Cushion cooling device and electric two-wheeled vehicle

Abstract

The utility model discloses a kind of cushion cooling device and electric two-wheeled vehicle, applied to cooling device technical field, to solve the problem of overheat of electric two-wheeled vehicle cushion in high temperature environment in prior art, specifically including main control module and external device connection, the output of main control module is electrically connected with driving module;The output of driving module is connected with heat dissipation mechanism, and heat dissipation mechanism is set to the inside of the cushion of electric two-wheeled vehicle;Main control module is triggered under external device, and sends cooling control signal to driving module;Driving module is connected or cut off according to cooling control signal The connection of heat dissipation mechanism and external power supply;Heat dissipation mechanism absorbs the heat of the cushion of electric two-wheeled vehicle and dissipates when external power supply is connected. In this way, heat is absorbed and dissipated by heat dissipation mechanism built in cushion, and the cooling of cushion can be realized.

Description

Technical Field

[0001] This utility model relates to the field of cooling device technology, and in particular to a seat cushion cooling device and an electric two-wheeled vehicle. Background Technology

[0002] With the rapid development of electric two-wheeler technology and the continuous improvement of its intelligence level, electric two-wheelers have become one of the important means of transportation for short-distance urban travel. Modern electric two-wheelers not only have basic transportation functions, but also integrate a variety of intelligent functions such as intelligent navigation, anti-theft alarm, and remote control, greatly enhancing the user's travel experience.

[0003] Currently, electric two-wheeler seats generally adopt a traditional structural design, mainly composed of three parts: the seat cover, sponge filling, and a plastic base. This design primarily considers comfort and durability. The seat cover is usually made of PVC or PU material to enhance wear resistance, the sponge layer provides cushioning and comfort, and the plastic base serves as support and fixation. However, this traditional seat structure exposes significant flaws in high-temperature summer environments: when the vehicle is parked outdoors for extended periods, the dark-colored seat cover absorbs a large amount of solar radiation heat, and combined with the heat insulation properties of the sponge layer, the seat temperature rises rapidly, often exceeding 50°C. Especially during the hottest summer months, users frequently encounter overheated seats when preparing to ride after work. This phenomenon not only affects users' immediate travel needs but may also cause discomfort or even the risk of burns. Although some users take temporary measures such as splashing water to cool down or using sunshades, these methods have limited effectiveness and are inconvenient to operate, failing to fundamentally solve the problem. Therefore, the overheating problem of electric two-wheeler seats in high-temperature environments has become a significant factor affecting user experience. Utility Model Content

[0004] This utility model provides a seat cooling device and an electric two-wheeler to solve the problem of overheating of electric two-wheeler seats in high-temperature environments in the prior art.

[0005] The technical solution provided by this utility model embodiment is as follows: On the one hand, this utility model embodiment provides a seat cushion cooling device, including: a main control module, a drive module, and a heat dissipation mechanism; The main control module is connected to external devices, and the output of the main control module is electrically connected to the drive module; the output of the drive module is connected to the heat dissipation mechanism, which is located inside the seat of the electric two-wheeled vehicle. The main control module is used to send a cooling control signal to the drive module when triggered by an external device; The drive module is used to connect or disconnect the heat dissipation mechanism from the external power supply according to the cooling control signal; The heat dissipation mechanism is used to absorb and dissipate heat from the seat of the electric two-wheeler when an external power source is connected.

[0006] Optionally, the main control module includes: a microcontroller and a first K-line circuit; The input terminal of the microcontroller is connected to an external device, the first communication terminal of the microcontroller is connected to the transmitting terminal of the first K-line circuit, the second communication terminal of the microcontroller is connected to the receiving terminal of the first K-line circuit, and the K-line terminal of the first K-line circuit is connected to the driver module.

[0007] Optionally, the first K-line circuit includes: a receiving module, a transmitting module, a first resistor, a first diode, and a first Zener diode; The positive terminal of the first diode is connected to an external power supply via a first resistor, and the negative terminal of the first diode is connected to the drive module; the negative terminal of the first Zener diode is connected to the negative terminal of the first diode, and the positive terminal of the first Zener diode is connected to ground; the first terminal of the transmitting module is connected to the negative terminal of the first diode, and the second terminal of the transmitting module is connected to the first communication terminal of the microcontroller; the first terminal of the receiving module is connected to the negative terminal of the first diode, and the second terminal of the receiving module is connected to the second communication terminal of the microcontroller.

[0008] Optionally, the transmitting module includes: a first transistor, a second transistor, a second resistor, a third resistor, a fourth resistor, a fifth resistor, and a second diode; The emitter of the first transistor is connected to an external power supply; the base of the first transistor is connected to the first communication terminal of the microcontroller via a second resistor; the collector of the first transistor is connected to the anode of the second diode via a third resistor; the emitter of the second transistor is connected to ground; the base of the second transistor is connected to the cathode of the second diode; and the collector of the second transistor is connected to the cathode of the first diode; a fourth resistor is connected in parallel between the base and emitter of the first transistor; and a fifth resistor is connected in parallel between the base and emitter of the second transistor. The receiving module includes: a third transistor, a fourth transistor, a sixth resistor, a seventh resistor, an eighth resistor, a ninth resistor, a tenth resistor, an eleventh resistor, a third diode, a fourth diode, and a first capacitor; The emitter of the third transistor is connected to ground. The base of the third transistor is connected to the cathode of the third diode via the sixth resistor. The collector of the third transistor is connected to the cathode of the fourth diode. The anode of the third diode is connected to the cathode of the first diode. The anode of the fourth diode is connected to the external power supply via the seventh and eighth resistors. The ninth resistor is connected in parallel between the base and emitter of the third transistor. The emitter of the fourth transistor is connected to the external power supply. The base of the fourth transistor is connected between the seventh and eighth resistors. The collector of the fourth transistor is connected to ground via the tenth resistor. The collector of the fourth transistor is connected to the second communication terminal of the microcontroller via the eleventh resistor. The first capacitor is connected in parallel with the tenth resistor.

[0009] Optionally, the driving module includes: a second K-line circuit, a control chip, and a heat dissipation driving circuit; The K-line terminal of the second K-line circuit is connected to the K-line terminal of the first K-line circuit, the transmitting terminal of the second K-line circuit is connected to the first communication terminal of the control chip, and the receiving terminal of the second K-line circuit is connected to the second communication terminal of the control chip. The output of the control chip is connected to the control terminal of the heat dissipation drive circuit; the input of the heat dissipation drive circuit is connected to the external power supply, and the output of the heat dissipation drive circuit is connected to the power supply terminal of the heat dissipation mechanism.

[0010] Optionally, the heat dissipation drive circuit includes: a fifth transistor, a twelfth resistor, a thirteenth resistor, a fourteenth resistor, a fifteenth resistor, a sixteenth resistor, a first MOSFET, and a second capacitor; The emitter of the fifth transistor is connected to ground, the base of the fifth transistor is connected to the output terminal of the control chip via the twelfth resistor, and the collector of the fifth transistor is connected to the external power supply via the thirteenth, fourteenth, and fifteenth resistors in sequence. The source of the first MOSFET is connected between the fourteenth and fifteenth resistors, the gate of the first MOSFET is connected between the thirteenth and fourteenth resistors, and the drain of the first MOSFET is connected to the power supply terminal of the heat dissipation mechanism. The first end of the sixteenth resistor is connected between the thirteenth and fourteenth resistors, and the second end of the sixteenth resistor is connected to ground; the first end of the second capacitor is connected to the drain of the first MOSFET, and the second end of the second capacitor is connected to ground.

[0011] Optionally, the heat dissipation drive circuit may also include: a sixth transistor, a seventeenth resistor, and a fifth diode; The fifth diode is connected in series with the sixteenth resistor. The positive terminal of the fifth diode is connected to the sixteenth resistor, and the negative terminal of the fifth diode is connected between the thirteenth and fourteenth resistors. The emitter of the sixth transistor is connected to an external power supply, the base of the sixth transistor is connected to the source of the first MOSFET via the seventeenth resistor, and the collector of the sixth transistor is connected between the positive terminal of the fifth diode and the sixteenth resistor.

[0012] Optionally, the heat dissipation mechanism includes: a diode cooling chip, a heat sink, and a cooling fan; The cold side of the diode cooling chip is attached to the seat of the electric two-wheeler, the heat dissipation device is located on the hot side of the diode cooling chip, and the air outlet of the cooling fan faces the heat dissipation device; the power supply terminals of the diode cooling chip and the cooling fan are connected to the output terminal of the drive module.

[0013] Optionally, the heat dissipation device is a hollow columnar structure, with heat dissipation fins disposed on the inner wall of the hollow columnar structure; the hot surface of the diode cooling chip is disposed at one end of the hollow columnar structure, and the cooling fan is disposed at the other end of the hollow columnar structure.

[0014] On the other hand, this utility model embodiment provides an electric two-wheeled vehicle, including: a vehicle body and the aforementioned seat cooling device; The seat cooling device is located inside the seat cushion of the vehicle body.

[0015] The beneficial effects of this utility model embodiment are as follows: In this embodiment of the invention, a heat dissipation mechanism built into the seat cushion absorbs and dissipates heat, thereby cooling the seat cushion. This effectively solves the problem of excessively high seat temperatures in electric two-wheelers during summer or after prolonged sun exposure, causing discomfort to the rider and significantly improving the user's riding comfort. The heat dissipation mechanism is located inside the seat cushion, without affecting the original appearance of the electric two-wheeler or the riding experience of the seat cushion. Its simple structure makes it easy to install and integrate during production.

[0016] Other features and advantages of this invention will be set forth in the description which follows, and will be apparent in part from the description, or may be learned by practicing the invention. The objects and other advantages of this invention may be realized and obtained by means of the structures particularly pointed out in the written description, claims, and drawings. Attached Figure Description

[0017] The accompanying drawings, which are included to provide a further understanding of the present invention and constitute a part of this invention, illustrate exemplary embodiments of the present invention and, together with the description thereof, serve to explain the present invention and do not constitute an undue limitation thereof. In the drawings: Figure 1 This is a schematic diagram of the first structure of the seat cushion cooling device in this utility model embodiment; Figure 2 This is a schematic diagram of the second structure of the seat cushion cooling device in this embodiment of the present invention; Figure 3 This is a schematic diagram of the third structure of the seat cushion cooling device in this utility model embodiment; Figure 4 This is a schematic diagram of the fourth structure of the seat cushion cooling device in this utility model embodiment; Figure 5 This is a schematic diagram of the fifth circuit structure of the seat cushion cooling device in this embodiment of the present invention; Figure 6 This is a schematic diagram of the sixth circuit structure of the seat cushion cooling device in this embodiment of the present invention; Figure 7This is a schematic diagram of the seventh circuit structure of the seat cushion cooling device in this utility model embodiment; Figure 8 This is a schematic diagram of the eighth circuit structure of the seat cushion cooling device in this utility model embodiment; Figure 9 This is a schematic diagram of the heat dissipation structure in an embodiment of this utility model.

[0018] Icons: 100 - Seat cushion cooling device; 110 - Main control module; 120 - Drive module; 130 - Heat dissipation mechanism; 111 - Microcontroller; 112 - First K-line circuit; 113 - Receiver module; 114 - Transmitter module; R1 - First resistor; D1 - First diode; D0 - First Zener diode; P1 - First transistor; P2 - Second transistor; R2 - Second resistor; R3 - Third resistor; R4 - Fourth resistor; R5 - Fifth resistor; D2 - Second diode; P3 - Third transistor; P4 - Fourth transistor; R6 - Sixth resistor; R7 - Seventh resistor; R8 - Eighth resistor; R9 - Ninth resistor Resistors; R10 - 10th resistor; R11 - 11th resistor; D3 - 3rd diode; D4 - 4th diode; C1 - 1st capacitor; 121 - 2nd K-line circuit; 122 - Control chip; 123 - Heat dissipation drive circuit; P5 - 5th transistor; R12 - 12th resistor; R13 - 13th resistor; R14 - 14th resistor; R15 - 15th resistor; R16 - 16th resistor; Q1 - 1st MOSFET; C2 - 2nd capacitor; P6 - 6th transistor; R17 - 17th resistor; D5 - 5th diode; 131 - Diode cooling chip; 132 - Heat dissipation device; 133 - Cooling fan. Detailed Implementation

[0019] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0020] This utility model embodiment provides a seat cooling device for electric two-wheeled vehicles, see reference. Figure 1 As shown, the seat cooling device 100 applied to electric two-wheeled vehicles includes: a main control module 110, a drive module 120, and a heat dissipation mechanism 130; The main control module 110 is connected to an external device, and the output terminal of the main control module 110 is electrically connected to the drive module 120; the output terminal of the drive module 120 is connected to the heat dissipation mechanism 130, which is located inside the seat of the electric two-wheeled vehicle. The main control module 110 is used to send a cooling control signal to the drive module 120 when triggered by an external device; The drive module 120 is used to connect or disconnect the heat dissipation mechanism 130 from the external power supply according to the cooling control signal; The heat dissipation mechanism 130 is used to absorb and dissipate heat from the seat of the electric two-wheeler when an external power source is connected.

[0021] exist Figure 1 In the seat cooling device 100 shown, the main control module 110 is equipped with an interface for data communication with external devices, which supports wired or wireless communication protocols. The signal output terminal of the main control module 110 is electrically connected to the control input terminal of the drive module 120 via a standard electrical connector. The output terminal of the drive module 120 is reliably connected to the power input terminal of the heat dissipation mechanism 130 via a dedicated power harness. The heat dissipation mechanism 130, as the final thermal energy management execution unit, is fully integrated into the internal space of the electric two-wheeled vehicle seat assembly, specifically located in the sponge filling layer between the seat surface layer and the support base, or fixed to the base. During operation, the main control module 110 continuously monitors cooling commands sent by external devices. Upon receiving a valid cooling command, it immediately parses the command and generates a cooling control signal with a specific format, transmitting this signal to the drive module 120. The drive module 120 controls the power supply circuit of the heat dissipation mechanism 130 based on the received cooling control signal. Specifically, the cooling control signal indicates that when the heat dissipation mechanism 130 is working, an external power source (such as a vehicle battery) is connected to the heat dissipation mechanism 130 to provide the power required for its operation; the cooling control signal indicates that when the heat dissipation mechanism 130 is off, the power supply to the heat dissipation mechanism 130 is cut off, causing it to stop working. After being powered on, the heat dissipation mechanism 130 begins to operate, and its internal thermoelectric conversion elements or fluid drive elements start working, actively absorbing heat energy from the seat cushion material and transferring the absorbed heat through the heat dissipation path to the external environment of the seat cushion or the vehicle structure, thereby achieving the active cooling function of the seat cushion.

[0022] Thus, this utility model provides a seat cooling device that absorbs and dissipates heat through a heat dissipation mechanism built into the seat, effectively cooling the seat and solving the problem of excessively high seat temperatures in electric two-wheelers during summer or after prolonged sun exposure, causing discomfort to the rider and significantly improving user riding comfort. The heat dissipation mechanism is located inside the seat, without affecting the original appearance of the electric two-wheeler or the riding experience of the seat. Its simple structure makes it easy to install and integrate during production.

[0023] In one possible implementation, see [reference] Figure 2 As shown, the main control module 110 includes: a microcontroller 111 and a first K-line circuit 112; The input terminal of the microcontroller 111 is connected to an external device, the first communication terminal of the microcontroller 111 is connected to the transmitting terminal of the first K-line circuit 112, the second communication terminal of the microcontroller 111 is connected to the receiving terminal of the first K-line circuit 112, and the K-line terminal of the first K-line circuit 112 is connected to the driving module 120.

[0024] exist Figure 2 In the seat cushion cooling device 100 shown, the first K-line circuit 112 is a standard K-line serial communication interface circuit. The microcontroller 111 is an embedded processor with at least one UART or SCI serial communication interface, configured with general-purpose input / output pins as data input terminals for connection to external devices. The first communication terminal of the microcontroller 111 is defined as a serial data transmission pin, which is connected to the input terminal of the transmission signal processing circuit inside the first K-line circuit 112 through printed circuit board traces. The second communication terminal of the microcontroller 111 is defined as a serial data reception pin, which is also connected to the output terminal of the reception signal processing circuit inside the first K-line circuit 112 through printed circuit board traces. The K-line terminal of the first K-line circuit 112 has a standard K-line interface pin, which is connected to the corresponding K-line interface pin in the driver module 120 through a single-wire bus, forming a master-slave communication network. This architecture ensures reliable, real-time bidirectional data exchange between the master control module 110 and the driver module 120, while also possessing good electromagnetic compatibility.

[0025] In one possible implementation, see [reference] Figure 3 As shown, the first K-line circuit includes: a receiving module 113, a transmitting module 114, a first resistor R1, a first diode D1, and a first Zener diode D0; The positive terminal of the first diode D1 is connected to an external power supply via the first resistor R1, and the negative terminal of the first diode D1 is connected to the drive module 120; the negative terminal of the first Zener diode D0 is connected to the negative terminal of the first diode D1, and the positive terminal of the first Zener diode D0 is connected to ground; the first terminal of the transmitting module 114 is connected to the negative terminal of the first diode D1, and the second terminal of the transmitting module 114 is connected to the first communication terminal of the microcontroller 111; the first terminal of the receiving module 113 is connected to the negative terminal of the first diode D1, and the second terminal of the receiving module 113 is connected to the second communication terminal of the microcontroller 111.

[0026] exist Figure 3In the seat cushion cooling device 100 shown, the basic power supply path of the first K-line circuit is composed of a first resistor R1 and a first diode D1 connected in series. One end of the first resistor R1 is connected to an external power supply, and the other end of the first resistor R1 is connected to the positive terminal of the first diode D1. The negative terminal of the first diode D1 serves as the K-line node of the circuit. The first Zener diode D0 constitutes an overvoltage protection circuit. The cathode of the first Zener diode D0 is connected to the K-line node, and the anode of the first Zener diode D0 is grounded. The transmitting module 114 and the receiving module 113 serve as two functionally independent data transmission paths, both using the K-line node as a signal reference point. The function of the transmitting module 114 is to convert the TTL or CMOS level signal output by the microcontroller 111 into a level signal that conforms to the K-line protocol requirements. One end of the transmitting module 114 is connected to the first communication terminal of the microcontroller 111, and the other end of the transmitting module 114 is connected to the K-line node. The function of the receiving module 113 is to convert the level signal on the K-line into a TTL or CMOS level signal that can be recognized by the microcontroller 111. One end of the receiving module 113 is connected to the K-line node, and the other end of the receiving module 113 is connected to the second communication terminal of the microcontroller 111.

[0027] For specific implementation, please refer to Figure 4 As shown, the transmitting module includes: a first transistor P1, a second transistor P2, a second resistor R2, a third resistor R3, a fourth resistor R4, a fifth resistor R5, and a second diode D2; The emitter of the first transistor P1 is connected to an external power supply. The base of the first transistor P1 is connected to the first communication terminal of the microcontroller 111 via the second resistor R2. The collector of the first transistor P1 is connected to the positive terminal of the second diode D2 via the third resistor R3. The emitter of the second transistor P2 is connected to ground. The base of the second transistor P2 is connected to the negative terminal of the second diode D2. The collector of the second transistor P2 is connected to the negative terminal of the first diode D1. The fourth resistor R4 is connected in parallel between the base and emitter of the first transistor P1. The fifth resistor R5 is connected in parallel between the base and emitter of the second transistor P2. The receiving module includes: a third transistor P3, a fourth transistor P4, a sixth resistor R6, a seventh resistor R7, an eighth resistor R8, a ninth resistor R9, a tenth resistor R10, an eleventh resistor R11, a third diode D3, a fourth diode D4, and a first capacitor C1. The emitter of the third transistor P3 is connected to ground. The base of the third transistor P3 is connected to the cathode of the third diode D3 via the sixth resistor R6. The collector of the third transistor P3 is connected to the cathode of the fourth diode D4. The anode of the third diode D3 is connected to the cathode of the first diode D1. The anode of the fourth diode D4 is connected to the external power supply via the seventh resistor R7 and the eighth resistor R8. The ninth resistor R9 is connected in parallel between the base and emitter of the third transistor P3. The emitter of the fourth transistor P4 is connected to the external power supply. The base of the fourth transistor P4 is connected between the seventh resistor R7 and the eighth resistor R8. The collector of the fourth transistor P4 is connected to ground via the tenth resistor R10. The collector of the fourth transistor P4 is connected to the second communication terminal of the microcontroller 111 via the eleventh resistor R11. The first capacitor C1 is connected in parallel with the tenth resistor R10.

[0028] exist Figure 4 In the seat cooling device 100 shown, the transmitting module uses a two-stage transistor amplification architecture to achieve signal driving and level conversion. The base of the first transistor P1 receives the transmitted signal from the microcontroller 111 through the second resistor R2, the emitter is connected to the power supply, and the collector drives the second diode D2 through the third resistor R3. The second transistor P2 forms a common-emitter switching circuit. The base of the second transistor P2 receives the driving signal from the first transistor P1 through the second diode D2. The emitter of the second transistor P2 is grounded, and the collector of the second transistor P2 directly drives the K-line node. The fourth resistor R4 provides a base-emitter bias path for the first transistor P1, and the fifth resistor R5 provides a base-emitter bias path for the second transistor P2. The receiving module uses a differential comparator and level conversion architecture. The anode of the third diode D3 is connected to the K-line node, and the cathode of the third diode D3 drives the base of the third transistor P3 through the sixth resistor R6. The seventh resistor R7 and the eighth resistor R8 form a voltage divider network to provide a reference bias for the fourth transistor P4. The ninth resistor R9 provides a stable bias for the third transistor P3. The tenth resistor R10 forms the collector load of the fourth transistor P4. The first capacitor C1 and the eleventh resistor R11 form an RC filter to suppress high-frequency interference.

[0029] In one possible implementation, see [reference] Figure 5 As shown, the driving module 120 includes: a second K-line circuit 121, a control chip 122, and a heat dissipation driving circuit 123; The K-line terminal of the second K-line circuit 121 is connected to the K-line terminal of the first K-line circuit 112, the transmitting terminal of the second K-line circuit 121 is connected to the first communication terminal of the control chip 122, and the receiving terminal of the second K-line circuit 121 is connected to the second communication terminal of the control chip 122. The output terminal of the control chip 122 is connected to the control terminal of the heat dissipation drive circuit 123; the input terminal of the heat dissipation drive circuit 123 is connected to an external power supply, and the output terminal of the heat dissipation drive circuit 123 is connected to the power supply terminal of the heat dissipation mechanism 130.

[0030] exist Figure 5 In the seat cooling device 100 shown, the second K-line circuit 121 corresponds completely to the first K-line circuit of the main control module 110 at both the physical layer and protocol layer. The circuit structure of the second K-line circuit 121 is the same as that of the first K-line circuit. The K-line terminals of the second K-line circuit 121 are connected to the K-line terminals of the first K-line circuit via twisted-pair cables or shielded single wires to form a complete communication loop. The control chip 122 is a microcontroller 111 with PWM output capability. At least one digital output pin of the control chip 122 serves as the control terminal of the heat dissipation drive circuit 123. The heat dissipation drive circuit 123 includes power switching devices. The power input terminal of the heat dissipation drive circuit 123 is connected to the positive terminal of the vehicle battery via a high-current wire and connected in series with an overcurrent protection device. The output terminal of the heat dissipation drive circuit 123 provides modulated drive power to the heat dissipation mechanism 130 via a dedicated connector.

[0031] In one possible implementation, see [reference] Figure 6 As shown, the heat dissipation drive circuit 123 includes: a fifth transistor P5, a twelfth resistor R12, a thirteenth resistor R13, a fourteenth resistor R14, a fifteenth resistor R15, a sixteenth resistor R16, a first MOSFET Q1, and a second capacitor C2. The emitter of the fifth transistor P5 is connected to ground, the base of the fifth transistor P5 is connected to the output terminal of the control chip 122 via the twelfth resistor R12, and the collector of the fifth transistor P5 is connected to the external power supply via the thirteenth resistor R13, the fourteenth resistor R14 and the fifteenth resistor R15 in sequence. The source of the first MOSFET Q1 is connected between the fourteenth resistor R14 and the fifteenth resistor R15, the gate of the first MOSFET Q1 is connected between the thirteenth resistor R13 and the fourteenth resistor R14, and the drain of the first MOSFET Q1 is connected to the power supply terminal of the heat dissipation mechanism 130. The first end of the sixteenth resistor R16 is connected between the thirteenth resistor R13 and the fourteenth resistor R14, and the second end of the sixteenth resistor R16 is connected to ground; the first end of the second capacitor C2 is connected to the drain of the first MOSFET Q1, and the second end of the second capacitor C2 is connected to ground.

[0032] exist Figure 6In the seat cooling device 100 shown, the fifth transistor P5 constitutes the pre-drive stage. The base of the fifth transistor P5 receives the PWM control signal from the control chip 122 through the twelfth resistor R12, and the emitter is grounded. The collector of the fifth transistor P5 is connected to the positive terminal of the power supply through a cascaded voltage divider network composed of the thirteenth resistor R13, the fourteenth resistor R14, and the fifteenth resistor R15. The first MOSFET Q1 serves as the main power switch. The gate of the first MOSFET Q1 is connected to the node of the thirteenth resistor R13 and the fourteenth resistor R14, and the gate of the first MOSFET Q1 receives the drive voltage after voltage division. The source of the first MOSFET Q1 is connected to the node of the fourteenth resistor R14 and the fifteenth resistor R15, forming a current sampling feedback point. The drain of the first MOSFET Q1 serves as the power output and is connected to the output terminal through the printed circuit board trace. The sixteenth resistor R16 is connected between the gate and the source of the first MOSFET Q1, providing a fast gate charge release path to prevent the first MOSFET Q1 from being mis-turned on. The second capacitor C2 is an electrolytic capacitor or ceramic capacitor with low ESR, connected in parallel between the power output terminal and ground to absorb voltage ripple caused by sudden changes in load current and maintain the stability of the output voltage.

[0033] In one possible implementation, see [reference] Figure 7 As shown, the heat dissipation drive circuit 123 also includes: a sixth transistor P6, a seventeenth resistor R17, and a fifth diode D5; The fifth diode D5 is connected in series with the sixteenth resistor R16. The positive terminal of the fifth diode D5 is connected to the sixteenth resistor R16, and the negative terminal of the fifth diode D5 is connected between the thirteenth resistor R13 and the fourteenth resistor R14. The emitter of the sixth transistor P6 is connected to an external power supply. The base of the sixth transistor P6 is connected to the source of the first MOSFET Q1 via the seventeenth resistor R17. The collector of the sixth transistor P6 is connected between the positive terminal of the fifth diode D5 and the sixteenth resistor R16.

[0034] exist Figure 7 In the seat cooling device 100 shown, the seventeenth resistor R17 serves as a current sampling resistor, connected in series between the source and ground of the first MOSFET Q1. The sixth transistor P6 forms a current sensing amplifier. The base of the sixth transistor P6 is driven by the voltage drop across the seventeenth resistor R17. The emitter of the sixth transistor P6 is connected to the power supply, and the collector of the sixth transistor P6 is connected to the gate drive node of the first MOSFET Q1 through the fifth diode D5. The fifth diode D5 provides unidirectional isolation, preventing the gate drive signal from affecting the protection circuit in reverse. When the load current exceeds a preset value, the voltage drop across the seventeenth resistor R17 increases, causing the sixth transistor P6 to conduct, thereby shunting the gate drive current of the first MOSFET Q1. The first MOSFET Q1 cannot conduct, providing reliable overcurrent protection.

[0035] In one possible implementation, see [reference] Figure 8 As shown, the heat dissipation mechanism 130 includes: a diode cooling chip 131, a heat dissipation device 132, and a cooling fan 133; The cold side of the diode cooling chip 131 is attached to the seat of the electric two-wheeled vehicle, the heat dissipation device 132 is disposed on the hot side of the diode cooling chip 131, and the air outlet of the cooling fan 133 is disposed towards the heat dissipation device 132; the power supply terminals of the diode cooling chip 131 and the cooling fan 133 are connected to the output terminal of the drive module 120.

[0036] exist Figure 8 In the seat cushion cooling device 100 shown, the heat dissipation mechanism 130 adopts a hybrid heat dissipation scheme combining thermoelectric cooling and forced air cooling. A diode cooling chip 131 serves as the core cooling element. The cold side of the diode cooling chip 131 achieves close thermal contact with the thermally conductive substrate of the seat cushion through thermally conductive silicone grease or phase change material, ensuring minimal contact thermal resistance. Multiple diode cooling chips 131 can be connected in parallel. The heat dissipation device 132 is made of aluminum or copper alloy with high thermal conductivity and achieves full thermal connection with the hot side of the diode cooling chip 131 through mechanical clamping or thermally conductive adhesive bonding. The cooling fan 133 is an axial or centrifugal fan driven by a DC brushless motor. Its air outlet guides the air to the fin surface of the heat dissipation device 132 through a specially designed air duct, forming a directional cooling airflow. The power leads of the diode cooling chip 131 and the cooling fan 133 are electrically connected to the power output terminal of the drive module 120 through a waterproof connector, and their power supply circuits can be independently controlled to achieve different combinations of cooling intensity and heat dissipation modes.

[0037] In one possible implementation, see [reference] Figure 9 As shown, the heat dissipation device 132 is a hollow columnar structure, and the heat dissipation fins of the heat dissipation device 132 are disposed on the inner wall of the hollow columnar structure; the hot surface of the diode cooling chip 131 is disposed at one end of the hollow columnar structure, and the cooling fan 133 is disposed at the other end of the hollow columnar structure.

[0038] exist Figure 9In the seat cooling device shown, the heat dissipation device 132 is constructed as a hollow cylindrical metal body with a circular, rectangular, or polygonal cross-section. Continuous or intermittent radial heat dissipation fins are machined on the inner wall of the cylinder. The hot side of the diode cooling chip 131 is smoothly mounted at one end opening of the cylindrical structure via a thermally conductive interface material. The cooling fan 133 can be mounted at the other end opening of the cylindrical structure via a flexible shock-absorbing bracket, with its rotation axis coinciding with the central axis of the cylinder, ensuring that airflow is uniformly distributed axially throughout the entire cooling duct. This integrated air duct design improves heat dissipation efficiency while optimizing space utilization, allowing the entire cooling mechanism to be compactly installed in the limited space under the seat.

[0039] Based on the same concept, this utility model embodiment also provides an electric two-wheeled vehicle, which includes: a vehicle body and the above-mentioned seat cooling device; The seat cooling device is located inside the seat cushion of the vehicle body.

[0040] In practical applications, the heat dissipation mechanism of the seat cushion cooling device is fixedly installed inside the seat cushion compartment using brackets and fasteners, with its cooling surface in close contact with the heat-conducting plate at the bottom of the seat cushion. The main control module and drive module are installed in the vehicle's waterproof electronic compartment, exchanging data with the vehicle controller via the vehicle's CAN bus or K-line network. The entire device is powered directly from the vehicle's battery through a fuse box and is controlled by the ignition switch. This deep integration ensures that the seat cushion cooling function works in coordination with other vehicle systems, providing users with a complete intelligent temperature control experience.

[0041] Although preferred embodiments of the present invention have been described, those skilled in the art, upon learning the basic inventive concept, can make other changes and modifications to these embodiments. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments as well as all changes and modifications falling within the scope of the present invention.

[0042] Obviously, those skilled in the art can make various modifications and variations to the embodiments of this utility model without departing from the spirit and scope of the embodiments of this utility model. Therefore, if these modifications and variations to the embodiments of this utility model fall within the scope of the claims of this utility model and their equivalents, then this utility model also intends to include these modifications and variations.

Claims

1. A cushion cooling device, characterized by, For use in electric two-wheeled vehicles, including: main control module, drive module and heat dissipation mechanism; The main control module is connected to an external device, and the output terminal of the main control module is electrically connected to the drive module; the output terminal of the drive module is connected to the heat dissipation mechanism, which is located inside the seat of the electric two-wheeled vehicle. The main control module is used to send a cooling control signal to the drive module when triggered by an external device; The drive module is used to connect or disconnect the heat dissipation mechanism from the external power supply according to the cooling control signal. The heat dissipation mechanism is used to absorb and dissipate the heat from the seat of the electric two-wheeler when an external power source is connected.

2. The seat cooling device according to claim 1, wherein The main control module includes: a microcontroller and a first K-line circuit; The input terminal of the microcontroller is connected to an external device, the first communication terminal of the microcontroller is connected to the transmitting terminal of the first K-line circuit, the second communication terminal of the microcontroller is connected to the receiving terminal of the first K-line circuit, and the K-line terminal of the first K-line circuit is connected to the driving module.

3. The seat cooling device of claim 2, wherein The first K-line circuit includes: a receiving module, a transmitting module, a first resistor, a first diode, and a first Zener diode; The anode of the first diode is connected to an external power supply via a first resistor, and the cathode of the first diode is connected to the driving module; the cathode of the first Zener diode is connected to the cathode of the first diode, and the anode of the first Zener diode is connected to ground; the first terminal of the transmitting module is connected to the cathode of the first diode, and the second terminal of the transmitting module is connected to the first communication terminal of the microcontroller; the first terminal of the receiving module is connected to the cathode of the first diode, and the second terminal of the receiving module is connected to the second communication terminal of the microcontroller.

4. The seat cooling device as claimed in claim 3, wherein The transmitting module includes: a first transistor, a second transistor, a second resistor, a third resistor, a fourth resistor, a fifth resistor, and a second diode; The emitter of the first transistor is connected to an external power supply; the base of the first transistor is connected to the first communication terminal of the microcontroller via a second resistor; the collector of the first transistor is connected to the anode of the second diode via a third resistor; the emitter of the second transistor is connected to ground; the base of the second transistor is connected to the cathode of the second diode; and the collector of the second transistor is connected to the cathode of the first diode. A fourth resistor is connected in parallel between the base and emitter of the first transistor; and a fifth resistor is connected in parallel between the base and emitter of the second transistor. The receiving module includes: a third transistor, a fourth transistor, a sixth resistor, a seventh resistor, an eighth resistor, a ninth resistor, a tenth resistor, an eleventh resistor, a third diode, a fourth diode, and a first capacitor; The emitter of the third transistor is connected to ground; the base of the third transistor is connected to the cathode of the third diode via a sixth resistor; the collector of the third transistor is connected to the cathode of the fourth diode; the anode of the third diode is connected to the cathode of the first diode; the anode of the fourth diode is connected to an external power supply via a seventh resistor and an eighth resistor; a ninth resistor is connected in parallel between the base and emitter of the third transistor; the emitter of the fourth transistor is connected to an external power supply; the base of the fourth transistor is connected between the seventh resistor and the eighth resistor; the collector of the fourth transistor is connected to ground via a tenth resistor; the collector of the fourth transistor is connected to the second communication terminal of the microcontroller via an eleventh resistor; the first capacitor is connected in parallel with the tenth resistor.

5. The seat cooling device of claim 2, wherein The driving module includes: a second K-line circuit, a control chip, and a heat dissipation driving circuit; The K-line terminal of the second K-line circuit is connected to the K-line terminal of the first K-line circuit, the transmitting terminal of the second K-line circuit is connected to the first communication terminal of the control chip, and the receiving terminal of the second K-line circuit is connected to the second communication terminal of the control chip. The output terminal of the control chip is connected to the control terminal of the heat dissipation drive circuit; the input terminal of the heat dissipation drive circuit is connected to an external power supply, and the output terminal of the heat dissipation drive circuit is connected to the power supply terminal of the heat dissipation mechanism.

6. The seat cooling device as claimed in claim 5, wherein The heat dissipation driving circuit includes: a fifth transistor, a twelfth resistor, a thirteenth resistor, a fourteenth resistor, a fifteenth resistor, a sixteenth resistor, a first MOSFET, and a second capacitor; The emitter of the fifth transistor is connected to ground, the base of the fifth transistor is connected to the output terminal of the control chip via the twelfth resistor, and the collector of the fifth transistor is connected to an external power supply via the thirteenth resistor, the fourteenth resistor, and the fifteenth resistor in sequence. The source of the first MOS transistor is connected between the fourteenth resistor and the fifteenth resistor, the gate of the first MOS transistor is connected between the thirteenth resistor and the fourteenth resistor, and the drain of the first MOS transistor is connected to the power supply terminal of the heat dissipation mechanism. The first end of the sixteenth resistor is connected between the thirteenth resistor and the fourteenth resistor, and the second end of the sixteenth resistor is connected to ground; the first end of the second capacitor is connected to the drain of the first MOS transistor, and the second end of the second capacitor is connected to ground.

7. The seat cooling device as claimed in claim 6, wherein The heat dissipation drive circuit also includes: a sixth transistor, a seventeenth resistor, and a fifth diode; The fifth diode is connected in series with the sixteenth resistor, the positive terminal of the fifth diode is connected to the sixteenth resistor, and the negative terminal of the fifth diode is connected between the thirteenth resistor and the fourteenth resistor; The emitter of the sixth transistor is connected to an external power supply, the base of the sixth transistor is connected to the source of the first MOS transistor via the seventeenth resistor, and the collector of the sixth transistor is connected between the anode of the fifth diode and the sixteenth resistor.

8. The seat cooling device according to any one of claims 1 to 7, wherein The heat dissipation mechanism includes: a diode cooling chip, a heat dissipation device, and a cooling fan; The cold side of the diode cooling chip is attached to the seat of the electric two-wheeler, the heat dissipation device is disposed on the hot side of the diode cooling chip, and the air outlet of the cooling fan is oriented towards the heat dissipation device; the power supply terminals of the diode cooling chip and the cooling fan are connected to the output terminal of the drive module.

9. The seat cooling device of claim 8, wherein the seat cushion is formed of a material having a thermal conductivity of 0.1 to 0.5 W / mK. The heat dissipation device is a hollow columnar structure, and the heat dissipation fins of the heat dissipation device are disposed on the inner wall of the hollow columnar structure; the hot surface of the diode cooling chip is disposed at one end of the hollow columnar structure, and the cooling fan is disposed at the other end of the hollow columnar structure.

10. An electric two-wheeled vehicle characterized by include: The vehicle body and the seat cushion cooling device as described in any one of claims 1-9; The seat cooling device is located inside the seat cushion of the vehicle body.

Images