Semiconductor storage transfer device

Abstract

The utility model relates to the technical field of semiconductor transfer, especially for a semiconductor storage transfer device, including transfer tray and storage box, the storage box is placed on the top of transfer tray and installs, in the utility model, through the transfer tray and the storage box of above setting, the inside of pad is provided with the flange through the stud screw thread assembly, the sliding installation of the slot and the groove block is placed, the rear end of box body, the front end of box cover all are provided with the column block, manually with the first magnetic attraction piece bottom end and second magnetic attraction piece top end magnetic attraction limit, two moisture absorption hollow plates are placed and installed in the upper layer inside and lower layer inside symmetry of box body, two moisture absorption hollow plates that set up symmetrically between up and down are placed and installed to two clamping frames, install and place the semiconductor wafer between flexible silica gel strip, arc column and arc strip insert and place, the convenient installation limit of device main part forms to multiple groups of storage box, and the storage box that device sets is easy to assemble and dismount.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor transfer technology, specifically a semiconductor storage transfer device. Background Technology

[0002] Semiconductor processing component storage and transfer devices are a series of devices used throughout the entire lifecycle of semiconductor manufacturing, testing, packaging, and transportation. Taking semiconductor wafer storage and transfer as an example, these devices are used to safely contain, protect, transport, and transfer semiconductor wafers, thereby achieving effective protection of the semiconductor wafers.

[0003] Some semiconductor wafer storage and transfer devices store semiconductor wafers inside storage boxes and then transport and transfer the storage boxes. However, this method is inconvenient for convenient installation and positioning of multiple sets of storage boxes, and the storage boxes are not easy to assemble and disassemble. Therefore, a semiconductor storage and transfer device is proposed to address the above problems. Utility Model Content

[0004] The purpose of this utility model is to provide a semiconductor storage transfer device to solve the problems mentioned above, such as the inconvenience of the loading body in conveniently installing and limiting multiple sets of storage boxes and the difficulty in assembling and disassembling the storage boxes.

[0005] To achieve the above objectives, this utility model provides the following technical solution:

[0006] A semiconductor storage transfer device includes a transfer tray and a storage box. The storage box is mounted on the top of the transfer tray. The transfer tray includes a pad, a folding plate, a guard plate, a slot block, a pillar block, a first magnetic block, and a second magnetic block. The folding plate is threadedly assembled inside the pad with studs. A guard plate is fixedly connected to one side of the folding plate, and a slot block is fixedly connected to one side of the guard plate. The first magnetic block is fixedly connected to the bottom of the pillar block, and the second magnetic block is fixedly connected to the inner hole at the top of the pad.

[0007] Preferably, the storage box includes a box body, a box lid, a moisture-absorbing hollow board, a card holder, a flexible silicone strip, an arc strip, a card slot, an arc column, and an RFID tag. Two moisture-absorbing hollow boards are symmetrically installed inside the upper and lower layers of the box body. A card holder is installed between the two symmetrically arranged moisture-absorbing hollow boards. A flexible silicone strip is fixedly connected to the inner side of the card holder. Arc strips are fixedly connected to the four corners of the front end of the box body. Card slots are opened on the outer sides of the left and right ends of the box body. An arc column is fixedly connected to the rear end of the box lid. An RFID tag is fixedly connected to the top of the box body.

[0008] Preferably, the arc column and arc strip are inserted and placed, and the front end of the box body, the front end of the moisture-absorbing hollow board, the front end of the card holder and the rear end of the box cover are in contact and limited.

[0009] Preferably, the slots and grooves on the outer side of the box are slidably installed, and the bottom of the box and the top of the pad are installed.

[0010] Preferably, the bottom end of the first magnetic block and the top end of the second magnetic block are magnetically attracted and limited, and the two pillars symmetrically distributed at the front end are in contact with and limited by the front end of the box cover.

[0011] Compared with the prior art, the beneficial effects of this utility model are:

[0012] In this utility model, the transfer tray and storage box are configured as described above. The inside of the tray is fitted with a folded plate by a stud thread assembly. The slot and groove block are slidably installed. The rear end of the box body and the front end of the box cover are both provided with column blocks. The bottom end of the first magnetic block and the top end of the second magnetic block are manually magnetically attracted and limited. Two moisture-absorbing hollow plates are symmetrically installed inside the upper and lower layers of the box body. Two card holders are installed opposite each other between the two symmetrically arranged moisture-absorbing hollow plates. Semiconductor wafers are installed between flexible silicone strips. Arc columns and arc strips are inserted and placed. The main body of the device forms a convenient installation and limiting mechanism for multiple sets of storage boxes. The storage boxes set by the device are easy to assemble and disassemble. Attached Figure Description

[0013] Figure 1 This is a schematic diagram of the overall structure of this utility model;

[0014] Figure 2 This is a schematic diagram of the internal component structure of the transfer tray of this utility model;

[0015] Figure 3 This utility model Figure 2 A schematic diagram of the structure at point A;

[0016] Figure 4 This is a schematic diagram of the internal component structure of the storage box of this utility model;

[0017] Figure 5 This utility model Figure 4 A schematic diagram of the structure at point B;

[0018] Figure 6 This is a schematic diagram of the cross-sectional structure of the box body of this utility model;

[0019] Figure 7 This utility model Figure 6 A schematic diagram of the structure at point C;

[0020] Figure 8 This utility model Figure 6 A schematic diagram of the structure at point D.

[0021] In the diagram: 1. Transfer tray; 11. Pad; 12. Folding plate; 13. Balustrade; 14. Slot; 15. Column; 16. First magnetic block; 17. Second magnetic block; 2. Storage box; 21. Box body; 22. Box lid; 23. Moisture-absorbing hollow board; 24. Card holder; 25. Flexible silicone strip; 26. Curved strip; 27. Card slot; 28. Curved column; 29. ​​RFID tag. Detailed Implementation

[0022] The technical solutions of the utility model embodiments will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the utility model, and not all embodiments. Based on the embodiments of the utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the utility model.

[0023] In the embodiments of the utility model, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the position or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations of the utility model. In addition, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. Similarly, words such as "an," "a," or "the" do not indicate a quantity limitation, but rather indicate the presence of at least one. Words such as "comprising" or "including" mean that the element or object preceding the word covers the element or object listed after the word and its equivalents, without excluding other elements or objects.

[0024] Furthermore, in the embodiments of the utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. For those skilled in the art, the specific meaning of the above terms in the utility model can be understood according to the specific circumstances.

[0025] Please see Figure 1-8 This utility model provides a technical solution:

[0026] A semiconductor storage transfer device includes a transfer tray 1 and a storage box 2. The storage box 2 is mounted on the top of the transfer tray 1. The transfer tray 1 includes a pad 11, a folding plate 12, a guard plate 13, a slot block 14, a pillar block 15, a first magnetic block 16, and a second magnetic block 17. The folding plate 12 is threadedly assembled inside the pad 11 with studs. The guard plate 13 is fixedly connected to one side of the folding plate 12. The slot block 14 is fixedly connected to one side of the guard plate 13. The first magnetic block 16 is fixedly connected to the bottom of the pillar block 15. The second magnetic block 17 is fixedly connected to the inner hole at the top of the pad 11. The transfer tray 1 and the storage box 2 together form a storage and transfer function for semiconductor wafers.

[0027] Storage box 2 includes a box body 21, a lid 22, a moisture-absorbing hollow board 23, a card holder 24, a flexible silicone strip 25, an arc strip 26, a card slot 27, an arc column 28, and an RFID tag 29. Two moisture-absorbing hollow boards 23 are symmetrically installed inside the upper and lower layers of the box body 21. A card holder 24 is installed between the two symmetrically arranged moisture-absorbing hollow boards 23. A flexible silicone strip 25 is fixedly connected to the inner side of the card holder 24. Arc strips 26 are fixedly connected to the four corners of the front end of the box body 21. Card slots 27 are opened on the outer left and right ends of the box body 21. An arc column 28 is fixedly connected to the rear end of the lid 22. An RFID tag 29 is fixedly connected to the top of the box body 21. Through the above arrangement, an assembled storage box 2 is formed. The column 28 and the arc strip 26 are inserted and placed. The front end of the box body 21, the front end of the moisture-absorbing hollow plate 23, the front end of the card holder 24 and the rear end of the box cover 22 are abutted and limited. Through the above settings, the assembly structure of the storage box 2 is formed. The card slot 27 and the slot block 14 opened on the outside of the box body 21 are slidably installed. The bottom end of the box body 21 and the top end of the pad 11 are installed. Through the above settings, the installation structure of the box body 21 and the transfer tray 1 is formed. The bottom end of the first magnetic block 16 and the top end of the second magnetic block 17 are magnetically limited. The two column blocks 15 symmetrically distributed at the front end abut and limit the front end of the box cover 22. Through the above settings, together with the folding plate 12, the guardrail 13 and the slot block 14, a transfer tray 1 that can conveniently install and limit multiple sets of storage boxes 2 is formed.

[0028] Workflow: This utility model provides a storage and transfer device for semiconductor wafers. The main body of the device forms a convenient installation and limiting mechanism for multiple sets of storage boxes 2. The storage boxes 2 are easy to assemble and disassemble. Two moisture-absorbing hollow plates 23 are symmetrically installed inside the upper and lower layers of the box body 21. Two card holders 24 are installed opposite each other between the two symmetrically arranged moisture-absorbing hollow plates 23. Semiconductor wafers are installed between flexible silicone strips 25. Arc pillars 28 and arc strips 26 are inserted and placed. The front end of the box body 21, the front end of the moisture-absorbing hollow plates 23, the front end of the card holders 24 and the rear end of the box cover 22 are in contact and limited. The inside of the pad 11 is equipped with a threaded assembly of studs. The folding plate 12 and the slot 27 and slot block 14 on the outside of the box body 21 are slidably installed to form a preliminary installation limit for the storage box 2. The rear end of the box body 21 and the front end of the box cover 22 are provided with pillar blocks 15. The bottom end of the first magnetic block 16 and the top end of the second magnetic block 17 are magnetically attracted and limited by manual means. The two pillar blocks 15 symmetrically distributed at the front end abut and limit the front end of the box cover 22, and the two pillar blocks 15 at the rear end abut and limit the rear end of the box body 21, forming a transfer tray 1 that can conveniently install and limit multiple sets of storage boxes 2. The RFID tag 29 set on the top of the box body 21 is used to track the flow, status and history of each batch of products in real time throughout the supply chain.

[0029] Although embodiments of the utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the utility model, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A semiconductor storage and transport device comprising a transport tray (1) and a storage magazine (2), characterized in that: The transfer tray (1) is equipped with a storage box (2) on top. The transfer tray (1) includes a pad (11), a folding plate (12), a guardrail (13), a groove block (14), a column block (15), a first magnetic block (16), and a second magnetic block (17). The folding plate (12) is installed inside the pad (11) by a stud thread. The guardrail (13) is fixedly connected to one side of the folding plate (12). The groove block (14) is fixedly connected to one side of the guardrail (13). The first magnetic block (16) is fixedly connected to the bottom end of the column block (15). The second magnetic block (17) is fixedly connected to the inner hole at the top of the pad (11).

2. The semiconductor storage and transfer device of claim 1, wherein: The storage box (2) includes a box body (21), a box cover (22), a moisture-absorbing hollow board (23), a card holder (24), a flexible silicone strip (25), an arc strip (26), a card slot (27), an arc column (28), and an RFID tag (29). Two moisture-absorbing hollow boards (23) are symmetrically installed inside the upper and lower layers of the box body (21). A card holder (24) is installed between the two moisture-absorbing hollow boards (23) that are symmetrically arranged above and below. A flexible silicone strip (25) is fixedly connected to the inner side of the card holder (24). An arc strip (26) is fixedly connected to the four corners of the front end of the box body (21). Card slots (27) are opened on the outer left and outer right ends of the box body (21). An arc column (28) is fixedly connected to the rear end of the box cover (22). An RFID tag (29) is fixedly connected to the top of the box body (21).

3. The semiconductor storage and transfer device of claim 2, wherein: The arc column (28) and arc strip (26) are inserted and placed, and the front end of the box body (21), the front end of the moisture-absorbing hollow board (23), the front end of the card holder (24) and the rear end of the box cover (22) are in contact and limited.

4. The semiconductor storage and transfer device of claim 2, wherein: The slot (27) and the groove block (14) on the outside of the box body (21) are slidably installed, and the bottom of the box body (21) and the top of the pad (11) are installed.

5. The semiconductor storage and transfer device of claim 1, wherein: The bottom of the first magnetic block (16) is magnetically attracted and limited to the top of the second magnetic block (17), and the two pillars (15) symmetrically distributed at the front end are in contact with and limited to the front end of the box cover (22).

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