Silicon wafer debonding tooling

Abstract

This utility model discloses a silicon wafer debonding fixture, comprising: a frame; at least two clamping members located within the frame and capable of sliding along a first preset path on the frame; at least one support member located below the clamping members and capable of sliding along a second preset path on the frame; and an opening and closing mechanism, comprising a first plate slidably disposed vertically on the outer side of the frame, the first plate capable of driving the clamping members to slide along the first preset path; a second plate disposed on the inner side of the frame and fixedly connected to the first plate; and a connecting rod disposed on the inner side of the frame and rotatably connected to the frame, one end of the connecting rod being driven by the second plate to slide along a third preset path on the second plate, and the other end of the connecting rod being connected to the support member. This silicon wafer debonding fixture has a simple structure and can be used in conjunction with automated equipment to achieve automatic clamping and releasing of silicon wafers, thereby increasing production capacity and reducing labor costs. Furthermore, this silicon wafer debonding fixture can meet the needs of silicon wafers of different sizes and has high compatibility.

Description

Technical Field

[0001] This utility model relates to the field of silicon wafer processing, and in particular to a silicon wafer debonding tool. Background Technology

[0002] In the silicon wafer production process, silicon ingots are cut into wafers. After the silicon ingots are cut, a debinding machine is used to separate the silicon wafers from the wafer holders according to process requirements. Chinese utility model patent CN212498395U discloses a self-locking debinding fixture. It describes a downward transmission rod connected to a self-locking device via a transmission rod height adjustment device, and the self-locking device is equipped with a manual release button. After debinding using this fixture, the unloading operator removes the wafer holder, arranges the material, and then uses the manual release button to release the self-lock before the material can be further removed from the debinding fixture. Due to the limitations of this structure, the silicon wafer debinding process cannot be fully automated, increasing labor costs and resulting in lower production capacity. Furthermore, this debinding fixture is not compatible with silicon wafers and wafer holders of different sizes, failing to meet diverse production needs and exhibiting low versatility. Therefore, there is an urgent need to improve the existing debinding fixture. Summary of the Invention

[0003] To overcome the shortcomings of the prior art, this utility model provides a silicon wafer debonding fixture. The silicon wafer debonding fixture has a simple structure and can be used with automated equipment to automatically clamp and release silicon wafers, thereby increasing production capacity and reducing labor costs. Moreover, the silicon wafer debonding fixture can meet the needs of silicon wafers of different sizes and has high compatibility.

[0004] To achieve the above objectives, the technical solution adopted by this utility model is: a silicon wafer debonding fixture, comprising:

[0005] frame;

[0006] At least two clamping members are located within the frame and are slidable along a first preset path on the frame;

[0007] At least one support member is located below the clamping member and is slidable along a second predetermined path on the frame;

[0008] The opening and closing mechanism includes a first plate that is slidably disposed on the outside of the frame in a vertical direction, the first plate being able to drive the clamping member to slide along a first preset path, a second plate disposed on the inside of the frame and fixedly connected to the first plate, and a connecting rod disposed on the inside of the frame and rotatably connected to the frame, one end of the connecting rod being driven by the second plate to slide along a third preset path on the second plate, and the other end of the connecting rod being connected to the supporting member.

[0009] The first plate slides vertically relative to the frame, switching between a first state and a second state. The first state is when the first plate slides to the top of the frame. The second state is when the first plate slides to the top of the frame. While the first plate slides, it causes the clamping member to slide along a first preset path, and simultaneously causes the second plate to rotate the connecting rod. The first end of the connecting rod slides along a third preset path, and the second end of the connecting rod causes the supporting member to slide along a second preset path. Specifically, when the first plate slides from the second state to the first state, the clamping member and the supporting member slide towards the outside of the frame, so that when the first plate is in the first state, the clamping member and the supporting member are in an open state. When the first plate slides from the first state to the second state under the influence of gravity, the clamping member and the supporting member slide towards the middle of the frame, so that when the first plate is in the second state, the clamping member and the supporting member are in a closed state. When the clamping and supporting components are in the open state, the space between the opposing clamping components is greater than the width of the silicon wafer. The supporting component is located near the frame, allowing the silicon wafer to be debonded to be placed inside the frame or dropped from the frame onto the support platform, thus automatically proceeding to the next process. When the clamping and supporting components are in the closed state, the opposing clamping components abut against the opposite sides of the silicon wafer to clamp it, preventing it from shaking or tipping over. The supporting component is located below the silicon wafer to support it.

[0010] It is understandable that an opening and closing mechanism can be provided at one end of the frame, or simultaneously at both ends of the frame. When opening and closing mechanisms are provided at both ends of the frame, both ends of a clamping member or a supporting member can be subjected to force simultaneously, which facilitates the control of the movement of the clamping member or the supporting member.

[0011] Preferably, the frame includes two opposing panels and a limiting piece detachably connected to the panels. Each panel has a through hole for the clamping member to pass through, and mounting holes surround the through hole. The limiting piece is detachably connected to the panel via a connector located within the mounting holes. The limiting piece has a first path hole for the clamping member to pass through, forming a first preset path for the clamping member to slide. Detachably connecting the limiting piece to the panels simplifies operation and reduces replacement costs when the first preset path needs to be changed, as only the limiting piece needs to be modified.

[0012] More preferably, the mounting holes include multiple holes arranged along the width direction of the frame, used to adjust the position of the limiting piece relative to the panel. Specifically, multiple sets of mounting holes are provided on the upper and lower sides of the through hole on the panel, and the limiting piece is connected to different sets of mounting holes to adjust the position of the limiting piece, that is, to adjust the position of the first path hole on the limiting piece, so as to meet the placement requirements of silicon wafers of different sizes.

[0013] Preferably, the first path hole includes a first inclined hole and a vertical hole extending downward from the bottom of the first inclined hole. The first inclined hole is inclined downward from the side of the limiting piece away from the middle of the frame. The vertical hole at the bottom of the first inclined hole can be used to limit the clamping member. When the clamping member is located in the vertical hole, the clamping member is in a closed state, that is, the opposing clamping member is used to clamp the silicon wafer inside. The vertical hole can lock the horizontal position of the clamping member, thereby ensuring its stable clamping of the silicon wafer.

[0014] Preferably, the first plate is provided with a first waist-shaped hole, the first waist-shaped hole is opposite to the first path hole, and the clamping member passes through both the first path hole and the first waist-shaped hole.

[0015] Preferably, the frame is provided with a second path hole, which forms a second preset path for the sliding of the support member. The second path hole is a second waist-shaped hole parallel to the first waist-shaped hole. The second plate is provided with a third path hole, which forms a third preset path for the sliding of the connecting rod. The third path hole is a second inclined hole parallel to the first inclined hole.

[0016] The clamping member's end passes through the through hole on the panel, the first path hole on the limiting piece, and the first oblong hole on the first plate. A bearing or steel sleeve is provided at the end of the clamping member, allowing it to rotate freely within the first path hole and the first oblong hole. The supporting member's end passes through the second oblong hole, and a bearing or steel sleeve is provided at the end of the supporting member, allowing it to rotate freely within the second oblong hole. One end of the connecting rod has a third oblong hole, through which the connecting rod is fitted onto the supporting member. The other end of the connecting rod slides within the second inclined hole. The middle of the connecting rod is rotatably connected to the frame via a pivot.

[0017] As the first plate slides upward, it simultaneously drives the second plate upward. Due to the cooperation of the first path hole and the first oblong hole, the clamping member is driven upward by the first plate and simultaneously tilts and slides outward towards the frame, gradually opening the internal placement space. The connecting rod is driven by the second plate, and due to the action of the pivot, the connecting rod rotates around the pivot. The end of the connecting rod connected to the second plate slides downward relative to the second plate along the second oblong hole. The end of the connecting rod sleeved with the support member drives the support member to slide outward towards the frame along the second oblong hole. Until the first plate slides to the top limit position, the clamping member and the support member are in the open state.

[0018] As the first plate slides downwards, it causes the second plate to slide downwards simultaneously. The clamping member is driven downwards by the first plate and simultaneously slides inwards towards the frame, gradually reducing the internal placement space. The connecting rod is driven by the second plate, and due to the action of the pivot, the connecting rod rotates around the pivot. The end of the connecting rod connected to the second plate slides upwards relative to the second plate along the second inclined hole. The end of the connecting rod sleeved on the support member drives the support member to slide inwards towards the frame along the second oblong hole. Until the first plate slides to the bottom limit position, the clamping member and the support member are in a closed state.

[0019] Preferably, the opening and closing mechanism further includes a sliding component, which includes a guide rail disposed vertically on the frame and a slider disposed on the first plate that cooperates with the guide rail.

[0020] Preferably, the frame includes two clamping members, which are arranged opposite to each other along the width direction of the frame. Arranging the clamping members opposite to each other along the width direction of the frame can improve the clamping effect on the silicon wafer.

[0021] Preferably, the clamping member and the supporting member are cylindrical, and the surface of the clamping member is provided with an elastic layer. The elastic layer can be made of silicone foam sponge tube, which has the characteristics of acid and alkali resistance and high temperature resistance. Providing an elastic layer on the clamping member can prevent damage to the silicon wafer when the clamping member applies clamping force.

[0022] Preferably, the top of the frame is provided with a support frame for placing the crystal tray, and the support frame is provided with positioning posts for positioning the crystal tray.

[0023] Due to the application of the above technical solution, the present invention has the following advantages compared with the prior art:

[0024] 1. The silicon wafer debonding fixture of this application has a simple structure and low manufacturing cost. It can cooperate with the lifting mechanism and control the position of the clamping and supporting parts by controlling the sliding of the first plate, so as to realize different functions of clamping and releasing. This is conducive to realizing a fully automated integrated process of silicon wafer production, increasing production capacity and reducing labor costs.

[0025] 2. The limiting plate of this silicon wafer debonding tool can be connected to different mounting positions on the panel, making it suitable for debonding silicon wafers of different sizes, with high versatility.

[0026] To make the above and other objects, features and advantages of this utility model more apparent and understandable, preferred embodiments are described below in detail with reference to the accompanying drawings. Attached Figure Description

[0027] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0028] Figure 1 This is a schematic diagram of the silicon wafer debonding fixture in the open state according to an embodiment of this utility model;

[0029] Figure 2 This is a schematic diagram of the closed state of the silicon wafer debonding fixture according to an embodiment of this utility model;

[0030] Figure 3 This is a schematic diagram of the connection between the panel and the first plate in an embodiment of this utility model;

[0031] Figure 4 This is a schematic diagram of the connection between the panel and the second plate in an embodiment of this utility model;

[0032] Figure 5 This is a schematic diagram of the connection between the panel and the limiting piece in an embodiment of this utility model;

[0033] Figure 6 This is a schematic diagram of a silicon wafer placed inside a silicon wafer debonding fixture according to an embodiment of the present invention;

[0034] Figure 7 This is a schematic diagram of the silicon wafer debonding fixture in the open state under the action of the lifting mechanism, according to an embodiment of this utility model.

[0035] The reference numerals in the above figures are as follows: 1. Frame; 11. Panel; 111. Mounting hole; 12. Limiting piece; 13. Connecting rod; 2. Clamping component; 3. Support component; 4. Opening and closing mechanism; 41. First plate; 411. First oblong hole; 42. Second plate; 43. Connecting rod; 431. Rotating shaft; 44. Sliding assembly; 5. First path hole; 6. Second path hole; 7. Third path hole; 8. Material to be processed; 81. Crystal holder; 82. Silicon wafer; 9. Support frame; 91. Positioning post; 10. Lifting mechanism. Detailed Implementation

[0036] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0037] Example 1: See Figures 1-7 As shown, a silicon wafer 82 debonding fixture includes a frame 1, two clamping members 2, two supporting members 3, and two opening and closing mechanisms 4. The clamping members 2 and the supporting members 3 are arranged parallel to each other within the frame 1, with the supporting members 3 located below the clamping members 2. The two opening and closing mechanisms 4 are respectively located at both ends of the frame 1 and are used to control the movement of the clamping members 2 and the supporting members 3.

[0038] See Figure 1 , 2 As shown, the frame 1 includes two opposing panels 11 and a connecting rod 13 connecting the two panels 11. Each panel 11 has two first path holes 5, and the end of the clamping member 2 passes through each first path hole 5. The first path holes 5 restrict the clamping member 2 from moving along a first preset path. Each panel 11 also has two second path holes 6, and the end of the supporting member 3 passes through each second path hole 6. The second path holes 6 restrict the supporting member 3 from moving along a second preset path. The second path holes 6 are horizontally arranged second oblong holes. The two second oblong holes are symmetrically arranged along the width direction of the frame 1. At least two connecting rods 13 are included, respectively located at the two top corners of the panel 11. Preferably, four connecting rods 13 are included, respectively located at the four corners of the panel 11. The top of the frame 1 has a first opening, through which the material to be processed 8 enters the silicon wafer 82 debonding fixture. The material to be processed 8 includes a crystal tray 81 and a silicon wafer 82 bonded to the crystal tray 81. The bottom of the frame 1 has a second opening, through which the silicon wafer 82, after being separated from the crystal holder 81, can be placed onto the support platform.

[0039] In an optional embodiment, the frame 1 further includes limiting plates 12. The number of limiting plates 12 is twice that of the clamping members 2. The limiting plates 12 are detachably connected to the panel 11. The panel 11 has a square through hole, and the limiting plates 12 have a first path hole 5. The end of the clamping member 2 passes through both the through hole on the panel 11 and the first path hole 5 on the limiting plate 12.

[0040] The first path hole 5 includes a first inclined hole and a vertical hole extending downward from the bottom of the first inclined hole. The first inclined hole is inclined downward from top to bottom on the side of the limiting piece 12 away from the middle of the frame 1. The vertical hole at the bottom of the first inclined hole can be used to limit the clamping member 2. When the clamping member 2 is located in the vertical hole, the clamping member 2 is in a closed state, that is, the opposing clamping member 2 is used to clamp the silicon wafer 82 inside it. The vertical hole can lock the horizontal position of the clamping member 2, thereby ensuring its stable clamping of the silicon wafer 82.

[0041] In an optional embodiment, the panel 11 has two square through holes symmetrically arranged along the width direction of the frame 1. Multiple sets of mounting holes 111 are arranged opposite each other on the upper and lower sides of the through holes, and these sets of mounting holes 111 are arranged along the width direction of the frame 1. The position of the limiting piece 12 is adjusted by connecting it to different sets of mounting holes 111, thereby adjusting the position of the first path hole 5 on the limiting piece 12 to meet the placement requirements of silicon wafers 82 of different sizes. The mounting holes 111 can be threaded holes. The limiting piece 12 has a fourth oblong hole. The fourth oblong hole is aligned with the mounting hole 111 to be connected, and the limiting piece 12 is connected to the panel 11 by screws simultaneously located in the fourth oblong hole and the mounting hole 111 to be connected.

[0042] The two ends of the clamping member 2 are respectively located in an opening and closing mechanism 4, and the two ends of the supporting member 3 are also respectively located in an opening and closing mechanism 4. The movement of the clamping member 2 and the supporting member 3 are simultaneously controlled by the two opening and closing mechanisms 4 arranged opposite to each other.

[0043] In an optional embodiment, the clamping member 2 is a cylindrical component, with bearings or steel sleeves at both ends, allowing the clamping member 2 to rotate within the panel 11 and the opening / closing mechanism 4. The surface of the clamping member 2 is provided with an elastic layer. This elastic layer can be made of silicone foam tubing, which is resistant to acids and alkalis and has high-temperature resistance. The elastic layer on the clamping member 2 prevents damage to the silicon wafer 82 when the clamping member 2 applies clamping force.

[0044] In an optional embodiment, the two clamping members 2 are arranged opposite each other along the width direction of the frame 1. Arranging the clamping members 2 opposite each other along the width direction of the frame 1 can improve the clamping effect on the silicon wafer 82.

[0045] In an optional embodiment, the support member 3 is a cylindrical member, and bearings or steel sleeves are provided at both ends of the support member 3, so that the support member 3 can rotate within the panel 11 and the opening and closing mechanism 4.

[0046] The opening and closing mechanism 4 includes a first plate 41, a second plate 42, a connecting rod 43, and a sliding assembly 44. (See also...) Figure 3 As shown, the first plate 41 is disposed on the outer side of the panel 11, and the first plate 41 is slidably connected to the frame 1 via the sliding assembly 44. Two first oblong holes 411 are symmetrically provided on the first plate 41 along the width direction of the frame 1. The first oblong holes 411 are opposite to the first path holes 5, and the end of the clamping member 2 passes through the first path hole 5 and is disposed within the first oblong hole 411. (See also...) Figure 4 As shown, the second plate 42 is disposed inside the panel 11. The second plate 42 is fixedly connected to the first plate 41. Specifically, the first plate 41 and the second plate 42 can be fixedly connected by multiple bolts that pass through the first plate 41, the panel 11, and the second plate 42 simultaneously. Two third path holes 7 are symmetrically provided on the second plate 42 along the width direction of the frame 1, and one end of the connecting rod 43 is slidably disposed within the third path hole 7. The third path hole 7 is used to restrict the movement of the connecting rod 43 along a third preset path. The third path hole 7 is a second inclined hole parallel to the first inclined hole. One end of the connecting rod 43 is provided with a third oblong hole, and the connecting rod 43 is sleeved on the support member 3 through the third oblong hole. The other end of the connecting rod 43 is slidably disposed within the second inclined hole. The middle of the connecting rod 43 is rotatably connected to the frame 1 via a pivot 431. See also Figure 5 As shown, the sliding component 44 includes a guide rail disposed vertically on the frame 1, and a slider disposed on the first plate 41 that cooperates with the guide rail. Preferably, to make the first plate 41 slide more smoothly, it includes two parallel guide rails.

[0047] See Figure 1 , 6 As shown, in an optional embodiment, the top of the frame 1 is provided with a support frame 9 for placing the crystal tray 81, and the support frame 9 is provided with a positioning post 91 for positioning the crystal tray 81.

[0048] See Figure 7As shown, after the silicon wafer 82 debonding fixture is placed on the loading platform, the first plate 41 slides upward under the action of the lifting mechanism 10. As the first plate 41 slides upward, it drives the second plate 42 to slide upward simultaneously. Due to the cooperation of the first path hole 5 and the first oblong hole 411, the clamping member 2 is driven upward by the first plate 41 and simultaneously tilts and slides outward towards the frame 1, gradually opening the internal placement space. The connecting rod 43 is driven by the second plate 42. Due to the action of the rotating shaft 431, the connecting rod 43 rotates around the rotating shaft 431, and the end of the connecting rod 43 connected to the second plate 42 slides downward relative to the second plate 42 along the second oblique hole. The end of the connecting rod 43 sleeved on the support member 3 drives the support member 3 to slide outward towards the frame 1 along the second oblong hole. Until the first plate 41 slides to the top limit position, the clamping member 2 and the support member 3 are in an open state. At this time, the material to be processed 8 can be placed into the wafer debonding fixture. The wafer 81 of the material to be processed 8 rests on the support frame 9 and is simultaneously fixed by the positioning post 91. The silicon wafer 82 of the material to be processed 8 is located in the placement space between the clamping member 2 and the support member 3. After the material to be processed 8 is positioned, the lifting mechanism 10 cancels the lifting action on the first plate 41, allowing the first plate 41 to slide downward under the action of gravity. As the first plate 41 slides downward, it drives the second plate 42 to slide downward at the same time. The clamping member 2 is driven downward by the first plate 41 and simultaneously tilts and slides inward towards the frame 1, gradually reducing the internal placement space. The connecting rod 43 is driven by the second plate 42. Due to the action of the rotating shaft 431, the connecting rod 43 rotates around the rotating shaft 431. The end of the connecting rod 43 connected to the second plate 42 slides upward relative to the second plate 42 along the second inclined hole. The end of the connecting rod 43 sleeved on the support member 3 drives the support member 3 to slide inward towards the frame 1 along the second oblong hole. When the first plate 41 slides to its bottom limit, the clamping member 2 and the supporting member 3 are in a closed state. At this time, the two opposing clamping members 2 are located on both sides of the silicon wafer 82, applying clamping force to the silicon wafer 82 to prevent it from shaking or tipping over during the cleaning process. The supporting member 3 is located at the bottom of the silicon wafer 82, supporting it. After cleaning and separating the crystal holder 81 from the silicon wafer 82, the crystal holder 81 can be directly removed, and then the first plate 41 can be slid upwards to open the clamping member 2 and the supporting member 3, allowing the silicon wafer 82 to be placed from the bottom of the frame 1 onto the support platform.

[0049] This utility model uses specific embodiments to illustrate the principle and implementation of the utility model. The above description of the embodiments is only for the purpose of helping to understand the method and core idea of ​​the utility model. At the same time, for those skilled in the art, there will be changes in the specific implementation and application scope based on the idea of ​​the utility model. Therefore, the content of this specification should not be construed as a limitation of the utility model.

Claims

1. A silicon wafer debonding tool, comprising: include: frame; At least two clamping members are located within the frame and are slidable along a first preset path on the frame; At least one support member is located below the clamping member and is slidable along a second predetermined path on the frame; The opening and closing mechanism includes a first plate that is slidably disposed on the outside of the frame in a vertical direction, the first plate being able to drive the clamping member to slide along a first preset path, a second plate disposed on the inside of the frame and fixedly connected to the first plate, and a connecting rod disposed on the inside of the frame and rotatably connected to the frame, one end of the connecting rod being driven by the second plate to slide along a third preset path on the second plate, and the other end of the connecting rod being connected to the supporting member.

2. The silicon wafer debonding tool of claim 1, wherein, The frame includes two panels arranged opposite to each other and a limiting piece detachably connected to the panels; the panels are provided with through holes for the clamping member to pass through, and mounting holes are provided around the through holes; the limiting piece is detachably connected to the panels via a connector provided in the mounting holes; the limiting piece is provided with a first path hole for the clamping member to pass through, and the first path hole forms a first preset path for the clamping member to slide.

3. The silicon wafer debonding tool of claim 2, wherein, The mounting holes include multiple holes arranged along the width direction of the frame, used to adjust the position of the limiting piece relative to the panel.

4. The silicon wafer debonding tooling of claim 2, wherein, The first path hole includes a first inclined hole and a vertical hole extending downward from the bottom of the first inclined hole.

5. The silicon wafer debonding tool of claim 2, wherein, The first plate is provided with a first waist-shaped hole, which is opposite to the first path hole, and the clamping member passes through both the first path hole and the first waist-shaped hole.

6. The silicon wafer debonding tool of claim 1, wherein, The frame is provided with a second path hole, which forms a second preset path for the sliding of the support member. The second plate is provided with a third path hole, which forms a third preset path for the sliding of the connecting rod.

7. The silicon wafer debonding tool of claim 1, wherein, The opening and closing mechanism further includes a sliding component, which includes a guide rail disposed vertically on the frame and a slider disposed on the first plate that cooperates with the guide rail.

8. The silicon wafer debonding tool of claim 1, wherein, It includes two clamping members, which are arranged opposite each other along the width direction of the frame.

9. The silicon wafer debonding tool of claim 8, wherein, The clamping member and the supporting member are cylindrical, and the surface of the clamping member is provided with an elastic layer.

10. The silicon wafer debonding tool of claim 1, wherein, The top of the frame is provided with a support frame for placing the crystal tray, and the support frame is provided with positioning posts for positioning the crystal tray.

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