A film tearing mechanism of a debonder

Abstract

The utility model is suitable for film tearing technical field provides a kind of film tearing mechanism of debonding machine, including substrate, substrate side is equipped with stage subassembly, substrate top surface is provided with transverse slide rail, transverse slide rail is slidably connected with longitudinal sliding assembly, longitudinal sliding assembly is slidably connected with film tearing subassembly, film tearing subassembly includes longitudinal plate and sliding member on longitudinal sliding assembly, sliding member one end is connected with mounting plate, mounting plate is fixedly connected with transverse pneumatic cylinder, transverse pneumatic cylinder output end is connected with connecting piece board, connecting piece board is fixedly connected with total mounting plate, total mounting plate is sequentially fixedly connected with clamping assembly, suction cup subassembly, rolling assembly.This device solves the problem that traditional film tearing subassembly is not firm to tear off UV film pasting of easy-to-tear paste, achieves through rolling guaranteeing the adhesion of easy-to-tear paste to UV film, so as to guarantee that easy-to-tear paste can be firmly pasted and tear off UV film.

Description

Technical Field

[0001] This utility model relates to the field of film tearing technology, and more specifically, to a film tearing mechanism for a debonding machine. Background Technology

[0002] Wafer peeling is a critical step in semiconductor manufacturing, primarily involving the removal of thin film materials covering the wafer surface. These films are typically UV films or protective films applied to protect the wafer surface before processes such as wafer grinding, dicing, or polishing. The quality of the peeling process directly affects the wafer's appearance integrity and electrical performance stability in subsequent processes; therefore, high requirements are placed on peeling precision, surface cleanliness, and wafer protection.

[0003] Currently, wafer film peeling processes mostly rely on manual operation, where operators manually peel off the film edges and gradually detach it from the wafer surface. Manual peeling is not only labor-intensive and inefficient, but also prone to film breakage, residue, or wafer surface damage due to the difficulty in maintaining consistent peeling angles and speeds, thus reducing yield and production consistency.

[0004] To achieve automated production, some equipment manufacturers have developed automatic film-peeling devices. For example, Chinese patent CN112918826A discloses a film-peeling device for a wafer film-peeling machine. Its structure includes adhesive tape mounted on an adhesive tape roller, a transmission path passing through a pressure roller, and a tape collector connected to a take-up roller. This device uses adhesive blocks on the tape collector to adhere the adhesive tape to the UV film on the wafer surface, and tightens the tape as the take-up roller rotates, thereby peeling the UV film off the wafer surface, achieving automatic film peeling.

[0005] However, this film-peeling device still has certain technical limitations. First, the adhesion between the adhesive tape and the UV film is greatly affected by environmental humidity, the degree of aging of the adhesive tape, and the surface condition of the UV film, making it difficult to maintain a stable peeling force. Second, the structure cannot precisely control the peeling angle. When the peeling angle is too large or too small, it is easy to cause the UV film to tear, remain, or generate tensile stress on the wafer surface, resulting in scratches or chipping on the wafer surface.

[0006] Therefore, based on the above problems, this application proposes a debonding machine film-tearing mechanism. Utility Model Content

[0007] In view of the shortcomings of the existing technology, the purpose of this utility model is to provide a film-tearing mechanism for a debonding machine.

[0008] To achieve the above objectives, the present invention provides the following technical solution:

[0009] A film-tearing mechanism for a debonding machine includes a substrate. A stage assembly is mounted on one side of the substrate. A transverse slide rail is provided on the top surface of the substrate. A longitudinal sliding assembly is slidably connected to the transverse slide rail. A film-tearing assembly is slidably connected to the longitudinal sliding assembly. The film-tearing assembly includes a longitudinal plate and a sliding member slidably connected to the longitudinal sliding assembly. One end of the sliding member is connected to a mounting plate. A transverse cylinder is fixedly connected to the mounting plate. A connecting plate is connected to the output end of the transverse cylinder. A main mounting plate is fixedly connected to the connecting plate. A clamping assembly, a suction cup assembly, and a rolling assembly are sequentially fixedly connected to the main mounting plate.

[0010] The present invention is further configured such that: the clamping assembly includes a clamping cylinder, the clamping cylinder is fixed to one side of the connecting plate in the horizontal direction, a clamping fixing plate is fixedly connected to one end of the clamping cylinder, the clamping fixing plate is fixedly connected to the longitudinal plate, a longitudinal fixing plate is connected to the output end of the clamping cylinder, and a clamping drive is horizontally connected to one end of the longitudinal fixing plate.

[0011] The present invention is further configured such that: a sliding groove is fixedly connected to the clamping drive, the sliding groove is arranged in a vertical direction, and two sets of sliders are slidably connected to the sliding groove; an upper jaw is fixedly connected to one set of sliders, and a lower jaw is fixedly connected to the other set of sliders; and a protrusion is provided on the lower jaw.

[0012] The present invention is further configured such that: the suction cup assembly includes a suction cup driver, the suction cup driver is fixedly connected to one side of the main mounting plate in the vertical direction, the output end of the suction cup driver is configured as L-shaped, and a vertical plate is fixedly connected to the side of the L-shaped long plate, a suction cup fixing plate is fixedly connected to the bottom of the vertical plate, and a suction cup is fixedly connected to the bottom of the suction cup fixing plate.

[0013] The present invention is further configured such that: the rolling assembly includes a rolling longitudinal drive fixedly connected to one side of the main mounting plate, the rolling longitudinal drive is arranged in a vertical direction, a rolling fixing plate is fixedly connected to the top of the rolling longitudinal drive, and the rolling fixing plate is fixedly connected to one side of the longitudinal plate.

[0014] The present invention is further configured such that: the output end of the rolling longitudinal drive is configured as an L-shaped plate, and a rolling mounting plate is fixedly connected to the long side of the L-shaped plate; a rolling transverse drive is fixedly connected to the rolling mounting plate; the rolling transverse drive is arranged in the horizontal direction; a roller fixing member is fixedly connected to the output end of the rolling transverse drive; and a roller is rotatably connected to the roller fixing member.

[0015] The present invention is further configured such that: the platform assembly includes a telescopic cylinder fixedly connected to the top of the substrate, four sets of mating rods fixedly connected to the top of the substrate, a first mounting plate fixedly connected to the top of the mating rods, the four sets of mating rods fixedly connected to the four corners of the first mounting plate, a through hole opened at the center of the first mounting plate, and the output end of the telescopic cylinder passing through the first mounting plate.

[0016] The present invention is further configured such that: a second mounting plate is fixedly connected to the output end of the telescopic cylinder, a platform base plate is provided on the top of the second mounting plate, and a number of sets of inner support rods and outer support rods are respectively provided at the four corners of the second mounting plate, with the inner support rods being provided inside the outer support rods.

[0017] The present invention is further configured such that: four sets of support columns are connected at the four corners of the platform substrate, the bottom of the support columns are fixedly connected to the top of the substrate, and several sets of through holes are opened on the platform substrate relative to the positions of the inner support rod and the outer support rod. The inner support rod and the outer support rod are arranged through the through holes of the platform substrate, and the inner support rod and the outer support rod are connected to the heating platform through the platform substrate.

[0018] The present invention is further configured such that: the heating platform includes a mounting base plate, a heating element is connected to the center of the mounting base plate, an isolation sheet is attached to the top of the heating element, micropores are formed on the surface of the heating element, and several sets of heating strips are attached to the bottom of the heating element.

[0019] In summary, this application includes at least one of the following beneficial technical effects:

[0020] 1. This application, by setting up a clamping mechanism, a suction cup assembly, and a rolling assembly for peeling off UV film with easy-tear adhesive, can clamp the easy-tear adhesive during the film peeling process. The suction cup assembly adsorbs the easy-tear adhesive, ensuring that it is horizontally pasted onto the UV film surface. The rolling assembly rolls the easy-tear adhesive to ensure the adhesion between the easy-tear adhesive and the UV film, preventing the easy-tear adhesive from falling off during the film peeling process. This achieves a continuous and stable peeling action during the film peeling process, avoiding film layer breakage or residue, and improving the integrity of film peeling and overall work efficiency.

[0021] 2. By setting up a heating platform, the workpiece is kept in a constant temperature heating state before or during the film peeling process. The heating effect can effectively soften the adhesive layer between the UV film and the workpiece surface, reduce its adhesion strength, reduce the pulling force required for film peeling, ensure the efficiency of film peeling, and avoid the UV film from breaking or remaining. Attached Figure Description

[0022] Figure 1 This is a schematic diagram of the structure of a film-tearing mechanism for a debonding machine according to the present invention.

[0023] Figure 2This is a schematic diagram of the structure of the platform assembly in this utility model.

[0024] Figure 3 This is an exploded view of the platform assembly in this utility model.

[0025] Figure 4 for Figure 3 A magnified view of a portion of region A in the middle.

[0026] Figure 5 This is an exploded schematic diagram of the heating platform in this utility model.

[0027] Figure 6 This is a structural schematic diagram of the heating platform in this utility model from another perspective.

[0028] Figure 7 This is a side view of a film-tearing mechanism for a debonding machine according to the present invention.

[0029] Figure 8 This is a schematic diagram of the structure of the film-tearing assembly in this utility model.

[0030] Figure 9 This is a schematic diagram of the clamping component in this utility model.

[0031] Figure 10 This is a partially enlarged schematic diagram of the clamping component in this utility model.

[0032] Figure 11 This is a schematic diagram of the suction cup assembly in this utility model.

[0033] Figure 12 This is a schematic diagram of the rolling assembly in this utility model.

[0034] Figure 13 This is a schematic diagram of the easy-tear adhesive in this utility model.

[0035] Explanation of reference numerals in the attached drawings: 1. Substrate;

[0036] 2. Platform assembly; 21. Support column; 22. Telescopic cylinder; 23. Matching rod; 24. First mounting plate; 25. Second mounting plate; 26. Inner support rod; 27. Outer support rod; 28. Platform base plate; 29. ​​Heated platform; 291. Mounting base plate; 292. Heating element; 2921. Heating strip; 293. Isolation plate;

[0037] 3. Lateral slide rail;

[0038] 4. Vertical sliding component; 41. Vertical drive;

[0039] 5. Film-tearing assembly; 51. Longitudinal plate; 52. Sliding component; 53. Mounting plate; 54. Transverse cylinder; 55. Connecting plate; 56. Main mounting plate; 57. Clamping assembly; 571. Clamping cylinder; 572. Clamping fixing plate; 573. Longitudinal fixing plate; 574. Clamping drive; 575. Slide groove; 576. Slider; 577. Upper jaw; 578. Lower jaw; 579. Protrusion; 58. Suction cup assembly; 581. Suction cup drive; 582. Vertical plate; 583. Suction cup fixing plate; 584. Suction cup; 59. Rolling assembly; 591. Rolling longitudinal drive; 592. Rolling fixing plate; 593. Rolling mounting plate; 594. Rolling transverse drive; 595. Roller fixing component; 596. Roller;

[0040] 6. Easy-tear adhesive; 61. Non-adhesive section; 62. Adhesive section. Detailed Implementation

[0041] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. The present invention will now be described in detail with reference to the accompanying drawings and embodiments.

[0042] It should be noted that, unless otherwise specified, all technical and scientific terms used in this application have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains.

[0043] Example 1, please refer to Figure 1-13 The present invention provides the following technical solution:

[0044] Specifically, it refers to a debonding machine film-removing mechanism, including a substrate 1, which is a rectangular plate structure used to support the upper components. A stage assembly 2 is mounted on one side of the substrate 1. The stage assembly 2 is used to place the wafer and heat it to assist in removing the UV film. A transverse slide rail 3 is provided on the top surface of the substrate 1. A drive is provided on one side of the transverse slide rail 3. A longitudinal sliding assembly 4 is slidably connected to the transverse slide rail 3. The longitudinal sliding assembly 4 is displaced horizontally by the drive of the transverse slide rail 3. A longitudinal drive 41 is connected to the top of the sliding assembly 4. A film-removing assembly 5 is slidably connected to the longitudinal sliding assembly 4. The film-removing assembly 5 is used to remove the UV film on the surface of the wafer. The film-removing assembly 5 is used to clamp an easy-tear adhesive 6 to adhere the UV film for film removal. The easy-tear adhesive 6 includes a non-adhesive section 61 for clamping and an adhesive section 62 for adhering to the surface of the UV film.

[0045] Please see Figures 2-5The platform assembly 2 includes a telescopic cylinder 22 fixedly connected to the top of the substrate 1 and four sets of mating rods 23 fixedly connected to the top of the substrate 1. The telescopic cylinder 22 is arranged vertically with its output end facing upward. The mating rods 23 are arranged around the telescopic cylinder 22. A first mounting plate 24 is fixedly connected to the top of the mating rods 23. The first mounting plate 24 is a rectangular plate structure. The four sets of mating rods 23 are fixedly connected to the four corners of the first mounting plate 24. A through hole is opened at the center of the first mounting plate 24. The output end of the telescopic cylinder 22 passes through the first mounting plate 24.

[0046] The output end of the telescopic cylinder 22 is fixedly connected to the second mounting plate 25. The extension and retraction of the telescopic cylinder 22 can drive the second mounting plate 25 to move vertically. The top of the second mounting plate 25 is provided with a platform base plate 28. Several sets of inner support rods 26 and outer support rods 27 are respectively provided at the four corners of the second mounting plate 25. The inner support rods 26 are arranged around the inner side of the outer support rods 27.

[0047] Four sets of support columns 21 are connected to the four corners of the platform substrate 28. The four sets of support columns 21 are arranged vertically, and their bottoms are fixedly connected to the top of the substrate 1. The platform substrate 28 is stably supported by the support columns 21. Several sets of through holes are opened on the platform substrate 28 relative to the positions of the inner support rod 26 and the outer support rod 27. The inner support rod 26 and the outer support rod 27 are arranged through the through holes of the platform substrate 28 and are connected to the heating platform 29 through the platform substrate 28.

[0048] Specifically, when the wafer needs to be moved vertically on top of the stage assembly 2, the output end of the telescopic cylinder 22 extends through the first mounting plate 24, subsequently driving the second mounting plate 25 to move vertically. This causes the inner support rod 26 and outer support rod 27 on the top of the second mounting plate 25 to pass through the stage substrate 28 and lift the heating stage 29 to a suitable height. Compared to directly using cylinders and telescopic rods to lift, this method further ensures the balance of the heating stage 29, improves the film peeling efficiency and quality, and avoids film damage caused by stage imbalance.

[0049] Furthermore, the heating stage 29 includes a mounting base 291, a heating element 292 is connected to the center of the mounting base 291, an isolation sheet 293 is attached to the top of the heating element 292, micropores are opened on the surface of the heating element 292, and several sets of heating strips 2921 are attached to the bottom of the heating element 292.

[0050] With the above settings, the heating stage 29 can provide a constant temperature heating environment in the wafer peeling and bonding process, effectively improving the softening performance of the UV film and making it more fully bonded to the easy-tear sticker 6, thereby reducing film cracking or residue in the subsequent peeling process.

[0051] See Figure 7 The film-peeling assembly 5 includes a longitudinal plate 51 and a sliding member 52 slidably connected to the longitudinal sliding assembly 4. The sliding member 52 can slide vertically relative to the longitudinal sliding assembly 4. One end of the sliding member 52 is connected to a mounting plate 53, which is arranged vertically. A transverse cylinder 54 is fixedly connected to the mounting plate 53, which is arranged horizontally. The output end of the transverse cylinder 54 is connected to a connecting plate 55. A main mounting plate 56 is fixedly connected to the connecting plate 55. The main mounting plate 56 is vertically fixedly connected to the connecting plate 55. A clamping assembly 57, a suction cup assembly 58, and a rolling assembly 59 are sequentially fixedly connected to the main mounting plate 56. The clamping assembly 57 is used to clamp the easy-tear adhesive. The suction cup assembly 58 is used to vacuum-adhere the easy-tear adhesive clamped by the clamping assembly 57 to the suction cup assembly 58 and press it down. The rolling assembly 59 is used to repeatedly extend and retract to roll the easy-tear adhesive 6 so that the easy-tear adhesive 6 is completely adhered to the UV film covering the wafer surface.

[0052] See Figure 9 , Figure 10 The clamping assembly 57 includes a clamping cylinder 571, which is fixed horizontally to one side of the connecting plate 55. One end of the clamping cylinder 571 is fixedly connected to a clamping fixing plate 572, which is fixedly connected to the longitudinal plate 51. The connection between the clamping fixing plate 572 and the longitudinal plate 51 ensures the stability of the clamping assembly 57. The output end of the clamping cylinder 571 is connected to a longitudinal fixing plate 573, and one end of the longitudinal fixing plate 573 is horizontally connected to a clamping drive 574.

[0053] A slide groove 575 is fixedly connected to the clamping drive 574. The slide groove 575 is set in the vertical direction. Two sets of sliders 576 are slidably connected to the slide groove 575. An upper jaw 577 is fixedly connected to one set of sliders 576, and a lower jaw 578 is fixedly connected to the other set of sliders 576. The lower jaw 578 has a protrusion 579 for limiting and enhancing clamping stability.

[0054] Specifically, the easy-tear label 6 is usually obtained from an external labeling machine, moved horizontally by a clamping cylinder 571, and the non-adhesive segment 61 is clamped by an upper jaw 577 and a lower jaw 578.

[0055] See Figure 11The suction cup assembly 58 includes a suction cup driver 581, which is fixedly connected vertically to one side of the main mounting plate 56. The output end of the suction cup driver 581 is L-shaped, and a vertical plate 582 is fixedly connected to the long side of the L-shaped plate. A suction cup fixing plate 583 is fixedly connected to the bottom of the vertical plate 582, and a suction cup 584 is fixedly connected to the bottom of the suction cup fixing plate 583. The suction part of the suction cup 584 faces the easy-tear sticker 6 and the UV film. The suction cup 584 is used to vacuum-adsorb the easy-tear sticker 6 during the material picking and film application process, and coordinates with the vertical sliding assembly 4 and the lifting and extending movements of the suction cup driver 581 to achieve positioning and adhesion.

[0056] Preferably, the suction cup 584 adopts a sponge suction cup structure, whose adsorption surface is soft and has a certain degree of elasticity. When adhering to the wafer, it can automatically compensate for minor differences in the wafer surface, avoiding scratches or damage to the wafer surface caused by hard contact. At the same time, the sponge suction cup can provide a buffering effect during film application, making the pressure distribution more uniform and avoiding pressure damage to the wafer surface.

[0057] Specifically, when the suction cup drive 581 is activated, the suction cup 584 can move vertically to pick up and release the easy-tear sticker 6; simultaneously, in conjunction with the sliding of the longitudinal sliding component 4, the suction cup moves horizontally, thus completing the automatic transfer process from the material picking position to the film application position. During the film application stage, the suction cup 584 uses the vacuum negative pressure formed inside to adsorb the easy-tear sticker 6, and under the action of the suction cup drive 581, it is smoothly pressed onto the wafer surface, so that the easy-tear sticker and the UV film are tightly bonded.

[0058] See Figure 12 The rolling assembly 59 includes a rolling longitudinal drive 591 fixedly connected to one side of the main mounting plate 56. The rolling longitudinal drive 591 is arranged in the vertical direction and can drive the entire rolling assembly 59 to move in the vertical direction and apply pressure to the entire rolling assembly 59 to ensure the rolling pressure. A rolling fixing plate 592 is fixedly connected to the top of the rolling longitudinal drive 591 and is fixedly connected to one side of the longitudinal plate 51.

[0059] The output end of the longitudinal roller drive 591 is set as an L-shaped plate, and the long side of the L-shaped plate is fixedly connected to the roller mounting plate 593. The lateral roller drive 594 is fixedly connected to the roller mounting plate 593. The output end of the lateral roller drive 594 is fixedly connected to the roller fixing component 595. The roller 596 is rotatably mounted on the roller fixing component 595. The roller 596 is preferably set as a rubber roller, that is, the outer surface of the central rolling shaft is covered with rubber, which is commonly used for roller pasting operation of easy-tear sticker 6 before and after peeling film.

[0060] Specifically, the rolling lateral drive 594 is set in the horizontal direction. By reciprocating the rolling lateral drive 594, the drive roller fixing part 595 can reciprocate, and then drive the roller 596 to repeatedly roll the easy-tear sticker 6, so that the easy-tear sticker 6 can be firmly pasted on the UV film, ensuring that the UV film can be lifted when the easy-tear sticker 6 is pulled up.

[0061] The method of using the film-tearing mechanism of the debonding machine provided by this utility model is as follows:

[0062] S1. Take the easy-tear sticker 6;

[0063] S11. The external labeling machine delivers the easy-tear label 6 to the material handling position;

[0064] S12, the film-peeling assembly 5 moves to the material-picking position;

[0065] S121, The longitudinal sliding component 4 descends, causing the sliding component 52 to drive the suction cup component 58 to move down to the label machine outlet height;

[0066] S122, the horizontal cylinder 54 extends, driving the main mounting plate 56 to move forward, so that the suction cup 584 is directly aligned with the center of the easy-tear sticker 6, achieving precise alignment before adsorption;

[0067] S2. Clamp and absorb the easy-tear sticker 6;

[0068] S21, Gripper extension: The gripping cylinder 571 is activated to extend horizontally, driving the gripping drive 574 to move forward; the upper gripper 577 and the lower gripper 578 close, clamping the non-adhesive section 61 of the easy-tear adhesive 6;

[0069] S22, suction cup 584 activates vacuum adsorption, picks up the easy-tear sticker 6 clamped by clamping component 57;

[0070] S23, The gripper is released and retracted, the suction cup 584 is lifted, and the longitudinal sliding component 4 moves upward;

[0071] S24, the horizontal cylinder 54 retracts, and the entire film-peeling assembly 5 is moved to the wafer film-peeling station;

[0072] S3. Remove the UV film;

[0073] S31, the suction cup drive 581 drives the suction cup 584 to descend, attaching the adhesive side of the easy-tear sticker 6 to the UV film covering the wafer surface.

[0074] S32, the rolling assembly 59 is started, and the rolling lateral drive 594 drives the roller 596 to extend and retract repeatedly, repeatedly rolling the easy-tear adhesive 6 to ensure a tight fit.

[0075] S33, the rolling assembly 59 is recycled, and the roller 596 is lifted;

[0076] S34. The grippers re-clamp the non-adhesive end of the easy-tear sticker 6 and lift it upwards, so that the easy-tear sticker 6 forms a separation angle with the edge of the UV film.

[0077] S4. Separate the UV membrane;

[0078] S41, the grippers continue to lift, and the easy-tear label 6 pulls the edge of the UV film away from the wafer surface, forming a separation angle of about 45°;

[0079] S42. Control the longitudinal sliding component 4 to rise at a uniform speed, while the transverse cylinder 54 slightly retracts, so that the tearing direction is balanced with the wafer surface, ensuring that the UV film is smoothly torn off without leaving any residue.

[0080] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0081] It should be understood that the terms "length", "width", "up", "down", "front and back", "left and right", "vertical", "horizontal", "top", "bottom", "inner", and "outer" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0082] Based on the preferred embodiments of this utility model described above, those skilled in the art can make various changes and modifications without departing from the scope of this utility model. The technical scope of this utility model is not limited to the contents of the specification, but must be determined according to the scope of the claims.

Claims

1. A de-bonding machine film tear mechanism, characterized by: The system includes a substrate (1), a platform assembly (2) is mounted on one side of the substrate (1), a transverse slide rail (3) is provided on the top surface of the substrate (1), a longitudinal sliding assembly (4) is slidably connected to the transverse slide rail (3), a film-tearing assembly (5) is slidably connected to the longitudinal sliding assembly (4), the film-tearing assembly (5) includes a longitudinal plate (51) and a sliding member (52) slidably connected to the longitudinal sliding assembly (4), a mounting plate (53) is connected to one end of the sliding member (52), a transverse cylinder (54) is fixedly connected to the mounting plate (53), a connecting plate (55) is connected to the output end of the transverse cylinder (54), a main mounting plate (56) is fixedly connected to the connecting plate (55), and a clamping assembly (57), a suction cup assembly (58), and a rolling assembly (59) are fixedly connected to the main mounting plate (56) in sequence.

2. A film tear mechanism for a debonder as claimed in claim 1, wherein: The clamping assembly (57) includes a clamping cylinder (571), which is fixed horizontally to one side of the connecting plate (55). One end of the clamping cylinder (571) is fixedly connected to a clamping fixing plate (572), which is fixedly connected to the longitudinal plate (51). The output end of the clamping cylinder (571) is connected to a longitudinal fixing plate (573), and one end of the longitudinal fixing plate (573) is horizontally connected to a clamping drive (574).

3. A film tear mechanism for a debonder as claimed in claim 2, wherein: The clamping drive (574) is fixedly connected to a slide groove (575), which is arranged in a vertical direction. Two sets of sliders (576) are slidably connected to the slide groove (575). One set of sliders (576) is fixedly connected to an upper jaw (577), and the other set of sliders (576) is fixedly connected to a lower jaw (578). The lower jaw (578) is provided with a protrusion (579).

4. The de-bonding machine film tearing mechanism of claim 1, wherein: The suction cup assembly (58) includes a suction cup driver (581), which is fixedly connected to one side of the main mounting plate (56) in the vertical direction. The output end of the suction cup driver (581) is set to L-shape, and a vertical plate (582) is fixedly connected to the side of the L-shaped long plate. A suction cup fixing plate (583) is fixedly connected to the bottom of the vertical plate (582), and a suction cup (584) is fixedly connected to the bottom of the suction cup fixing plate (583).

5. A film tear mechanism for a debonder as claimed in claim 4, wherein: The rolling assembly (59) includes a rolling longitudinal drive (591) fixedly connected to one side of the main mounting plate (56). The rolling longitudinal drive (591) is arranged in a vertical direction. A rolling fixing plate (592) is fixedly connected to the top of the rolling longitudinal drive (591). The rolling fixing plate (592) is fixedly connected to one side of the longitudinal plate (51).

6. A film tear mechanism for a debonder according to claim 5, wherein: The output end of the rolling longitudinal drive (591) is set as an L-shaped plate, and the long side of the L-shaped plate is fixedly connected to a rolling mounting plate (593). A rolling transverse drive (594) is fixedly connected to the rolling mounting plate (593). The rolling transverse drive (594) is set in the horizontal direction. A roller fixing member (595) is fixedly connected to the output end of the rolling transverse drive (594). A roller (596) is rotatably connected to the roller fixing member (595).

7. The de-bonding machine film tearing mechanism of claim 1, wherein: The platform assembly (2) includes a telescopic cylinder (22) fixedly connected to the top of the substrate (1) and four sets of mating rods (23) fixedly connected to the top of the substrate (1). A first mounting plate (24) is fixedly connected to the top of the mating rods (23). The four sets of mating rods (23) are fixedly connected to the four corners of the first mounting plate (24). A through hole is opened at the center of the first mounting plate (24). The output end of the telescopic cylinder (22) passes through the first mounting plate (24).

8. A film tear mechanism for a debonder according to claim 7, wherein: The output end of the telescopic cylinder (22) is fixedly connected to a second mounting plate (25). The top of the second mounting plate (25) is provided with a platform base plate (28). Several sets of inner support rods (26) and outer support rods (27) are respectively provided at the four corners of the second mounting plate (25). The inner support rods (26) are located inside the outer support rods (27).

9. A film tear mechanism for a debonder according to claim 8, wherein: The platform substrate (28) is connected to four sets of support columns (21) at its four corners. The bottom of the support column (21) is fixedly connected to the top of the substrate (1). The platform substrate (28) has several sets of through holes relative to the inner support rod (26) and the outer support rod (27). The inner support rod (26) and the outer support rod (27) pass through the through holes of the platform substrate (28). The inner support rod (26) and the outer support rod (27) pass through the platform substrate (28) and are connected to a heating platform (29).

10. A de-bonding machine film tearing mechanism according to claim 9, wherein: The heating platform (29) includes a mounting base (291), a heating element (292) is connected to the center of the mounting base (291), an isolation sheet (293) is attached to the top of the heating element (292), micropores are opened on the surface of the heating element (292), and several sets of heating strips (2921) are attached to the bottom of the heating element (292).

Images