion hole; 6. Insertion plate; 7. First magnetic piece; 8. Plug; 9. Operating hole; 10. Fixing bracket; 11. Second magnetic piece; 12. Adjusting bolt; 13. Screw sleeve; 14. Guide rod. Detailed Implementation

[0017] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the following will be described in conjunction with the accompanying drawings of the embodiments of this utility model. Figures 1 to 3 The technical solutions of the embodiments of this utility model are clearly and completely described herein. Obviously, the described embodiments are only some, not all, of the embodiments of this utility model. All other embodiments obtained by those skilled in the art based on the described embodiments of this utility model are within the protection scope of this utility model.

[0018] like Figures 1 to 3 As shown: Example

[0019] A novel chip solder pad for mobile phone repair includes a solder pad body 1 and a placement area, which includes a first placement area 2, a second placement area 3, and a third placement area 4, and the placement area has a groove structure; an insertion hole 5 is disposed on the side of the solder pad body 1, and an insertion plate 6 is placed in the insertion hole 5; and an adjustment mechanism, which includes a fixing frame 10 disposed on the solder pad body 1, an adjusting bolt 12 disposed on the fixing frame 10, a screw sleeve 13 connected to the adjusting bolt 12, the screw sleeve 13 connected to a second magnetic sheet 11, and the second magnetic sheet 11 connected to the third placement area 4.

[0020] In this embodiment, three placement areas are provided. The first placement area 2 and the second placement area 3 have a fixed thickness. Generally, the first placement area 2 is for chips with a thickness of 0.3 mm, and the second placement area 3 is for chips with a thickness of 0.5 mm. The thickness of the third placement area 4 is adjustable. The thickness is adjusted by an adjustment mechanism to accommodate chips of different thicknesses. Specifically, the adjustment mechanism includes a fixing frame 10 set on the solder pad body 1. An operation hole 9 is provided at the bottom of the solder pad body 1. The fixing frame 10 is set in the operation hole 9. The fixing frame 10 is connected to an adjustment bolt 12. The adjustment bolt 12 is connected to a second magnetic sheet 11. The second magnetic sheet 11 is connected to the third placement area 4. By adjusting the adjustment bolt 12, the height of the third placement area 4 can be changed. Example

[0021] The grooves in the first placement area 2, the second placement area 3, and the third placement area 4 have different depths, which are used to place chips of different thicknesses.

[0022] Unlike the above embodiments, in this embodiment, the groove depths of the first placement area 2 and the second placement area 3 are different, which is suitable for placing chips of different thicknesses. Example

[0023] Both the first placement area 2 and the second placement area 3 have insertion holes 5 below them. The insertion plate 6 is inserted into the insertion hole 5. The insertion plate 6 is provided with a first magnetic sheet 7. The end of the insertion plate 6 is provided with a plug 8. When the plug 8 is flush with the outer side of the solder pad body 1, the first magnetic sheet 7 moves to the bottom of the first placement area 2 and the second placement area 3.

[0024] Unlike the above embodiments, in this embodiment, a socket 5 is provided below both the first placement area 2 and the second placement area 3. A plug plate 6 can be inserted into the socket 5. A first magnetic sheet 7 is provided on the plug plate 6, which is used to fix the chip by magnetic adsorption during the soldering process. A plug 8 is provided at the end of the plug plate 6, which can act as a plug for fixing the plug plate 6. Example

[0025] The fixing frame 10 and the solder pad body 1 are fixedly connected. The fixing frame 10 is placed horizontally. A hole is provided in the middle of the fixing frame 10. The hole is a through hole and the adjusting bolt 12 is connected to the through hole.

[0026] Unlike the above embodiments, in this embodiment, the fixing frame 10 and the solder pad body 1 are fixedly connected. A through hole is provided in the middle of the fixing frame 10. The through hole and the adjusting bolt 12 are threaded and slidably connected. The adjusting bolt 12 passes through the through hole and is connected to the screw sleeve 13. Example

[0027] The third placement area 4 is a block structure. The third placement area 4 and the solder pad body 1 are slidably connected. The lower end of the third placement area 4 is fixedly connected to the second magnetic sheet 11.

[0028] Unlike the above embodiments, in this embodiment, the second magnetic sheet 11 below the third placement area 4 is fixed together with the third placement area 4 and moves up and down with the second magnetic sheet 11. Example

[0029] A screw sleeve 13 is fixedly provided on the lower end face of the second magnetic sheet 11. The screw sleeve 13 is vertically arranged and connected to the adjusting bolt 12.

[0030] Unlike the above embodiments, in this embodiment, the screw sleeve 13 and the adjusting bolt 12 are threadedly connected, and the position of the second magnetic piece 11 can be adjusted by turning the adjusting bolt 12. Example

[0031] The lower end of the second magnetic sheet 11 is also provided with a guide rod 14, which passes through the fixing frame 10 and is slidably connected to the fixing frame 10.

[0032] Unlike the above embodiments, in this embodiment, in order to achieve stable adjustment of the second magnetic sheet 11, a guide rod 14 is provided on the lower end face of the second magnetic sheet 11, and the guide rod 14 and the fixing frame 10 are slidably connected.

[0033] The working method (or working principle) of this utility model: When this technology is in operation, if it is necessary to perform soldering on a thin chip, the chip is placed in the first placement area 2. Under the action of the first magnetic sheet 7, the chip is fixed in the first placement area 2, and then the soldering operation is performed after the soldering mesh is placed.

[0034] When the thickness increases, it can be placed in the second placement area 3. A magnetic sheet is also placed below the second placement area 3 to attract and fix the placed chip.

[0035] When thickness adjustment is required, place the chip in the third placement area 4, and then operate the adjustment screw 12 to adjust it. When the upper surface of the chip is flush with the upper surface of the solder pad body 1, the adjustment is complete. Then place the solder mesh and start the soldering operation.

[0036] In this utility model, unless otherwise explicitly specified and limited, for example, it can be a fixed connection, a detachable connection, or an integral part; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be a connection within two components or an interaction between two components. Unless otherwise explicitly limited, those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0037] The above description is the preferred embodiment of this utility model. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the principle of this utility model, and these improvements and modifications should also be considered within the protection scope of this utility model.

Claims

1. A novel chip solder pad for mobile phone repair, comprising a solder pad body (1), characterized in that: Also includes The placement area includes a first placement area (2), a second placement area (3) and a third placement area (4), and the placement area has a groove structure; A socket (5) is provided on the side of the solder pad body (1), and a plug plate (6) is placed in the socket (5); The adjustment mechanism includes a fixing frame (10) set on the solder pad body (1), an adjustment bolt (12) is provided on the fixing frame (10), the adjustment bolt (12) is connected to a screw sleeve (13), the screw sleeve (13) is connected to a second magnetic sheet (11), and the second magnetic sheet (11) is connected to a third placement area (4).

2. The novel chip solder pad for mobile phone repair according to claim 1, characterized in that: The grooves in the first placement area (2), the second placement area (3), and the third placement area (4) have different depths and are used to place chips of different thicknesses.

3. The novel chip solder pad for mobile phone repair according to claim 2, characterized in that: A socket (5) is provided below the first placement area (2) and the second placement area (3). The insert plate (6) is inserted into the socket (5). A first magnetic piece (7) is provided on the insert plate (6). A plug (8) is provided at the end of the insert plate (6). When the plug (8) is flush with the outer side of the solder pad body (1), the first magnetic piece (7) moves to the bottom of the first placement area (2) and the second placement area (3).

4. The novel chip solder pad for mobile phone repair according to claim 3, characterized in that: The fixing frame (10) and the solder pad body (1) are fixedly connected. The fixing frame (10) is placed horizontally. A hole is provided in the middle of the fixing frame (10). The hole is a through hole. The adjusting bolt (12) is connected to the through hole.

5. The novel chip solder pad for mobile phone repair according to claim 4, characterized in that: The third placement area (4) is a block structure. The third placement area (4) and the tin pad body (1) are slidably connected. The lower end of the third placement area (4) is fixedly connected to the second magnetic sheet (11).

6. The novel chip solder pad for mobile phone repair according to claim 5, characterized in that: A screw sleeve (13) is fixedly provided on the lower end face of the second magnetic sheet (11). The screw sleeve (13) is vertically arranged and connected to an adjusting bolt (12).

7. A novel chip solder pad for mobile phone repair according to claim 6, characterized in that: The lower end of the second magnetic sheet (11) is also provided with a guide rod (14), which passes through the fixing frame (10) and is slidably connected to the fixing frame (10).

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